CN108977786A - A kind of magnetic control spattering target water route backboard - Google Patents
A kind of magnetic control spattering target water route backboard Download PDFInfo
- Publication number
- CN108977786A CN108977786A CN201811076149.2A CN201811076149A CN108977786A CN 108977786 A CN108977786 A CN 108977786A CN 201811076149 A CN201811076149 A CN 201811076149A CN 108977786 A CN108977786 A CN 108977786A
- Authority
- CN
- China
- Prior art keywords
- backboard
- buttcover plate
- water route
- water tank
- annular water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a kind of magnetic control spattering target water route backboards, including upper backboard, the two sides of the upper backboard are equipped with the first buttcover plate, the avris of the bottom of the upper backboard is provided with embedding groove, welding layer is provided on the inside of the embedding groove, lower backboard is installed below the upper backboard, the both ends of the annular water tank of the bottom middle position of the upper backboard are separately installed with the first discharge outlet and the first water inlet, and the both ends of the annular water tank at the top center position of the lower backboard are separately installed with the second discharge outlet and the second water inlet.Backboard material in water route used of the invention uses metal molybdenum, the hardness of molybdenum is high, thermal expansion coefficient is small, improve temperature capacity, increase the intensity of backboard material, annular water tank is installed in the inside of device, so that two backboard solderings is spliced to form annular water channel, may insure Maximum Contact area in this way, and stable water pressure can be kept.
Description
Technical field
The present invention relates to water route Backplane area, specifically a kind of magnetic control spattering target water route backboard.
Background technique
As global electronic information industry is fast-developing, the fast development of FPD industry, planar display surface board size
It is required that constantly expanding, this requires sputtering target material sizes also to expand therewith, and full-size has reached 2 meters of 3 meters of X, this kind of target at present
Material needs to be fixed on backboard, and the low alloy metal usually with good fluidity and with certain viscosity is as solder.Due to magnetic
Control in sputtering process, excitaton source particle constantly bombards target material surface under accelerating field traction, and kinetic energy is converted into thermal energy, target because
This can accumulate amount of heat, these heats can not transmit in time, and then cause that target deforms or even target can be caused because of overheat
Miss target phenomenon influences plated film production.Target bulk temperature must be strictly controlled in a certain range thus.Tradition is usually to plate
A cooling trough is designed on film machine, backboard is allowed closely to touch sink, then passes to the cooling target of recirculated cooling water, however such is done
Method is only contacted with back plate surface due to cooling water, and the cooling effect thicker for back plate thickness is general, high-power it is even more impossible to meet
Sputtering target material, in order to further strengthen target cooling effect.There are many for the sputtering target material water route backboard of current stage
Shortcoming, for example, target is easily deformed, cooling effect is poor, and cooling inconvenient.
Summary of the invention
The purpose of the present invention is to provide a kind of magnetic control spattering target water route backboards, to solve target in the prior art
It is easily deformed, the problem that cooling effect is poor and cooling inconvenient.
To achieve the above object, the invention provides the following technical scheme: a kind of magnetic control spattering target water route backboard, including
Upper backboard, the two sides of the upper backboard are equipped with the first buttcover plate, and the avris of the bottom of the upper backboard is provided with embedding groove, institute
It states and is provided with welding layer on the inside of embedding groove, lower backboard, the two sides installation of the lower backboard are installed below the upper backboard
There is the second buttcover plate, fixing bolt, one end installation of the fixing bolt are installed between first buttcover plate and the second buttcover plate
There is carrying handle, grip is installed on the carrying handle, the top avris of the lower backboard is equipped with tongue, the upper backboard
Bottom middle position and lower backboard top center position at be provided with annular water tank, among the bottom of the upper backboard
The both ends of annular water tank at position are separately installed with the first discharge outlet and the first water inlet, the top center position of the lower backboard
The both ends of the annular water tank at the place of setting are separately installed with the second discharge outlet and the second water inlet.
Preferably, the upper backboard is identical with the size of lower backboard, and upper backboard and lower backboard pass through tongue
Connection is inlayed with embedding groove.
Preferably, the annular water tank is set as semicircular curved pipe slot structure, and after upper backboard and lower backboard splicing,
Two annular water tanks mutually splice and combine and circularize water route.
Preferably, there are four first buttcover plate and the second buttcover plate are respectively provided with, and four the first buttcover plates and four
Second buttcover plate is mutually butted by fixed pin.
Compared with prior art, the beneficial effects of the present invention are: backboard material in water route used of the invention uses metal molybdenum,
The hardness of molybdenum is high, thermal expansion coefficient is small, improves temperature capacity, increases the intensity of backboard material, is equipped with ring in the inside of device
Shape sink makes two backboard solderings be spliced to form annular water channel, may insure Maximum Contact area in this way, and can keep water
Pressure is stablized, and such mode is stronger to backboard heat dissipation effect, and it is convenient to radiate, and can improve cold to avoid the non-uniform problem that radiates
But effect.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention.
Fig. 2 is the bottom view of upper backboard of the invention.
In figure: 1- grip, 2- carrying handle, the first buttcover plate of 3-, 4- fixing bolt, the second buttcover plate of 5-, 6- upper backboard, 7-
Welding layer, 8- embedding groove, the first discharge outlet of 9-, the first water inlet of 10-, 11- tongue, 12- lower backboard, the second discharge outlet of 13-,
The second water inlet of 14-, 15- annular water tank.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Please refer to Fig. 1~2, in the embodiment of the present invention, a kind of magnetic control spattering target water route backboard, including upper backboard 6, on
The two sides of backboard 6 are equipped with the first buttcover plate 3, and the first buttcover plate 3 is used to splice with the second buttcover plate 5, facilitate upper backboard 6 under
The splicing of backboard 12, the avris of the bottom of upper backboard 6 are provided with embedding groove 8, and embedding groove 8 is used to inlay with tongue 11, make
Backboard 6 is fixedly connected with lower backboard 12, and the inside of embedding groove 8 is provided with welding layer 7, and welding layer 7 can weld soldering opening
It connects, the lower section of upper backboard 6 is equipped with lower backboard 12, and the two sides of lower backboard 12 are equipped with the second buttcover plate 5,3 He of the first buttcover plate
Fixing bolt 4 is installed between second buttcover plate 5, fixing bolt 4 is used to for the first buttcover plate 3 being fixedly connected with the second buttcover plate 5, Gu
The one end for determining bolt 4 is equipped with carrying handle 2, and carrying handle 2 facilitates the carrying of device, grip 1 is equipped on carrying handle 2, under
The top avris of backboard 12 is equipped with tongue 11, the bottom middle position of upper backboard 6 and the top center position of lower backboard 12
Place is provided with annular water tank 15, and annular water tank 15 is used to convey cold water, the annular water tank of the bottom middle position of upper backboard 6
15 both ends are separately installed with the first discharge outlet 9 and the first water inlet 10, and the first discharge outlet 9 and the first water inlet 10 are used to intake
And draining, the both ends of the annular water tank 15 at the top center position of lower backboard 12 are separately installed with the second discharge outlet 13 and second
Water inlet 14, upper backboard 6 is identical with the size of lower backboard 12, and upper backboard 6 and lower backboard 12 by tongue 11 and
Embedding groove 8 inlays connection, and annular water tank 15 is set as semicircular curved pipe slot structure, and upper backboard 6 and lower backboard 12 are spliced
Afterwards, two annular water tanks 15, which mutually splice and combine, circularizes water route, there are four the first buttcover plate 3 and the second buttcover plate 5 are respectively provided with,
And four the first buttcover plates 3 and four the second buttcover plates 5 are mutually butted by fixed pin 4.
The working principle of the invention is: the equipment when in use, upper backboard 6 and lower backboard 12 is closely pressed, tongue is made
11 are embedded in the inside of embedding groove 8, and the bottom of upper backboard 6 and the annular water tank 15 at the top of lower backboard 12 are seamless spliced, together
When the first buttcover plate 3 and the second buttcover plate 5 are fastened by fixing bolt 4, then by welding gun to the welding on embedding groove 8
Layer 7 carries out spot welding, makes it that interface gap of embedding groove 8 and tongue 11 is carried out welded seal, passes through the first water inlet 10 and the
Water inlet is passed through cold water into water route after the splicing of two water inlets 14, and by the first discharge outlet 9 and the splicing of the second discharge outlet 13 after
Discharge outlet by water route hot water be discharged.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
Claims (4)
1. a kind of magnetic control spattering target water route backboard, including upper backboard (6), it is characterised in that: the two sides of the upper backboard (6)
It is equipped with the first buttcover plate (3), the avris of the bottom of the upper backboard (6) is provided with embedding groove (8), the embedding groove (8)
Inside is provided with welding layer (7), is equipped with lower backboard (12) below the upper backboard (6), the two sides of the lower backboard (12)
It is equipped with the second buttcover plate (5), is equipped with fixing bolt (4) between first buttcover plate (3) and the second buttcover plate (5), it is described
One end of fixing bolt (4) is equipped with carrying handle (2), is equipped with grip (1), the lower backboard on the carrying handle (2)
(12) top avris is equipped with tongue (11), the bottom middle position of the upper backboard (6) and the top of lower backboard (12)
Middle position is provided with annular water tank (15), the annular water tank (15) of the bottom middle position of the upper backboard (6)
Both ends are separately installed with the first discharge outlet (9) and the first water inlet (10), at the top center position of the lower backboard (12)
The both ends of annular water tank (15) are separately installed with the second discharge outlet (13) and the second water inlet (14).
2. a kind of magnetic control spattering target water route backboard according to claim 1, it is characterised in that: the upper backboard (6)
It is identical with the size of lower backboard (12), and upper backboard (6) and lower backboard (12) pass through tongue (11) and embedding groove (8)
Inlay connection.
3. a kind of magnetic control spattering target water route backboard according to claim 1, it is characterised in that: the annular water tank
(15) it is set as semicircular curved pipe slot structure, and after upper backboard (6) and lower backboard (12) splicing, two annular water tanks (15)
It mutually splices and combines and circularizes water route.
4. a kind of magnetic control spattering target water route backboard according to claim 1, it is characterised in that: first buttcover plate
(3) and there are four the second buttcover plate (5) is respectively provided with, and four the first buttcover plates (3) and four the second buttcover plates (5) pass through fixation
Pin (4) is mutually butted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811076149.2A CN108977786A (en) | 2018-09-14 | 2018-09-14 | A kind of magnetic control spattering target water route backboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811076149.2A CN108977786A (en) | 2018-09-14 | 2018-09-14 | A kind of magnetic control spattering target water route backboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108977786A true CN108977786A (en) | 2018-12-11 |
Family
ID=64546267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811076149.2A Pending CN108977786A (en) | 2018-09-14 | 2018-09-14 | A kind of magnetic control spattering target water route backboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108977786A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112570691B (en) * | 2019-09-29 | 2021-12-07 | 京磁材料科技股份有限公司 | Cooling device for preparing magnetron sputtering target by vacuum melting |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101213319A (en) * | 2005-05-02 | 2008-07-02 | 霍尼韦尔国际公司 | Target assemblies, targets, backing plates, and methods of target cooling |
| JP2009191324A (en) * | 2008-02-15 | 2009-08-27 | Ulvac Material Kk | Backing plate manufacturing method, backing plate, sputter cathode, sputtering apparatus, bucking plate cleaning method |
| CN102501045A (en) * | 2011-10-20 | 2012-06-20 | 宁波江丰电子材料有限公司 | Method and device for processing nickel target component |
| KR101225844B1 (en) * | 2010-07-13 | 2013-01-23 | 플란제 에스이 | Composition for Bonding Rotary Target for Sputtering and Method for Bonding Rotary Target Using the Same |
| CN104625389A (en) * | 2014-12-22 | 2015-05-20 | 有研亿金新材料有限公司 | Welding method of aluminum alloy sputtering target material for integrated circuit package material |
| CN205590793U (en) * | 2016-04-18 | 2016-09-21 | 绍兴鑫兴纺织镭射科技有限公司 | Vacuum coating machine's magnetron sputtering target device |
-
2018
- 2018-09-14 CN CN201811076149.2A patent/CN108977786A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101213319A (en) * | 2005-05-02 | 2008-07-02 | 霍尼韦尔国际公司 | Target assemblies, targets, backing plates, and methods of target cooling |
| JP2009191324A (en) * | 2008-02-15 | 2009-08-27 | Ulvac Material Kk | Backing plate manufacturing method, backing plate, sputter cathode, sputtering apparatus, bucking plate cleaning method |
| KR101225844B1 (en) * | 2010-07-13 | 2013-01-23 | 플란제 에스이 | Composition for Bonding Rotary Target for Sputtering and Method for Bonding Rotary Target Using the Same |
| CN102501045A (en) * | 2011-10-20 | 2012-06-20 | 宁波江丰电子材料有限公司 | Method and device for processing nickel target component |
| CN104625389A (en) * | 2014-12-22 | 2015-05-20 | 有研亿金新材料有限公司 | Welding method of aluminum alloy sputtering target material for integrated circuit package material |
| CN205590793U (en) * | 2016-04-18 | 2016-09-21 | 绍兴鑫兴纺织镭射科技有限公司 | Vacuum coating machine's magnetron sputtering target device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112570691B (en) * | 2019-09-29 | 2021-12-07 | 京磁材料科技股份有限公司 | Cooling device for preparing magnetron sputtering target by vacuum melting |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106158788A (en) | Liquid cooling heat radiator and electronic equipment | |
| CN106455430B (en) | A kind of manufacturing method of radiator | |
| CN104806824A (en) | Novel copper and steel composite pipe, manufacture method and application | |
| US8357885B2 (en) | Microwave furnace | |
| CN108977786A (en) | A kind of magnetic control spattering target water route backboard | |
| CN102019476B (en) | Braze welding method of slot antenna | |
| US10957663B2 (en) | Spoked solder pad to improve solderability and self-alignment of integrated circuit packages | |
| CN206471326U (en) | A kind of liquid-cooling heat radiator | |
| CN103862123A (en) | Laser welding method for solar heat collecting board core | |
| CN204342868U (en) | A kind of powder metallurgy diffusion welding target | |
| US10541188B2 (en) | Power module and manufacturing method thereof | |
| CN108550560A (en) | A kind of New IGBT module copper soleplate structure | |
| KR20170012206A (en) | Adhesive agent and connection structure | |
| CN108155162A (en) | A kind of three-dimensional high heat conduction highly exothermic of no glue laminating and preparation method thereof | |
| CN106413285A (en) | Microcircuit module back side pre-soldering and pre-soldering heating device | |
| JP5596537B2 (en) | Microwave melting furnace | |
| CN104816102A (en) | Method for heat conduction fixed connection between components and solder used by the same | |
| US9258852B2 (en) | Microwave furnace | |
| CN201181713Y (en) | Flip-chip bonding structure of indium gallium aluminum nitrogen epitaxial wafer | |
| CN105244755B (en) | Semiconductor laser single tube chip packaging method | |
| CN210232049U (en) | Target welding jig | |
| CN202425269U (en) | Cold plate of electronic component | |
| CN206272923U (en) | Steel disc reinforcing chip | |
| CN111805082A (en) | Surface mounting and welding method for controlling tracking error of coaxial optical device | |
| CN206786159U (en) | A kind of easily direct Petroleum Pipehead of duplex |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181211 |