JP2008159437A - Single liquid type coating agent for both light curing and moisture curing, electric-electronic component subjected to insulating treatment by the same, and its manufacturing method - Google Patents
Single liquid type coating agent for both light curing and moisture curing, electric-electronic component subjected to insulating treatment by the same, and its manufacturing method Download PDFInfo
- Publication number
- JP2008159437A JP2008159437A JP2006347732A JP2006347732A JP2008159437A JP 2008159437 A JP2008159437 A JP 2008159437A JP 2006347732 A JP2006347732 A JP 2006347732A JP 2006347732 A JP2006347732 A JP 2006347732A JP 2008159437 A JP2008159437 A JP 2008159437A
- Authority
- JP
- Japan
- Prior art keywords
- curing
- coating agent
- moisture
- electronic component
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Paints Or Removers (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
本発明は、特に電気・電子部品の防湿を目的とする防湿絶縁性、作業性に優れた一液型光硬化湿気硬化併用コーティング剤及びそれで絶縁処理された電気・電子部品及びその製造方法に関する。 The present invention relates to a one-component photocuring / moisture-curing combined coating agent excellent in moisture-proof insulation and workability especially for the purpose of moisture-proofing electrical / electronic components, and an electrical / electronic component insulated with the same, and a method for producing the same.
最近の電気・電子部品は小型軽量化および高性能化が進み、各種電気・電子部品に使用される実装回路板は高密度搭載がなされ、湿気、ほこり等から保護する目的で、アクリル樹脂、シリコーン樹脂塗料による保護コーティングやウレタン樹脂、エポキシ樹脂等による注型封止処理がなされている。このような実装回路板は、過酷な環境下、特に高湿度化で使用され、例えば洗濯機、自動車、フラットパネルディスプレイ等の機器に搭載されて使用されている。
しかし、前記塗料は実装回路板に搭載された電子部品のピン足を完全に保護コーティングできず、耐湿性が劣るという問題、シリコーン樹脂塗料の場合、硬化するまでの時間がかかり生産性に問題があった。
一方、注型処理に用いられるウレタン樹脂やエポキシ樹脂は優れた絶縁性、耐湿熱性を有するが、高温の条件下で長時間放置されると、酸化劣化により硬化物が硬くなり、部品、実装回路板等に応力がかかるとクラック、剥離が発生し、信頼性が低下する恐れがあった。
一部ではあるが、作業性に優れた、無溶剤の一液型湿気硬化コーティング材の検討もされてきたが、透湿性が高く、防湿コーティング剤としては不十分なものであった。
Recent electrical and electronic components are becoming smaller, lighter and higher in performance, and the mounting circuit boards used for various electrical and electronic components are mounted with high density to protect them from moisture, dust, etc. acrylic resin, silicone Protective coating with resin paint and casting sealing with urethane resin, epoxy resin, etc. are performed. Such a mounting circuit board is used in a severe environment, particularly at a high humidity, and is used by being mounted on a device such as a washing machine, an automobile, or a flat panel display.
However, the paint cannot completely protect the pin foot of the electronic component mounted on the mounting circuit board, resulting in inferior moisture resistance. In the case of silicone resin paint, it takes time to cure and there is a problem in productivity. there were.
On the other hand, urethane resin and epoxy resin used for casting treatment have excellent insulation and moisture and heat resistance, but when left for a long time under high temperature conditions, the cured product becomes hard due to oxidative degradation, and components and mounting circuits When stress is applied to a plate or the like, cracks and peeling occur, which may reduce reliability.
Although some studies have been made on a solvent-free one-component moisture-curing coating material excellent in workability, it has high moisture permeability and is insufficient as a moisture-proof coating agent.
本発明は、前記従来技術の問題点である透湿性を改善し、さらに、作業性に優れた硬化物を形成しうる一液型光硬化湿気硬化併用コーティング剤、及びそれで絶縁処理された信頼性の高い電気・電子部品、及びその製造方法を提供することを目的とする。 The present invention improves the moisture permeability, which is a problem of the prior art, and further provides a one-component photocuring / moisture-curing coating agent capable of forming a cured product excellent in workability, and reliability treated with insulation. It is an object of the present invention to provide an electrical / electronic component having a high level and a manufacturing method thereof.
本発明は［１］ （ａ）有機ポリイソシアネート化合物と（ｂ）ダイマー酸、ダイマージオールおよびそれらを水添したもののうち少なくとも一種以上を共重合成分として含有する数平均分子量が８０００以下のポリエステルポリオールとを、（ａ）／（ｂ）のＮＣＯ／ＯＨ比が１．８〜２．３となるように反応させて得られるポリウレタンプレポリマーの末端ＮＣＯ基数の５０〜９０％を、光重合性の（メタ）アクリロイル基変性した一液型光硬化湿気硬化併用コーティング剤である。
また、本発明は、［２］ 光重合開始剤をさらに含む上記［１］に記載の一液型光硬化湿気硬化併用コーティング剤である。
また、本発明は、［３］ 上記［１］または上記［２］に記載の一液型光硬化湿気硬化併用コーティング剤を用いて絶縁処理された電気・電子部品と、［４］ 上記［１］または上記［２］に記載の一液型光硬化湿気硬化併用コーティング剤を、電気・電子部品に塗布し、硬化させる絶縁処理された電気・電子部品の製造方法に関する。
The present invention provides: [1] (a) an organic polyisocyanate compound and (b) a polyester polyol having a number average molecular weight of 8000 or less containing at least one of dimer acid, dimer diol and hydrogenated compounds as a copolymerization component; Is reacted so that the NCO / OH ratio of (a) / (b) is 1.8 to 2.3, and 50 to 90% of the number of terminal NCO groups of the polyurethane prepolymer is converted to photopolymerizable ( It is a one-component photocuring and moisture curing combined coating agent modified with a (meth) acryloyl group.
In addition, the present invention is the one-component photocuring / moisture-curing combined coating agent according to the above [1], further comprising [2] a photopolymerization initiator.
The present invention also provides [3] an electrical / electronic component insulated using the one-component photocuring / moisture-curing combined coating agent according to [1] or [2], and [4] the above [1] Or a one-component photocuring / moisture-curing combined coating agent according to [2] above, which is applied to an electrical / electronic component and cured, and relates to a method for producing an insulated electrical / electronic component.
本発明の一液型光硬化湿気硬化併用コーティング剤は、透湿度が低く、かつ作業性に優れ、高い信頼性の絶縁処理された各種電気・電子部品を得ることができる。 The one-component photocuring / moisture-curing coating agent of the present invention has low moisture permeability, excellent workability, and can provide various highly reliable and electrically insulated electronic / electronic components.
（ａ）成分である有機ポリイソシアネート化合物は、ジイソシアネート化合物、トリイソシアネート化合物、テトライソシアネート化合物等のポリイソシアネートを用いることができる。例えば、トリレンジイソシアネート、ジフェニルメタンジイソシアネート、ナフタレンジイソシアネート、キシリレンジイソシアネート、ジフェニルスルホンジイソシアネート、ヘキサメチレンジイソシアネート、３−イソシアネートメチル−３，５，５−トリメチルシクロヘキシルイソシアネート、３−イソシアネートエチル−３，５，５−トリメチルシクロヘキシルイソシアネート、３−イソシアネートエチル−３，５，５−トリエチルシクロヘキシルイソシアネート、ジフェニルプロパンジイソシアネート、フェニレンジイソシアネート、シクロヘキシリレンジイソシアネート、３，３’−ジイソシアネートジプロピルエーテル、トリフェニルメタントリイソシアネート、ジフェニルエーテル−４，４’−ジイソシアネート、メチレンビス（４−シクロヘキシルイソシアネート）、イソホロンジイソシアネートなどのポリイソシアネート化合物が挙げられ、これらを単独で、または２種以上組合せて使用することができる。 As the organic polyisocyanate compound as component (a), polyisocyanates such as diisocyanate compounds, triisocyanate compounds, and tetraisocyanate compounds can be used. For example, tolylene diisocyanate, diphenylmethane diisocyanate, naphthalene diisocyanate, xylylene diisocyanate, diphenyl sulfone diisocyanate, hexamethylene diisocyanate, 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate, 3-isocyanate ethyl-3,5,5- Trimethylcyclohexyl isocyanate, 3-isocyanatoethyl-3,5,5-triethylcyclohexyl isocyanate, diphenylpropane diisocyanate, phenylene diisocyanate, cyclohexylene diisocyanate, 3,3′-diisocyanate dipropyl ether, triphenylmethane triisocyanate, diphenyl ether-4, 4'-diisocyanate, methylene Scan (4-cyclohexyl isocyanate), polyisocyanate compounds such as isophorone diisocyanate and the like, may be used in combination of these alone, or two or more.
（ｂ）成分のダイマー酸、ダイマージオール及びそれらを水添したもののうち少なくとも一種以上を共重合成分として含有する数平均分子量が８０００以下のポリエステルポリオールは、例えば二塩基酸とジオールとを反応させて得ることができる。
二塩基酸としてはコハク酸、グルタル酸、アジピン酸、ピメリン酸、スペリン酸、アゼライン酸、セバチン酸、ブラシル酸、ダイマー酸、水添ダイマー酸、イソフタル酸、テレフタル酸、ナフタレンジカルボン酸などのうちの一種またはそれらの組合せで用いることができる。
ジオールとしては、エチレングリコール、ジエチレングリコール、プロピレングリコール、ジプロピレングリコール、ブタンジオール、ネオペンチルグリコール、シクロヘキサンジオール、水添キシリレングリコール、キシリレングリコール、メチルペンタンジオール、ヘキサンジオール、ヘプタンジオール、オクタンジオール、ノナンジオール、デカンジオール、ドデカンジオール、ダイマージオール、水添ダイマージオールなどのうちの一種またはそれらの組合せで用いることができる。
これら二塩基酸とジオールのうちダイマー酸、ダイマージオールおよびそれらを水添したもののうちの少なくとも一種以上をポリエステルポリオールの必須成分とする以外はそれらの組合せに制限はない。ポリエステルポリオールの数平均分子量は８０００以下である必要がある。この値が８０００を超えるとコーティング剤の粘度が高くなり作業性が低下する。数平均分子量は、ＧＰＣにより分子量分布を測定し、標準ポリスチレン換算して測定した。
(B) A polyester polyol having a number average molecular weight of 8000 or less, which contains at least one of dimer acid, dimer diol and hydrogenated components thereof as a copolymer component, is obtained by, for example, reacting a dibasic acid and a diol. Obtainable.
Dibasic acids include succinic acid, glutaric acid, adipic acid, pimelic acid, spellic acid, azelaic acid, sebacic acid, brassylic acid, dimer acid, hydrogenated dimer acid, isophthalic acid, terephthalic acid, naphthalenedicarboxylic acid, etc. One or a combination thereof can be used.
Diols include ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, butanediol, neopentyl glycol, cyclohexanediol, hydrogenated xylylene glycol, xylylene glycol, methylpentanediol, hexanediol, heptanediol, octanediol, and nonane. One or a combination of diol, decane diol, dodecane diol, dimer diol, hydrogenated dimer diol and the like can be used.
Among these dibasic acids and diols, there is no limitation on the combination thereof except that at least one of dimer acid, dimer diol and hydrogenated products thereof is an essential component of the polyester polyol. The number average molecular weight of the polyester polyol needs to be 8000 or less. When this value exceeds 8000, the viscosity of the coating agent increases and workability decreases. The number average molecular weight was measured in terms of standard polystyrene by measuring the molecular weight distribution by GPC.
本発明において（ａ）成分の有機ポリイソシアネート化合物と（ｂ）成分のダイマー酸、ダイマージオールおよびそれらを水添したもののうち少なくとも一種以上を共重合成分として含有する数平均分子量が８０００以下のポリエステルポリオールとは、（ａ）／（ｂ）のＮＣＯ／ＯＨ比が１．８〜２．３の範囲となるように配合される。１．８未満では、得られるプレポリマーの粘度が高くなり過ぎ、作業性の悪化を招き、塗布作業時の加熱安定性も劣る傾向がある。一方、２．３を超えると得られる被膜が硬くなり、電気・電子部品、実装回路板等に応力がかかるとクラック、剥離が発生し、信頼性が低下する恐れがあるためである。
また、上記有機ポリイソシアネート化合物とポリエステルポリオールからポリウレタンプレポリマーを得るには、加熱および脱泡可能な混合機を用いて、５０〜１３０℃の範囲で窒素ガスをパージする等の方法で空気を遮断しつつ数時間加熱、反応させる。
In the present invention, the polyester polyol having a number average molecular weight of 8000 or less, comprising at least one of the organic polyisocyanate compound as component (a) and dimer acid, dimer diol as component (b) and hydrogenated components thereof as a copolymer component. Is blended so that the NCO / OH ratio of (a) / (b) is in the range of 1.8 to 2.3. If it is less than 1.8, the viscosity of the resulting prepolymer will be too high, resulting in poor workability and poor heat stability during the coating operation. On the other hand, if it exceeds 2.3, the resulting coating becomes hard, and if stress is applied to electrical / electronic components, mounted circuit boards, etc., cracks and peeling may occur and reliability may be reduced.
In addition, in order to obtain a polyurethane prepolymer from the above organic polyisocyanate compound and polyester polyol, air is shut off by a method such as purging nitrogen gas in the range of 50 to 130 ° C using a mixer that can be heated and defoamed. Then, heat and react for several hours.
ポリウレタンプレポリマーの末端ＮＣＯ基を光重合性の（メタ）アクリロイル基変性する場合に用いる光重合性モノマーとしては、ＮＣＯ基と反応性を有する官能基、例えば水酸基を分子構造内に有する光重合性モノマーを用いることができる。２−ヒドロキシエチル（メタ）アクリレート、２−ヒドロキシプロピル（メタ）アクリレート、２−ヒドロキシイソプロピル（メタ）アクリレート、３−ヒドロキシプロピル（メタ）アクリレートおよび４−ヒドロキシブチル（メタ）アクリレート、ブタンジオールモノ（メタ）アクリレート、クロロ−２−ヒドロキシプロピル（メタ）アクリレート、エチレングリコールモノ（メタ）アクリレートなどの（ポリ）アルキレングリコ−ルモノアクリレ−トなどが挙げられる。
この場合、末端官能基数の５０〜９０％を光重合性の（メタ）アクリロイル基とし、残りはＮＣＯ基としておく必要がある。５０％未満の場合、紫外線照射のみでは硬化不足であり湿気による硬化までに時間がかかり生産性に劣る問題がある。一方、９０％を超えると各種基材との密着性が低下する。
また、上記ポリウレタンプレポリマーと水酸基を有する光重合性モノマーから一液型光硬化湿気硬化併用コーティング剤を得るには、加熱および脱泡可能な混合機を用いて、５０〜１３０℃の範囲で酸素ガスをパージする等の方法で数時間加熱、反応させる。ここで、（メタ）アクリロイル基は、アクリロイル基、メタアクリロイル基をそれぞれ示し、両者の混合物であっても良い。
The photopolymerizable monomer used when the terminal NCO group of the polyurethane prepolymer is modified with a photopolymerizable (meth) acryloyl group is a photopolymerizable monomer having a functional group having reactivity with the NCO group, for example, a hydroxyl group in the molecular structure. Monomers can be used. 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxyisopropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate, butanediol mono (meta) ) Acrylate, chloro-2-hydroxypropyl (meth) acrylate, (poly) alkylene glycol monoacrylate such as ethylene glycol mono (meth) acrylate, and the like.
In this case, it is necessary that 50 to 90% of the number of terminal functional groups be photopolymerizable (meth) acryloyl groups and the rest be NCO groups. If it is less than 50%, curing by ultraviolet irradiation alone is insufficient and there is a problem that it takes time to cure by moisture and is inferior in productivity. On the other hand, when it exceeds 90%, adhesiveness with various base materials will fall.
In addition, in order to obtain a one-component photocuring / moisture-curing combined coating agent from the polyurethane prepolymer and a photopolymerizable monomer having a hydroxyl group, oxygen can be used in a range of 50 to 130 ° C. using a mixer capable of heating and defoaming. Heat and react for several hours, such as by purging gas. Here, the (meth) acryloyl group represents an acryloyl group and a methacryloyl group, respectively, and may be a mixture of both.
本発明では、光重合開始剤を含むことが好ましい。例えば、ベンゾイン、ベンゾインイソブチルエーテル、ベンジルジメチルケタール、エチルフェニルグリオキシレート、ジエトキシアセトフェノン、１，１−ジクロロアセトフェノン、４′−イソプロピル−２−ヒドロキシ−２−メチルプロピオフェノン、１−ヒドロキシシクロヘキシルフェニルケトン、ベンゾフェノン、ベンゾフェノン／ジエタノールアミン、４，４′−ビスジメチルアミノベンゾフェノン、２−メチルチオキサントン、ｔｅｒｔ−ブチルアントラキノン、ベンジル等のカルボニル化合物；テトラメチルチウラムモノスルフィド、テトラメチルチウラムジスルフィド等の硫黄化合物；アゾビスイソブチロニトリル、アゾビス−２，４−ジメチルバレロニトリル等のアゾ化合物；ベンゾイルパーオキサイド、ジ−ｔｅｒｔ−ブチルパーオキサイド等のパーオキサイド化合物（有機過酸化物）１種もしくは２種以上の混合系で使用される。光重合開始剤は、光重合性の（メタ）アクリロイル基変性した一液型光硬化湿気硬化併用コーティング剤１００重量部に０．１〜１０重量部配合することが好ましい。０．１重量部未満では光重合性の効果が少なく硬化までに時間がかかる。また、１０重量部を超えて配合するとコーティング剤が着色したり、見合う効果が得られないばかりか、コーティング剤表面にこの光重合開始剤が残留するため好ましくない。 In this invention, it is preferable that a photoinitiator is included. For example, benzoin, benzoin isobutyl ether, benzyl dimethyl ketal, ethylphenylglyoxylate, diethoxyacetophenone, 1,1-dichloroacetophenone, 4'-isopropyl-2-hydroxy-2-methylpropiophenone, 1-hydroxycyclohexylphenyl Carbonyl compounds such as ketone, benzophenone, benzophenone / diethanolamine, 4,4'-bisdimethylaminobenzophenone, 2-methylthioxanthone, tert-butylanthraquinone, benzyl; sulfur compounds such as tetramethylthiuram monosulfide and tetramethylthiuram disulfide; azo Azo compounds such as bisisobutyronitrile and azobis-2,4-dimethylvaleronitrile; benzoyl peroxide, di-tert- Peroxide compounds such as chill peroxide used in the (organic peroxide) one or a mixture of two or more systems. The photopolymerization initiator is preferably blended in an amount of 0.1 to 10 parts by weight per 100 parts by weight of the photopolymerizable (meth) acryloyl group-modified one-component photocuring / moisture-curing coating agent. If it is less than 0.1 part by weight, the photopolymerization effect is small and it takes time to cure. If the amount exceeds 10 parts by weight, the coating agent will not be colored or a suitable effect will not be obtained, and the photopolymerization initiator will remain on the coating agent surface, which is not preferable.
本発明では、必要に応じて、熱可塑性ポリマー（ポリウレタン、エチレン系共重合体、プロピレン系共重合体、塩化ビニル系共重合体、アクリル共重合体、スチレン−共役ジエンブロック共重合体等の各種ゴム系）、粘着付与樹脂（ロジン樹脂、ロジンエステル樹脂、水添ロジンエステル樹脂、テルペン樹脂、テルペンフェノール樹脂、水添テルペン樹脂、石油樹脂、水添石油樹脂、クマロン樹脂、ケトン樹脂、スチレン樹脂、変性スチレン樹脂、キシレン樹脂、エポキシ樹脂等の各種樹脂系）、さらに触媒（ジブチルチンジラウレート、ジブチルチンジオクテート、ジメチルシクロヘキシルアミン、ジメチルベンジルアミン、トリオクチルアミン等）、顔料または染料、酸化防止剤、紫外線吸収剤、界面活性剤、難燃剤、充填剤等を適量配合しても良い。 In the present invention, if necessary, various kinds of thermoplastic polymers (polyurethane, ethylene copolymer, propylene copolymer, vinyl chloride copolymer, acrylic copolymer, styrene-conjugated diene block copolymer, etc.). Rubber), tackifying resin (rosin resin, rosin ester resin, hydrogenated rosin ester resin, terpene resin, terpene phenol resin, hydrogenated terpene resin, petroleum resin, hydrogenated petroleum resin, coumarone resin, ketone resin, styrene resin, Modified styrene resin, xylene resin, epoxy resin, and other resins), catalysts (dibutyltin dilaurate, dibutyltin dioctate, dimethylcyclohexylamine, dimethylbenzylamine, trioctylamine, etc.), pigments or dyes, antioxidants, Appropriate amount of UV absorber, surfactant, flame retardant, filler, etc. It may be.
本発明になる一液型光硬化湿気硬化併用コーティング剤を用いて絶縁される電気・電子部品としてはマイコン、トランジスタ、コンデンサ、抵抗、リレー、トランス等、及びこれらを搭載した実装回路板などが挙げられ、さらにこれら電気・電子部品に接合されるリード線、ハーネス、フィルム基板等も含むことができる。また、液晶ディスプレイパネル、プラズマディスプレイパネル、有機エレクトロルミネッセンスパネル、フィールドエミッションディスプレイパネル等のフラットパネルディスプレイパネルの信号入力部等も挙げられる。 Examples of the electrical / electronic components insulated using the one-component photocuring / moisture-curing combined coating agent according to the present invention include a microcomputer, a transistor, a capacitor, a resistor, a relay, a transformer, and a mounting circuit board on which these are mounted. Furthermore, lead wires, harnesses, film substrates, and the like joined to these electric / electronic components can also be included. Moreover, the signal input part of flat panel display panels, such as a liquid crystal display panel, a plasma display panel, an organic electroluminescent panel, a field emission display panel, etc. are mentioned.
本発明になる一液型光硬化湿気硬化併用コーティング剤を用いて絶縁される電気・電子部品の製造方法としては、例えば、一液光硬化湿気硬化併用型コーティング剤を上記電気・電子部品上に塗布し１００〜３０００ｍＪ／ｃｍ２の紫外線を照射ののち、空気中の水分により湿気硬化させれば良い。 As a method for producing an electrical / electronic component that is insulated using the one-component photocuring / moisture-curing combined coating agent according to the present invention, for example, the one-component photocuring / moisture-curing combined coating agent is applied on the electric / electronic component. After applying and irradiating ultraviolet rays of 100 to 3000 mJ / cm 2 , moisture curing may be performed with moisture in the air.
以下に実施例および比較例により本発明をさらに具体的に説明し、表１にこれら具体例の結果を示すが、本発明はこれらによって制限されるものではない。 The present invention will be described more specifically with reference to the following examples and comparative examples. The results of these specific examples are shown in Table 1, but the present invention is not limited thereto.
（実施例１）
ジエチレングリコールとダイマー酸を主成分とするポリエステルポリオール（日立化成ポリマー株式会社製テスラック２４７０、数平均分子量２２００）１１０重量部とジフェニルメタンジイソシアネート２５重量部（ＮＣＯ／ＯＨ比は２．０）を加熱、脱泡攪拌可能な反応容器に投入し、窒素ガス雰囲気中で混合撹拌しながら、１１０℃で２時間反応させた後、２−ヒドロキシエチルアクリレート９．３重量部を加え、続いて酸素ガス雰囲気中１１０℃で２時間混合撹拌した。光重合開始剤（チバ・スペシャリティーケミカルズ社製、イルガキュア１８４、１−ヒドロキシ−シクロヘキシル−フェニル−ケトン）４．３重量部を添加し、１時間減圧脱泡撹拌し一液型光硬化湿気硬化併用コーティング剤（粘度：３．０Ｐａ・ｓ／１２０℃）を得た。
(Example 1)
Heating and defoaming 110 parts by weight of a polyester polyol mainly composed of diethylene glycol and dimer acid (Teslac 2470, Hitachi Chemical Co., Ltd., number average molecular weight 2200) and 25 parts by weight of diphenylmethane diisocyanate (NCO / OH ratio is 2.0) The reaction vessel was put into a stirrable reaction vessel and reacted at 110 ° C. for 2 hours while mixing and stirring in a nitrogen gas atmosphere. Then, 9.3 parts by weight of 2-hydroxyethyl acrylate was added, and subsequently 110 ° C. in an oxygen gas atmosphere. And stirred for 2 hours. 4.3 parts by weight of a photopolymerization initiator (Ciba Specialty Chemicals, Irgacure 184, 1-hydroxy-cyclohexyl-phenyl-ketone) was added and degassed and stirred under reduced pressure for 1 hour, combined with one-part photocuring and moisture curing. A coating agent (viscosity: 3.0 Pa · s / 120 ° C.) was obtained.
（実施例２）
ジエチレングリコールとダイマー酸を主成分とするポリエステルポリオール（日立化成ポリマー株式会社製テスラック２４７０、数平均分子量２２００）１１０重量部とジフェニルメタンジイソシアネート２８．８重量部（ＮＣＯ／ＯＨ比は２．３）を加熱、脱泡攪拌可能な反応容器に投入し、窒素ガス雰囲気中で混合撹拌しながら、１１０℃で２時間反応させた後、２−ヒドロキシエチルアクリレート７．５重量部を加え、続いて酸素ガス雰囲気中１１０℃で２時間混合撹拌した。光重合開始剤（チバ・スペシャリティーケミカルズ社製、イルガキュア１８４、１−ヒドロキシ−シクロヘキシル−フェニル−ケトン）４．４重量部を添加し、１時間減圧脱泡撹拌し一液型光硬化湿気硬化併用コーティング剤（粘度：２．９Ｐａ・ｓ／１２０℃）を得た。
(Example 2)
Heating 110 parts by weight of a polyester polyol mainly composed of diethylene glycol and dimer acid (Teslac 2470 manufactured by Hitachi Chemical Co., Ltd., number average molecular weight 2200) and 28.8 parts by weight of diphenylmethane diisocyanate (NCO / OH ratio is 2.3), After putting into a reaction vessel capable of defoaming stirring and mixing and stirring in a nitrogen gas atmosphere, the mixture was reacted at 110 ° C. for 2 hours, and then 7.5 parts by weight of 2-hydroxyethyl acrylate was added, and then in an oxygen gas atmosphere The mixture was stirred at 110 ° C. for 2 hours. Add 4.4 parts by weight of photopolymerization initiator (Ciba Specialty Chemicals, Irgacure 184, 1-hydroxy-cyclohexyl-phenyl-ketone) A coating agent (viscosity: 2.9 Pa · s / 120 ° C.) was obtained.
（比較例１）
ジエチレングリコールとダイマー酸を主成分とするポリエステルポリオール（日立化成ポリマー株式会社製テスラック２４７０、数平均分子量２２００）１１０重量部とジフェニルメタンジイソシアネート２５重量部（ＮＣＯ／ＯＨ比は２．０）を加熱、脱泡攪拌可能な反応容器に投入し、窒素ガス雰囲気中で混合撹拌しながら、１１０℃で２時間反応させた後、２−ヒドロキシエチルアクリレート３．５重量部を加え、続いて酸素ガス雰囲気中１１０℃で２時間混合撹拌した。光重合開始剤（チバ・スペシャリティーケミカルズ社製、イルガキュア１８４、１−ヒドロキシ−シクロヘキシル−フェニル−ケトン）４．２重量部を添加し、１時間減圧脱泡撹拌し一液型光硬化湿気硬化併用コーティング剤（粘度：２．９Ｐａ・ｓ／１２０℃）を得た。
(Comparative Example 1)
Heating and defoaming 110 parts by weight of a polyester polyol mainly composed of diethylene glycol and dimer acid (Teslac 2470, Hitachi Chemical Co., Ltd., number average molecular weight 2200) and 25 parts by weight of diphenylmethane diisocyanate (NCO / OH ratio is 2.0) The reaction vessel was put into a stirrable reaction vessel and reacted for 2 hours at 110 ° C. with mixing and stirring in a nitrogen gas atmosphere. Then, 3.5 parts by weight of 2-hydroxyethyl acrylate was added, and subsequently 110 ° C. in an oxygen gas atmosphere. And stirred for 2 hours. 4.2 parts by weight of a photopolymerization initiator (Ciba Specialty Chemicals, Irgacure 184, 1-hydroxy-cyclohexyl-phenyl-ketone) was added, stirred under vacuum for 1 hour, and combined with a one-part photocuring and moisture curing. A coating agent (viscosity: 2.9 Pa · s / 120 ° C.) was obtained.
（比較例２）
ジエチレングリコールとダイマー酸を主成分とするポリエステルポリオール（日立化成ポリマー株式会社製テスラック２４７０、数平均分子量２２００）１１０重量部とジフェニルメタンジイソシアネート２５重量部（ＮＣＯ／ＯＨ比は２．０）を加熱、脱泡攪拌可能な反応容器に投入し、窒素ガス雰囲気中で混合撹拌しながら、１１０℃で２時間反応させた後、２−ヒドロキシエチルアクリレート１１．６重量部を加え、続いて酸素ガス雰囲気中１１０℃で２時間混合撹拌した。光重合開始剤（チバ・スペシャリティーケミカルズ社製、イルガキュア１８４、１−ヒドロキシ−シクロヘキシル−フェニル−ケトン）４．４重量部を添加し、１時間減圧脱泡撹拌し一液型光硬化湿気硬化併用コーティング剤（粘度：３．１Ｐａ・ｓ／１２０℃）を得た。
(Comparative Example 2)
Heating and defoaming 110 parts by weight of a polyester polyol mainly composed of diethylene glycol and dimer acid (Teslac 2470, Hitachi Chemical Co., Ltd., number average molecular weight 2200) and 25 parts by weight of diphenylmethane diisocyanate (NCO / OH ratio is 2.0) The reaction vessel was put into a stirrable reaction vessel and reacted for 2 hours at 110 ° C. while mixing and stirring in a nitrogen gas atmosphere. Then, 11.6 parts by weight of 2-hydroxyethyl acrylate was added, and subsequently 110 ° C. in an oxygen gas atmosphere. And stirred for 2 hours. Add 4.4 parts by weight of photopolymerization initiator (Ciba Specialty Chemicals, Irgacure 184, 1-hydroxy-cyclohexyl-phenyl-ketone) A coating agent (viscosity: 3.1 Pa · s / 120 ° C.) was obtained.
（比較例３）
ジエチレングリコールとダイマー酸を主成分とするポリエステルポリオール（試作品、数平均分子量１００００）１００重量部とジフェニルメタンジイソシアネート２．５重量部（ＮＣＯ／ＯＨ比は２．０）を加熱、脱泡攪拌可能な反応容器に投入し、窒素ガス雰囲気中で混合撹拌しながら、１１０℃で２時間反応させた後、２−ヒドロキシエチルアクリレート０．９重量部を加え、続いて酸素ガス雰囲気中１１０℃で２時間混合撹拌した。光重合開始剤（チバ・スペシャリティーケミカルズ社製、イルガキュア１８４、１−ヒドロキシ−シクロヘキシル−フェニル−ケトン）３．１重量部を添加し、１時間減圧脱泡撹拌し一液型光硬化湿気硬化併用コーティング剤（粘度：３０．０Ｐａ・ｓ／１２０℃）を得た。
(Comparative Example 3)
A reaction in which 100 parts by weight of a polyester polyol (prototype, number average molecular weight 10,000) based on diethylene glycol and dimer acid and 2.5 parts by weight of diphenylmethane diisocyanate (NCO / OH ratio is 2.0) can be heated and defoamed and stirred. The mixture was put into a container and reacted at 110 ° C. for 2 hours with mixing and stirring in a nitrogen gas atmosphere, then 0.9 parts by weight of 2-hydroxyethyl acrylate was added, and then mixed at 110 ° C. in an oxygen gas atmosphere for 2 hours. Stir. 3.1 parts by weight of a photopolymerization initiator (Ciba Specialty Chemicals, Irgacure 184, 1-hydroxy-cyclohexyl-phenyl-ketone) was added and degassed and stirred under reduced pressure for 1 hour, combined with one-part photocuring and moisture curing. A coating agent (viscosity: 30.0 Pa · s / 120 ° C.) was obtained.
（比較例４）
予め真空乾燥機により脱水処理した１，６−ヘキサンジオールを主成分とするポリカーボネートジオール（日本ポリウレタン工業株式会社製Ｎ−９８０、官能基数 ２．０、数平均分子量２０００）とセバチン酸と１，６ヘキサンジオールを主成分とするポリエステルポリオール（日立化成ポリマー株式会社製Ａ−４８，官能基数 ２．０、数平均分子量５０００）の水酸基モル数比を９０／１０としたポリオール成分１００重量部とジフェニルメタンジイソシアネート２１．７重量部（ＮＣＯ／ＯＨ比は２．０）を加熱、脱泡攪拌可能な反応容器に投入し、窒素ガス雰囲気中で混合撹拌しながら、１１０℃で２時間反応させた後、更に１１０℃で２時間減圧脱泡攪拌し、一液型湿気硬化コーティング剤（粘度：７．０Ｐａ・ｓ／１２０℃）を得た。
(Comparative Example 4)
Polycarbonate diol (N-980 made by Nippon Polyurethane Industry Co., Ltd., functional group number 2.0, number average molecular weight 2000) made of 1,6-hexanediol, which has been dehydrated in advance by a vacuum dryer, sebacic acid and 1,6 100 parts by weight of a polyol component having a hydroxyl group molar ratio of 90/10 and diphenylmethane diisocyanate of a polyester polyol (Hitachi Kasei Polymer Co., Ltd., A-48, functional group number 2.0, number average molecular weight 5000) made of hexanediol as a main component 21.7 parts by weight (NCO / OH ratio is 2.0) was charged into a reaction vessel capable of being heated and degassed and stirred, and reacted at 110 ° C. for 2 hours with mixing and stirring in a nitrogen gas atmosphere. Defoaming and stirring under reduced pressure at 110 ° C. for 2 hours, a one-component moisture-curing coating agent (viscosity: 7.0 Pa · s / 120 ° C.) It was.
実施例１、２で得た本発明の一液型光硬化湿気硬化併用コーティング剤と比較例１〜４で得た一液型光硬化湿気硬化併用コーティング剤または一液型湿気硬化コーティング剤を用いて以下の試験を行った。
尚、実施例１、２および比較例１〜３は塗工後１０００ｍＪ／ｃｍ２の紫外線を照射の後、以下の試験を実施した。
Using the one-component photocuring and moisture-curing combined coating agent of the present invention obtained in Examples 1 and 2 and the one-component photocuring and moisture-curing combined coating agent or one-component moisture-curing coating agent obtained in Comparative Examples 1 to 4 The following tests were conducted.
Examples 1 and 2 and Comparative Examples 1 to 3 were subjected to the following tests after being irradiated with 1000 mJ / cm 2 of ultraviolet light after coating.
（塗工作業性）
２０℃雰囲気中でＰＥＴシート（厚み：３０μｍ）の上に１２０℃で溶融した上記コーティング剤をヘラで塗工（厚み約０．５ｍｍ）した時の表面平滑性を目視にて確認した。
(Coating workability)
The surface smoothness when the coating agent melted at 120 ° C. on a PET sheet (thickness: 30 μm) in a 20 ° C. atmosphere was applied with a spatula (thickness: about 0.5 mm) was visually confirmed.
（固化時間）
２０℃雰囲気中でＰＥＴシート（厚み：３０μｍ）の上に１２０℃で溶融した上記コーティング剤をヘラで塗工（厚み約０．５ｍｍ）し、放置したときに指にコーティング剤がついてこなくなるまでの時間および指でコーティング剤を押しても変形が見られない時間を固化時間として測定した。
(Solidification time)
Apply the above coating agent melted at 120 ° C on a PET sheet (thickness: 30 µm) in a 20 ° C atmosphere with a spatula (thickness of about 0.5 mm) until the coating agent does not adhere to the fingers when left standing The time during which no deformation was observed even when the coating agent was pressed with a finger was measured as the solidification time.
（密着性）
汎布の上に１２０℃で溶融した上記コーティング剤をヘラで塗工（厚み約１ｍｍ）し、ＰＰシート（厚み：１００μｍ）を貼り合せる。実施例１〜２および比較例１〜３は１０００ｍＪ／ｃｍ２の紫外線をＰＰシート面から照射し、その後、比較例４とともに室温（２５℃）で２４時間以上放置し硬化したものを試験片とした。この試験片を２３℃雰囲気下において剥離試験を行った。
(Adhesion)
The above-mentioned coating agent melted at 120 ° C. is applied on a general cloth with a spatula (thickness: about 1 mm), and a PP sheet (thickness: 100 μm) is bonded. Examples 1-2 and Comparative Examples 1-3 irradiate 1000 mJ / cm 2 of ultraviolet rays from the PP sheet surface, and then, after being allowed to stand for 24 hours or more together with Comparative Example 4 at room temperature (25 ° C.) did. The test piece was subjected to a peel test in an atmosphere at 23 ° C.
（透湿度）
１２０℃で溶融した上記コーティング剤を離型処理の施されたＰＥＴシートで挿み、厚みが約１００μｍになるようプレスした。実施例１、２および比較例１〜３は１０００ｍＪ／ｃｍ２の紫外線照射し、その後、比較例４とともに室温（２５℃）で２４時間以上放置し硬化したものを試験片とした。この試験片を用いてＪＩＳＺ０２０８「防湿包装材の透湿度試験方法（カップ法）」に準じて透湿度を測定した。
これらの測定結果をまとめて表１に示した。
(Moisture permeability)
The coating agent melted at 120 ° C. was inserted with a release-treated PET sheet and pressed to a thickness of about 100 μm. Examples 1 and 2 and Comparative Examples 1 to 3 were irradiated with ultraviolet rays of 1000 mJ / cm 2 and then allowed to stand for 24 hours or more together with Comparative Example 4 at room temperature (25 ° C.) to obtain test pieces. Using this test piece, the moisture permeability was measured according to JISZ0208 “Moisture permeability test method for moisture-proof packaging material (cup method)”.
These measurement results are summarized in Table 1.
表１の結果より、末端官能基比率中光重合性のアクリロイル基の割合が３０％である比較例１は、固化時間が長い。また、末端官能基が全て光重合性のアクリロイル基である比較例２は、固化時間は短いが密着性が低くなる。ベースポリエステルポリオールの分子量が１００００である比較例３では樹脂粘度が高く、塗工作業性が悪くなる。作業性が良好である比較例４は、透湿度の面で本発明を検証した実施例１、２より劣る。よって、本発明は、塗工作業性、固化時間、密着性に優れ、透湿度が低い。本発明の一液型光硬化湿気硬化併用コーティング剤は、各種電気・電子部品を搭載する実装回路板の防湿絶縁等に適する。 From the results of Table 1, Comparative Example 1 in which the ratio of the photopolymerizable acryloyl group in the terminal functional group ratio is 30% has a long solidification time. In Comparative Example 2 in which all terminal functional groups are photopolymerizable acryloyl groups, the solidification time is short, but the adhesion is low. In Comparative Example 3 in which the molecular weight of the base polyester polyol is 10,000, the resin viscosity is high and the coating workability is deteriorated. Comparative Example 4 with good workability is inferior to Examples 1 and 2 in which the present invention was verified in terms of moisture permeability. Therefore, this invention is excellent in coating workability | operativity, solidification time, and adhesiveness, and its moisture permeability is low. The one-component photo-curing and moisture-curing coating agent of the present invention is suitable for moisture-proof insulation of a mounting circuit board on which various electric / electronic components are mounted.
（実施例３）
実施例１、２で得られた一液型光硬化湿気硬化併用コーティング剤を、４層多層板にＬＳＩ、コンデンサ、チップ抵抗を両面に実装した実装回路板に、１２０℃の温度で約０．５ｍｍ厚みとなるように塗布し、１０００ｍＪ／ｃｍ２の紫外線を照射し、室温に１日放置し硬化させた。電子部品と多層板の隙間をコーティング剤が十分に埋めており、これを５０℃、９５％ＲＨの雰囲気に２４時間放置してもクラック、剥離が発生せず、信頼性に優れていた。
(Example 3)
The one-component photocuring / moisture-curing combined coating agent obtained in Examples 1 and 2 was mounted on a circuit board having LSI, a capacitor, and a chip resistor mounted on both sides on a four-layer multilayer board at a temperature of about 0. The film was applied to a thickness of 5 mm, irradiated with 1000 mJ / cm 2 ultraviolet light, and allowed to stand at room temperature for 1 day to be cured. The coating agent was sufficiently filled in the gap between the electronic component and the multilayer board, and even if this was left in an atmosphere of 50 ° C. and 95% RH for 24 hours, cracks and peeling did not occur and the reliability was excellent.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006347732A JP2008159437A (en) | 2006-12-25 | 2006-12-25 | Single liquid type coating agent for both light curing and moisture curing, electric-electronic component subjected to insulating treatment by the same, and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006347732A JP2008159437A (en) | 2006-12-25 | 2006-12-25 | Single liquid type coating agent for both light curing and moisture curing, electric-electronic component subjected to insulating treatment by the same, and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2008159437A true JP2008159437A (en) | 2008-07-10 |
Family
ID=39660110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006347732A Pending JP2008159437A (en) | 2006-12-25 | 2006-12-25 | Single liquid type coating agent for both light curing and moisture curing, electric-electronic component subjected to insulating treatment by the same, and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008159437A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4329046B1 (en) * | 2008-02-27 | 2009-09-09 | Ｄｉｃ株式会社 | Moisture permeable film, method for producing the same, and laminate using the same |
| JP2010100711A (en) * | 2008-10-22 | 2010-05-06 | Hitachi Kasei Polymer Co Ltd | Urethan(meth)acrylate composition and sealant |
| WO2011074504A1 (en) * | 2009-12-14 | 2011-06-23 | 昭和電工株式会社 | Photocurable moistureproof insulating coating material |
| JP2012121935A (en) * | 2010-12-06 | 2012-06-28 | Denso Corp | Photocurable drip-proofing material |
| WO2013118655A1 (en) * | 2012-02-07 | 2013-08-15 | 昭和電工株式会社 | Urethane (meth)acrylate and moisture-proof insulating coating material |
| WO2014065048A1 (en) * | 2012-10-26 | 2014-05-01 | 昭和電工株式会社 | Novel electronic circuit reinforcing agent |
| WO2014188850A1 (en) * | 2013-05-21 | 2014-11-27 | 昭和電工株式会社 | Light-shielding moisture-proof insulating coating material, sealing/insulating treatment method using light-shielding moisture-proof insulating coating material, and electronic component which is sealed/insulated using light-shielding moisture-proof insulating coating material |
| KR101623778B1 (en) | 2011-12-27 | 2016-05-24 | 쇼와 덴코 가부시키가이샤 | Polymerizable composition, polymer, image-display device, and manufacturing method therefor |
| CN106752877A (en) * | 2017-01-17 | 2017-05-31 | 福州展辰新材料有限公司 | A kind of white UV coating |
| JP2018016731A (en) * | 2016-07-28 | 2018-02-01 | 株式会社ブリヂストン | Composition for coating material for water-area product, coating material for water-area product and water-area product |
| CN111500181A (en) * | 2020-05-20 | 2020-08-07 | 宿迁市同创化工科技股份有限公司 | Preparation method of ultraviolet-moisture dual-curing acid-and-alkali-resistant conformal coating |
| CN113462346A (en) * | 2021-07-27 | 2021-10-01 | 重庆中科力泰高分子材料股份有限公司 | UV/moisture dual-curing polyurethane hot melt adhesive with high initial adhesion and excellent drop resistance, and preparation method and application thereof |
| CN114574091A (en) * | 2022-03-15 | 2022-06-03 | 武汉华工正源光子技术有限公司 | UV-moisture dual-curing three-proofing paint for optical module and preparation method and application thereof |
-
2006
- 2006-12-25 JP JP2006347732A patent/JP2008159437A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4329046B1 (en) * | 2008-02-27 | 2009-09-09 | Ｄｉｃ株式会社 | Moisture permeable film, method for producing the same, and laminate using the same |
| JP2010100711A (en) * | 2008-10-22 | 2010-05-06 | Hitachi Kasei Polymer Co Ltd | Urethan(meth)acrylate composition and sealant |
| WO2011074504A1 (en) * | 2009-12-14 | 2011-06-23 | 昭和電工株式会社 | Photocurable moistureproof insulating coating material |
| JP2012121935A (en) * | 2010-12-06 | 2012-06-28 | Denso Corp | Photocurable drip-proofing material |
| KR101623778B1 (en) | 2011-12-27 | 2016-05-24 | 쇼와 덴코 가부시키가이샤 | Polymerizable composition, polymer, image-display device, and manufacturing method therefor |
| US20150005406A1 (en) * | 2012-02-07 | 2015-01-01 | Showa Denko K.K. | Urethane (meth)acrylate and moisture-proof insulating coating material |
| CN104093761A (en) * | 2012-02-07 | 2014-10-08 | 昭和电工株式会社 | Urethane (meth)acrylate and moisture-proof insulating coating material |
| WO2013118655A1 (en) * | 2012-02-07 | 2013-08-15 | 昭和電工株式会社 | Urethane (meth)acrylate and moisture-proof insulating coating material |
| WO2014065048A1 (en) * | 2012-10-26 | 2014-05-01 | 昭和電工株式会社 | Novel electronic circuit reinforcing agent |
| WO2014188850A1 (en) * | 2013-05-21 | 2014-11-27 | 昭和電工株式会社 | Light-shielding moisture-proof insulating coating material, sealing/insulating treatment method using light-shielding moisture-proof insulating coating material, and electronic component which is sealed/insulated using light-shielding moisture-proof insulating coating material |
| JP2018016731A (en) * | 2016-07-28 | 2018-02-01 | 株式会社ブリヂストン | Composition for coating material for water-area product, coating material for water-area product and water-area product |
| CN106752877A (en) * | 2017-01-17 | 2017-05-31 | 福州展辰新材料有限公司 | A kind of white UV coating |
| CN111500181A (en) * | 2020-05-20 | 2020-08-07 | 宿迁市同创化工科技股份有限公司 | Preparation method of ultraviolet-moisture dual-curing acid-and-alkali-resistant conformal coating |
| CN113462346A (en) * | 2021-07-27 | 2021-10-01 | 重庆中科力泰高分子材料股份有限公司 | UV/moisture dual-curing polyurethane hot melt adhesive with high initial adhesion and excellent drop resistance, and preparation method and application thereof |
| CN113462346B (en) * | 2021-07-27 | 2022-07-22 | 重庆中科力泰高分子材料股份有限公司 | UV/moisture dual-curing polyurethane hot melt adhesive with high initial adhesion and excellent drop resistance, and preparation method and application thereof |
| CN114574091A (en) * | 2022-03-15 | 2022-06-03 | 武汉华工正源光子技术有限公司 | UV-moisture dual-curing three-proofing paint for optical module and preparation method and application thereof |
| CN114574091B (en) * | 2022-03-15 | 2023-02-28 | 武汉华工正源光子技术有限公司 | UV-moisture dual-curing three-proofing paint for optical module and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2008159437A (en) | Single liquid type coating agent for both light curing and moisture curing, electric-electronic component subjected to insulating treatment by the same, and its manufacturing method | |
| EP1732372B1 (en) | Wiring-connecting material and wiring-connected board production process using the same | |
| KR101097428B1 (en) | Anisotropic conductive film composition and anisotropic conductive film using it | |
| KR101355857B1 (en) | Anisotropic conductive film composition, the anisotropic conductive film thereof and semiconductor device | |
| EP3628717B1 (en) | Adhesive, laminate, packaging material for battery casing, battery case, and method for manufacturing battery case | |
| JP6414057B2 (en) | Photocurable resin and photocurable resin composition | |
| JP2009197053A (en) | One component type moisture curing urethane resin adhesive composition | |
| KR101551758B1 (en) | Composition for use of an anisotropic conductive film and an anisotropic conductive film thereof | |
| EP2429269B1 (en) | Circuit connection material, circuit member connecting structure and method of connecting circuit member | |
| CA2279315A1 (en) | Unsaturated polymer polyurethane structural adhesive | |
| KR101526278B1 (en) | An anisotropic conductive film in separate form comprising a curing film and a conductive film | |
| JP2008156501A (en) | One-part moisture-curable polyurethane coating agent, mounting circuit board having been subjected to moistureproof insulation treatment using the same, and method for producing the mounting circuit board | |
| JP5181220B2 (en) | Adhesive film for circuit connection, connection structure and manufacturing method thereof | |
| KR101293788B1 (en) | Composition For Anisotropic Conductive Film And Anisotropic Conductive Film Using the Same | |
| KR101488916B1 (en) | Anisotropic conductive film and the semiconductor device | |
| JP2007332279A (en) | One pack type moisture-curable coating agent, electric/electronic component insulated with the same agent and method for producing the same component | |
| JP2007070618A (en) | Photocurable composition | |
| WO2022019256A1 (en) | Curable compound, curable composition, and method for producing curable composition | |
| JP2007332278A (en) | Reactive hot-melt adhesive composition | |
| KR101822712B1 (en) | Anisotropic conductive film and display device connected by the same | |
| KR20220117246A (en) | curable composition | |
| TW202328390A (en) | Adhesive composition, cured product, and heat-peelable adhesive sheet | |
| JP2007308679A (en) | Photo-curable resin composition, photo-curable moisture-preventing insulation coating for mounting circuit board, electronic part and method for producing the same | |
| JP2008156500A (en) | One-part moisture-curable polyurethane coating agent, mounting circuit board having been subjected to moistureproof insulation treatment using the same, and method for producing the mounting circuit board | |
| WO2002100139A1 (en) | A method of forming flexible insulation protection film of flexible circuit board and flexible circuit board formed with flexible insulation protection film and production method therefor |