JP2007332279A - One pack type moisture-curable coating agent, electric/electronic component insulated with the same agent and method for producing the same component - Google Patents
One pack type moisture-curable coating agent, electric/electronic component insulated with the same agent and method for producing the same component Download PDFInfo
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- JP2007332279A JP2007332279A JP2006165941A JP2006165941A JP2007332279A JP 2007332279 A JP2007332279 A JP 2007332279A JP 2006165941 A JP2006165941 A JP 2006165941A JP 2006165941 A JP2006165941 A JP 2006165941A JP 2007332279 A JP2007332279 A JP 2007332279A
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- 239000011248 coating agent Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000003795 chemical substances by application Substances 0.000 title description 2
- 150000002009 diols Chemical class 0.000 claims abstract description 26
- 229920005906 polyester polyol Polymers 0.000 claims abstract description 17
- 229920000515 polycarbonate Polymers 0.000 claims abstract description 15
- 239000004417 polycarbonate Substances 0.000 claims abstract description 15
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 8
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 8
- 239000000178 monomer Substances 0.000 claims abstract description 7
- 238000013008 moisture curing Methods 0.000 claims description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 229920005862 polyol Polymers 0.000 claims description 6
- 150000003077 polyols Chemical class 0.000 claims description 6
- 125000002947 alkylene group Chemical group 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 14
- -1 4'-diisocyanate Chemical compound 0.000 description 11
- 125000000524 functional group Chemical group 0.000 description 11
- 238000003756 stirring Methods 0.000 description 11
- 239000002253 acid Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000007711 solidification Methods 0.000 description 8
- 230000008023 solidification Effects 0.000 description 8
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- 239000012298 atmosphere Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 229910001873 dinitrogen Inorganic materials 0.000 description 7
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 7
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 7
- 238000009413 insulation Methods 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 229920001730 Moisture cure polyurethane Polymers 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 229920002635 polyurethane Polymers 0.000 description 6
- 239000004814 polyurethane Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 4
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- XMUZQOKACOLCSS-UHFFFAOYSA-N [2-(hydroxymethyl)phenyl]methanol Chemical compound OCC1=CC=CC=C1CO XMUZQOKACOLCSS-UHFFFAOYSA-N 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- MHIBEGOZTWERHF-UHFFFAOYSA-N heptane-1,1-diol Chemical compound CCCCCCC(O)O MHIBEGOZTWERHF-UHFFFAOYSA-N 0.000 description 3
- SAMYCKUDTNLASP-UHFFFAOYSA-N hexane-2,2-diol Chemical compound CCCCC(C)(O)O SAMYCKUDTNLASP-UHFFFAOYSA-N 0.000 description 3
- FVXBCDWMKCEPCL-UHFFFAOYSA-N nonane-1,1-diol Chemical compound CCCCCCCCC(O)O FVXBCDWMKCEPCL-UHFFFAOYSA-N 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920005903 polyol mixture Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 150000003505 terpenes Chemical class 0.000 description 3
- 235000007586 terpenes Nutrition 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 2
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- INSRQEMEVAMETL-UHFFFAOYSA-N decane-1,1-diol Chemical compound CCCCCCCCCC(O)O INSRQEMEVAMETL-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- GTZOYNFRVVHLDZ-UHFFFAOYSA-N dodecane-1,1-diol Chemical compound CCCCCCCCCCCC(O)O GTZOYNFRVVHLDZ-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 239000005028 tinplate Substances 0.000 description 2
- ZKHDOHYPDHIMPH-UHFFFAOYSA-N 1,1,3-triethyl-5-isocyanato-3-(2-isocyanatoethyl)cyclohexane Chemical compound CCC1(CC)CC(N=C=O)CC(CC)(CCN=C=O)C1 ZKHDOHYPDHIMPH-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- MTZUIIAIAKMWLI-UHFFFAOYSA-N 1,2-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC=C1N=C=O MTZUIIAIAKMWLI-UHFFFAOYSA-N 0.000 description 1
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- SVYKKECYCPFKGB-UHFFFAOYSA-N N,N-dimethylcyclohexylamine Chemical compound CN(C)C1CCCCC1 SVYKKECYCPFKGB-UHFFFAOYSA-N 0.000 description 1
- JCELWOGDGMAGGN-UHFFFAOYSA-N N=C=O.N=C=O.C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 JCELWOGDGMAGGN-UHFFFAOYSA-N 0.000 description 1
- INWVTRVMRQMCCM-UHFFFAOYSA-N N=C=O.N=C=O.C=1C=CC=CC=1C(C)(C)C1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C=1C=CC=CC=1C(C)(C)C1=CC=CC=C1 INWVTRVMRQMCCM-UHFFFAOYSA-N 0.000 description 1
- AXCSBFRIHQXBSG-UHFFFAOYSA-N N=C=O.N=C=O.C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 AXCSBFRIHQXBSG-UHFFFAOYSA-N 0.000 description 1
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- PDXRQENMIVHKPI-UHFFFAOYSA-N cyclohexane-1,1-diol Chemical compound OC1(O)CCCCC1 PDXRQENMIVHKPI-UHFFFAOYSA-N 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- XTAZYLNFDRKIHJ-UHFFFAOYSA-N n,n-dioctyloctan-1-amine Chemical compound CCCCCCCCN(CCCCCCCC)CCCCCCCC XTAZYLNFDRKIHJ-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- KRISBJIGEQYHDD-UHFFFAOYSA-N nonane-2,2-diol Chemical compound CCCCCCCC(C)(O)O KRISBJIGEQYHDD-UHFFFAOYSA-N 0.000 description 1
- 238000010525 oxidative degradation reaction Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- DXNCZXXFRKPEPY-UHFFFAOYSA-N tridecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCC(O)=O DXNCZXXFRKPEPY-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
Landscapes
- Polyurethanes Or Polyureas (AREA)
- Paints Or Removers (AREA)
Abstract
Description
本発明は、特に電気・電子部品の防湿を目的とする防湿絶縁性、作業性に優れた一液湿気硬化型コーティング剤及び絶縁処理された電気・電子部品及びその製造方法に関する。 The present invention relates to a one-component moisture-curing coating agent excellent in moisture-proof insulating properties and workability for the purpose of moisture-proofing electrical / electronic components, and an insulated electrical / electronic component and a method for producing the same.
最近の電気・電子部品は小型軽量化および高性能化が進み、各種電気・電子部品に使用される実装回路板は高密度搭載がなされ、湿気、ほこり等から保護する目的で、アクリル樹脂、シリコーン樹脂塗料による保護コーティングやウレタン樹脂、エポキシ樹脂等による注型封止処理がなされている。このような実装回路板は、過酷な環境下、特に高湿度化で使用され、例えば洗濯機、自動車、フラットパネルディスプレイ等の機器に搭載されて使用されている。
しかし、前記塗料は実装回路板に搭載された電子部品のピン足を完全に保護コーティングできず、耐湿性が劣るという問題やシリコーン樹脂塗料の場合、硬化するまでの時間がかかり生産性に問題があった。
一方、注型処理に用いられるウレタン樹脂やエポキシ樹脂は優れた絶縁性、耐湿熱性を有するが、高温の条件下で長時間放置されると、酸化劣化により硬化物が硬くなり、部品、実装回路板等に応力がかかるとクラック、剥離が発生し、信頼性が低下する恐れがあった。
Recent electrical and electronic components are becoming smaller, lighter and higher in performance, and the mounting circuit boards used for various electrical and electronic components are mounted with high density to protect them from moisture, dust, etc. acrylic resin, silicone Protective coating with resin paint and casting sealing with urethane resin, epoxy resin, etc. are performed. Such a mounting circuit board is used in a severe environment, particularly at a high humidity, and is used by being mounted on a device such as a washing machine, an automobile, or a flat panel display.
However, the paint cannot completely protect the pin foot of the electronic component mounted on the mounting circuit board, resulting in a problem that the moisture resistance is inferior, and in the case of the silicone resin paint, it takes time to cure and there is a problem in productivity. there were.
On the other hand, urethane resin and epoxy resin used for casting treatment have excellent insulation and moisture and heat resistance, but when left for a long time under high temperature conditions, the cured product becomes hard due to oxidative degradation, and components and mounting circuits When stress is applied to a plate or the like, cracks and peeling occur, which may reduce reliability.
本発明は、前記従来技術の問題点を解決し、防湿絶縁等に適し、さらに、作業性に優れた硬化物を形成しうる一液湿気硬化型コーティング剤及び絶縁処理された信頼性の高い電気・電子部品及びその製造方法を提供することを目的とする。 The present invention solves the above-mentioned problems of the prior art, is suitable for moisture-proof insulation and the like, and further, a one-component moisture-curing coating agent capable of forming a cured product excellent in workability, and a highly reliable electrical insulation treatment. -It aims at providing an electronic component and its manufacturing method.
本発明は[1](a)有機ポリイソシアネート、(b)数平均分子量500〜3000からなるポリカーボネートジオール、及び(c)炭素数6〜12のアルキレン基を有するジオールモノマーを構成単位とする数平均分子量1000〜5000のポリエステルポリオールを、(a)/[(b)+(c)]のNCO/OH比が1.8〜2.3となるように反応させて得られる一液湿気硬化型コーティング剤である。
また、本発明は、[2](b)ポリカーボネートジオールと(c)ポリエステルポリオールの水酸基モル数比((b)/(c))が95/5〜80/20である上記[1]に記載の一液湿気硬化型コーティング剤である。
さらに、本発明は[3]上記[1]または[2]に記載の一液湿気硬化型コーティング剤を用いて絶縁処理された電気・電子部品である。
また、本発明は、[4]上記[1]または[2]に記載の一液湿気硬化型コーティング剤を、電気・電子部品に塗布し、硬化する上記[3]に記載の絶縁処理された電気・電子部品の製造方法である。
The present invention provides [1] (a) an organic polyisocyanate, (b) a polycarbonate diol having a number average molecular weight of 500 to 3000, and (c) a number average having a diol monomer having an alkylene group having 6 to 12 carbon atoms as a structural unit. One-part moisture curable coating obtained by reacting a polyester polyol having a molecular weight of 1000 to 5000 so that the NCO / OH ratio of (a) / [(b) + (c)] is 1.8 to 2.3. It is an agent.
Further, the present invention is as described in [1] above, wherein [2] (b) polycarbonate diol and (c) polyester polyol have a hydroxyl group molar ratio ((b) / (c)) of 95/5 to 80/20. This is a one-component moisture-curing coating agent.
Furthermore, the present invention is [3] an electrical / electronic component that is insulated using the one-component moisture-curing coating agent described in [1] or [2].
Further, according to the present invention, [4] the one-component moisture-curing coating agent described in [1] or [2] is applied to an electric / electronic component and cured, and then the insulating treatment described in [3] is performed. This is a method for manufacturing electrical and electronic parts.
本発明の一液湿気硬化型コーティング剤は作業性に優れ、高い信頼性の絶縁処理された各種電気・電子部品を得ることができる。 The one-component moisture curable coating agent of the present invention is excellent in workability and can provide various highly reliable electric / electronic parts subjected to insulation treatment.
本発明で使用する(a)成分である有機ポリイソシアネートは、ジイソシアネート化合物、トリイソシアネート化合物、テトライソシアネート化合物等のポリイソシアネートを用いることができる。例えば、トリレンジイソシアネート、ジフェニルメタンジイソシアネート、ナフタレンジイソシアネート、キシリレンジイソシアネート、ジフェニルスルホンジイソシアネート、トリフェニルメタンジイソシアネート、ヘキサメチレンジイソシアネート、3−イソシアネートメチル−3,5,5−トリメチルシクロヘキシルイソシアネート、3−イソシアネートエチル−3,5,5−トリメチルシクロヘキシルイソシアネート、3−イソシアネートエチル−3,5,5−トリエチルシクロヘキシルイソシアネート、ジフェニルプロパンジイソシアネート、フェニレンジイソシアネート、シクロヘキシリレンジイソシアネート、3,3’−ジイソシアネートジプロピルエーテル、トリフェニルメタントリイソシアネート、ジフェニルエーテル−4,4’−ジイソシアネート、メチレンビス(4−シクロヘキシルイソシアネート)、イソホロンジイソシアネートなどのポリイソシアネートが挙げられ、これらを単独で、または2種以上組合せて使用することができる。 As the organic polyisocyanate which is the component (a) used in the present invention, polyisocyanates such as diisocyanate compounds, triisocyanate compounds and tetraisocyanate compounds can be used. For example, tolylene diisocyanate, diphenylmethane diisocyanate, naphthalene diisocyanate, xylylene diisocyanate, diphenylsulfone diisocyanate, triphenylmethane diisocyanate, hexamethylene diisocyanate, 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate, 3-isocyanate ethyl-3 , 5,5-trimethylcyclohexyl isocyanate, 3-isocyanatoethyl-3,5,5-triethylcyclohexyl isocyanate, diphenylpropane diisocyanate, phenylene diisocyanate, cyclohexylylene diisocyanate, 3,3'-diisocyanate dipropyl ether, triphenylmethane triisocyanate , Diphenyl ether , 4'-diisocyanate, methylenebis (4-cyclohexyl isocyanate), polyisocyanates include such isophorone diisocyanate, it may be used in combination of these alone, or two or more.
本発明で使用する(b)成分の数平均分子量500〜3000からなるポリカーボネートジオールは、例えばカーボネート化合物とジオールとを反応させて得ることができる。カーボネート化合物としては、ジメチルカーボネート、ジフェニルカーボネート、エチレンカーボネートなどを用いることができる。
ジオールとしては、エチレングリコール、プロピレングリコール、ブタンジオール、ネオペンチルグリコール、メチルペンタンジオール、ヘキサンジオール、ヘプタンジオール、オクタンジオール、ノナンジオール、デカンジオール、ドデカンジオールなどの脂肪族ジオール、シクロヘキサンジオール、水添キシリレングリールなどの脂環式ジオール、キシリレングリールなどの芳香族ジオールなどの一種もしくは二種以上の混合物が用いられるが、なかでも脂肪族ジオールとりわけブタンジオール、メチルペンタンジオール、ヘキサンジオール、ヘプタンジオール、メチルオクタンジオール、ノナンジオールなどの炭素鎖長が4〜9の脂肪族ジオールの一種もしくは二種以上の混合物が好適な例として挙げられる。カーボネートジオールの数平均分子量は500〜3000である必要がある。この値が500未満だと回路板との接着性が劣り、3000を超えるとコーティング剤の粘度が高くなり作業性が低下する。
The polycarbonate diol composed of the number average molecular weight 500 to 3000 of the component (b) used in the present invention can be obtained, for example, by reacting a carbonate compound and a diol. As the carbonate compound, dimethyl carbonate, diphenyl carbonate, ethylene carbonate and the like can be used.
Diols include ethylene glycol, propylene glycol, butanediol, neopentyl glycol, methylpentanediol, hexanediol, heptanediol, octanediol, nonanediol, decanediol, dodecanediol, and other aliphatic diols, cyclohexanediol, and hydrogenated xylylene. One or a mixture of two or more of alicyclic diols such as length reels and aromatic diols such as xylylene glycol are used, among which aliphatic diols, especially butanediol, methylpentanediol, hexanediol, heptanediol, Suitable examples include one or a mixture of two or more aliphatic diols having a carbon chain length of 4 to 9, such as methyloctanediol and nonanediol. The number average molecular weight of the carbonate diol needs to be 500 to 3000. If this value is less than 500, the adhesion to the circuit board is poor, and if it exceeds 3000, the viscosity of the coating agent becomes high and the workability decreases.
本発明で使用する(c)成分の炭素数6〜12のアルキレン基を有するジオールモノマーを構成単位とする数平均分子量1000〜5000のポリエステルポリオールは、例えば二塩基酸とジオールとを反応させて得ることができる。
二塩基酸としてはコハク酸、グルタル酸、アジピン酸、ピメリン酸、スペリン酸、アゼライン酸、セバチン酸、ブラシル酸のごとき脂肪族二塩基酸、イソフタル酸、テレフタル酸、ナフタレンジカルボン酸などの芳香族二塩基酸の一種またはそれらの組合せで用いることができる。なかでも脂肪族二塩基酸が、とりわけグルタル酸、アジピン酸、ピメリン酸、スペリン酸、アゼライン酸、セバチン酸、などのメチレン鎖長が3〜8の二塩基酸がさらに好適に用いられる。
ジオールとしては炭素数6〜12、好ましくは炭素数8〜12のアルキレン基を有するジオールモノマーを用いる必要がある。このようなモノマーの例としては、メチルペンタンジオール、ヘキサンジオール、ヘプタンジオール、オクタンジオール、ノナンジオール、デカンジオール、ドデカンジオールなどを挙げることができる。アルキレン基の炭素数が6未満であると、結晶化しにくくなり、固化時間が長くなる。また、この値が12を超えると高粘度化により作業性の低下や塗布素材への密着性の低下を招く。他のジオールモノマーの例としては、低級アルコールで置換されてもよいエチレングリコール、プロピレングリコール、ブタンジオール、ネオペンチルグリコールなどの脂肪族ジオール、シクロヘキサンジオール、水添キシリレングリールなどの脂環式ジオール、キシリレングリールなどの芳香族ジオールなどの一種もしくは二種以上の混合物が用いられる。ポリエステルポリオールの数平均分子量1000〜5000である必要がある。この値が1000未満だと、結晶化しにくく固化時間が長くなり、5000を超えるとコーティング剤の粘度が高くなり作業性が低下する。
The polyester polyol having a number average molecular weight of 1000 to 5000 having a diol monomer having an alkylene group having 6 to 12 carbon atoms as the component (c) used in the present invention is obtained, for example, by reacting a dibasic acid with a diol. be able to.
Dibasic acids include aliphatic dibasic acids such as succinic acid, glutaric acid, adipic acid, pimelic acid, speric acid, azelaic acid, sebacic acid, and brassylic acid, and aromatic dibasic acids such as isophthalic acid, terephthalic acid, and naphthalenedicarboxylic acid. One kind of basic acid or a combination thereof can be used. Of these, dibasic acids having a methylene chain length of 3 to 8 such as glutaric acid, adipic acid, pimelic acid, speric acid, azelaic acid, and sebacic acid are more preferably used.
As the diol, it is necessary to use a diol monomer having an alkylene group having 6 to 12 carbon atoms, preferably 8 to 12 carbon atoms. Examples of such monomers include methylpentanediol, hexanediol, heptanediol, octanediol, nonanediol, decanediol, and dodecanediol. If the alkylene group has less than 6 carbon atoms, it will be difficult to crystallize and the solidification time will be longer. On the other hand, when this value exceeds 12, the workability and the adhesion to the coating material are lowered due to the increase in viscosity. Examples of other diol monomers include aliphatic diols such as ethylene glycol, propylene glycol, butanediol and neopentyl glycol, which may be substituted with lower alcohols, cycloaliphatic diols such as hydrogenated xylylene glycol, One or a mixture of two or more aromatic diols such as xylylene glycol is used. The number average molecular weight of the polyester polyol needs to be 1000 to 5000. If this value is less than 1000, it is difficult to crystallize and the solidification time becomes long, and if it exceeds 5000, the viscosity of the coating agent increases and the workability decreases.
本発明における(a)成分の有機ポリイソシアネート化合物と(b)+(c)成分のポリオール混合物のNCO/OH比((a)/[(b)+(c)])は、1.8〜2.3の範囲となるよう決定される。1.8未満では、得られるプレポリマーの粘度が高くなり過ぎ、作業性の悪化を招き、塗布作業時の加熱安定性にも劣る傾向がある。2.3を超えると得られる被膜が脆くなり、防湿絶縁性の低下を生じるという欠点があるためである。
また、ポリオール混合物のポリカーボネートジオールとポリエステルポリオールの水酸基モル数比は、95/5〜80/20(ポリカーボネートジオール/ポリエステルポリオール)が好ましい。ポリエステルポリオールの比率が5未満では固化時間が長くなり、20を超えて大きいと耐湿熱性が低下する。
上記有機ポリイソシアネート化合物とポリオール混合物からプレポリマーを得るには、加熱および脱泡可能な混合機を用いて、50〜130℃の範囲で窒素ガスをパージする等の方法で空気を遮断しつつ数時間加熱、反応させる。
In the present invention, the NCO / OH ratio ((a) / [(b) + (c)]) of the organic polyisocyanate compound as the component (a) and the polyol mixture as the component (b) + (c) is 1.8 to It is determined to be in the range of 2.3. If it is less than 1.8, the viscosity of the resulting prepolymer becomes too high, resulting in poor workability and poor heat stability during the coating operation. This is because when the ratio exceeds 2.3, the resulting coating film becomes brittle, and the moisture-proof insulating property is deteriorated.
Moreover, the hydroxyl group molar ratio of the polycarbonate diol and the polyester polyol in the polyol mixture is preferably 95/5 to 80/20 (polycarbonate diol / polyester polyol). If the ratio of the polyester polyol is less than 5, the solidification time becomes long, and if it exceeds 20 the moisture and heat resistance is lowered.
In order to obtain a prepolymer from the above organic polyisocyanate compound and polyol mixture, a heat and defoaming mixer is used and several air is shut off by purging nitrogen gas in the range of 50 to 130 ° C. Heat and react for hours.
本発明では、必要に応じて、熱可塑性ポリマー(ポリウレタン、エチレン系共重合体、プロピレン系共重合体、塩化ビニル系共重合体、アクリル共重合体、スチレン−共役ジエンブロック共重合体等の各種ゴム系)、粘着付与樹脂(ロジン樹脂、ロジンエステル樹脂、水添ロジンエステル樹脂、テルペン樹脂、テルペンフェノール樹脂、水添テルペン樹脂、石油樹脂、水添石油樹脂、クマロン樹脂、ケトン樹脂、スチレン樹脂、変性スチレン樹脂、キシレン樹脂、エポキシ樹脂等の各種樹脂系)、さらに触媒(ジブチルチンジラウレート、ジブチルチンジオクテート、ジメチルシクロヘキシルアミン、ジメチルベンジルアミン、トリオクチルアミン等)、顔料または染料、酸化防止剤、紫外線吸収剤、界面活性剤、難燃剤、充填剤等を適量配合しても良い。 In the present invention, a thermoplastic polymer (polyurethane, ethylene copolymer, propylene copolymer, vinyl chloride copolymer, acrylic copolymer, styrene-conjugated diene block copolymer, etc.) is optionally selected. Rubber type), tackifying resin (rosin resin, rosin ester resin, hydrogenated rosin ester resin, terpene resin, terpene phenol resin, hydrogenated terpene resin, petroleum resin, hydrogenated petroleum resin, coumarone resin, ketone resin, styrene resin, Modified resins such as modified styrene resins, xylene resins, epoxy resins), catalysts (dibutyltin dilaurate, dibutyltin dioctate, dimethylcyclohexylamine, dimethylbenzylamine, trioctylamine, etc.), pigments or dyes, antioxidants, Appropriate amounts of UV absorbers, surfactants, flame retardants, fillers, etc. It may be.
本発明になる一液湿気硬化型コーティング剤を用いて絶縁される電気・電子部品としてはマイコン、トランジスタ、コンデンサ、抵抗、リレー、トランス等、及びこれらを搭載した実装回路板などが挙げられ、さらにこれら電気・電子部品に接合されるリード線、ハーネス、フィルム基板等も含むことができる。また、液晶ディスプレイパネル、プラズマディスプレイパネル、有機エレクトロルミネッセンスパネル、フィールドエミッションディスプレイパネル等のフラットパネルディスプレイパネルの信号入力部等も挙げられる。 Examples of the electrical / electronic components insulated using the one-component moisture curable coating agent according to the present invention include a microcomputer, a transistor, a capacitor, a resistor, a relay, a transformer, and a mounting circuit board on which these are mounted. Lead wires, harnesses, film substrates and the like joined to these electric / electronic components can also be included. Moreover, the signal input part of flat panel display panels, such as a liquid crystal display panel, a plasma display panel, an organic electroluminescent panel, a field emission display panel, etc. are mentioned.
本発明になる一液湿気硬化型コーティング剤を用いて絶縁される電気・電子部品の製造方法としては、例えば、一液湿気硬化型コーティング剤を加熱、溶融させた状態で上記電気・電子部品上に塗布し放冷により固化させた後、空気中の水分により硬化させれば良い。 Examples of the method for producing an electrical / electronic component insulated using the one-component moisture-curing coating agent according to the present invention include, for example, heating and melting the one-component moisture-curing coating agent on the electrical / electronic component. After being applied to the substrate and solidified by cooling, it may be cured by moisture in the air.
以下に実施例および比較例により本発明をさらに具体的に説明し、表1にこれら具体例の結果を示すが、本発明はこれらによって制限されるものではない。 The present invention will be described more specifically with reference to the following examples and comparative examples. The results of these specific examples are shown in Table 1, but the present invention is not limited thereto.
(実施例1)
予め真空乾燥機により脱水処理した1,6ヘキサンジオールを主成分とするポリカーボネートジオール(日本ポリウレタン工業株式会社製N−980、官能基数 2.0、数平均分子量2000)とセバチン酸と1,6−ヘキサンジオールを主成分とするポリエステルポリオール(日立化成ポリマー株式会社製A−48、官能基数 2.0、数平均分子量5000)の水酸基モル数比を90/10としたポリオール成分100重量部とジフェニルメタンジイソシアネート22.3重量部(NCO/OH比は2.05)を加熱、脱泡攪拌可能な反応容器に投入し、窒素ガス雰囲気中で混合撹拌しながら、110℃で2時間反応させた後、更に110℃で2時間減圧脱泡攪拌し、ポリウレタンプレポリマー(粘度:7.0Pa・s/120℃)を得た。
Example 1
Polycarbonate diol (N-980, manufactured by Nippon Polyurethane Industry Co., Ltd., number of functional groups: 2.0, number average molecular weight: 2000) mainly composed of 1,6 hexanediol, which has been dehydrated in advance by a vacuum dryer, sebacic acid and 1,6- 100 parts by weight of a polyol component having a hydroxyl group molar ratio of 90/10 and diphenylmethane diisocyanate of a polyester polyol (Hitachi Kasei Polymer Co., Ltd. A-48, functional group number 2.0, number average molecular weight 5000) made mainly of hexanediol 22.3 parts by weight (NCO / OH ratio is 2.05) was charged into a reaction vessel capable of being heated and defoamed and stirred, and mixed and stirred in a nitrogen gas atmosphere for 2 hours at 110 ° C. Defoaming and stirring under reduced pressure at 110 ° C. for 2 hours gave a polyurethane prepolymer (viscosity: 7.0 Pa · s / 120 ° C.). .
(実施例2)
予め真空乾燥機により脱水処理したカプロラクトンと1,6−ヘキサンジオールを主成分とするポリカーボネートジオール(日本ポリウレタン工業株式会社製N−982、官能基数 2.0、数平均分子量2000)とセバチン酸と1,6ヘキサンジオールを主成分とするポリエステルポリオール(日立化成ポリマー株式会社製A−48,官能基数 2.0、数平均分子量5000)の水酸基モル数比を80/20としたポリオール成分100重量部とジフェニルメタンジイソシアネート19.7重量部(NCO/OH比は2.05)を加熱、脱泡攪拌可能な反応容器に投入し、窒素ガス雰囲気中で混合撹拌しながら、110℃で2時間反応させた後、更に110℃で2時間減圧脱泡攪拌し、ポリウレタンプレポリマー(粘度:6.0Pa・s/120℃)を得た。
(Example 2)
Polycarbonate diol (N-982, manufactured by Nippon Polyurethane Industry Co., Ltd., functional group number 2.0, number average molecular weight 2000), which is dehydrated in advance by a vacuum dryer, and 1,6-hexanediol as main components, sebacic acid and 1 100 parts by weight of a polyol component having a hydroxyl group molar ratio of 80/20 of a polyester polyol (A-48 manufactured by Hitachi Chemical Polymer Co., Ltd., functional group number 2.0, number average molecular weight 5000), which is mainly composed of 6 hexanediol, After putting 19.7 parts by weight of diphenylmethane diisocyanate (NCO / OH ratio is 2.05) into a reaction vessel capable of being heated and defoamed and stirred for 2 hours at 110 ° C. with mixing and stirring in a nitrogen gas atmosphere. Further, the mixture was stirred under reduced pressure at 110 ° C. for 2 hours under reduced pressure to give a polyurethane prepolymer (viscosity: 6.0 Pa · s). To obtain a 120 ℃).
(比較例1)
予め真空乾燥機により脱水処理した1,6−ヘキサンジオールを主成分とするポリカーボネートジオール(日本ポリウレタン工業株式会社製N−980、官能基数 2.0、数平均分子量1000)100重量部とジフェニルメタンジイソシアネート25.6重量部(NCO/OH比は2.05)を加熱、脱泡攪拌可能な反応容器に投入し、窒素ガス雰囲気中で混合撹拌しながら、110℃で2時間反応させた後、更に110℃で2時間減圧脱泡攪拌し、ポリウレタンプレポリマー(粘度:2.0Pa・s/120℃)を得た。
(Comparative Example 1)
100 parts by weight of polycarbonate diol (N-980, manufactured by Nippon Polyurethane Industry Co., Ltd., functional group number 2.0, number average molecular weight 1000) mainly composed of 1,6-hexanediol dehydrated in advance by a vacuum dryer and 25 diphenylmethane diisocyanate .6 parts by weight (NCO / OH ratio is 2.05) was charged into a reaction vessel capable of being heated and degassed and stirred and reacted at 110 ° C. for 2 hours with mixing and stirring in a nitrogen gas atmosphere. Defoaming and stirring under reduced pressure at 2 ° C. for 2 hours gave a polyurethane prepolymer (viscosity: 2.0 Pa · s / 120 ° C.).
(比較例2)
予め真空乾燥機により脱水処理したとセバチン酸と1,6−ヘキサンジオールを主成分とするポリエステルポリオール(日立化成ポリマー株式会社製A−48、官能基数 2.0、数平均分子量5000)とアジピン酸と1,6−ヘキサンジオールを主成分とするポリエステルポリオール(日立化成ポリマー株式会社製A−43、官能基数 2.0、数平均分子量5000)の水酸基モル数比を85/15としたポリオール成分100重量部とジフェニルメタンジイソシアネート10.3重量部(NCO/OH比は2.05)を加熱、脱泡攪拌可能な反応容器に投入し、窒素ガス雰囲気中で混合撹拌しながら、110℃で2時間反応させた後、更に110℃で2時間減圧脱泡攪拌し、ポリウレタンプレポリマー(粘度:20.0Pa・s/120℃)を得た。
(Comparative Example 2)
Polyester polyol (A-48 manufactured by Hitachi Chemical Co., Ltd., functional group number 2.0, number average molecular weight 5000) and adipic acid, which are mainly composed of sebacic acid and 1,6-hexanediol when dehydrated in advance by a vacuum dryer Polyol component 100 having a hydroxyl group mole ratio of 85/15 of polyester polyol (A-43, manufactured by Hitachi Chemical Polymer Co., Ltd., functional group number 2.0, number average molecular weight 5000) mainly composed of 1,6-hexanediol Part by weight and 10.3 parts by weight of diphenylmethane diisocyanate (NCO / OH ratio is 2.05) are placed in a reaction vessel capable of heating and defoaming and stirring, and the reaction is carried out at 110 ° C. for 2 hours while mixing and stirring in a nitrogen gas atmosphere. And then defoaming and stirring under reduced pressure at 110 ° C. for 2 hours to produce a polyurethane prepolymer (viscosity: 20.0 Pa · s / 12). ℃) was obtained.
(比較例3)
予め真空乾燥機により脱水処理した1,6ヘキサンジオールを主成分とするポリカーボネートジオール(日本ポリウレタン工業株式会社製N−980、官能基数 2.0、数平均分子量2000)とセバチン酸と1,6−ヘキサンジオールを主成分とするポリエステルポリオール(日立化成ポリマー株式会社製A−48、官能基数 2.0、数平均分子量5000)の水酸基モル数比を90/10としたポリオール成分100重量部とジフェニルメタンジイソシアネート17.4重量部(NCO/OH比は1.60)を加熱、脱泡攪拌可能な反応容器に投入し、窒素ガス雰囲気中で混合撹拌しながら、110℃で2時間反応させた後、更に110℃で2時間減圧脱泡攪拌し、ポリウレタンプレポリマー(粘度:24.0Pa・s/120℃)を得た。
(Comparative Example 3)
Polycarbonate diol (N-980, manufactured by Nippon Polyurethane Industry Co., Ltd., number of functional groups: 2.0, number average molecular weight: 2000) mainly composed of 1,6 hexanediol, which has been dehydrated in advance by a vacuum dryer, sebacic acid and 1,6- 100 parts by weight of a polyol component having a hydroxyl group molar ratio of 90/10 and diphenylmethane diisocyanate of a polyester polyol (Hitachi Kasei Polymer Co., Ltd. A-48, functional group number 2.0, number average molecular weight 5000) made mainly of hexanediol 17.4 parts by weight (NCO / OH ratio is 1.60) was charged into a reaction vessel capable of heating and defoaming and stirred for 2 hours at 110 ° C. with mixing and stirring in a nitrogen gas atmosphere. Defoaming and stirring under reduced pressure at 110 ° C. for 2 hours, polyurethane prepolymer (viscosity: 24.0 Pa · s / 120 ° C.) It was.
(比較例4)
予め真空乾燥機により脱水処理した1,6ヘキサンジオールを主成分とするポリカーボネートジオール(日本ポリウレタン工業株式会社製N−980、官能基数 2.0、数平均分子量2000)とセバチン酸と1,6−ヘキサンジオールを主成分とするポリエステルポリオール(日立化成ポリマー株式会社製A−48、官能基数 2.0、数平均分子量5000)の水酸基モル数比を90/10としたポリオール成分100重量部とジフェニルメタンジイソシアネート27.1重量部(NCO/OH比は2.50)を加熱、脱泡攪拌可能な反応容器に投入し、窒素ガス雰囲気中で混合撹拌しながら、110℃で2時間反応させた後、更に110℃で2時間減圧脱泡攪拌し、ポリウレタンプレポリマー(粘度:2.0Pa・s/120℃)を得た。
(Comparative Example 4)
Polycarbonate diol (N-980, manufactured by Nippon Polyurethane Industry Co., Ltd., number of functional groups: 2.0, number average molecular weight: 2000) mainly composed of 1,6 hexanediol, which has been dehydrated in advance by a vacuum dryer, sebacic acid and 1,6- 100 parts by weight of a polyol component having a hydroxyl group molar ratio of 90/10 and diphenylmethane diisocyanate of a polyester polyol (Hitachi Kasei Polymer Co., Ltd. A-48, functional group number 2.0, number average molecular weight 5000) made mainly of hexanediol 27.1 parts by weight (NCO / OH ratio is 2.50) was placed in a reaction vessel capable of being heated and degassed and stirred and reacted at 110 ° C. for 2 hours with mixing and stirring in a nitrogen gas atmosphere. Defoaming and stirring under reduced pressure at 110 ° C. for 2 hours gave a polyurethane prepolymer (viscosity: 2.0 Pa · s / 120 ° C.). .
実施例1〜2で得た本発明の一液湿気硬化型コーティング剤と比較例1〜4で得た一液湿気硬化型コーティング剤を用いて以下の試験を行った。 The following tests were conducted using the one-part moisture curable coating agent of the present invention obtained in Examples 1 and 2 and the one-part moisture curable coating agent obtained in Comparative Examples 1 to 4.
(固化時間)
20℃雰囲気中でPETシート(厚み:30μm)の上に120℃で1〜2時間放置した上記一液湿気硬化型コーティング剤をヘラでビード状(幅約2mm×高さ約2mm)に塗工し、放置したときに指にコーティング剤がついてこなくなるまでの時間および指でコーティング剤を押しても変形が見られない時間を固化時間として測定した。
(Solidification time)
Apply the above one-component moisture-curing coating agent on a PET sheet (thickness: 30 μm) in a 20 ° C. atmosphere at 120 ° C. for 1-2 hours with a spatula in a bead shape (width: about 2 mm × height: about 2 mm) Then, the time until the coating agent did not adhere to the finger when allowed to stand and the time when no deformation was observed even when the coating agent was pressed with the finger were measured as the solidification time.
(耐湿熱性)
ブリキ板(大きさ:50mm×180mm×0.25mm)の両端にポリエステルテープ(幅:10mm、厚み:約50μm)を3枚重ねたものを作製し、120℃で1〜2時間放置した上記一液湿気硬化型コーティング剤をガラス棒で厚みが約100〜150μmになるように調整しながら塗工し、室温(25℃)で24時間放置し硬化したものを試験片とした。この試験片を90℃、85%RHの恒温恒湿槽に垂直立てて入れ、コーティング剤の状態を観察評価した。軟化しないものを「○」、僅かに軟化したものを「△」、軟化したものを「×」として評価した。
(Moisture and heat resistance)
A piece of tin plate (size: 50 mm x 180 mm x 0.25 mm) with 3 layers of polyester tape (width: 10 mm, thickness: about 50 μm) was prepared and left at 120 ° C for 1-2 hours. The liquid moisture curable coating agent was applied with a glass rod while adjusting the thickness to be about 100 to 150 μm, and allowed to stand at room temperature (25 ° C.) for 24 hours to obtain a test piece. This test piece was placed vertically in a constant temperature and humidity chamber at 90 ° C. and 85% RH, and the state of the coating agent was observed and evaluated. Evaluation was made as “◯” for those that were not softened, “Δ” for those that were slightly softened, and “X” for those that were softened.
(耐熱性)
ブリキ板(大きさ:50mm×180mm×0.25mm)の両端にポリエステルテープ(幅:10mm、厚み:約50μm)を3枚重ねたものを作製し、120℃で1〜2時間放置した上記一液湿気硬化型コーティング剤をガラス棒で厚みが約100〜150μmになるように調整しながら塗工し、室温で24時間放置し硬化したものを試験片とした。この試験片を125℃の熱風循環乾燥機に垂直立てで入れ、コーティング剤の垂れを評価した。垂れがないものを「○」、僅かに垂れがあるものを「△」、垂れがあるものを「×」として評価した。
(Heat-resistant)
A piece of tin plate (size: 50 mm x 180 mm x 0.25 mm) with 3 layers of polyester tape (width: 10 mm, thickness: about 50 μm) was prepared and left at 120 ° C for 1-2 hours. A liquid moisture curable coating agent was applied with a glass rod while adjusting the thickness to be about 100 to 150 μm, and allowed to stand at room temperature for 24 hours to obtain a test piece. This test piece was placed vertically in a hot air circulating dryer at 125 ° C. to evaluate the dripping of the coating agent. The case where there was no dripping was evaluated as “◯”, the case where there was slight dripping was evaluated as “Δ”, and the case where there was dripping was evaluated as “×”.
(防湿絶縁性)
ガラスAg電極くし型基板(線間100μm)を用いて、コーティング剤を塗膜厚さ約150μmで回路板上に塗布・硬化した試験片に、DC60Vの電圧を印加し、60℃、90%RHに放置し、通電するまでの時間を測定した。500時間まで通電しないものを500<とした。
これらの測定結果をまとめて表1に示した。
(Moisture-proof insulation)
Using a glass Ag electrode comb substrate (100 μm between lines), a voltage of DC 60 V was applied to a test piece obtained by applying and curing a coating agent on a circuit board with a coating thickness of about 150 μm at 60 ° C. and 90% RH. The time until energization was measured. Those that were not energized until 500 hours were defined as 500 <.
These measurement results are summarized in Table 1.
表1の結果より、ポリカーボネートジオールのみを用いた比較例1は、耐湿熱性、防湿絶縁性は良好であるが固化時間が長い。また、2種類のポリエステルポリオールのみを用いた比較例2では、固化時間が短く硬化性は良好であるが、耐湿熱性、防湿絶縁性に劣る。これに対し、本発明のポリカーボネートジオールとポリエステルポリオールを併用した実施例1,2は、固化時間、耐湿熱性、防湿絶縁性に優れ、本発明の一液湿気硬化型コーティング剤は、各種電気・電子部品に使用される実装回路板の防湿絶縁等に適し、作業性に優れる。
From the results shown in Table 1, Comparative Example 1 using only polycarbonate diol has good heat and moisture resistance and moistureproof insulation, but has a long solidification time. Further, in Comparative Example 2 using only two types of polyester polyols, the solidification time is short and the curability is good, but the moisture and heat resistance and moisture proof insulation are poor. In contrast, Examples 1 and 2 in which the polycarbonate diol and the polyester polyol of the present invention are used in combination are excellent in solidification time, heat and moisture resistance, and moisture-proof insulating properties. Suitable for moisture-proof insulation of mounted circuit boards used for parts, and excellent workability.
Claims (4)
The method for producing an insulated electrical / electronic component according to claim 3, wherein the one-component moisture curable coating agent according to claim 1 or 2 is applied to an electrical / electronic component and cured.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130021416A (en) | 2010-10-22 | 2013-03-05 | 쇼와 덴코 가부시키가이샤 | Moisture-proof insulating material |
DE102016210629A1 (en) | 2015-06-19 | 2016-12-22 | Hyundai Mobis Co., Ltd. | A method of making a hot melt adhesive composition and hot melt adhesive composition prepared thereby |
-
2006
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130021416A (en) | 2010-10-22 | 2013-03-05 | 쇼와 덴코 가부시키가이샤 | Moisture-proof insulating material |
DE102016210629A1 (en) | 2015-06-19 | 2016-12-22 | Hyundai Mobis Co., Ltd. | A method of making a hot melt adhesive composition and hot melt adhesive composition prepared thereby |
US10023769B2 (en) | 2015-06-19 | 2018-07-17 | Hyundai Mobis Co., Ltd. | Method for preparing hot-melt adhesive composition and hot-melt adhesive composition prepared thereby |
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