CN108955664B - Fully-decoupled annular micro gyroscope based on optical microcavity and processing method thereof - Google Patents
Fully-decoupled annular micro gyroscope based on optical microcavity and processing method thereof Download PDFInfo
- Publication number
- CN108955664B CN108955664B CN201810809702.2A CN201810809702A CN108955664B CN 108955664 B CN108955664 B CN 108955664B CN 201810809702 A CN201810809702 A CN 201810809702A CN 108955664 B CN108955664 B CN 108955664B
- Authority
- CN
- China
- Prior art keywords
- optical
- microcavity
- harmonic oscillator
- layer
- optical waveguide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5698—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using acoustic waves, e.g. surface acoustic wave gyros
Abstract
The invention discloses a full decoupling annular micro gyroscope based on an optical microcavity and a processing method thereof, wherein the micro gyroscope comprises a cap and a wafer from top to bottom, the wafer comprises an upper device layer and a lower substrate layer, the device layer is provided with a plurality of electrodes, a harmonic oscillator, a first optical microcavity, a second optical microcavity, a first optical waveguide and a second optical waveguide, the electrodes are adjacent to the inner wall of the harmonic oscillator to form a capacitor, the first optical waveguide and the second optical waveguide are symmetrically distributed on two sides of the harmonic oscillator, the first optical microcavity and the second optical microcavity are respectively adjacent to the first optical waveguide and the second optical waveguide, and the first optical microcavity and the second optical microcavity are both connected with the harmonic oscillator. The invention adopts an optical detection scheme, and compared with the traditional micro-electromechanical gyroscope, the reliability and the measurement precision of the gyroscope can reach a higher level.
Description
Technical Field
The invention relates to a micro-opto-electro-mechanical and inertial navigation device and a process, in particular to a fully-decoupled annular gyroscope based on an optical microcavity and a processing method thereof.
Background
The MOEMS gyroscope is a novel gyroscope developed on the basis of an MEMS gyroscope, and the angular velocity detection is realized by combining an optical detection component with higher sensitivity on the basis of an MEMS processing technology. The device has the advantages of small size, light weight, low cost, easy integration, high measurement precision of micro-optical devices, anti-electromagnetic interference capability and the like of MEMS devices, and is a very excellent high-precision micro gyroscope.
The optical microcavity belongs to a Whispering Gallery Mode (WGM) optical microcavity, and the microcavity is characterized in that photons can be totally reflected at the boundary of the microcavity, the Q value is very high, and when incident light in the optical waveguide only has light with the same resonant frequency as that of the microcavity, the incident light can be coupled into the microcavity, so that the optical microcavity can be regarded as an optical filter.
Disclosure of Invention
The purpose of the invention is as follows: in order to overcome the defects of the prior art and realize the miniaturization of a high-precision gyroscope, the invention provides a fully-decoupled annular micro-gyroscope based on an optical microcavity and a processing technology thereof.
The technical scheme is as follows: the invention provides a full-decoupling annular micro gyroscope based on an optical microcavity, which comprises a cover cap and a wafer from top to bottom, wherein the wafer comprises an upper device layer and a lower substrate layer, the device layer is provided with a plurality of electrodes, a harmonic oscillator, a first optical microcavity, a second optical microcavity, a first optical waveguide and a second optical waveguide, the electrodes are adjacent to the inner wall of the harmonic oscillator to form a capacitor, the first optical waveguide and the second optical waveguide are symmetrically distributed on two sides of the harmonic oscillator, the first optical microcavity and the second optical microcavity are respectively adjacent to the first optical waveguide and the second optical waveguide, and the first optical microcavity and the second optical microcavity are connected with the harmonic oscillator.
Preferably, the harmonic oscillator is disc-shaped and sequentially comprises an inner ring, an inner disc, a middle ring, a middle disc, an outer ring and an outer disc from inside to outside, the outer disc is provided with a plurality of decoupling beams, the electrodes are adjacent to the inner ring of the harmonic oscillator to form a capacitor, and an isolation structure is arranged around the outer disc.
Preferably, the four electrodes are uniformly arranged on the inner side of the resonator inner ring, the electrodes and the resonator inner ring form a capacitor, and after an electric signal is input, an electrostatic force is generated, so that the rings and the disc structures are driven to vibrate, and sound waves are generated.
Preferably, the optical microcavity is disc-shaped and located at an edge of the harmonic oscillator, and the optical waveguide is of a straight waveguide structure and tangent to the optical microcavity for input and output of light.
Preferably, the cap is a silicon cap and is positioned right above the harmonic oscillator, the cap is provided with a plurality of electrode through holes which are in one-to-one correspondence with the electrodes, and the electrodes are electrically connected with the metal lead wires through the electrode through holes so as to realize the input of electrical signals.
Preferably, the silicon cap is processed on a silicon wafer, the electrode through hole is a taper hole, and the bonding metal layer is deposited on the periphery of the lower surface of the silicon cap and used for realizing bonding of the cap and the wafer.
Preferably, the harmonic oscillator and the electrode are processed on a device layer of an SOI wafer, and the optical waveguide and the optical microcavity are processed by L PCVD on a silicon oxide layer deposited on the surface of the device layer of the SOI wafer where the harmonic oscillator is located.
A processing method of a fully decoupled annular micro-gyroscope based on an optical microcavity comprises the following steps:
(1) cleaning a wafer, drying, and depositing a light guide layer on the surface of a wafer device layer by adopting a low-pressure chemical vapor deposition method for processing an optical waveguide and an optical microcavity;
(2) cleaning and drying the surface of the wafer in the step (1), coating a layer of adhesive on the surface of the light guide layer, spin-coating a layer of electron beam exposure glue, and curing;
(3) defining patterns and positions of the optical waveguide and the optical microcavity by using electron beam exposure on the electron beam exposure adhesive layer obtained in the step (2), and then carrying out development and post-baking;
(4) on the basis of the step (3), processing the light guide layer by adopting a dry etching process to obtain an optical waveguide and an optical microcavity, and then removing residual electron beam exposure glue;
(5) cleaning and drying the wafer processed in the step (4), spraying photoresist on the surface of the device layer, curing, and transferring the patterns of the electrode and the disc harmonic oscillator to the photoresist layer by using a first mask;
(6) on the basis of the step (5), obtaining an electrode harmonic oscillator by utilizing deep reactive ion etching processing, then carrying out wet etching, removing a part of buried oxide layer below the disc harmonic oscillator, and then removing residual photoresist;
(7) another silicon wafer is taken, cleaned and dried, photoresist is coated on the lower surface in a rotating mode, a second mask is utilized, the pattern of a metal bonding area is defined through photoetching, then a layer of chromium metal and a layer of gold are deposited in sequence, a lift-off process is adopted, the bonding area is obtained through stripping, and residual photoresist is removed;
(8) spin-coating photoresist on the upper surface of the cap obtained in the step (7), defining a pattern of an electrode hole by photoetching by using a third mask, then performing wet etching, forming the electrode hole in the cap, and cleaning the residual photoresist;
(9) and (5) bonding the cap obtained in the step (8) and the structure obtained in the step (5) through a gold-silicon bonding process to obtain a complete photoacoustic wave gyroscope structure.
Preferably, the material of the light guide layer deposited in step (1) is silicon oxide, silicon nitride, indium phosphide or gallium arsenide.
Preferably, when the light guide layer is made of silicon oxide, the light guide layer is deposited in step (1) by a low-pressure chemical vapor deposition method or by a thermal silicon oxidation process on the surface of the device layer of the SOI wafer.
Has the advantages that: compared with the prior art, the method measures the change of the sound wave by means of the optical microcavity, thereby realizing the measurement of the angular velocity. Due to the adoption of the optical detection scheme, compared with the traditional micro-electromechanical gyroscope, the reliability and the measurement precision of the gyroscope can reach a higher level. The invention has the advantages of high measurement precision, no electromagnetic interference, full decoupling and the like.
Drawings
FIG. 1 is a schematic view of a split structure according to the present invention;
FIG. 2 is a top view of the harmonic oscillator, optical microcavity, and optical waveguide of FIG. 1;
FIG. 3 is a schematic rear view of the cap of FIG. 1;
FIG. 4 is an enlarged view of a portion of the optical microcavity and optical waveguide of FIGS. 1 and 2;
FIG. 5 is a cross-sectional view taken along plane AA of FIG. 1;
FIG. 6 is a flow chart of the process of the present invention.
In the figure: 1 is an SOI wafer for processing a resonator and an electrode, 2 is a silicon cap, 3 is a disk resonator, 4 is an optical microcavity, 5 is an optical waveguide, 21 is an electrode through hole on the silicon cap, 22 is a bonding metal layer, 31 is an electrode, 32 is an inner ring structure, 33 is an inner disk structure, 34 is an intermediate ring, 35 is an intermediate disk, 36 is an outer ring, 37 is an outer disk, 38 is isolation, 39 is a decoupling beam, and 40 (a protruding portion in a dotted line frame in fig. 5) is an anchor point.
Detailed Description
For a better understanding of the present invention, the contents of the present invention will be further explained below with reference to the accompanying drawings and specific examples, but the contents of the present invention are not limited to the following examples. It should be noted that: it will be apparent to those skilled in the art that the location of each facility can be adjusted without departing from the principles of the invention, and such adjustments should be considered within the scope of the invention.
The utility model provides a full decoupling annular micro gyroscope based on optics microcavity, includes from top to bottom block and wafer, the wafer includes the device layer on upper strata and the substrate layer of lower floor, and the device layer is equipped with a plurality of electrodes, harmonic oscillator, first optics microcavity, second optics microcavity, first optical waveguide and second optical waveguide, the electrode is adjacent with the harmonic oscillator inner wall, constitutes the electric capacity, and first optical waveguide and second optical waveguide symmetric distribution are in the harmonic oscillator both sides, and first optics microcavity and second optics microcavity are adjacent with first optical waveguide and second optical waveguide respectively, and first optics microcavity and second optics microcavity all link to each other with the harmonic oscillator.
The harmonic oscillator is disc-shaped and sequentially comprises an inner ring, an inner disc, a middle ring, a middle disc, an outer ring and an outer disc from inside to outside, a plurality of decoupling beams are arranged on the outer disc, electrodes are adjacent to the inner ring of the harmonic oscillator to form a capacitor, an isolation structure is arranged around the outer disc, four electrodes are uniformly distributed on the inner side of the inner ring of the harmonic oscillator and form a capacitor, electrostatic force is generated after electric signals are input to drive the rings and the discs to vibrate to generate sound waves, the optical microcavity is disc-shaped and is positioned at the edge of the harmonic oscillator, the optical waveguide is a straight waveguide structure and is tangent to the optical microcavity and used for inputting and outputting light, the cap is a silicon cap which is positioned right above the harmonic oscillator, a plurality of electrode through holes are arranged on the cap and correspond to the electrodes one by one to one, the electrodes are electrically connected with metal leads through the electrode through holes to realize the input of the electric signals, the silicon cap is processed on a silicon wafer surface of a silicon wafer through a silicon bonding process and the silicon oxide layer deposited on the wafer with the optical waveguide through a PCVD L.
Example 1
As shown in figures 1-5, the fully decoupled annular micro-gyroscope based on the optical microcavity comprises a disc-shaped harmonic oscillator 3 with decoupling characteristics, a group of electrodes 31 for inputting electric signals, two optical microcavities 4 for realizing angular velocity detection, two groups of optical waveguides 5 for realizing optical transmission, and a group of silicon caps 2 for realizing packaging, wherein the harmonic oscillator and the electrodes are processed on a device layer of an SOI wafer 1, the optical waveguides and the optical microcavities are processed by a silicon oxide layer deposited on the surface of the harmonic oscillator 3 by L PCVD (low pressure chemical vapor deposition), and the silicon caps 2 are processed on a silicon wafer and are bonded with the harmonic oscillator by a gold-silicon bonding process.
The silicon cap for realizing packaging is positioned right above the harmonic oscillator, the total number of the 4 electrode through holes on the cap correspond to the electrodes one by one, and the interconnection between the metal lead and the electrodes can be realized through the electrode through holes, so that the input of electric signals is realized. The electrode through hole 21 in the silicon cap 2 is a taper hole, and a bonding metal layer 22 is deposited on the periphery of the lower surface of the electrode through hole for realizing the bonding of the cap and the SOI wafer.
The electrodes 31 are adjacent to the inner ring 32 of the harmonic oscillator and are circumferentially distributed, a capacitor is formed between the electrodes and the inner ring 32, and after an electric signal is input, electrostatic force can be generated, so that the rings and the disk structure are driven to vibrate, and sound waves are generated.
The disc-shaped harmonic oscillator is formed by processing a disc-shaped harmonic oscillator on a device layer of an SOI wafer and comprises an inner disc, a middle disc, an outer disc, an inner ring, a middle ring, an outer ring, a decoupling beam and an anchor point, wherein the inner ring 32, the inner disc 33, the middle ring 34, the middle disc 35, the outer ring 36, the outer disc 37 and the decoupling beam 39 are sequentially interconnected, so that part of body waves can be prevented from being transmitted to the outer ring, referring to fig. 2, the decoupling beam is a thin rod connected with the outer periphery of the outer ring, and full decoupling between a driving mode and a sensitive mode is realized through constraint of the decoupling beam and the inner, middle and outer three. Referring to fig. 5, the anchor point is a bump in a dashed line frame in the figure, and is located at the bottommost portion of the device layer.
The optical microcavity and the optical waveguide are tightly attached to the upper surface of the SOI wafer device layer where the harmonic oscillator is located, the optical microcavity is a micro-disk cavity in a whispering gallery mode, is in a disk shape, is located on the upper surface of an outer disk of the harmonic oscillator, and is used for detecting deformation and bulk waves generated by vibration, namely detecting the change of sound wave distribution in the harmonic oscillator, and further calculating the angular velocity.
The optical waveguide is a straight waveguide structure, is coupled with the optical microcavity 4, is tangent to the optical microcavity, and is used for detecting the input and output of light.
The working principle of the fully-decoupled annular micro gyroscope based on the optical microcavity is as follows:
the invention relates to a full-decoupling annular micro gyroscope based on an optical microcavity and a processing method thereof.A metal lead is electrically connected with an electrode through hole on a cap from the outside, the electrode is electrified to drive a harmonic oscillator to generate resonant motion, and stably distributed bulk waves exist in the harmonic oscillator and form standing waves inside the harmonic oscillator; when the angular velocity changes, due to the brother effect, after the harmonic oscillator rotates, the wave field distribution of the bulk wave in the harmonic oscillator changes, and based on the elasto-optical effect, the bulk wave in the medium can cause the shape and the refractive index of the optical microcavity which is in contact with the harmonic oscillator to change, so that the filtering characteristic of the optical microcavity changes, and therefore, before and after the rotation, the shape and the refractive index of the optical microcavity are different, so that the spectral line changes, the transmittance of detection light entering the microcavity through optical waveguide coupling is different, the spectral line of the microcavity can be obtained through frequency sweeping, and the angular velocity can be calculated through measuring the change of the spectrum.
The optical waveguide is used for detecting input and output of light and optical coupling of the light and the optical microcavity, the detection light is provided by an external narrow-band laser generator as a light source, the detection light enters the optical microcavity through optical waveguide coupling, and returns to the optical waveguide for emergence after being filtered by the optical cavity, and finally, an emergent light spectrum is analyzed through an external spectrometer, so that a spectral line of the optical microcavity is obtained.
As shown in fig. 6, a method for processing a fully decoupled annular micro-gyroscope based on an optical microcavity includes the following steps:
(1) cleaning an SOI wafer, drying, and depositing a light guide layer on the surface of the device layer of the SOI wafer by adopting a low-pressure chemical vapor deposition (L PCVD) method for processing an optical waveguide and an optical microcavity;
(2) cleaning and drying the surface of the SOI wafer in the step (1), coating a layer of adhesive on the surface of the light guide layer, spin-coating a layer of electron beam exposure glue (PMMA) and curing;
(3) defining patterns and positions of the optical waveguide and the optical microcavity by using electron beam exposure on the electron beam exposure adhesive layer obtained in the step (2), and then carrying out development and post-baking;
(4) on the basis of the step (3), processing the light guide layer by adopting a dry etching process to obtain an optical waveguide and an optical microcavity, and then removing residual electron beam exposure glue by adopting an acetone solution;
(5) cleaning and drying the wafer processed in the step (4), spraying photoresist on the surface of the device layer, curing, and transferring the patterns of the electrode and the disc harmonic oscillator to the photoresist layer by using a first mask;
(6) on the basis of the step (5), processing by using DRIE (deep reactive ion etching) to obtain an electrode harmonic oscillator, then removing a part of buried oxide layer below the disc harmonic oscillator by using KOH solution and wet etching, and then removing residual photoresist by using acetone solution;
(7) another silicon wafer is taken, cleaned and dried, photoresist is coated on the lower surface in a rotating mode, a second mask is used for defining the pattern of the metal bonding area through photoetching, then a layer of chromium (Ga) metal and gold (Au) layer are deposited in sequence, a lift-off process is adopted, the bonding area is obtained through stripping, and the residual photoresist is removed;
(8) spin-coating photoresist on the upper surface of the cap obtained in the step (7), defining a pattern of an electrode hole by photoetching by using a third mask, etching by using a KOH solution and a wet method, forming the electrode hole in the cap, and cleaning residual photoresist;
(9) and (5) bonding the cap obtained in the step (8) and the structure obtained in the step (5) through a gold-silicon bonding process to obtain a complete photoacoustic wave gyroscope structure.
The gyroscope is manufactured by combining electron beam exposure, a photoetching process, an MEMS (micro-electromechanical systems) bulk silicon processing process, a surface micro-processing process and a gold-silicon bonding process.
The invention realizes the angular velocity detection by using the method for detecting the optical cavity spectrum, and has high measurement precision and small volume. No electromagnetic interference, convenient batch production and the like, wide application range and good market prospect.
Example 2
Essentially the same as in example 1, except that: in the step (1), when depositing the silicon oxide layer, the silicon oxide layer may also be generated by a silicon thermal oxidation process on the surface of the device layer of the SOI wafer.
Example 3
Essentially the same as in example 1, except that: in steps (1) to (4) of the processing scheme of example 1, the materials used for processing the optical waveguide and the optical microcavity can be replaced by other materials such as silicon nitride, indium phosphide, gallium arsenide and the like besides silicon oxide.
The prior art is not mentioned in the invention.
The invention relates to a full decoupling annular micro gyroscope based on an optical microcavity and a processing method thereof. The optical microcavity and the optical waveguide are both obtained by depositing silicon dioxide at low temperature. The gyroscope utilizes static electricity to drive the harmonic oscillator to generate sound waves, the sound waves are distributed to change under the influence of angular velocity, and then the change of the sound waves is measured by means of the optical microcavity, so that the measurement of the angular velocity is realized. Due to the adoption of the optical detection scheme, compared with the traditional micro-electromechanical gyroscope, the reliability and the measurement precision of the gyroscope can reach a higher level.
The invention belongs to the category of MOMES gyroscopes, realizes the measurement and processing of devices by adopting the MEMS technology, and realizes the diagonal velocity detection by means of the optical microcavity. The basic principle is as follows: the disc harmonic oscillator resonates under the drive of the inner electrode, generated body waves act on the optical cavity after the decoupling effect of the inner disc, the middle disc and the outer disc, the deformation of the optical cavity and the change of the refractive index of the material are caused, when the external world rotates, the deformation of the optical cavity and the change of the refractive index are changed along with the change of the vibration mode, the spectral line of the optical cavity is changed, and the angular velocity can be obtained by detecting the spectral line change.
Claims (10)
1. The utility model provides a full decoupling annular micro gyroscope based on optics microcavity which characterized in that: from top to bottom including block and wafer, the wafer includes the device layer on upper strata and the substrate layer of lower floor, and the device layer is equipped with a plurality of electrodes, harmonic oscillator, first optics microcavity, second optics microcavity, first optical waveguide and second optical waveguide, the electrode is adjacent with the harmonic oscillator inner wall, constitutes the electric capacity, and first optical waveguide and second optical waveguide symmetric distribution are in the harmonic oscillator both sides, and first optics microcavity and second optics microcavity are adjacent with first optical waveguide and second optical waveguide respectively, and first optics microcavity and second optics microcavity all link to each other with the harmonic oscillator.
2. The fully decoupled annular micro-gyroscope based on optical microcavities of claim 1, wherein: the harmonic oscillator is disc-shaped and sequentially comprises an inner ring, an inner disc, a middle ring, a middle disc, an outer ring and an outer disc from inside to outside, a plurality of decoupling beams are arranged on the outer disc, the electrodes are adjacent to the inner ring of the harmonic oscillator to form a capacitor, and an isolation structure is arranged around the outer disc.
3. The fully decoupled annular micro-gyroscope based on optical microcavities of claim 2, wherein: the four electrodes are uniformly arranged on the inner side of the harmonic oscillator inner ring, the electrodes and the harmonic oscillator inner ring form a capacitor, and after an electric signal is input, an electrostatic force is generated, so that the rings and the disc structures are driven to vibrate, and sound waves are generated.
4. The fully decoupled annular micro-gyroscope based on optical microcavities of claim 1, wherein: the optical microcavity is disc-shaped and is positioned at the edge of the harmonic oscillator, and the optical waveguide is of a straight waveguide structure, is tangent to the optical microcavity and is used for inputting and outputting light.
5. The fully decoupled annular micro-gyroscope based on optical microcavities of claim 1, wherein: the cap is a silicon cap and is positioned right above the harmonic oscillator, a plurality of electrode through holes are formed in the cap and correspond to the electrodes one to one, and the electrodes are electrically connected with the metal lead wires through the electrode through holes so as to realize the input of electric signals.
6. The fully decoupled annular micro-gyroscope based on optical microcavities of claim 5, wherein: the silicon cap is processed on a silicon wafer, the electrode through hole is a conical hole, and the bonding metal layer is deposited on the periphery of the lower surface of the silicon cap and used for achieving bonding of the cap and the wafer.
7. The full-decoupling annular micro-gyroscope based on the optical microcavity as claimed in claim 1, wherein the harmonic oscillator and the electrode are processed on a device layer of an SOI wafer, and the optical waveguide and the optical microcavity are processed by L PCVD on a silicon oxide layer deposited on the surface of the device layer of the SOI wafer where the harmonic oscillator is located.
8. The method for processing a fully decoupled annular micro-gyroscope according to any of claims 1 to 7, comprising the following steps:
(1) cleaning a wafer, drying, and depositing a light guide layer on the surface of a wafer device layer by adopting a low-pressure chemical vapor deposition method for processing an optical waveguide and an optical microcavity;
(2) cleaning and drying the surface of the wafer in the step (1), coating a layer of adhesive on the surface of the light guide layer, spin-coating a layer of electron beam exposure glue, and curing;
(3) defining patterns and positions of the optical waveguide and the optical microcavity by using electron beam exposure on the electron beam exposure adhesive layer obtained in the step (2), and then carrying out development and post-baking;
(4) on the basis of the step (3), processing the light guide layer by adopting a dry etching process to obtain an optical waveguide and an optical microcavity, and then removing residual electron beam exposure glue;
(5) cleaning and drying the wafer processed in the step (4), spraying photoresist on the surface of the device layer, curing, and transferring the patterns of the electrode and the disc harmonic oscillator to the photoresist layer by using a first mask;
(6) on the basis of the step (5), obtaining an electrode harmonic oscillator by utilizing deep reactive ion etching processing, then carrying out wet etching, removing a part of buried oxide layer below the disc harmonic oscillator, and then removing residual photoresist;
(7) another silicon wafer is taken, cleaned and dried, photoresist is coated on the lower surface in a rotating mode, a second mask is utilized, the pattern of a metal bonding area is defined through photoetching, then a layer of chromium metal and a layer of gold are deposited in sequence, a lift-off process is adopted, the bonding area is obtained through stripping, and residual photoresist is removed;
(8) spin-coating photoresist on the upper surface of the cap obtained in the step (7), defining a pattern of an electrode hole by photoetching by using a third mask, then performing wet etching, forming the electrode hole in the cap, and cleaning the residual photoresist;
(9) and (5) bonding the cap obtained in the step (8) and the structure obtained in the step (5) through a gold-silicon bonding process to obtain a complete photoacoustic wave gyroscope structure.
9. The method for processing the fully decoupled annular micro-gyroscope based on the optical microcavity as claimed in claim 8, wherein: the light guide layer deposited in the step (1) is made of silicon oxide, silicon nitride, indium phosphide or gallium arsenide.
10. The method for processing the fully decoupled annular micro-gyroscope based on the optical microcavity as claimed in claim 9, wherein: when the light guide layer is made of silicon oxide and deposited in the step (1), the light guide layer is produced by adopting a low-pressure chemical vapor deposition method or a silicon thermal oxidation process on the surface of the SOI wafer device layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810809702.2A CN108955664B (en) | 2018-07-23 | 2018-07-23 | Fully-decoupled annular micro gyroscope based on optical microcavity and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810809702.2A CN108955664B (en) | 2018-07-23 | 2018-07-23 | Fully-decoupled annular micro gyroscope based on optical microcavity and processing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108955664A CN108955664A (en) | 2018-12-07 |
| CN108955664B true CN108955664B (en) | 2020-07-14 |
Family
ID=64463284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810809702.2A Active CN108955664B (en) | 2018-07-23 | 2018-07-23 | Fully-decoupled annular micro gyroscope based on optical microcavity and processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108955664B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109945851B (en) * | 2019-02-28 | 2020-08-11 | 东南大学 | Photoacoustic wave gyroscope based on bulk acoustic wave resonator and processing method thereof |
| CN109974681B (en) * | 2019-04-09 | 2021-01-26 | 东南大学 | Disc type resonance gyroscope based on optical waveguide and processing and packaging method thereof |
| CN110631568B (en) * | 2019-09-10 | 2021-02-09 | 东南大学 | Novel MOEMS (metal oxide semiconductor energy management system) double-shaft gyroscope based on two-dimensional photonic crystal cavity structure and processing method thereof |
| CN110967001B (en) | 2019-12-17 | 2023-09-26 | 重庆邮电大学 | Cavity light mechanical vibration gyro |
| CN111854723B (en) * | 2020-06-17 | 2022-06-17 | 中国船舶重工集团公司第七0七研究所 | Method for fixedly connecting harmonic oscillator and electrode suitable for high vacuum environment |
| CN112066975B (en) * | 2020-09-25 | 2021-05-14 | 中北大学 | Gyroscope and accelerometer integrated system based on double resonant cavities and preparation method thereof |
| CN112729334B (en) * | 2020-11-27 | 2022-07-26 | 中国船舶重工集团公司第七0七研究所 | Electrode switching gap detection circuit of hemispherical resonance gyroscope |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6603558B2 (en) * | 2001-07-25 | 2003-08-05 | University Of Delaware | Micro-ring cavity gyroscope with magnetic field lock-in minimization |
| CN101793520B (en) * | 2010-01-30 | 2013-04-10 | 中北大学 | Integrated optical waveguide gyroscope based on optical microcavity |
| CN102003959B (en) * | 2010-10-09 | 2012-05-23 | 浙江大学 | Annular optical microcavity type optical fiber gyro |
| US8736845B2 (en) * | 2011-05-24 | 2014-05-27 | Honeywell International Inc. | Frequency stabilized laser system |
-
2018
- 2018-07-23 CN CN201810809702.2A patent/CN108955664B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN108955664A (en) | 2018-12-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108955664B (en) | Fully-decoupled annular micro gyroscope based on optical microcavity and processing method thereof | |
| US6894787B2 (en) | Optical pressure sensor | |
| CN106959106B (en) | Fused quartz micro-hemispherical resonator gyroscope based on SOI packaging and processing method thereof | |
| CN108716914B (en) | MOEMS gyroscope based on nano grating and processing method thereof | |
| CN110631568B (en) | Novel MOEMS (metal oxide semiconductor energy management system) double-shaft gyroscope based on two-dimensional photonic crystal cavity structure and processing method thereof | |
| CN103308717B (en) | Optical fiber Fabry-Perot acceleration sensor and manufacturing method thereof | |
| US8939026B2 (en) | Frequency modulated micro gyro | |
| CN110308306B (en) | MOEMS accelerometer based on fully-differential two-dimensional photonic crystal cavity structure and processing method thereof | |
| CN110799822B (en) | Hermetic seal test of optical assemblies | |
| CN110133321B (en) | Monolithic integrated optical accelerometer based on phase detection | |
| CN105445494A (en) | MOEMS accelerometer based on planar ring cavity, and manufacturing method of the same | |
| CN112066967A (en) | Chip-level resonant acousto-optic coupling solid-state fluctuation gyroscope | |
| US20240053148A1 (en) | A chip-level disc-type acousto-optic standing wave gyroscope | |
| CN108489476B (en) | Photoacoustic wave gyroscope based on acousto-optic coupling effect and processing method thereof | |
| CN114486019A (en) | Optical fiber Fabry-Perot pressure sensor for eliminating third-cavity interference and MEMS manufacturing method | |
| US11372176B2 (en) | Implantable optical sensor with hermetically sealed cover cap | |
| US6369374B1 (en) | Filter including a micro-mechanical resonator | |
| CN116425110B (en) | Wafer-level manufacturing method of high-temperature photoelectric pressure sensing chip with differential structure | |
| CN108195366B (en) | Processing method of micro-nano gyroscope based on double-layer nano grating | |
| CN110342453A (en) | A kind of micro-electro-mechanical gyroscope and its processing packaging method based on double grating detection | |
| CN103345057A (en) | Miniature bridge-type structure and preparation method thereof | |
| CN108709549B (en) | Monolithic integrated gyroscope based on nano grating and processing method thereof | |
| CN109945851B (en) | Photoacoustic wave gyroscope based on bulk acoustic wave resonator and processing method thereof | |
| CN113108938A (en) | Optical fiber temperature sensing probe based on parallel polymer microcavity and preparation method thereof | |
| CN109974681B (en) | Disc type resonance gyroscope based on optical waveguide and processing and packaging method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |