CN109974681B - Disc type resonance gyroscope based on optical waveguide and processing and packaging method thereof - Google Patents
Disc type resonance gyroscope based on optical waveguide and processing and packaging method thereof Download PDFInfo
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- G01C19/5684—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially two-dimensional vibrators, e.g. ring-shaped vibrators the devices involving a micromechanical structure
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Abstract
The invention discloses a disc type resonance gyroscope based on optical waveguide and a processing and packaging method thereof, wherein the gyroscope comprises an SOI structure and a glass cover cap which are connected in a bonding way, and the SOI structure is respectively a silicon device layer, a silicon dioxide insulating layer and a silicon substrate layer from top to bottom; the central area of the silicon device layer is a circular anchor point, the periphery of the circular anchor point is concentrically provided with a circular groove structure, optical structures are uniformly distributed on the periphery of the circular groove structure, and a corresponding electrode bonding pad is arranged outside each optical structure; a plurality of back through holes are punched in the silicon substrate layer; the silicon dioxide insulating layer is provided with a circular groove so that the circular groove is communicated with the back through hole; the cavity of the glass cap is arranged in the middle area of the back surface of the glass cap, a grating round hole with the bottom not opened is arranged on the glass cap at the position opposite to the nano grating, and an electrode round hole with the bottom completely opened is arranged at the position opposite to the electrode pad. The invention has small size, good sealing performance and high sensitivity, and can realize high-precision optical detection.
Description
Technical Field
The invention relates to the fields of micro-electro-mechanical systems and optical waveguides, in particular to a disk type resonance gyroscope based on an optical waveguide and a processing and packaging method thereof.
Background
The disk type resonance gyroscope is a vibration gyroscope with highly symmetrical structure based on the Goldfish effect, and the angle measurement is realized through the switching between a sensitive mode and a detection mode. The optical waveguide technology is an emerging technology and has high detection precision. The disc type resonance gyroscope is combined with the optical waveguide technology, so that the gyroscope has high measurement precision, super-strong stability and reliability, lower energy loss and strong resistance to electromagnetic and atomic radiation interference. The disk gyroscope has long expected life, is a key component in a continuous inertial navigation system, and has very wide development prospect.
In 2014, Tsanh-Hung Su et al, Burkeley university, California, USA, proposed in their paper a disc resonator gyroscope made from <111> crystal orientation silicon, with a diameter of 2mm, a thickness of up to 35um, and a quality factor of 2800 at a vibration frequency of 78kHz, achieving a high sensitivity of 55 uV/DEG/s.
The disk resonator gyroscope based on the optical waveguide technology is an emerging gyroscope, and in the development process of the disk resonator gyroscope, a difficulty is how to combine the optical waveguide technology with the MEMS gyroscope. By looking up documents, the countries which can produce high-performance finished products at present mainly comprise the United states, Germany and the like, the research of other countries is still in the early stage, and most of the produced products are middle-end and low-end products. The main technical defects are that the nano-scale optical structure is extremely sensitive, and the processing error can cause larger measurement deviation; the research on the basic theory of the optical waveguide is still in the initial stage, and a complex waveguide model is difficult to establish an accurate mathematical model; at the same time, there is still less research on the combination of optical detection technology and MEMS technology. Based on the situation, the disc type resonant gyroscope based on the optical waveguide technology is provided, and the disc type resonant gyroscope has high research value.
Disclosure of Invention
The purpose of the invention is as follows: in order to overcome the defects of the prior art, the invention provides a disk type resonance gyroscope based on optical waveguides and a processing and packaging method thereof.
The technical scheme is as follows: in order to achieve the above purpose, the invention adopts the following method:
a disc type resonance gyroscope based on optical waveguide comprises an SOI structure and a glass cover cap, wherein the SOI structure is composed of a silicon device layer, a silicon dioxide insulating layer and a silicon substrate layer from top to bottom;
the silicon device layer comprises a circular anchor point, a first circular groove structure, an optical structure, electrode pads and a first metal bonding area, wherein the circular anchor point is arranged in a central area;
a plurality of back through holes are punched in the silicon substrate layer;
the silicon dioxide insulating layer is provided with a second circular groove structure corresponding to the first circular groove structure on the silicon device layer, and the second circular groove structure enables the first circular groove structure on the silicon device layer to be communicated with the back through hole of the silicon substrate layer;
the glass cap comprises a cavity, a grating round hole, an electrode round hole and a second metal bonding region, wherein the cavity is arranged in the middle area of the back surface of the glass cap and covers the first annular groove of the silicon device layer and the optical structure; a grating round hole with a bottom not opened is arranged on the glass cover cap at a position opposite to the nano grating, and an electrode round hole with a bottom completely opened is arranged at a position opposite to the electrode pad; the second metal bonding region is arranged on the periphery of the glass cap;
the SOI structure and the glass cap are bonded and connected through the first metal bonding area and the second metal bonding area.
Optionally, the ring groove structure includes multiple ring grooves, each ring includes multiple ring grooves, two adjacent ring grooves in the same ring are connected through connecting spokes, eight connecting spokes are arranged between two adjacent pairs of ring grooves, and the difference angle between each two connecting spokes is 45 °; the web spokes between two adjacent pairs of annular grooves are angled by 22.5.
Optionally, the optical structure includes a light wave track, an optical cavity, and a nano-grating, passing through the grating circular aperture. An optical fiber is used for being lapped on a grating round hole, and external light is introduced into the nano grating; the light wave track is connected with the nano grating, and part of light enters the light wave track according to the grating coupling effect; the optical cavity is arranged in the middle of the light wave track, a certain waveband of incident light is latched in the optical cavity, and the rotating angular speed can be calculated by detecting the wavelength and the intensity change of the emergent light.
Optionally, the back through holes are arranged in a circular array.
Optionally, a metal conductive layer of chrome gold is deposited on the inner wall of the electrode round hole.
Optionally, the shape of the cavity is matched with the annular groove structure on the silicon device layer and the outer contour line of the optical wave track.
Optionally, the deposition material of the first metal bonding region is chrome gold, and the deposition material of the second metal bonding region is chrome gold and tin gold.
The invention also discloses a processing and packaging method of the disk type resonance gyroscope based on the optical waveguide, which comprises the following steps:
(1) forming an SOI structure:
firstly, cleaning the SOI, thermally growing a layer of SiO2 on the upper surface and the lower surface of the SOI, depositing Si3N4 on the thermally grown SiO2 surface by LPCVD, and etching an alignment mark on Si3N4 so as to align the subsequent positive and negative alignment;
secondly, etching Si3N4 and SiO2 in the corresponding area of the back surface of the SOI, etching the exposed silicon substrate layer by using DRIE to form a back through hole, and introducing HF steam into the back through hole to release an SiO2 insulating layer;
etching Si3N4 and SiO2 in the corresponding region of the front surface of the SOI, sputtering an electrode pad and a first metal bonding region on the exposed silicon device layer, then etching the reserved Si3N4 to form a lightwave track, an optical cavity and a nano grating, and thermally growing a layer of SiO2 in the region corresponding to the lightwave track, the optical cavity and the nano grating for protection;
finally, DRIE etches the silicon device layer to form an SOI structure;
(2) forming a glass cap:
firstly, cleaning glass, carrying out PECVD deposition on the upper surface and the lower surface of the glass to obtain Si3N4, and etching an alignment mark on Si3N4 so as to align the subsequent positive and negative alignment;
secondly, sputtering chrome gold on the back of the glass to form a cavity pattern, coating photoresist on the front of the glass in a spinning mode to form electrode round hole and grating round hole patterns, and corroding Si3N4 exposed on the front and the back of the glass;
thirdly, protecting the front side of the glass by using a protection device, carrying out wet etching on the glass in the cavity region on the back side to reach a specified depth, carrying out wet etching on the front side and the back side of the glass simultaneously, forming shallow grooves in the electrode circular holes and the grating circular hole regions on the front side of the glass, and forming electrode circular holes and grating circular holes by using a laser drilling technology;
and finally, sputtering chrome gold and tin gold on the back surface of the glass to form a second metal bonding area.
(3) Bonding and packaging:
and (3) aligning the SOI structure processed in the step (1) and the step (2) with the glass cap up and down, carrying out metal bonding, and carrying out vacuum packaging.
Further, the etching the silicon device layer comprises the following steps:
(a) spin-coating photoresist on the front side of the SOI, photoetching, developing, and then dry etching SIO2 and Si3N4 by RIE;
(b) spin-coating photoresist on the front side of the SOI, photoetching, developing, carrying out magnetron sputtering on chromium gold, putting the SOI into an acetone and isopropanol solution, and stripping the chromium gold to form an electrode pad and a first metal bonding area;
(c) spraying electron beam exposure special glue on the front surface of the SOI, carrying out electron beam exposure, and then etching SI3N4 on the surface by an RIE dry method to obtain a light wave track, a light cavity and a nano grating;
(d) spraying photoresist on the front side of the SOI, photoetching and developing, then thermally growing a layer of SiO2, putting the SOI into acetone and isopropanol solution to strip chrome gold, and protecting a precise optical part;
(e) and spraying photoresist on the front side of the SOI, photoetching and developing, and then DRIE etching the silicon structure layer to form a circular anchor point, a circular ring and a connecting spoke.
Has the advantages that: compared with the prior art, the disc type resonance gyroscope based on the optical waveguide detection principle transmits the optical signals through the nano grating and the optical waveguide, latches the optical signals of the specific wave band through the optical cavity, realizes photoelectric separation, eliminates the influence of parasitic capacitance, simultaneously improves the detection precision, and reduces the contradiction that the precision and the dynamic characteristic are difficult to be considered simultaneously. The invention has the advantages of high precision, small size, good dynamic performance and the like, and the processing and packaging method has simple process and is suitable for batch production.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic diagram of an SOI structure of the present invention;
FIG. 3 is a cross-sectional view of an SOI structure of the present invention;
FIG. 4 is a partial schematic view of an optical structure of the present invention;
FIG. 5 is a schematic illustration of a backside via on a silicon substrate layer of the present invention;
FIG. 6 is a schematic view of a glass cap of the present invention;
FIG. 7 is a cross-sectional view of a glass cap of the present invention;
FIG. 8 is a schematic view of a process flow of the present invention.
In the figure: 1 is SOI structure, 2 is glass block, 101 is silicon device layer, 102 is silicon dioxide insulating layer, 103 is silicon substrate layer, 1011 is circular anchor point, 1012 is annular groove, 1013 is connecting spoke, 1014 is electrode pad, 1015 is first metal bonding zone, 1016 is light wave track, 1017 is optical cavity, 1018 is nanometer grating, 1031 is back through hole, 201 is cavity, 202 is grating round hole, 203 is electrode round hole, 204 is second metal bonding zone.
Detailed Description
The technical solution of the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.
A disc type resonance gyroscope based on optical waveguide comprises an SOI structure and a glass cover cap, wherein the SOI structure is composed of a silicon device layer, a silicon dioxide insulating layer and a silicon substrate layer from top to bottom; the silicon device layer comprises a circular anchor point, a first circular groove structure, an optical structure, electrode pads and a first metal bonding area, wherein the circular anchor point is arranged in a central area; a plurality of back through holes are punched in the silicon substrate layer; the silicon dioxide insulating layer is provided with a second circular groove structure corresponding to the first circular groove structure on the silicon device layer, and the second circular groove structure enables the first circular groove structure on the silicon device layer to be communicated with the back through hole of the silicon substrate layer; the glass cap comprises a cavity, a grating round hole, an electrode round hole and a second metal bonding region, wherein the cavity is arranged in the middle area of the back surface of the glass cap and covers the circular groove of the silicon device layer and the optical structure; a grating round hole with a bottom not opened is arranged on the glass cover cap at a position opposite to the nano grating, and an electrode round hole with a bottom completely opened is arranged at a position opposite to the electrode pad; the second metal bonding region is arranged on the periphery of the glass cap; the SOI structure and the glass cap are bonded and connected through the first metal bonding area and the second metal bonding area.
As shown in fig. 1-7, an optical waveguide-based disk resonator gyroscope includes an SOI structure and a glass cap. The SOI structure comprises a silicon device layer, a silicon dioxide insulating layer and a silicon substrate layer from top to bottom; the silicon device layer comprises a circular anchor point, circular ring grooves, connecting spokes, electrode bonding pads, a first metal bonding area, a light wave track, an optical cavity and a nano grating, wherein the circular anchor point is arranged in a central area, the circular ring grooves are concentrically arranged on the periphery of the circular anchor point, the connecting spokes are connected with the adjacent circular ring grooves, the electrode bonding pads are uniformly distributed on the periphery of the circular ring grooves, the first metal bonding area is arranged on the periphery of the silicon device layer, the light wave track, the optical cavity and the nano grating are communicated with each other and are uniformly distributed on the periphery of the outermost circular ring groove, silicon dioxide below the silicon device layer is an optical structure substrate, and silicon dioxide above the silicon device layer is an optical structure protective layer; the silicon dioxide insulating layer is arranged between the silicon device layer and the silicon substrate layer; back through holes are punched in the silicon substrate layer, a plurality of back through holes are formed in the silicon substrate layer, and the back through holes are arranged in parallel by the circular ring array; introducing HF steam from the through hole on the back, releasing the silicon dioxide insulating layer, corroding off all silicon dioxide below the first circular groove structure to ensure the vibration of the silicon dioxide, and reserving the silicon dioxide at the circular anchor point and other places. The glass cap comprises a cavity, a grating round hole, an electrode round hole and a second metal bonding area; the cavity is arranged in the middle area of the glass cover cap, and the shape of the cavity is matched with the outer ring groove on the silicon device layer and the outer contour line of the light wave track; the grating round hole is arranged right above the nano grating, and the bottom of the grating round hole is not completely opened; the electrode round hole is arranged right above the electrode and is completely opened; the second metal bonding region is disposed at the periphery of the glass cap. The electrode pads are circular electrode pads, each circular electrode pad is connected with the top end of the corresponding electrode round hole, a metal conducting layer of chrome gold is deposited on the inner wall of each electrode round hole, the light wave track, the light cavity and the nano grating are connected into a whole, the positions of a first metal bonding area on the SOI structure and a second metal bonding area on the glass cover cap completely correspond, the deposition material of the first metal bonding area is chrome gold, and the deposition material of the second metal bonding area is chrome gold and tin gold.
When the optical detection structure is used, the optical detection structure is placed in the 45-degree direction of the outermost ring groove, external light is guided into the nano-grating from the grating circular hole light through the optical fiber, the nano-grating guides the guided light to the optical waveguide along the horizontal direction through the grating coupling effect, the optical cavity is arranged in the middle of the waveguide, and a tiny gap exists between the optical cavity and the waveguide, so that the light of a specific waveband can be latched; when the gyroscope does not rotate, the 45-degree direction of the circular groove does not displace; when the gyroscope deflects, the optical cavity is driven to deform due to the format displacement generated in the 45-degree direction of the Goldfish effect circular groove, and the wave band of the latch light changes; the angle of rotation can be inferred by detecting the change in wavelength and intensity of the output light.
As shown in fig. 8, a method for processing and packaging a disk resonator gyroscope based on an optical waveguide includes the following steps:
(1) cleaning the SOI, and thermally growing a layer of SiO2 on the upper surface and the lower surface of the SOI;
(2) depositing Si3N4 on the thermally grown SiO2 surface by LPCVD, and etching an alignment mark on Si3N4 so as to align the subsequent positive and negative overlay;
(3) spin-coating photoresist on the back of the SOI, photoetching and developing, then etching SiO2 and Si3N4 by an RIE dry method, then etching the silicon substrate layer by DRIE to form a back through hole, introducing HF steam into the back through hole, and releasing the silicon dioxide insulating layer;
(4) spin-coating photoresist on the front surface of the SOI, photoetching, developing, and then etching SIO2 and Si3N4 by RIE dry method;
(5) firstly, spin-coating photoresist on the front side of the SOI, photoetching and developing, then carrying out magnetron sputtering on chromium gold, and then putting the SOI into an acetone and isopropanol solution to strip the chromium gold to form an electrode pad and a first metal bonding area;
(6) spraying electron beam exposure special glue on the front surface of the SOI, carrying out electron beam exposure, and then etching SI3N4 on the surface by an RIE dry method to obtain a light wave track, a light cavity and a nano grating;
(7) firstly, spraying photoresist on the front side of the SOI, photoetching and developing, then thermally growing a layer of SiO2, putting the SOI into acetone and isopropanol solution to strip chrome gold, and protecting a precise optical part;
(8) firstly, spraying photoresist on the front side of the SOI, photoetching and developing, and then etching the silicon structure layer by DRIE to form a circular anchor point, a circular ring and a connecting spoke;
(9) cleaning glass, carrying out PECVD (plasma enhanced chemical vapor deposition) on a layer of Si3N4 on the upper surface and the lower surface of the glass, and etching an alignment mark on Si3N4 so as to align the subsequent positive and negative alignment;
(10) firstly, spin-coating photoresist on the back of glass and photoetching, carrying out magnetron sputtering on chromium gold, then putting the SOI into an acetone and isopropanol solution to strip the chromium gold to form a cavity pattern, and then spin-coating photoresist on the front and photoetching to form a circular hole pattern;
(11) carrying out isotropic wet etching by using H3PO4 solution, and etching the Si3N4 exposed on the upper and lower surfaces of the glass;
(12) protecting the front side of the glass by using a protection device, integrally placing the glass into an HF solution, and etching the back side of the glass by using a wet method to form a cavity;
(13) disassembling the glass from the protection device, and performing slow wet etching by using BOE solution to form a grating round hole and a shallow groove of an electrode round hole on the front surface of the glass;
(14) washing off photoresist and Si3N4 on the front surface, washing off chrome gold on the back surface, performing laser drilling on glass by using high-precision equipment, and completely drilling an electrode taper hole without drilling a grating taper hole so as to prevent air leakage;
(15) photoetching through an alignment mark on the back Si3N4, etching Si3N4 by an RIE dry method, carrying out magnetron sputtering on chrome gold and tin gold in the same area, then putting glass into an acetone and isopropanol solution to strip the glass to form a second metal bonding area, and cleaning the back Si3N 4;
(16) and (5) aligning the SOI structure subjected to the step (8) and the glass cap subjected to the step (15), and bonding the SOI structure and the glass cap by a metal bonding technology.
The disc type resonance gyroscope based on the optical waveguide principle has the advantages of small size, good sealing performance, high sensitivity, capability of realizing high-precision optical detection, simple processing and packaging method and simple process, and is suitable for batch production.
The prior art is not mentioned in the invention.
Claims (9)
1. A disk resonator gyroscope based on optical waveguides is characterized in that: the SOI structure comprises a silicon device layer, a silicon dioxide insulating layer and a silicon substrate layer from top to bottom;
the silicon device layer comprises a circular anchor point, a first circular groove structure, an optical structure, electrode pads and a first metal bonding area, wherein the circular anchor point is arranged in a central area;
a plurality of back through holes are punched in the silicon substrate layer;
the silicon dioxide insulating layer is provided with a second circular groove structure corresponding to the first circular groove structure on the silicon device layer, and the second circular groove structure enables the first circular groove structure on the silicon device layer to be communicated with the back through hole of the silicon substrate layer;
the glass cap comprises a cavity, a grating round hole, an electrode round hole and a second metal bonding region, wherein the cavity is arranged in the middle area of the back surface of the glass cap and covers the circular groove of the silicon device layer and the optical structure; a grating round hole with a bottom not opened is arranged on the glass cover cap at a position opposite to the nano grating, and an electrode round hole with a bottom completely opened is arranged at a position opposite to the electrode pad; the second metal bonding region is arranged on the periphery of the glass cap;
the SOI structure and the glass cap are bonded and connected through the first metal bonding area and the second metal bonding area.
2. An optical waveguide-based disk resonator gyroscope according to claim 1, and further comprising: the first ring groove structure comprises a plurality of ring grooves, each ring comprises a plurality of ring grooves, two adjacent ring grooves in the same ring are connected through connecting spokes, eight connecting spokes are arranged between every two adjacent ring grooves, and the difference angle of every two connecting spokes is 45 degrees; the web spokes between two adjacent pairs of annular grooves are angled by 22.5.
3. An optical waveguide-based disk resonator gyroscope according to claim 1, and further comprising: the optical structure comprises a light wave track, an optical cavity and a nano grating, and an optical fiber is used for being lapped on a grating round hole to introduce external light into the nano grating; the light wave track is connected with the nano grating, and part of light enters the light wave track according to the grating coupling effect; the optical cavity is arranged in the middle of the light wave track and latches a certain waveband of incident light therein.
4. An optical waveguide-based disk resonator gyroscope according to claim 1, and further comprising: the back through holes are arranged in a circular ring array.
5. An optical waveguide-based disk resonator gyroscope according to claim 1, and further comprising: a metal conductive layer of chrome gold is deposited on the inner wall of the round hole of the electrode.
6. An optical waveguide-based disk resonator gyroscope according to claim 1, and further comprising: the shape of the cavity is matched with the circular groove structure on the silicon device layer and the outer contour line of the light wave track.
7. An optical waveguide-based disk resonator gyroscope according to claim 1, and further comprising: the deposition material of the first metal bonding area is chrome gold, and the deposition material of the second metal bonding area is chrome gold and tin gold.
8. A method for manufacturing and packaging an optical waveguide-based disk resonator gyroscope according to any one of claims 1-7, wherein: the method comprises the following steps:
(1) forming an SOI structure:
firstly, cleaning the SOI, thermally growing a layer of SiO2 on the upper surface and the lower surface of the SOI, depositing Si3N4 on the thermally grown SiO2 surface by LPCVD, and etching an alignment mark on Si3N4 so as to align the subsequent positive and negative alignment;
secondly, etching Si3N4 and SiO2 in the corresponding area of the back surface of the SOI, etching the exposed silicon substrate layer by using DRIE to form a back through hole, and introducing HF steam into the back through hole to release an SiO2 insulating layer;
etching Si3N4 and SiO2 in the corresponding region of the front surface of the SOI, sputtering an electrode pad and a first metal bonding region on the exposed silicon device layer, then etching the reserved Si3N4 to form a lightwave track, an optical cavity and a nano grating, and thermally growing a layer of SiO2 in the region corresponding to the lightwave track, the optical cavity and the nano grating for protection;
finally, DRIE etches the silicon device layer to form an SOI structure;
(2) forming a glass cap:
firstly, cleaning glass, carrying out PECVD deposition on the upper surface and the lower surface of the glass to obtain Si3N4, and etching an alignment mark on Si3N4 so as to align the subsequent positive and negative alignment;
secondly, sputtering chrome gold on the back of the glass to form a cavity pattern, coating photoresist on the front of the glass in a spinning mode to form electrode round hole and grating round hole patterns, and corroding Si3N4 exposed on the front and the back of the glass;
thirdly, protecting the front side of the glass by using a protection device, carrying out wet etching on the glass in the cavity region on the back side to reach a specified depth, carrying out wet etching on the front side and the back side of the glass simultaneously, forming shallow grooves in the electrode circular holes and the grating circular hole regions on the front side of the glass, and forming electrode circular holes and grating circular holes by using a laser drilling technology;
finally, sputtering chrome gold and tin gold on the back of the glass to form a second metal bonding area;
(3) bonding and packaging:
and (3) aligning the SOI structure processed in the step (1) and the step (2) with the glass cap up and down, carrying out metal bonding, and carrying out vacuum packaging.
9. The method for processing and packaging the disk resonator gyroscope based on the optical waveguide as claimed in claim 8, wherein the step of etching the silicon device layer comprises the steps of:
(a) spin-coating photoresist on the front side of the SOI, photoetching, developing, and then dry etching SIO2 and Si3N4 by RIE;
(b) spin-coating photoresist on the front side of the SOI, photoetching, developing, carrying out magnetron sputtering on chromium gold, putting the SOI into an acetone and isopropanol solution, and stripping the chromium gold to form an electrode pad and a first metal bonding area;
(c) spraying electron beam exposure special glue on the front surface of the SOI, carrying out electron beam exposure, and then etching SI3N4 on the surface by an RIE dry method to obtain a light wave track, a light cavity and a nano grating;
(d) spraying photoresist on the front side of the SOI, photoetching and developing, then thermally growing a layer of SiO2, putting the SOI into acetone and isopropanol solution to strip chrome gold, and protecting a precise optical part;
(e) and spraying photoresist on the front side of the SOI, photoetching and developing, and then etching the silicon structure layer by DRIE to form a circular anchor point, a circular groove and a connecting spoke.
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