CN108977155A - Wet-curing reaction type polyurethane hot melt adhesives composition and preparation method thereof - Google Patents
Wet-curing reaction type polyurethane hot melt adhesives composition and preparation method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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Abstract
The present invention relates to a kind of wet-curing reaction type polyurethane hot melt adhesives compositions and preparation method thereof, mainly include: one or more polyether polyol of component A:10-40 parts by weight；One or more polyester polyol of component B:30-60 parts by weight；One or more methacrylate resins of component C:3-50 parts by weight；One or more isocyanates of component D:6-30 parts by weight；One or more catalyst of component E:0.01-2.0 parts by weight；With two kinds or more heat stabilizers of component F:0.1-5.0 parts by weight.Invention adhesive compositions using when require heat to 80 DEG C -120 DEG C, bonding especially suitable for metal, plastics or lacquered surface, high initial bonding strength can be established after glue construction in a very short period of time, and secondary curing is finally realized by moisture, is very beneficial for the raising of production efficiency.Glue is added at 100 DEG C in use, the viscosity of glue rises lower than 10% in 8 hours, and excellent heat stability is conducive to the precise glue dispensing of Application to Electronic Industry.
Description
Technical field
The present invention relates to polyurethane sealant technical fields, in particular to wet-curing reaction type polyurethane hot melt adhesives composition
And preparation method thereof.
Background technique
Hot melt adhesive is a kind of not solvent-laden adhesive, be generally at room temperature it is solid, soften into stickiness when heated
Therefore liquid can simultaneously be applied in the form of melt.The application of hot melt adhesive generally carries out at a temperature of being higher than 80 DEG C, is being cooled to
When room temperature, rapid build adhesive strength is formed into solidification.Traditional hot melt adhesive is non-reactive adhesive, when heated they
Soften again or melt, therefore in the case where not being suitable for high temperature.Reactive hot-melt be by by it is reactive, cause to be crosslinked
Group be introduced into polymer architecture, have more excellent high temperature resistance.
Reaction type polyurethane hot-melt adhesive (abbreviation PUR): pre- containing end NCO polyurethane in moisture-curable polyurethane hot melt adhesive ingredient
Aggressiveness generates under the condition of high temperature, moisture or active hydrogen object in active functional group and air or on adherend after heating
Qualitative response and form part cross-linked structure, make the performances such as adhesive strength, chemicals-resistant, heat-resisting, hydrolysis better than general heat
Melten gel.Reaction type polyurethane hot-melt adhesive is widely used in the industries such as carpenter, weaving, automobile, electronics, household electrical appliances.Reaction type polyurethane heat
The synthesis of melten gel is one and chemically reacts the process combined with physical mixed.Reaction type polyurethane hot-melt adhesive in the prior art
The chemical reaction of synthesis generally refers to reacting for isocyanates and multicomponent alcoholics compound, and wherein isocyanates uses hexichol
Dicyclohexylmethane diisocyanate (abbreviation MDI), and multicomponent alcoholics compound be number average molecular 1000~5000 polyester and
Polyethers.
Few in the dosage of the dispensing that electronics industry application field, such as mobile phone individually bond, glue, a glue generally requires
Very long soaking time, such as be up to 8 hours, this requires high, no person couple for the viscosity stability of glue in use
Adverse effect can be generated in the accurate control of tree lace, largely effects on the narrow frame design problem of mobile phone or panel.In the prior art
Reaction type polyurethane rise big there is also long-time high temperature viscosity, be easy the technical problems such as wire drawing trickling property difference.
Open (bulletin) number: a kind of silane-modified moisture cure urethanes heat is disclosed in the patent document of CN104449535A
The preparation method of melten gel, is made as follows: (1) by a certain amount of polyether polyol, polyester polyol, solvent misture,
Antioxidant, fluorescent whitening agent, are heated to 120-140 DEG C, are stirred, while depressurizing degassing 2.0h, are then cooled to 90 DEG C；
(2) under nitrogen protection, isocyanates, catalyst are added in (1) described reaction system, is reacted under the conditions of 85~95 DEG C
45min；(3) under nitrogen protection, chain extender, silane coupling agent are added in system described in (2), under the conditions of 85~95 DEG C
1h is reacted, prepolymer is obtained；(4) under nitrogen protection, step (3) reaction mixture is transferred in aluminium foil bag, 85 after sealing
Under the conditions of DEG C, 6h, the product being had excellent performance are cured；The introducing of siloxane group can improve final production to a certain extent
The cohesive force of product, however since alkoxy is in 80 degree or more very rotundities, it is easy to cause chemical side reactions for a long time,
Viscosity fluctuation at a temperature of is very big, is not suitable for long-time precise glue dispensing.
Summary of the invention
In order to overcome the drawbacks of the prior art, the present invention provides wet-curing reaction type polyurethane hot melt adhesives composition and its system
Preparation Method.
To achieve the goals above, the present invention the following technical schemes are provided:
Wet-curing reaction type polyurethane hot melt adhesives composition, including component A, B component, component C, D component, component E and F group
Point, the component A includes one or more polyether polyol, and the B component includes one or more polyester polyol, the C
Group is divided into one or more methacrylate resins, and the D group is divided into one or more isocyanates, and the component E includes
One or more catalyst, the F group are divided into two kinds or more heat stabilizers；Feed components are calculated as by weight, component A:
10-40 parts；B component: 30-60 parts；Component C: 3-50 parts；D component: 6-30 parts；Component E: 0.01-2 parts；F component: 0.1-5 parts.
Preferably, the component A is one or more polyether polyol, and the polyether polyol is polypropylene oxide two
Alcohol, weight average molecular weight 1000~5000, hydroxyl value is between 22~115mg KOH/g.
Preferably, the B component is one or more polyester polyol, is tetramethylene adipate glycol, succinic acid fourth
Glycol esterdiol, adipic acid hexylene glycol esterdiol, ethanedioic acid glycol ester glycol or phthalic acid butyl glycol ester diol one
Kind or two kinds, weight average molecular weight 800~10000.
Preferably, the component C be one or more methacrylate resins, weight average molecular weight 5000~100000,
Glass transition temperature is greater than 40 DEG C, and average hydroxyl value is between 0~5mg KOH/g；The average molecular weight of methacrylate is excessively high
Or its hydroxyl value is greater than 5mg KOH/g, formula is easy to appear wire drawing phenomenon in construction usage.This kind of resin plays in system
The significant effect for increasing initial bonding strength, can be improved reaction type polyurethane thermal decomposition temperature, improve viscosity under adhesive high temperature
The crosslink density for being added into material can be improved due to the presence of a small amount of hydroxyl to improve chemical-resistance in stability.
Preferably, the D group is divided into one or more isocyanates, and the isocyanates is diphenylmethane diisocyanate
Ester (MDI), toluene di-isocyanate(TDI) (TDI), isophorone diisocyanate (IPDI), dicyclohexyl methyl hydride diisocyanate
(HMDI) and one of hexamethylene diisocyanate (HDI) or a variety of；The present invention does not have the source of the isocyanates
It is specifically limited, using above-mentioned toluene di-isocyanate(TDI) (TDI) well known to those skilled in the art, isophorone diisocyanate
(IPDI), two isocyanide of methyl diphenylene diisocyanate (MDI), dicyclohexyl methyl hydride diisocyanate (HMDI) and hexa-methylene
The commercial goods of acid esters (HDI).
Preferably, the D group is divided into methyl diphenylene diisocyanate (MDI).
Preferably, the component E is dibutyl tin dilaurate, organo-bismuth, triethylenediamine and dimorpholine base diethyl
One of base ether is a variety of.
Preferably, the F group is divided into two or more heat stabilizer, and at least one is selected from carbodiimides and its spreads out
Biology can reduce or prevent the decomposition under polyester construction long term high temperature；At least one is selected from antioxidant, can improve glue
High-temperature stability.Antioxidant is for avoiding adhesive composition from producing during preparation, during use, during processing and finally
When object is exposed in atmospheric environment, because degrading with oxygen haptoreaction, to extend the mechanical property of adhesive composition
Retention time and service life.It is not particularly limited, is can be for preventing adhesive composition for antioxidant of the invention
Occur deterioration by oxidation primary antioxidant or primary antioxidant and for delay adhesive composition occur deterioration by oxidation aid anti-oxidants
Composition, preferred primary antioxidant.
The non-limitative example of the primary antioxidant includes Hinered phenols antioxidant, secondary diarylamine kind antioxidant, is obstructed
Amine antioxidants and benzotriazole kind antioxidant.
The specific example of hindered phenol can enumerate be purchased from BASF AG Irganox1010, Irganox1076,
Irganox1098, Irganox1135, Irganox1726, Irganox1520L and Irganox245 etc..
The specific example of secondary diarylamine can enumerate the Irganox5057 for being purchased from BASF AG.
The specific example of benzotriazole kind antioxidant can enumerate be purchased from BASF AG Tinuvin360 and
Tinuvin328 etc..
The specific example of suffocated amine antioxidant can enumerate the Tinuvin292Tinuvin765 for being purchased from BASF AG
With Tinuvin494 etc..The non-limitative example of aid anti-oxidants for use in the present invention can be phosphite ester.Phosphite ester
Typical example can enumerate the TNPP for being purchased from Chemtura company, Ultranox 626；Be purchased from Amfine
The HP-10 etc. of Chemical company.
In adhesive composition according to the present invention, primary antioxidant be can be used alone, can also in any proportion by
Two or more are used in mixed way.In view of optical property, preferably primary antioxidant.
Preferably, silane coupling agent, defoaming agent, levelling agent or ultraviolet light can be added in the composition as needed to inhale
Receive one of agent or a variety of further improvement performance formulas.
Preferably, the parts by weight of the D component are 8-20 parts, and the parts by weight of the component E are 0.05-0.5 parts, the F
The parts by weight of component are 0.2-2.5 parts.
Preferably, the performance indicator of the wet-curing reaction type polyurethane hot melt adhesives composition is as follows:
Tensile strength test condition: for 301 stainless steels to glass, glue is 100 μm thick.
Preferably, the performance indicator of the wet-curing reaction type polyurethane hot melt adhesives composition is as follows:
Tensile strength test condition: for 301 stainless steels to glass, glue is 100 μm thick.
The preparation method of wet-curing reaction type polyurethane hot melt adhesives composition, comprising the following steps:
1) the middle antioxidant being added in component A, B component, component C and F component in 500ml three-necked flask, is warming up to
At 90 DEG C, it is dehydrated 2 hours under vacuum 10KPa；
2) D component is added, is reacted 1 hour at 110 DEG C, keeps vacuum degree 10KPa；
3) stop vacuumizing, component E and residual F component is added, is stirred 10 minutes at 110 DEG C, vacuum degree 10KPa；
4) high temperature discharging, it is canned.
Beneficial effect of the invention is that a kind of reaction type polyurethane hot-melt adhesive and preparation method thereof, is different from biography
System reaction type polyurethane hot-melt adhesive:
1. adhesive 100 DEG C of heating at use temperature, 10% can be less than or equal to keep in 8 hours viscosity to rise, heat
Excellent in stability is conducive to electronics industry precise glue dispensing；
2. by the content of formula technique and control acrylate, adhesive heats at use temperature at 100 DEG C, and 8
Dispensing does not have wire drawing phenomenon in hour.
Specific embodiment
The preferred embodiments of the present invention will be described in detail below so that advantages and features of the invention can be easier to by
It will be appreciated by those skilled in the art that so as to make a clearer definition of the protection scope of the present invention.
Embodiment one:
According to preparing adhesive composition as following formula:
The Voranol 2120 of 12.0 parts of Dow chemistry, polyethers；
The Voranol 2140 of 10.0 parts of Dow chemistry, polyethers；
The Stepanpol PDP 70 of 18.0 parts of Stepan companies, polyester
The Dynacoll 7360 of 25.0 parts of Evonik companies, polyester
2595 methacrylate resin of MB of 20.0 parts of Dianal companies, 60 DEG C of glass transition temperature, weight average molecular weight
8000, hydroxyl value is less than 1.2mg KOH/g
The Desmodur 0118I of 14.0 parts of Bayer companies, isocyanates
The Jeffcat DMDEE of 0.1 part of Huntsman company, catalyst
The Carbodilite HMV-15CA of 0.2 part of Nisshinbo chemistry, heat stabilizer (prevent to decompose)
0.2 part of forever photochemical Evernox 10, heat stabilizer (antioxidant)
0.5 part of silane coupling agent, the Silquest A 189 of Momentive
All numbers are parts by weight, the adhesive composition based on 100 parts by weight.
Specific preparation method:
1. middle addition polyester, polyethers, methacrylate resin, heat stabilizer are (anti-oxidant in 500ml three-necked flask
Agent), it is warming up at 90 DEG C, is dehydrated 2 hours under vacuum 10KPa.
2. isocyanates is added, reacted 1 hour at 110 degree, keeps vacuum degree 10KPa.
3. stopping vacuumizes, Carbodilite HMV-15CA heat stabilizer, Jeffcat DMDEE catalyst and silicon is added
Stirring 10 minutes, vacuum degree 10KPa under 189,110 degree of alkane Silquest A.
4. high temperature discharging, canned.
Embodiment two:
According to preparing adhesive composition as following formula:
The Voranol 2120 of 20.0 parts of Dow chemistry, polyethers；
The Stepanpol PDP 70 of 18.0 parts of Stepan companies, polyester
The Dynacoll 7381 of 24.0 parts of Evonik companies, polyester
The Elvacite 2903 of 10.0 parts of Lucite company, methacrylate resin, 50 DEG C of glass transition temperature, weight
Average molecular weight 26000, hydroxyl value 9.5mg KOH/g
2595 methacrylate resin of MB of 12.0 parts of Dianal companies, glass transition temperature 60C, weight average molecular weight
8000, hydroxyl value is less than 1.2mg KOH/g
The Desmodur 0118I of 14.0 parts of Bayer companies, isocyanates
The Jeffcat DMDEE of 0.1 part of Huntsman company, catalyst
1.0 parts of Lanxess companiesP 200, heat stabilizer (prevent to decompose)
The Irganox 1010 of 0.4 part of BASF chemistry, heat stabilizer (antioxidant)
0.5 part of silane coupling agent, the Silquest A 189 of Momentive
All numbers are parts by weight, the adhesive composition based on 100 parts by weight.
Specific preparation method:
1. middle addition polyester, polyethers, methacrylate resin, heat stabilizer are (anti-oxidant in 500ml three-necked flask
Agent), it is warming up at 90 DEG C, is dehydrated 2 hours under vacuum 10KPa.
2. isocyanates is added, reacted 1 hour at 110 degree, keeps vacuum degree 10KPa.
3. stopping vacuumizes, it is added200 heat stabilizer of P, Jeffcat DMDEE catalyst and silicon
Stirring 10 minutes, vacuum degree 10KPa under 189,110 degree of alkane Silquest A.
4. high temperature discharging, canned.
Comparative example one:
According to preparing adhesive composition as following formula:
The Voranol 2120 of 12.0 parts of Dow chemistry, polyethers；
The Voranol 2140 of 10.0 parts of Dow chemistry, polyethers；
The Stepanpol PDP 70 of 18.0 parts of Stepan companies, polyester
25.0 the Dynacoll 7360 of part Evonik company, polyester
2595 methacrylate resin of MB of 20.0 parts of Dianal companies, glass transition temperature 60C, weight average molecular weight
8000, hydroxyl value is less than 1.2mg KOH/g
The Desmodur 0118I of 14.0 parts of Bayer companies, isocyanates
The Jeffcat DMDEE of 0.1 part of Huntsman company, catalyst
The Carbodilite HMV-15CA of 0 part of Nisshinbo chemistry, heat stabilizer (prevent to decompose)
0 part of forever photochemical Evernox 10, heat stabilizer (antioxidant)
0.5 part of silane coupling agent, the Silquest A 189 of Momentive
All numbers are parts by weight, the adhesive composition based on 99.6 parts by weight.
Using above-mentioned raw materials composite adhesives, specific preparation method is the same as example 1.
Comparative example two:
According to preparing adhesive composition as following formula:
The Voranol 2120 of 20.0 parts of Dow chemistry, polyethers；
The Stepanpol PDP 70 of 18.0 parts of Stepan companies, polyester
The Dynacoll 7381 of 24.0 parts of Evonik companies, polyester
The Elvacite 2903 of 22.0 parts of Lucite company, methacrylate resin, glass transition temperature 50C, weight are equal
Molecular weight 26000, hydroxyl value 9.5mg KOH/g
The Desmodur 0118I of 14.0 parts of Bayer companies, isocyanates
The Jeffcat DMDEE of 0.1 part of Huntsman company, catalyst
1.0 parts of Lanxess companiesP 200, heat stabilizer (prevent to decompose)
The Irganox 1010 of 0.4 part of BASF chemistry, heat stabilizer (antioxidant)
0.5 part of silane coupling agent, the Silquest A 189 of Momentive
All numbers are parts by weight, the adhesive composition based on 100 parts by weight.
Using above-mentioned raw materials composite adhesives, specific preparation method is identical as embodiment two.
Comparative example three:
According to preparing adhesive composition as following formula:
The Voranol 2120 of 20.0 parts of Dow chemistry, polyethers；
The Stepanpol PDP 70 of 18.0 parts of Stepan companies, polyester
The Dynacoll 7381 of 24.0 parts of Evonik companies, polyester
The Elvacite 2903 of 10.0 parts of Lucite company, methacrylate resin, glass transition temperature 50C, weight are equal
Molecular weight 26000, hydroxyl value 9.5mg KOH/g
2595 methacrylate resin of MB of 12.0 parts of Dianal companies, glass transition temperature 60C, weight average molecular weight
8000, hydroxyl value is less than 1.2mg KOH/g
The Desmodur 0118I of 14.0 parts of Bayer companies, isocyanates
The Jeffcat DMDEE of 0.1 part of Huntsman company, catalyst
0 part of Lanxess companyP 200, heat stabilizer (prevent to decompose)
The Irganox 1010 of 0 part of BASF chemistry, heat stabilizer (antioxidant)
0.5 part of silane coupling agent, the Silquest A 189 of Momentive
All numbers are parts by weight, the adhesive composition based on 98.6 parts by weight.
Using above-mentioned raw materials composite adhesives, specific preparation method is identical as embodiment two.
Performance test methods:
1) viscosity test
Refer to brookfield viscosity (Brookfield), test uses ASTM D1084, and test temperature is 100 DEG C.
2) hardness test
100 degree of high temperature lower sizings are on tetrafluoroethene plate, with the exemplar of scraper scraping 2mm thickness, standard environment (23C,
50% relative humidity) under solidify 7 days, with ShA hardometer test.When hardness test, it is superimposed 6mm height, at least measurement three pieces glue
The hardness number of film, is averaged.
3) the glue open hour
The test of open hour is referring to ASTM D4497-1994.
4) tensile strength is tested
2 tree laces are uniformly put at 100mm*25.4mm*4mm glass intermediate position points two, the width of glue is in 1.2-1.6mm
Between, thickness controls 100 microns with stainless steel wire, is covered with 301 stainless steels and is tried hard to keep pressure 1 minute immediately with 1Kg.It tests respectively
Initial tensile strength when glue is placed 10 minutes, and the stretching after solidifying 24 hours under 23 DEG C, 50RH% relative humidity are strong
Degree.
Using tensilon (manufacturer: Instron company, model: Instron 5540), for sample above,
In the direction vertical with glass sheet surface, sheet glass and 301 stainless steels are pulled open in opposite direction, carries out bonding tensile strength and survey
Examination, tensile speed 10mm is per minute, load 1000N.Obtained force value is divided by sheet glass and sheet glass overlapping area
It obtains adhesive strength (unit: MPa).
5) 8 hours viscosity changes at 100 DEG C of glue
Gluing after testing glue melts under 100 degree, and continue the viscosity after heat preservation 8 hours.Tested viscosity refers to Brooker
Field viscosity (Brookfield), test use ASTM D1084, and test temperature is 100 DEG C.
6) 8 hours wire drawing phenomenons at 100 DEG C of glue
It is melted under glue 100C, gets the width of tree lace between 1.2-1.6mm, whether observation glue has wire drawing phenomenon.
The performance test results of adhesive composition prepared by embodiment one, two and comparative example one~tri- are as shown in table 1:
1 adhesive composition the performance test results of table
| Performance indicator | Embodiment one | Embodiment two | Comparative example one | Comparative example two | Comparative example three |
| Viscosity/mPa.s/100 DEG C | 4800 | 5400 | 4500 | 6400 | 5400 |
| Open hour/min | 2.5 | 2.0 | 2.5 | 2.5 | 2.0 |
| Shore A hardness after solidification | 72 | 77 | 70 | 81 | 76 |
| Initial strength/MPa (10min) | 0.41 | 0.51 | 0.36 | 0.27 | 0.35 |
| Tensile strength/MPa (24H) | 5.8 | 8.1 | 5.3 | 4.9 | 5.3 |
| Viscosity change (8H) at 100 DEG C | 7.1% | 6.9% | 18.2% | 21.9% | 19.8% |
| Wire drawing phenomenon (8H) at 100 DEG C | Nothing | Nothing | Nothing | Have | Nothing |
By above-mentioned experimental data it is found that wet-curing reaction type polyurethane hot melt adhesives heat stability of composition of the present invention is excellent,
Be conducive to the precise glue dispensing of Application to Electronic Industry.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those skilled in the art within the technical scope disclosed by the invention, can without the variation that creative work is expected or
Replacement, should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be limited with claims
Subject to fixed protection scope.
Claims (9)
1. wet-curing reaction type polyurethane hot melt adhesives composition, which is characterized in that including component A, B component, component C, D component, E
Component and F component, the component A include one or more polyether polyol, and the B component includes one or more polyester polyols
Alcohol, the component C are one or more methacrylate resins, and the D group is divided into one or more isocyanates, the E
Component includes one or more catalyst, and the F group is divided into two kinds or more heat stabilizers；Feed components are by weight
For component A: 10-40 parts；B component: 30-60 parts；Component C: 3-50 parts；D component: 6-30 parts；Component E: 0.01-2 parts；F group
Point: 0.1-5 parts.
2. wet-curing reaction type polyurethane hot melt adhesives composition according to claim 1, which is characterized in that the component A
For one or more polyether polyol, the polyether polyol is polyoxypropyleneglycol, weight average molecular weight 1000~5000, hydroxyl
Value is between 22~115mg KOH/g；
The B component be one or more polyester polyol, be tetramethylene adipate glycol, succinic acid-butanediol ester glycol,
The one or two of adipic acid hexylene glycol esterdiol, ethanedioic acid glycol ester glycol or phthalic acid butyl glycol ester diol, weight
Average molecular weight 800~10000；
The component C is one or more methacrylate resins, and weight average molecular weight 5000~100000, glass transition temperature is big
In 40 DEG C, average hydroxyl value is between 0~5mg KOH/g；
The D group is divided into one or more isocyanates, and the isocyanates is methyl diphenylene diisocyanate (MDI), first
Phenylene diisocyanate (TDI), isophorone diisocyanate (IPDI), dicyclohexyl methyl hydride diisocyanate (HMDI) and six are sub-
One of methyl diisocyanate (HDI) is a variety of；
The component E is one of dibutyl tin dilaurate, organo-bismuth, triethylenediamine and dimorpholine base Anaesthetie Ether
Or it is a variety of；
The F group is divided into two or more heat stabilizer, and at least one is selected from carbodiimides and its derivative, meanwhile,
At least one is selected from antioxidant；The antioxidant can be primary antioxidant or the composition of primary antioxidant and aid anti-oxidants.
3. wet-curing reaction type polyurethane hot melt adhesives composition according to claim 2, which is characterized in that the D component
For methyl diphenylene diisocyanate (MDI).
4. wet-curing reaction type polyurethane hot melt adhesives composition according to claim 2, which is characterized in that the F component
Middle antioxidant is primary antioxidant.
5. wet-curing reaction type polyurethane hot melt adhesives composition according to claim 1, which is characterized in that the composition
In one of silane coupling agent, defoaming agent, levelling agent or ultraviolet absorbing agent or a variety of can be added as needed.
6. wet-curing reaction type polyurethane hot melt adhesives composition according to claim 1, which is characterized in that the D component
Parts by weight be 8-20 part, the parts by weight of the component E are 0.05-0.5 parts, and the parts by weight of the F component are 0.2-2.5 parts.
7. wet-curing reaction type polyurethane hot melt adhesives composition according to claim 1, which is characterized in that the moisturecuring
The performance indicator of reaction type polyurethane hot-melt adhesive composition is as follows:
Tensile strength test condition: for 301 stainless steels to glass, glue is 100 μm thick.
8. wet-curing reaction type polyurethane hot melt adhesives composition according to claim 1, which is characterized in that the moisturecuring
The performance indicator of reaction type polyurethane hot-melt adhesive composition is as follows:
Tensile strength test condition: for 301 stainless steels to glass, glue is 100 μm thick.
9. the preparation method of wet-curing reaction type polyurethane hot melt adhesives composition, which comprises the following steps:
1) the middle antioxidant being added in component A, B component, component C and F component in 500ml three-necked flask, is warming up to 90 DEG C
Under, it is dehydrated 2 hours under vacuum 10KPa；
2) D component is added, is reacted 1 hour at 110 DEG C, keeps vacuum degree 10KPa；
3) stop vacuumizing, component E and residual F component is added, is stirred 10 minutes at 110 DEG C, vacuum degree 10KPa；
4) high temperature discharging, it is canned.
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110092886A (en) * | 2019-05-16 | 2019-08-06 | 高鼎精细化工(昆山)有限公司 | The applicable moisture reaction type polyurethane resin and preparation method thereof of low temperature environment |
| CN110229644A (en) * | 2019-06-05 | 2019-09-13 | 格丽泰新材料科技（苏州）有限公司 | A kind of reaction type polyurethane hot-melt adhesive and its preparation method and application |
| CN110484188A (en) * | 2019-07-31 | 2019-11-22 | 东莞市澳中电子材料有限公司 | Reaction type polyurethane hot-melt adhesive and preparation method thereof with high initial bonding strength and low stringiness |
| CN110885663A (en) * | 2019-11-26 | 2020-03-17 | 塔威新材料科技(上海)有限公司 | UV (ultraviolet) moisture dual-curing reaction type polyurethane hot melt adhesive composition |
| CN110894415A (en) * | 2019-11-10 | 2020-03-20 | 苏州欧纳克纳米科技有限公司 | Polyurethane adhesive |
| CN110894414A (en) * | 2019-11-10 | 2020-03-20 | 苏州欧纳克纳米科技有限公司 | High-water-resistance polyurethane adhesive |
| CN111303824A (en) * | 2020-04-20 | 2020-06-19 | 常州威斯敦粘合材料有限责任公司 | Moisture-curing polyurethane hot melt adhesive, preparation method and application thereof, and steel member |
| CN112920756A (en) * | 2021-01-28 | 2021-06-08 | 浙江洛克新材料股份有限公司 | Residual-free moisture-cured adhesive and preparation method thereof |
| CN113234410A (en) * | 2021-05-18 | 2021-08-10 | 无锡莱恩科技有限公司 | Hollow glass based on single-component solvent-free hot melt adhesive and processing method thereof |
| CN114045143A (en) * | 2021-11-23 | 2022-02-15 | 广州市白云化工实业有限公司 | High-transparency reactive polyurethane hot melt adhesive and preparation method thereof |
| CN114716958A (en) * | 2021-12-15 | 2022-07-08 | 无锡市万力粘合材料股份有限公司 | PUR hot melt adhesive for friction material and preparation method and application thereof |
| WO2022164947A1 (en) * | 2021-01-28 | 2022-08-04 | Henkel Ag & Co. Kgaa | Process of incorporating gelling and phase separation inhibitor into a filled polyurethane reactive hot melt adhesive |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110092886A (en) * | 2019-05-16 | 2019-08-06 | 高鼎精细化工(昆山)有限公司 | The applicable moisture reaction type polyurethane resin and preparation method thereof of low temperature environment |
| CN110229644B (en) * | 2019-06-05 | 2021-09-03 | 格丽泰新材料科技（苏州）有限公司 | Reactive polyurethane hot melt adhesive and preparation method and application thereof |
| CN110229644A (en) * | 2019-06-05 | 2019-09-13 | 格丽泰新材料科技（苏州）有限公司 | A kind of reaction type polyurethane hot-melt adhesive and its preparation method and application |
| CN110484188A (en) * | 2019-07-31 | 2019-11-22 | 东莞市澳中电子材料有限公司 | Reaction type polyurethane hot-melt adhesive and preparation method thereof with high initial bonding strength and low stringiness |
| CN110894415A (en) * | 2019-11-10 | 2020-03-20 | 苏州欧纳克纳米科技有限公司 | Polyurethane adhesive |
| CN110894414A (en) * | 2019-11-10 | 2020-03-20 | 苏州欧纳克纳米科技有限公司 | High-water-resistance polyurethane adhesive |
| CN110885663A (en) * | 2019-11-26 | 2020-03-17 | 塔威新材料科技(上海)有限公司 | UV (ultraviolet) moisture dual-curing reaction type polyurethane hot melt adhesive composition |
| CN111303824A (en) * | 2020-04-20 | 2020-06-19 | 常州威斯敦粘合材料有限责任公司 | Moisture-curing polyurethane hot melt adhesive, preparation method and application thereof, and steel member |
| CN112920756A (en) * | 2021-01-28 | 2021-06-08 | 浙江洛克新材料股份有限公司 | Residual-free moisture-cured adhesive and preparation method thereof |
| WO2022164947A1 (en) * | 2021-01-28 | 2022-08-04 | Henkel Ag & Co. Kgaa | Process of incorporating gelling and phase separation inhibitor into a filled polyurethane reactive hot melt adhesive |
| CN113234410A (en) * | 2021-05-18 | 2021-08-10 | 无锡莱恩科技有限公司 | Hollow glass based on single-component solvent-free hot melt adhesive and processing method thereof |
| CN114045143A (en) * | 2021-11-23 | 2022-02-15 | 广州市白云化工实业有限公司 | High-transparency reactive polyurethane hot melt adhesive and preparation method thereof |
| CN114045143B (en) * | 2021-11-23 | 2024-02-09 | 广州白云科技股份有限公司 | High-transparency reactive polyurethane hot melt adhesive and preparation method thereof |
| CN114716958A (en) * | 2021-12-15 | 2022-07-08 | 无锡市万力粘合材料股份有限公司 | PUR hot melt adhesive for friction material and preparation method and application thereof |
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