CN108489476B - Photoacoustic wave gyroscope based on acousto-optic coupling effect and processing method thereof - Google Patents
Photoacoustic wave gyroscope based on acousto-optic coupling effect and processing method thereof Download PDFInfo
- Publication number
- CN108489476B CN108489476B CN201810140314.XA CN201810140314A CN108489476B CN 108489476 B CN108489476 B CN 108489476B CN 201810140314 A CN201810140314 A CN 201810140314A CN 108489476 B CN108489476 B CN 108489476B
- Authority
- CN
- China
- Prior art keywords
- soi
- layer
- electrode
- harmonic oscillator
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5698—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using acoustic waves, e.g. surface acoustic wave gyros
Abstract
The invention discloses a photoacoustic wave gyroscope based on an acousto-optic coupling effect and a processing method thereof, wherein the photoacoustic wave gyroscope comprises an SOI (silicon on insulator) main body structure, a silicon cap, a harmonic oscillator, a metal electrode and an optical path; the SOI main body structure is bonded with the silicon cap, the SOI main body structure comprises an SOI substrate and an SOI device layer, and the SOI substrate is arranged below the SOI device layer; the central part of the top surface of the SOI device layer is provided with a circular groove, the harmonic oscillator is disc-shaped and is arranged at the center of the circular groove, the metal electrodes are uniformly distributed at the periphery of the harmonic oscillator, and the optical paths are uniformly distributed between two adjacent metal electrodes; a groove is formed in the lower surface of the silicon cap corresponding to the position of the resonator; the silicon cap is provided with electrode through holes with the same number as the metal electrodes, the bottom of each electrode through hole is provided with a metal bonding pad, and the electrode through holes and the metal electrodes are in one-to-one correspondence and are connected. The invention uses light to detect the angular velocity, has small quality, high measurement precision, wide application range and good market prospect, and is free from electromagnetic interference.
Description
Technical Field
The invention relates to a photoacoustic wave gyroscope based on an acousto-optic coupling effect and a processing method thereof, belonging to the technical field of micro-opto-electro-mechanics and inertial navigation.
Background
The MOEMS, which is called Micro-opto-electro-mechanical System in english, is a Micro-opto-electro-mechanical System in chinese, or called optical MEMS, which is a Micro-System technology combining integrated optical technology and MEMS technology, and is the Micro-System at the forefront of scientific research field at present with the highest knowledge density. The MOEMS integrates various MEMS mechanisms with micro-optical devices, optical waveguide devices, optical fiber devices, lasers, photoelectric detection devices and the like to form a brand new functional component or system.
The MOMES gyroscope is also one of the MOMES gyroscopes, and is a novel and high-precision micro gyroscope which adopts an optical detection method to replace capacitance detection aiming at the limitations that most micro-electromechanical gyroscopes are easily interfered by parasitic effects and the precision and the dynamic performance are difficult to be considered simultaneously.
Disclosure of Invention
The purpose of the invention is as follows: in order to overcome the defects of the prior art, reduce the coupling effect in the gyroscope and improve the measurement precision of the gyroscope, the invention aims to provide a photoacoustic wave gyroscope based on the acousto-optic coupling effect and a processing method thereof.
The technical scheme is as follows: in order to solve the technical problems, the invention adopts the following technical scheme:
a photoacoustic wave gyroscope based on an acousto-optic coupling effect comprises an SOI (silicon on insulator) main body structure, a silicon cap, a harmonic oscillator, a metal electrode and an optical path; the SOI main body structure is bonded with the silicon cap, the SOI main body structure comprises an SOI substrate and an SOI device layer, and the SOI substrate is arranged below the SOI device layer; the central part of the top surface of the SOI device layer is provided with a circular groove, the harmonic oscillator is disc-shaped and is arranged at the center of the circular groove, the metal electrodes are uniformly distributed at the periphery of the harmonic oscillator, and the optical paths are uniformly distributed between two adjacent metal electrodes; a groove is formed in the lower surface of the silicon cap corresponding to the position of the resonator; the silicon cap is provided with electrode through holes with the same number as the metal electrodes, the bottom of each electrode through hole is provided with a metal bonding pad, and the electrode through holes and the metal electrodes are in one-to-one correspondence and are connected.
The working principle is as follows: the invention relates to a photoacoustic wave gyroscope based on an acousto-optic coupling effect, which belongs to the field of MOMES gyroscopes.A metal wire outside is electrically connected with a micro-resonator through a metal bonding pad in an electrode through hole to drive the micro-resonator to generate ultrasonic waves and form standing waves inside; due to the coriolis effect, the wave field of the ultrasonic waves in the harmonic oscillator changes; based on the elasto-optical effect, when detection light passes through the surface of a harmonic oscillator with sound waves, diffraction occurs, and the caused light intensity change is related to an ultrasonic field; the external laser generator is used as a light source to provide detection light, the detection light enters from the light generator and then sequentially passes through the light path, the harmonic oscillator and the light path to obtain emergent light, the light intensity of the emergent light changes along with the change of the ultrasonic field, and the angular velocity can be calculated by detecting the light intensity of the emergent light entering the external photoelectric converter.
The harmonic oscillator comprises a silicon resonator capable of generating sound waves and an acousto-optic medium coupling layer arranged on the upper surface of the silicon resonator, wherein the coupling layer and an optical path are positioned on the same plane, and the coupling of an ultrasonic field and an optical field can be realized.
The coupling layer is obtained by depositing an acousto-optic medium; for acousto-optic medium, when ultrasonic wave exists in the medium, the dielectric constant of the crystal is changed, and the periodic spacing layers with different refractive indexes are formed in the crystal and move at the speed of sound, and the spacing layers have the function of grating, so when light passes through the acousto-optic medium with the acoustic wave, diffraction can be generated, and the change of light intensity, frequency and direction along with the ultrasonic field is caused. When the medium rotates, the ultrasonic field inside the medium changes correspondingly under the action of the Coriolis effect, so that the light intensity of emergent light changes, and the external angular velocity can be calculated by detecting the change of the light intensity, so that the function of the gyroscope is realized.
The silicon resonator is driven by electrostatic force to generate sound waves, and the sound waves form standing waves in the disc, so that the position of the standing waves can be easily determined, and the subsequent light path design is facilitated.
The optical path is formed on the SOI device layer by processing through a film deposition process, the integration of the optical path and the device can be realized, and the processing precision is high.
The number of the metal electrodes and the number of the electrode through holes are 4, the metal electrodes are driven in a push-pull mode, the vibration mode of the harmonic oscillator is elliptical, differential signals can be adopted for detection at a detection end, and the influence of common-mode noise on the measurement precision is restrained.
The electrode through hole is of a tapered hole structure with a large upper part and a small lower part, so that the metal wire is more easily contacted with the bonding pad when the metal wire is bonded, the processing difficulty is reduced, and the success rate is improved.
The processing method of the photoacoustic wave gyroscope based on the acousto-optic coupling effect comprises the following steps of:
1) cleaning and drying the SOI wafer, and depositing a layer of lithium niobate on the surface of an SOI device layer of the SOI wafer by adopting a low-pressure chemical vapor deposition method for an optical path and a coupling layer;
2) depositing a layer of metal aluminum on the surface of the lithium niobate layer obtained in the step 1) as a mask and simultaneously processing a cladding of an optical path, and then spin-coating a layer of photoresist on the surface of the metal aluminum and curing;
3) defining the shape and position of the optical path and the harmonic oscillator on an ultraviolet lithography machine by using a first mask plate on the photoresist layer obtained in the step 2), removing the exposed metal aluminum layer by using hydrochloric acid to transfer the pattern to the metal aluminum mask layer, and removing redundant photoresist;
4) transferring the pattern of the harmonic oscillator and the optical path structure to a lithium niobate layer and an SOI device layer by adopting a deep reactive ion etching process;
5) removing the buried oxide layer below the movable part of the harmonic oscillator by using a hydrofluoric acid solution, and releasing the SOI main body structure;
6) taking a silicon wafer, thinning, cleaning, drying, coating photoresist on two sides in a spinning mode, and after curing, respectively defining the shapes and the positions of a groove of a silicon cap and an opening of an electrode through hole on the upper surface and the lower surface of the silicon wafer by using a second mask and a third mask;
7) using KOH solution for wet etching, and processing a groove and an electrode through hole on the silicon wafer obtained in the step 6) to obtain a required silicon cap;
8) and (3) bonding the silicon cap obtained in the step (7) and the SOI main body structure obtained in the step (5) through a gold-gold bonding process to obtain a complete photoacoustic wave gyroscope structure.
Preferably, in the step 1), during deposition of the coupling layer, a layer of gallium phosphide or tellurium dioxide is deposited on the surface of the SOI device layer of the SOI wafer by using a low-pressure chemical vapor deposition method for the coupling layer.
Has the advantages that: the photoacoustic wave gyroscope based on the acousto-optic coupling effect utilizes light to detect the angular speed, has the advantages of small quality, high measurement precision, no electromagnetic interference, convenience for batch production and the like, and has wide application range and good market prospect.
Drawings
FIG. 1 is a schematic view of the external structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
FIG. 3 is a schematic structural diagram of an SOI body structure;
FIG. 4 is a flow chart of the processing method of the present invention.
Detailed Description
Example 1
As shown in fig. 1-4, a photoacoustic wave gyroscope based on an acousto-optic coupling effect includes an SOI main body structure 2, a silicon cap 1, a harmonic oscillator 4, a metal electrode 5 and an optical path 6; the SOI main body structure 2 is bonded with the silicon cap 1, the SOI main body structure 2 comprises an SOI substrate 7 and an SOI device layer 8, and the SOI substrate 7 is arranged below the SOI device layer 8; a circular groove is formed in the center of the top surface of the SOI device layer 8, the harmonic oscillator 4 is disc-shaped and is arranged in the center of the circular groove, the metal electrodes 5 are uniformly distributed on the periphery of the harmonic oscillator 4, and the optical paths 6 are uniformly distributed between every two adjacent metal electrodes 5; a groove is formed in the lower surface of the silicon cap 1 corresponding to the position of the harmonic oscillator 4; electrode through holes 3 with the same number as the metal electrodes 5 are arranged on the silicon cap 1, metal bonding pads are arranged at the bottoms of the electrode through holes 3, and the electrode through holes 3 are in one-to-one correspondence with and connected with the metal electrodes 5; the harmonic oscillator 4 comprises a silicon resonator capable of generating sound waves and an acousto-optic medium coupling layer arranged on the upper surface of the silicon resonator, and the coupling layer and the optical path 6 are positioned on the same plane; the silicon resonator is driven by electrostatic force to generate sound waves, and the sound waves form standing waves in the disc; the optical path 6 is processed on the SOI device layer 8 by a thin film deposition process; the number of the metal electrodes 5 and the number of the electrode through holes 3 are 4, the metal electrodes 5 are driven in a push-pull mode, and the vibration mode of the harmonic oscillator 4 is oval; the electrode through hole 3 is a tapered hole structure with a large upper part and a small lower part.
A processing method of a photoacoustic wave gyroscope based on an acousto-optic coupling effect comprises the following steps:
1) cleaning and drying the SOI wafer, and depositing a layer of lithium niobate on the surface of an SOI device layer 8 of the SOI wafer by adopting a Low Pressure Chemical Vapor Deposition (LPCVD) method for an optical path 6 and a coupling layer;
2) depositing a layer of metal aluminum on the surface of the lithium niobate layer obtained in the step 1) as a mask and simultaneously processing a cladding of the optical path 6, and then spin-coating a layer of photoresist on the surface of the metal aluminum and curing;
3) defining the shape and position of the optical path 6 and the harmonic oscillator 4 on an ultraviolet photoetching machine by using a first mask plate on the photoresist layer obtained in the step 2), removing the exposed metal aluminum layer by using hydrochloric acid to transfer the pattern to the metal aluminum mask layer, and removing redundant photoresist;
4) transferring the pattern of the structures of the harmonic oscillator 4 and the optical path 6 to a lithium niobate layer and an SOI device layer 8 by adopting a Deep Reactive Ion Etching (DRIE) process;
5) removing the buried oxide layer below the movable part of the harmonic oscillator 4 by using a hydrofluoric acid solution, and releasing the SOI main body structure;
6) taking a silicon wafer, thinning, cleaning, drying, coating photoresist on two sides in a spinning mode, and after curing, respectively defining the shapes and the positions of a groove of a silicon cap 1 and an opening of an electrode through hole 3 on the upper surface and the lower surface of the silicon wafer by using a second mask and a third mask;
7) using KOH solution for wet etching, and processing grooves and electrode through holes 3 on the silicon wafer obtained in the step 6) to obtain the required silicon cap 1;
8) and (3) bonding the silicon cap 1 obtained in the step (7) and the SOI main body structure obtained in the step (5) through a gold-gold bonding process to obtain a complete photoacoustic wave gyroscope structure.
The invention relates to a photoacoustic wave gyroscope based on an acousto-optic coupling effect and a processing method thereof, belonging to the field of MOMES gyroscopes.A metal wire outside is electrically connected with a micro resonator through a metal bonding pad in an electrode through hole 3 to drive the micro resonator to generate ultrasonic waves and form standing waves inside; due to the coriolis effect, the wave field of the ultrasonic waves in the harmonic oscillator 4 changes; based on the elasto-optical effect, when detection light passes through the surface of the harmonic oscillator 4 with sound waves, diffraction occurs, and the caused light intensity change is related to an ultrasonic field; the external laser generator is used as a light source to provide detection light, the detection light enters from the light generator and then sequentially passes through the light path 6, the harmonic oscillator 4 and the light path 6 to obtain emergent light, the light intensity of the emergent light changes along with the change of the ultrasonic field, and the angular velocity can be calculated by detecting the light intensity of the emergent light entering the external photoelectric converter.
For acousto-optic medium, when ultrasonic wave exists in the medium, the dielectric constant of the crystal is changed, and the periodic spacing layers with different refractive indexes are formed in the crystal and move at the speed of sound, and the spacing layers have the function of grating, so when light passes through the acousto-optic medium with the acoustic wave, diffraction can be generated, and the change of light intensity, frequency and direction along with the ultrasonic field is caused. When the medium rotates, the ultrasonic field inside the medium changes correspondingly under the action of the Coriolis effect, so that the light intensity of emergent light changes, and the external angular velocity can be calculated by detecting the change of the light intensity, so that the function of the gyroscope is realized.
The processing method of the gyroscope combines electron beam exposure, MEMS bulk silicon processing technology, surface micromachining technology and bonding technology.
The photoacoustic wave gyroscope based on the acousto-optic coupling effect utilizes light to detect the angular speed, has the advantages of small quality, high measurement precision, no electromagnetic interference, convenience for batch production and the like, and has wide application range and good market prospect.
Example 2
Essentially the same as in example 1, except that: in the processing method of the photoacoustic wave gyroscope based on the acousto-optic coupling effect, in the step 1), when the coupling layer is deposited, a layer of gallium phosphide or tellurium dioxide is deposited on the surface of the SOI device layer 8 of the SOI wafer by adopting a low-pressure chemical vapor deposition method and is used for the coupling layer.
The prior art is referred to in the art for techniques not mentioned in the present invention.
Claims (7)
1. A photoacoustic wave gyroscope based on an acousto-optic coupling effect is characterized in that: the silicon-on-insulator (SOI) device comprises an SOI main body structure (2), a silicon cap (1), a harmonic oscillator (4), a metal electrode (5) and an optical path (6); the SOI main body structure (2) is bonded with the silicon cap (1), the SOI main body structure (2) comprises an SOI substrate (7) and an SOI device layer (8), and the SOI substrate (7) is arranged below the SOI device layer (8); a circular groove is formed in the center of the top surface of the SOI device layer (8), the harmonic oscillator (4) is disc-shaped and is arranged at the center of the circular groove, the metal electrodes (5) are uniformly distributed on the periphery of the harmonic oscillator (4), and the optical paths (6) are uniformly distributed between every two adjacent metal electrodes (5); a groove is formed in the lower surface of the silicon cap (1) corresponding to the position of the harmonic oscillator (4); electrode through holes (3) with the same number as the metal electrodes (5) are arranged on the silicon cap (1), metal bonding pads are arranged at the bottoms of the electrode through holes (3), and the electrode through holes (3) are in one-to-one correspondence with and connected with the metal electrodes (5); the harmonic oscillator (4) comprises a silicon resonator capable of generating sound waves and an acousto-optic dielectric coupling layer arranged on the upper surface of the silicon resonator, and the coupling layer and the optical path (6) are positioned on the same plane.
2. The photoacoustic gyroscope of claim 1, wherein: the silicon resonator is driven by electrostatic force to generate sound waves, and the sound waves form standing waves in the disc.
3. The photoacoustic gyroscope of claim 1, wherein: the optical path (6) is formed on the SOI device layer (8) by a thin film deposition process.
4. The photoacoustic gyroscope based on the acousto-optical coupling effect according to any one of claims 1 to 3, wherein: the number of the metal electrodes (5) and the number of the electrode through holes (3) are 4, the metal electrodes (5) are driven in a push-pull mode, and the vibration mode of the harmonic oscillator (4) is oval.
5. The photoacoustic gyroscope based on the acousto-optical coupling effect according to any one of claims 1 to 3, wherein: the electrode through hole (3) is of a conical hole structure with a large upper part and a small lower part.
6. The method for processing a photoacoustic wave gyroscope based on the acousto-optic coupling effect as claimed in any one of claims 1 to 5, wherein: the method comprises the following steps:
1) cleaning and drying the SOI wafer, and depositing a layer of lithium niobate on the surface of an SOI device layer (8) of the SOI wafer by adopting a low-pressure chemical vapor deposition method for an optical path (6) and a coupling layer;
2) depositing a layer of metal aluminum on the surface of the lithium niobate layer obtained in the step 1) as a mask and simultaneously processing a cladding of the optical path (6), and then spin-coating a layer of photoresist on the surface of the metal aluminum and curing;
3) defining the shape and the position of the optical path (6) and the harmonic oscillator (4) on an ultraviolet photoetching machine by using a first mask plate on the photoresist layer obtained in the step 2), removing the exposed metal aluminum layer by using hydrochloric acid to transfer the pattern to the metal aluminum mask layer, and then removing redundant photoresist;
4) transferring the pattern of the harmonic oscillator (4) and the optical path (6) structure to a lithium niobate layer and an SOI device layer (8) by adopting a deep reactive ion etching process;
5) removing the buried oxide layer below the movable part of the harmonic oscillator (4) by using a hydrofluoric acid solution, and releasing the SOI main body structure;
6) taking a silicon wafer, thinning, cleaning, drying, coating photoresist on two sides in a spinning mode, and after curing, respectively defining the shapes and the positions of a groove of a silicon cap (1) and an opening of an electrode through hole (3) on the upper surface and the lower surface of the silicon wafer by using a second mask and a third mask;
7) using KOH solution for wet etching, and processing grooves and electrode through holes (3) on the silicon wafer obtained in the step 6) to obtain the required silicon cap (1);
8) and (3) bonding the silicon cap obtained in the step (7) and the SOI main body structure obtained in the step (5) through a gold-gold bonding process to obtain a complete photoacoustic wave gyroscope structure.
7. The method for processing a photoacoustic gyroscope based on an acousto-optic coupling effect according to claim 6, wherein: in the step 1), when the coupling layer is deposited, a layer of gallium phosphide or tellurium dioxide is deposited on the surface of the SOI device layer (8) of the SOI wafer by adopting a low-pressure chemical vapor deposition method and is used for the coupling layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810140314.XA CN108489476B (en) | 2018-02-11 | 2018-02-11 | Photoacoustic wave gyroscope based on acousto-optic coupling effect and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810140314.XA CN108489476B (en) | 2018-02-11 | 2018-02-11 | Photoacoustic wave gyroscope based on acousto-optic coupling effect and processing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108489476A CN108489476A (en) | 2018-09-04 |
| CN108489476B true CN108489476B (en) | 2021-07-09 |
Family
ID=63340522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810140314.XA Active CN108489476B (en) | 2018-02-11 | 2018-02-11 | Photoacoustic wave gyroscope based on acousto-optic coupling effect and processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108489476B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109945851B (en) * | 2019-02-28 | 2020-08-11 | 东南大学 | Photoacoustic wave gyroscope based on bulk acoustic wave resonator and processing method thereof |
| CN113340289B (en) * | 2021-06-04 | 2023-01-24 | 西北工业大学 | Chip-level disc type acousto-optic standing wave gyroscope |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1791784A (en) * | 2003-05-16 | 2006-06-21 | 泰勒斯公司 | Solid-state gyrolaser stabilised by acousto-optical devices |
| CN101386403A (en) * | 2008-09-13 | 2009-03-18 | 中北大学 | Micro optical fibre voltage sensor based on ring micro-cavity |
| CN101625242A (en) * | 2009-08-10 | 2010-01-13 | 北京航空航天大学 | MOEMS gyro cavity resonator and method for adjusting micro-mirror spatial state thereof |
| CN101645698A (en) * | 2009-01-09 | 2010-02-10 | 中国科学院声学研究所 | Bridge type surface acoustic wave transducer in micro-optical-electro-mechanical gyroscope |
| CN203298772U (en) * | 2013-05-14 | 2013-11-20 | 东南大学 | Three-chip assembled type silica-based ultrathin micro semisphere resonance gyroscope |
| CN203310419U (en) * | 2013-05-14 | 2013-11-27 | 东南大学 | Two-chip integrated silicon-based ultrathin micro-hemispherical resonator gyroscope |
| CN104807452A (en) * | 2015-04-29 | 2015-07-29 | 东南大学 | Honeycomb MEMS (Micro-electromechanical System) resonance silicon micromachined gyroscope and machining method thereof |
| CN105115486A (en) * | 2015-07-17 | 2015-12-02 | 东南大学 | Electrostatic suspension triaxial spherical shell resonance micro-gyroscope and processing method thereof |
| CN204988292U (en) * | 2015-07-31 | 2016-01-20 | 中北大学 | High Q value micromechanics top structure based on nanometer optical grating detection |
| CN105466405A (en) * | 2016-01-07 | 2016-04-06 | 东南大学 | Hybrid hemispherical resonator micro-gyro and machining process thereof |
-
2018
- 2018-02-11 CN CN201810140314.XA patent/CN108489476B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1791784A (en) * | 2003-05-16 | 2006-06-21 | 泰勒斯公司 | Solid-state gyrolaser stabilised by acousto-optical devices |
| CN101386403A (en) * | 2008-09-13 | 2009-03-18 | 中北大学 | Micro optical fibre voltage sensor based on ring micro-cavity |
| CN101645698A (en) * | 2009-01-09 | 2010-02-10 | 中国科学院声学研究所 | Bridge type surface acoustic wave transducer in micro-optical-electro-mechanical gyroscope |
| CN101625242A (en) * | 2009-08-10 | 2010-01-13 | 北京航空航天大学 | MOEMS gyro cavity resonator and method for adjusting micro-mirror spatial state thereof |
| CN203298772U (en) * | 2013-05-14 | 2013-11-20 | 东南大学 | Three-chip assembled type silica-based ultrathin micro semisphere resonance gyroscope |
| CN203310419U (en) * | 2013-05-14 | 2013-11-27 | 东南大学 | Two-chip integrated silicon-based ultrathin micro-hemispherical resonator gyroscope |
| CN104807452A (en) * | 2015-04-29 | 2015-07-29 | 东南大学 | Honeycomb MEMS (Micro-electromechanical System) resonance silicon micromachined gyroscope and machining method thereof |
| CN105115486A (en) * | 2015-07-17 | 2015-12-02 | 东南大学 | Electrostatic suspension triaxial spherical shell resonance micro-gyroscope and processing method thereof |
| CN204988292U (en) * | 2015-07-31 | 2016-01-20 | 中北大学 | High Q value micromechanics top structure based on nanometer optical grating detection |
| CN105466405A (en) * | 2016-01-07 | 2016-04-06 | 东南大学 | Hybrid hemispherical resonator micro-gyro and machining process thereof |
Non-Patent Citations (2)
| Title |
|---|
| MOEMS陀螺的谐振腔设计;冯丽爽等;《北京航空航天大学学报》;20061230;第32卷(第11期);第1373-1376页 * |
| 微型光学陀螺仪中声表面波声光移频器的研究;张斌等;《清华大学学报(自然科学版)》;19990210;第39卷(第02期);第65-67页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108489476A (en) | 2018-09-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108955664B (en) | Fully-decoupled annular micro gyroscope based on optical microcavity and processing method thereof | |
| CN106959106B (en) | Fused quartz micro-hemispherical resonator gyroscope based on SOI packaging and processing method thereof | |
| CN110631568B (en) | Novel MOEMS (metal oxide semiconductor energy management system) double-shaft gyroscope based on two-dimensional photonic crystal cavity structure and processing method thereof | |
| JP2004205523A (en) | Vertical mems gyroscope of horizontal vibration and manufacturing method therefor | |
| US8939026B2 (en) | Frequency modulated micro gyro | |
| CN108489476B (en) | Photoacoustic wave gyroscope based on acousto-optic coupling effect and processing method thereof | |
| CN110308306B (en) | MOEMS accelerometer based on fully-differential two-dimensional photonic crystal cavity structure and processing method thereof | |
| CN111204701B (en) | Micro-mirror with fully symmetrical differential capacitance angle feedback | |
| US9880000B2 (en) | Manufacturing method of inertial sensor and inertial sensor | |
| CN104457725B (en) | High sensitivity bulk acoustic wave silicon micro-gyroscope | |
| CN108716914A (en) | A kind of MOEMS gyroscopes and its processing method based on nanometer grating | |
| CN112033526A (en) | Vibration sensor and method for manufacturing the same | |
| JP4362877B2 (en) | Angular velocity sensor | |
| CN104897146A (en) | Out-plane piezoelectric type hemispheric micro-gyroscope and preparation method thereof | |
| CN108195366B (en) | Processing method of micro-nano gyroscope based on double-layer nano grating | |
| JP3627648B2 (en) | Angular velocity sensor | |
| US20230067030A1 (en) | Fabrication of mems structures from fused silica for inertial sensors | |
| CN105737810B (en) | Highly sensitive plate-like bulk acoustic wave silicon micro-gyroscope | |
| CN109945851B (en) | Photoacoustic wave gyroscope based on bulk acoustic wave resonator and processing method thereof | |
| WO2022088015A1 (en) | Ultrasonic transducer unit and manufacturing method therefor | |
| CN113912001A (en) | Method and structure for on-glass sensor | |
| CN105466408A (en) | Triaxial stereo football-shaped micro-gyroscope and processing method thereof | |
| CN108709549A (en) | A kind of single-chip integration gyroscope and its processing method based on nanometer grating | |
| JP4362739B2 (en) | Vibration type angular velocity sensor | |
| CN219087309U (en) | Integrated optical fiber MEMS microphone probe and optical fiber MEMS microphone |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |