CN113861852A - Single-component moisture curing reaction type polyurethane hot melt adhesive for electronic products and preparation method thereof - Google Patents
Single-component moisture curing reaction type polyurethane hot melt adhesive for electronic products and preparation method thereof Download PDFInfo
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- CN113861852A CN113861852A CN202111182747.XA CN202111182747A CN113861852A CN 113861852 A CN113861852 A CN 113861852A CN 202111182747 A CN202111182747 A CN 202111182747A CN 113861852 A CN113861852 A CN 113861852A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
- C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
- C08G18/4018—Mixtures of compounds of group C08G18/42 with compounds of group C08G18/48
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4202—Two or more polyesters of different physical or chemical nature
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4236—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups
- C08G18/4238—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups derived from dicarboxylic acids and dialcohols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/44—Polycarbonates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6603—Compounds of groups C08G18/42, C08G18/48, or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
- C08G18/6607—Compounds of groups C08G18/42, C08G18/48, or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
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Abstract
The invention discloses a single-component moisture curing reaction type polyurethane hot melt adhesive for electronic products, which is characterized by comprising the following components in parts by weight: 28-52 parts of polyether polyol; 8-25 parts of poly adipic acid-1, 6 aliphatic diol hexanediol; 17-35 parts of polycarbonate polyol; 20-50 parts of crystalline polyester polyol; 20-50 parts of polyester prepolymer: 13-21 parts of isocyanate; 5-10 parts of butyl acrylate; 1-2 parts of a chain extender; 0.01-0.1 part of stabilizer; 0.1-0.5 part of catalyst; 0.1-1 part of adhesion promoter. The moisture curing reaction type polyurethane hot melt adhesive disclosed by the invention has the characteristics of high initial bonding strength, good wettability, high curing speed, high final bonding strength and the like, is particularly suitable for being used in products in the electronic field such as narrow-frame mobile phones and the like, and can greatly improve the working efficiency of a production line.
Description
Technical Field
The invention relates to the technical field of polyurethane hot melt adhesives, in particular to a single-component moisture curing reaction type polyurethane hot melt adhesive for electronic products and a preparation method thereof.
Background
The polyurethane adhesive is an adhesive containing urethane groups or isocyanate groups in molecular chains, is solid at room temperature, is liquid after being heated and melted, and has the characteristics of high bonding strength, water resistance, heat resistance, chemical resistance and the like after being cured. Has excellent chemical adhesive force with active hydrogen-containing materials, porous materials such as foam, wood, fabric, paper, ceramic and the like, and materials with smooth surfaces such as metal, glass, rubber, plastic and the like, so the adhesive is widely applied to various industries such as automobile, electronics, woodwork, textile and the like.
With the rapid development of the electronic industry, a large number of large-screen and portable handheld electronic products such as mobile phones, tablet computers and the like are produced, in the production line of the electronic products, the screen and the frame, the front cover and the rear cover are required to be structurally bonded with the frame, the frame design of the electronic products is narrower and narrower as the requirements of various electronic products are increased, and the development trend that the electronic products are thinner, lighter and more attractive is followed.
At present, the initial adhesion strength of the existing products on the market is generally about 0.2MPa (10-minute shearing strength of PC-PC), the initial adhesion strength is less than 1MPa, the rapid positioning adhesion cannot be realized, in order to improve the yield, the preset adhesion effect is achieved under the condition of long-time pressure maintaining, the cost is increased, the efficiency is also reduced, and after the products are completely cured, as most of electronic products are mainly narrow frames, the glue application amount is small, but the fixed materials are large in size, and the phenomenon of insecure adhesion is easily caused.
The developed and prepared material has high initial adhesion strength and can be quickly cured; the reactive polyurethane hot melt adhesive with high adhesive strength after curing is a development target in the future.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a one-component moisture-curing reactive polyurethane hot melt adhesive for electronic products and a preparation method thereof. Compared with the prior art, the adhesive has better initial adhesion effect, higher curing speed and higher later-stage adhesion strength.
A single-component moisture curing reactive polyurethane hot melt adhesive for electronic products comprises the following components in parts by weight:
28-52 parts of polyether polyol;
8-25 parts of poly adipic acid-1, 6 aliphatic diol hexanediol;
17-35 parts of polycarbonate polyol;
20-50 parts of crystalline polyester polyol;
20-50 parts of polyester prepolymer:
13-21 parts of isocyanate;
5-10 parts of butyl acrylate;
1-2 parts of a chain extender;
0.01-0.1 part of stabilizer
0.1 to 0.5 portion of catalyst
0.1-1 part of adhesion promoter.
In a preferred embodiment of the invention, the NCO% content of the one-component moisture-curing reactive polyurethane hot melt adhesive is 1.3-3.5%.
In a preferred embodiment of the present invention, the polyether polyol is a polyether diol having a hydroxyl value of 15 to 300mgKOH/g, preferably polypropylene oxide ether glycol.
In a preferred embodiment of the present invention, the poly (1, 6-adipate) glycol hexanediol has a hydroxyl value of 20 to 120mgKOH/g and an acid value of 0.1 to 1 mgKOH/g.
In a preferred embodiment of the present invention, the polycarbonate polyol is a polymer of 3-methyl-1, 5-pentanediol and 1, 6-hexanediol, and has a number average molecular weight of 3000.
In a preferred embodiment of the present invention, the crystalline polyester polyol has a number average molecular weight of 3000 as DYNACOLL 7130.
In a preferred embodiment of the present invention, the polyester prepolymer is a high crystalline polyester prepolymer and has an NCO content of 1.98%.
In a preferred embodiment of the invention, the stabilizer is phosphoric acid.
In a preferred embodiment of the invention, the isocyanate is one or a mixture of more than one of diphenylmethane-4, 4-diisocyanate, isophorone diisocyanate or 4, 4-dicyclohexylmethane diisocyanate.
In a preferred embodiment of the present invention, the chain extender is one or more of 1, 4-butanediol, 1, 5-pentanediol, 1, 6-hexanediol, neopentyl glycol or 3-methyl-1, 5-pentanediol.
In a preferred embodiment of the invention, the adhesion promoter is any one or a mixture of more than two of silane coupling agents KH-560, KH-570 or A-172.
In a preferred embodiment of the present invention, the catalyst is any one or a mixture of two or more of N-methylmorpholine, dibutyltin dilaurate and triethylenediamine.
A preparation method of a single-component moisture curing reaction type polyurethane hot melt adhesive for electronic products comprises the following steps:
firstly, adding the polyether polyol, the 1, 6-poly (adipic acid-hexanediol), the polycarbonate polyol, the crystalline polyester polyol, the butyl acrylate and the stabilizer into a reaction kettle, heating to 110-140 ℃, and performing dehydration reaction under the vacuum degree range of 0.05-0.095 MPa; then cooling to the temperature range of 80-100 ℃;
secondly, adding the isocyanate into the reaction product of the first step, and reacting at the temperature of 90-110 ℃;
thirdly, adding the chain extender into the reaction product obtained in the second step, and performing dehydration reaction at the temperature of 90-120 ℃ and the vacuum degree of 0.05-0.095 MPa; then cooling to a temperature range of 90-100 ℃;
and step four, adding the polyester prepolymer, the catalyst and the adhesion promoter into the reaction product obtained in the step three, heating to a temperature of 110-120 ℃, performing vacuum defoaming, and discharging.
In a preferred embodiment of the present invention, the discharged material after vacuum defoamation in the fourth step is packaged by nitrogen protection or vacuum sealing.
Compared with the prior art, the invention has the beneficial effects that:
reacting products formed by reacting polyols (polyether glycol, poly adipic acid-1, 6 ester diol hexanediol, polycarbonate polyol and crystalline polyester polyol) with different component ratios with isocyanate to form prepolymers with-NCO groups, and adding a chain extender to enable the prepolymers to react with each other so as to enhance the initial bonding force; on the other hand, the curing speed is improved by adding the high-crystalline polyester prepolymer. The finally obtained moisture curing reaction type polyurethane hot melt adhesive has the characteristics of high initial bonding strength, good wettability, high curing speed, high final bonding strength and the like, is particularly suitable for products in the electronic field such as narrow-frame mobile phones and the like, and can greatly improve the working efficiency of a production line.
Detailed Description
The technical solutions of the present invention will be described in detail below in order to clearly understand the technical features, objects, and advantages of the present invention, but the present invention is not limited to the practical scope of the present invention.
Example 1:
adding 18g of polyether polyol, 10g of poly adipic acid-1, 6 ester diol hexanediol, 10g of polycarbonate polyol, 20g of crystalline polyester polyol, 8g of butyl acrylate and 0.06g of phosphoric acid and polyphosphoric acid compound in a mass ratio of 1:1 into a reaction kettle, heating to 130 ℃, stirring and mixing uniformly under a vacuum condition (0.095-0.1MPa), and dehydrating for 3 hours; cooling to 80 ℃, charging nitrogen, adding 17g of diphenylmethane-4, 4-diisocyanate, quickly vacuumizing (0.095-0.1MPa), uniformly stirring, controlling the temperature to be about 95 ℃, reacting for 2 hours, charging nitrogen, adding 0.8g of 1, 4-butanediol, quickly vacuumizing (0.095-0.1MPa), and stirring for 1.5 hours; charging nitrogen, adding 15g of polyester prepolymer, 0.5g of dibutyltin dilaurate and 0.44g of KH-570, continuously vacuumizing and stirring for 30 minutes, controlling the temperature to be about 105 ℃, and defoaming for 30 minutes; discharging, packaging and storing under the protection of nitrogen.
Example 2:
adding 18g of polyether polyol, 10g of poly adipic acid-1, 6 ester diol hexanediol, 10g of polycarbonate polyol, 20g of crystalline polyester polyol, 8g of butyl acrylate and 0.06g of phosphoric acid and polyphosphoric acid compound in a mass ratio of 1:1 into a reaction kettle, heating to 130 ℃, stirring and mixing uniformly under a vacuum condition (0.095-0.1MPa), and dehydrating for 3 hours; cooling to 80 ℃, charging nitrogen, adding 17g of diphenylmethane-4, 4-diisocyanate, quickly vacuumizing (0.095-0.1MPa), uniformly stirring, controlling the temperature to be about 95 ℃, reacting for 2 hours, charging nitrogen, adding 1.0g of 1, 4-butanediol, quickly vacuumizing (0.095-0.1MPa), and stirring for 1.5 hours; charging nitrogen, adding 15g of polyester prepolymer, 0.5g of dibutyltin dilaurate and 0.44g of KH-570, continuously vacuumizing and stirring for 30 minutes, controlling the temperature to be about 105 ℃, and defoaming for 30 minutes; discharging, packaging and storing under the protection of nitrogen.
Example 3:
adding 18g of polyether polyol, 10g of poly adipic acid-1, 6 ester diol hexanediol, 10g of polycarbonate polyol, 20g of crystalline polyester polyol, 8g of butyl acrylate and 0.06g of phosphoric acid and polyphosphoric acid compound in a mass ratio of 1:1 into a reaction kettle, heating to 130 ℃, stirring and mixing uniformly under a vacuum condition (0.095-0.1MPa), and dehydrating for 3 hours; cooling to 80 ℃, charging nitrogen, adding 17g of diphenylmethane-4, 4-diisocyanate, quickly vacuumizing and uniformly stirring, controlling the temperature to be about 95 ℃, charging nitrogen after reacting for 2 hours, adding 1.2g of 1, 4-butanediol, quickly vacuumizing (0.095-0.1MPa), and stirring for 1.5 hours; charging nitrogen, adding 15g of polyester prepolymer, 0.5g of dibutyltin dilaurate and 0.44g of KH-570, continuously vacuumizing (0.095-0.1MPa), stirring for 30 minutes, controlling the temperature to be about 105 ℃, and defoaming for 30 minutes; discharging, packaging and storing under the protection of nitrogen.
Example 4:
adding 18g of polyether polyol, 10g of poly adipic acid-1, 6 ester diol hexanediol, 10g of polycarbonate polyol, 20g of crystalline polyester polyol, 8g of butyl acrylate and 0.06g of phosphoric acid and polyphosphoric acid compound in a mass ratio of 1:1 into a reaction kettle, heating to 130 ℃, stirring and mixing uniformly under a vacuum condition (0.095-0.1MPa), and dehydrating for 3 hours; cooling to 80 ℃, charging nitrogen, adding 17g of diphenylmethane-4, 4-diisocyanate, quickly vacuumizing and uniformly stirring, controlling the temperature to be about 95 ℃, charging nitrogen after reacting for 2 hours, adding 1g of 1, 4-butanediol, quickly vacuumizing (0.095-0.1MPa), and stirring for 1.5 hours; charging nitrogen, adding 18g of polyester prepolymer, 0.5g of dibutyltin dilaurate and 0.44g of KH-570, continuously vacuumizing (0.095-0.1MPa), stirring for 30 minutes, controlling the temperature to be about 105 ℃, and defoaming for 30 minutes; discharging, packaging and storing under the protection of nitrogen.
Example 5:
adding 18g of polyether polyol, 10g of poly adipic acid-1, 6 ester diol hexanediol, 10g of polycarbonate polyol, 20g of crystalline polyester polyol, 8g of butyl acrylate and 0.06g of phosphoric acid and polyphosphoric acid compound in a mass ratio of 1:1 into a reaction kettle, heating to 130 ℃, stirring and mixing uniformly under a vacuum condition (0.095-0.1MPa), and dehydrating for 3 hours; cooling to 80 ℃, charging nitrogen, adding 17g of diphenylmethane-4, 4-diisocyanate, quickly vacuumizing and uniformly stirring, controlling the temperature to be about 95 ℃, charging nitrogen after reacting for 2 hours, adding 1g of 1, 4-butanediol, quickly vacuumizing (0.095-0.1MPa), and stirring for 1.5 hours; filling nitrogen, adding 21g of polyester prepolymer, 0.5g of dibutyltin dilaurate and 0.44g of KH-570, continuously vacuumizing (0.095-0.1MPa), stirring for 30 minutes, controlling the temperature to be about 105 ℃, and defoaming for 30 minutes; discharging, packaging and storing under the protection of nitrogen.
Comparative example 1:
adding 18g of polyether polyol, 10g of poly adipic acid-1, 6 ester diol hexanediol, 10g of polycarbonate polyol, 20g of crystalline polyester polyol, 8g of butyl acrylate and 0.06g of phosphoric acid and polyphosphoric acid compound in a mass ratio of 1:1 into a reaction kettle, heating to 130 ℃, stirring and mixing uniformly under a vacuum condition (0.095-0.1MPa), and dehydrating for 3 hours; cooling to 80 ℃, charging nitrogen, adding 17g of diphenylmethane-4, 4-diisocyanate, quickly vacuumizing (0.095-0.1MPa), uniformly stirring, controlling the temperature to be about 95 ℃, charging nitrogen after reacting for 2 hours, adding 0.5g of dibutyltin dilaurate and 0.44g of KH-570, continuously vacuumizing (0.095-0.1MPa), stirring for 30 minutes, controlling the temperature to be about 105 ℃, and defoaming for 30 minutes; discharging, packaging and storing under the protection of nitrogen.
Comparative example 2:
adding 18g of polyether polyol, 10g of poly adipic acid-1, 6 ester diol hexanediol, 10g of polycarbonate polyol, 20g of crystalline polyester polyol, 8g of butyl acrylate and 0.06g of phosphoric acid and polyphosphoric acid compound in a mass ratio of 1:1 into a reaction kettle, heating to 130 ℃, stirring and mixing uniformly under a vacuum condition (0.095-0.1MPa), and dehydrating for 3 hours; cooling to 80 ℃, charging nitrogen, adding 17g of diphenylmethane-4, 4-diisocyanate, quickly vacuumizing and uniformly stirring, controlling the temperature to be about 95 ℃, charging nitrogen after reacting for 2 hours, adding 1g of 1, 4-butanediol, quickly vacuumizing (0.095-0.1MPa), and stirring for 1.5 hours; charging nitrogen, adding 0.5g of dibutyltin dilaurate and 0.44g of KH-570, continuously vacuumizing (0.095-0.1MPa), stirring for 30 minutes, controlling the temperature to be about 105 ℃, and defoaming for 30 minutes; discharging, packaging and storing under the protection of nitrogen.
Comparative example 3:
adding 18g of polyether polyol, 10g of poly adipic acid-1, 6 ester diol hexanediol, 10g of polycarbonate polyol, 20g of crystalline polyester polyol, 8g of butyl acrylate and 0.06g of phosphoric acid and polyphosphoric acid compound in a mass ratio of 1:1 into a reaction kettle, heating to 130 ℃, stirring and mixing uniformly under a vacuum condition (0.095-0.1MPa), and dehydrating for 3 hours; cooling to 80 ℃, charging nitrogen, adding 17g of diphenylmethane-4, 4-diisocyanate, quickly vacuumizing (0.095-0.1MPa), uniformly stirring, controlling the temperature to be about 95 ℃, charging nitrogen after reacting for 2 hours, adding 15g of polyester prepolymer, 0.5g of dibutyltin dilaurate and 0.44g of KH-570, continuously vacuumizing (0.095-0.1MPa), stirring for 30 minutes, controlling the temperature to be about 105 ℃, and defoaming for 30 minutes; discharging, packaging and storing under the protection of nitrogen.
The shear strength test results (test substrate using PC, tensile speed 5mm/min, bonding area 25 mm. about.5 mm) of the one-component moisture-curable polyurethane hot melt adhesives obtained in examples 1 to 5 and comparative examples 1 to 3 are shown in Table 1 below:
in conclusion, the single-component moisture curing reaction type polyurethane hot melt adhesive has high initial bonding strength (up to 1.9MPa in 10 minutes), curing speed (up to 90% strength in 2 hours) and later-stage bonding strength (up to 11.8MPa in 24 hours), and both the chain extender and the high-crystalline polyester can improve the initial bonding strength and shorten the curing time (up to 90% strength in 2 hours), and meanwhile, the use effect is better.
Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention as defined in the appended claims. The techniques, shapes, and configurations not described in detail in the present invention are all known techniques.
Claims (9)
1. The single-component moisture curing reactive polyurethane hot melt adhesive for electronic products is characterized by comprising the following components in parts by weight:
28-52 parts of polyether polyol;
8-25 parts of poly adipic acid-1, 6 aliphatic diol hexanediol;
17-35 parts of polycarbonate polyol;
20-50 parts of crystalline polyester polyol;
20-50 parts of polyester prepolymer:
13-21 parts of isocyanate;
5-10 parts of butyl acrylate;
1-2 parts of a chain extender;
0.01-0.1 part of stabilizer;
0.1-0.5 part of catalyst;
0.1-1 part of adhesion promoter.
2. The one-component moisture-curing reactive polyurethane hot melt adhesive for electronic products according to claim 1, wherein the NCO% content of the one-component moisture-curing reactive polyurethane hot melt adhesive is 1.3-3.5%.
3. The one-component moisture-curing reactive polyurethane hot melt adhesive for electronic products according to claim 1, wherein the polyether polyol is polyether glycol having a hydroxyl value of 15 to 300 mgKOH/g;
the hydroxyl value of the poly adipic acid-1, 6 ester diol hexanediol is 20-120mgKOH/g, and the acid value is 0.1-1 mgKOH/g;
the polycarbonate polyol is a polymer of 3-methyl-1, 5-pentanediol and 1, 6-hexanediol, and the number average molecular weight of the polycarbonate polyol is 3000;
the crystalline polyester polyol is named DYNACOLL7130, and the number average molecular weight of the crystalline polyester polyol is 3000.
4. The one-component moisture-curable reactive polyurethane hot melt adhesive for electronic products according to claim 1, wherein the polyester prepolymer is a high-crystalline polyester prepolymer and has an NCO content of 1.98%.
5. The one-component moisture-curable reactive polyurethane hot melt adhesive for electronic products according to claim 1, wherein the stabilizer is phosphoric acid;
the isocyanate is one or more of diphenylmethane-4, 4-diisocyanate, isophorone isocyanate or 4, 4-dicyclohexylmethane diisocyanate;
the chain extender is one or more of 1, 4-butanediol, 1, 5-pentanediol, 1, 6-hexanediol, neopentyl glycol or 3-methyl-1, 5-pentanediol.
6. The one-component moisture-curable polyurethane hot melt adhesive for electronic products according to claim 1, wherein the adhesion promoter is any one or a mixture of two or more of silane coupling agents KH-560, KH-570 or A-172.
7. The one-component moisture-curing reactive polyurethane hot melt adhesive for electronic products according to claim 1, wherein the catalyst is one or a mixture of more than two of N-methylmorpholine, dibutyltin dilaurate and triethylenediamine.
8. The method for preparing the one-component moisture-curable reactive polyurethane hot melt adhesive for electronic products according to claims 1 to 7, comprising the following steps:
firstly, adding the polyether polyol, the 1, 6-poly (adipic acid-hexanediol), the polycarbonate polyol, the crystalline polyester polyol, the butyl acrylate and the stabilizer into a reaction kettle, heating to 110-140 ℃, and performing dehydration reaction under the vacuum degree range of 0.05-0.095 MPa; then cooling to the temperature range of 80-100 ℃;
secondly, adding the isocyanate into the reaction product of the first step, and reacting at the temperature of 90-110 ℃;
thirdly, adding the chain extender into the reaction product obtained in the second step, and performing dehydration reaction at the temperature of 90-120 ℃ and the vacuum degree of 0.05-0.095 MPa; then cooling to a temperature range of 90-100 ℃;
and step four, adding the polyester prepolymer, the catalyst and the adhesion promoter into the reaction product obtained in the step three, heating to a temperature of 110-120 ℃, performing vacuum defoaming, and discharging.
9. The method for preparing the one-component moisture-curing reactive polyurethane hot melt adhesive for electronic products according to claim 8, wherein the discharged material after the vacuum defoamation in the fourth step is packaged by nitrogen protection or vacuum sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111182747.XA CN113861852A (en) | 2021-10-11 | 2021-10-11 | Single-component moisture curing reaction type polyurethane hot melt adhesive for electronic products and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114989773A (en) * | 2022-07-22 | 2022-09-02 | 上海美采新材料科技有限公司 | Polyurethane adhesive and preparation method thereof |
| JP7453634B2 (en) | 2022-03-03 | 2024-03-21 | Dic株式会社 | Moisture-curable polyurethane hot melt resin compositions, adhesives, and industrial belts |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07126600A (en) * | 1993-10-29 | 1995-05-16 | Sekisui Chem Co Ltd | Moisture-curable adhesive composition |
| CN108084946A (en) * | 2017-12-13 | 2018-05-29 | 昆山天洋热熔胶有限公司 | A kind of moisture-curable polyurethane hot melt adhesive and preparation method thereof |
| CN111019582A (en) * | 2019-12-02 | 2020-04-17 | 上海康达化工新材料集团股份有限公司 | Reactive polyurethane hot melt adhesive for household appliance sealing and preparation method thereof |
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2021
- 2021-10-11 CN CN202111182747.XA patent/CN113861852A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07126600A (en) * | 1993-10-29 | 1995-05-16 | Sekisui Chem Co Ltd | Moisture-curable adhesive composition |
| CN108084946A (en) * | 2017-12-13 | 2018-05-29 | 昆山天洋热熔胶有限公司 | A kind of moisture-curable polyurethane hot melt adhesive and preparation method thereof |
| CN111019582A (en) * | 2019-12-02 | 2020-04-17 | 上海康达化工新材料集团股份有限公司 | Reactive polyurethane hot melt adhesive for household appliance sealing and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7453634B2 (en) | 2022-03-03 | 2024-03-21 | Dic株式会社 | Moisture-curable polyurethane hot melt resin compositions, adhesives, and industrial belts |
| CN114989773A (en) * | 2022-07-22 | 2022-09-02 | 上海美采新材料科技有限公司 | Polyurethane adhesive and preparation method thereof |
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