CN108949303A - A kind of solar silicon wafers cutting fluid and preparation method thereof - Google Patents
A kind of solar silicon wafers cutting fluid and preparation method thereof Download PDFInfo
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- CN108949303A CN108949303A CN201811006419.2A CN201811006419A CN108949303A CN 108949303 A CN108949303 A CN 108949303A CN 201811006419 A CN201811006419 A CN 201811006419A CN 108949303 A CN108949303 A CN 108949303A
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- triethanolamine
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M167/00—Lubricating compositions characterised by the additive being a mixture of a macromolecular compound, a non-macromolecular compound and a compound of unknown or incompletely defined constitution, each of these compounds being essential
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/02—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/08—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds containing monomers having an unsaturated radical bound to a carboxyl radical, e.g. acrylate type
- C10M2209/086—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds containing monomers having an unsaturated radical bound to a carboxyl radical, e.g. acrylate type polycarboxylic, e.g. maleic acid
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
- C10M2209/104—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
- C10M2209/108—Polyethers, i.e. containing di- or higher polyoxyalkylene groups etherified
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2215/00—Organic non-macromolecular compounds containing nitrogen as ingredients in lubricant compositions
- C10M2215/02—Amines, e.g. polyalkylene polyamines; Quaternary amines
- C10M2215/04—Amines, e.g. polyalkylene polyamines; Quaternary amines having amino groups bound to acyclic or cycloaliphatic carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2227/00—Organic non-macromolecular compounds containing atoms of elements not provided for in groups C10M2203/00, C10M2207/00, C10M2211/00, C10M2215/00, C10M2219/00 or C10M2223/00 as ingredients in lubricant compositions
- C10M2227/06—Organic compounds derived from inorganic acids or metal salts
- C10M2227/061—Esters derived from boron
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2229/00—Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
- C10M2229/04—Siloxanes with specific structure
- C10M2229/041—Siloxanes with specific structure containing aliphatic substituents
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/64—Environmental friendly compositions
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/72—Extended drain
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Organic Chemistry (AREA)
- Dicing (AREA)
- Lubricants (AREA)
Abstract
The invention discloses a kind of solar silicon wafers cutting fluids, raw material including following parts by weight: 20~50 parts of aqueous polyethers, molecular weight is 30~60 parts of polyethylene glycol of 400,2~5 parts of alkyl phenol polyoxyethylene ether, 16~19 parts of tall oil triethanolamine ester, molecular weight is 14~17 parts of polymaleic anhydride of 600,3.4~6.4 parts of tetramethyl sodium hydroxide (25% aqueous solution), 0.2~0.5 part of polymethyl-siloxane type defoaming agent, 5~8 parts of triethanolamine borate ester, 0.8~1.1 part of fungicide, 8.6~11.6 parts of deionized water.The present invention has had both environmental protection and efficient two-fold advantage, will not generate foam, and own loss is small, promotes cut quality, and service life is long.
Description
Technical field
The present invention relates to cutting fluid technical fields more particularly to a kind of solar silicon wafers cutting fluid and preparation method thereof.
Background technique
As the problems such as global energy shortage and environmental pollution, becomes increasingly conspicuous, solar energy power generating because its cleaning, safety,
The features such as convenient, efficient, it has also become countries in the world common concern and the new industry given priority to, and in photovoltaic solar silicon wafer
In cutting process, silicon chip cutting fluid as a kind of auxiliary material consumable product that must be used in silicon wafer cutting process, dosage also with
Photovoltaic solar industry and China silicon wafer processing industry growth and extend, cutting liquid is undertaken in silicon wafer cutting process
It is cooling, suspend, dispersion, the multiple actions such as lubrication.
But existing conventional cutting liquid can not get both in terms of environmental protection and cutting efficiency two, and using effect is bad, cutting process
Middle loss is big, and foam is easily generated in high-speed friction, influences cut quality, and the period used is shorter.
Summary of the invention
The purpose of the present invention is to solve disadvantages existing in the prior art, and a kind of solar silicon wafers cutting proposed
Liquid and preparation method thereof.
A kind of solar silicon wafers cutting fluid, the raw material including following parts by weight: 20~50 parts of aqueous polyethers, molecular weight are
30~60 parts of 400 polyethylene glycol, 2~5 parts of alkyl phenol polyoxyethylene ether, 16~19 parts of tall oil triethanolamine ester, molecular weight
For 14~17 parts of polymaleic anhydride of 600,3.4~6.4 parts of tetramethyl sodium hydroxide (25% aqueous solution), polymethyl-siloxane type
0.2~0.5 part of defoaming agent, 5~8 parts of triethanolamine borate ester, 0.8~1.1 part of fungicide, 8.6~11.6 parts of deionized water.
Preferably, a kind of solar silicon wafers cutting fluid, the raw material including following parts by weight: aqueous polyethers 20~40
Part, molecular weight is 30~50 parts of polyethylene glycol of 400,2~4 parts of alkyl phenol polyoxyethylene ether, tall oil triethanolamine ester 16~
18 parts, molecular weight is 14~16 parts of polymaleic anhydride of 600,3.4~5.4 parts of tetramethyl sodium hydroxide (25% aqueous solution), poly- first
0.2~0.4 part of radical siloxane type defoaming agent, 5~7 parts of triethanolamine borate ester, 0.8~1 part of fungicide, deionization 8.6~
10.6 parts.
Preferably, a kind of solar silicon wafers cutting fluid, the raw material including following parts by weight: 30 parts of aqueous polyethers,
Molecular weight is 40 parts of polyethylene glycol of 400, and 3 parts of alkyl phenol polyoxyethylene ether, 17 parts of tall oil triethanolamine ester, molecular weight is
15 parts of 600 polymaleic anhydride, 4.4 parts of tetramethyl sodium hydroxide (25% aqueous solution), 0.3 part of polymethyl-siloxane type defoaming agent,
6 parts of triethanolamine borate ester, 0.9 part of fungicide, 9.6 parts of deionized water.
Preferably, the triethanolamine borate ester is mixed by boric acid and triethanolamine.
Preferably, the tall oil triethanolamine ester is mixed by tall oil and triethanolamine.
Preferably, the deionized water can be replaced with tap water, but need to be added into 0.2% disodium ethylene diamine tetraacetate.
Preferably, the preparation method of a kind of solar silicon wafers cutting fluid according to any one of claim 1 to 3,
Include the following steps:
S1, by boric acid and 120 degree of triethanolamine Hybrid Heating, when heating a length of half an hour synthesizes triethanolamine borate ester；
S2, tall oil and triethanolamine be mixed and heated to 80 degree, when heating a length of half an hour synthesizes three ethyl alcohol of tall oil
Amine ester；
S3, aqueous polyethers, polyethylene glycol, alkyl phenol polyoxyethylene ether, tall oil triethanolamine ester, poly- Malaysia are put into measuring cup
It is right after acid anhydrides, tetramethyl sodium hydroxide, polymethyl-siloxane type defoaming agent, triethanolamine borate ester, fungicide, deionized water
It is at the uniform velocity stirred, and is mixed them thoroughly to get solar silicon wafers cutting fluid.
A kind of solar silicon wafers cutting fluid proposed by the present invention, environment-friendly high-efficiency will not generate foam, and own loss is small, mentions
Cut quality is risen, service life is long.
Specific embodiment
Below in conjunction with embodiment, technical solution of the invention is clearly and completely described, it is clear that described
Embodiment be only a part of the embodiment of the present invention, instead of all the embodiments.
Embodiment one:
A kind of solar silicon wafers cutting fluid proposed by the present invention, the raw material including following parts by weight: 20 parts of aqueous polyethers, molecular weight
For 30 parts of polyethylene glycol of 400,2 parts of alkyl phenol polyoxyethylene ether, 16 parts of tall oil triethanolamine ester, molecular weight be 600 it is poly-
14 parts of maleic anhydride, 3.4 parts of tetramethyl sodium hydroxide (25% aqueous solution), 0.2 part of polymethyl-siloxane type defoaming agent, boric acid three
5 parts of ethanol amine ester, 0.8 part of fungicide, 8.6 parts of deionized water.
Preparation method, comprising the following steps:
S1, by boric acid and 120 degree of triethanolamine Hybrid Heating, when heating a length of half an hour synthesizes triethanolamine borate ester；
S2, tall oil and triethanolamine be mixed and heated to 80 degree, when heating a length of half an hour synthesizes three ethyl alcohol of tall oil
Amine ester；
S3, the aqueous polyethers that corresponding parts by weight are put into measuring cup, polyethylene glycol, alkyl phenol polyoxyethylene ether, three second of tall oil
Alkanolamine ester, polymaleic anhydride, tetramethyl sodium hydroxide, polymethyl-siloxane type defoaming agent, triethanolamine borate ester, fungicide,
After deionized water, it is at the uniform velocity stirred, is mixed them thoroughly to get solar silicon wafers cutting fluid.
Embodiment two:
A kind of solar silicon wafers cutting fluid proposed by the present invention, the raw material including following parts by weight: 30 parts of aqueous polyethers, molecular weight
For 40 parts of polyethylene glycol of 400,3 parts of alkyl phenol polyoxyethylene ether, 17 parts of tall oil triethanolamine ester, molecular weight be 600 it is poly-
15 parts of maleic anhydride, 4.4 parts of tetramethyl sodium hydroxide (25% aqueous solution), 0.3 part of polymethyl-siloxane type defoaming agent, boric acid three
6 parts of ethanol amine ester, 0.9 part of fungicide, 9.6 parts of deionized water.
Preparation method, comprising the following steps:
S1, by boric acid and 120 degree of triethanolamine Hybrid Heating, when heating a length of half an hour synthesizes triethanolamine borate ester；
S2, tall oil and triethanolamine be mixed and heated to 80 degree, when heating a length of half an hour synthesizes three ethyl alcohol of tall oil
Amine ester；
S3, the aqueous polyethers that corresponding parts by weight are put into measuring cup, polyethylene glycol, alkyl phenol polyoxyethylene ether, three second of tall oil
Alkanolamine ester, polymaleic anhydride, tetramethyl sodium hydroxide, polymethyl-siloxane type defoaming agent, triethanolamine borate ester, fungicide,
After deionized water, it is at the uniform velocity stirred, is mixed them thoroughly to get solar silicon wafers cutting fluid.
Embodiment three:
A kind of solar silicon wafers cutting fluid proposed by the present invention, the raw material including following parts by weight: 40 parts of aqueous polyethers, molecular weight
For 50 parts of polyethylene glycol of 400,4 parts of alkyl phenol polyoxyethylene ether, 18 parts of tall oil triethanolamine ester, molecular weight be 600 it is poly-
16 parts of maleic anhydride, 5.4 parts of tetramethyl sodium hydroxide (25% aqueous solution), 0.4 part of polymethyl-siloxane type defoaming agent, boric acid three
7 parts of ethanol amine ester, 1 part of fungicide, 10.6 parts of deionized water.
Preparation method, comprising the following steps:
S1, by boric acid and 120 degree of triethanolamine Hybrid Heating, when heating a length of half an hour synthesizes triethanolamine borate ester；
S2, tall oil and triethanolamine be mixed and heated to 80 degree, when heating a length of half an hour synthesizes three ethyl alcohol of tall oil
Amine ester；
S3, the aqueous polyethers that corresponding parts by weight are put into measuring cup, polyethylene glycol, alkyl phenol polyoxyethylene ether, three second of tall oil
Alkanolamine ester, polymaleic anhydride, tetramethyl sodium hydroxide, polymethyl-siloxane type defoaming agent, triethanolamine borate ester, fungicide,
After deionized water, it is at the uniform velocity stirred, is mixed them thoroughly to get solar silicon wafers cutting fluid.
Example IV:
A kind of solar silicon wafers cutting fluid proposed by the present invention, the raw material including following parts by weight: 50 parts of aqueous polyethers, molecular weight
For 60 parts of polyethylene glycol of 400,5 parts of alkyl phenol polyoxyethylene ether, 19 parts of tall oil triethanolamine ester, molecular weight be 600 it is poly-
17 parts of maleic anhydride, 6.4 parts of tetramethyl sodium hydroxide (25% aqueous solution), 0.5 part of polymethyl-siloxane type defoaming agent, boric acid three
8 parts of ethanol amine ester, 1.1 parts of fungicide, 11.6 parts of deionized water.
Preparation method, comprising the following steps:
S1, by boric acid and 120 degree of triethanolamine Hybrid Heating, when heating a length of half an hour synthesizes triethanolamine borate ester；
S2, tall oil and triethanolamine be mixed and heated to 80 degree, when heating a length of half an hour synthesizes three ethyl alcohol of tall oil
Amine ester；
S3, the aqueous polyethers that corresponding parts by weight are put into measuring cup, polyethylene glycol, alkyl phenol polyoxyethylene ether, three second of tall oil
Alkanolamine ester, polymaleic anhydride, tetramethyl sodium hydroxide, polymethyl-siloxane type defoaming agent, triethanolamine borate ester, fungicide,
After deionized water, it is at the uniform velocity stirred, is mixed them thoroughly to get solar silicon wafers cutting fluid.
A kind of solar silicon wafers cutting fluid proposed by the present invention has had both environmental protection and efficient two-fold advantage, raw material VOC
Content is low, and the polymaleic anhydride of the polyethylene glycol of 400 molecular weight and 600 molecular weight meets environmental requirement, in cutting process not
Foam can be generated, silk damage is small, promotes cut quality, accelerates cutting speed, and the service life of cutting fluid is long.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (7)
1. a kind of solar silicon wafers cutting fluid, which is characterized in that the raw material including following parts by weight: 20~50 parts of aqueous polyethers,
Molecular weight is 30~60 parts of polyethylene glycol of 400,2~5 parts of alkyl phenol polyoxyethylene ether, tall oil triethanolamine ester 16~19
Part, molecular weight is 14~17 parts of polymaleic anhydride of 600,3.4~6.4 parts of tetramethyl sodium hydroxide (25% aqueous solution), poly- methyl
0.2~0.5 part of silicone-type defoaming agent, 5~8 parts of triethanolamine borate ester, 0.8~1.1 part of fungicide, deionized water 8.6~
11.6 parts.
2. a kind of solar silicon wafers cutting fluid according to claim 1, which is characterized in that the original including following parts by weight
Material: 20~40 parts of aqueous polyethers, molecular weight are 30~50 parts of polyethylene glycol of 400,2~4 parts of alkyl phenol polyoxyethylene ether, Carvedilol
16~18 parts of oily triethanolamine ester, molecular weight are 14~16 parts of polymaleic anhydride of 600, and (25% is water-soluble for tetramethyl sodium hydroxide
Liquid) 3.4~5.4 parts, 0.2~0.4 part of polymethyl-siloxane type defoaming agent, 5~7 parts of triethanolamine borate ester, fungicide 0.8~
1 part, 8.6~10.6 parts of deionization.
3. a kind of solar silicon wafers cutting fluid according to claim 1, which is characterized in that the original including following parts by weight
Material: 30 parts of aqueous polyethers, molecular weight are 40 parts of polyethylene glycol of 400,3 parts of alkyl phenol polyoxyethylene ether, tall oil triethanolamine
17 parts of ester, molecular weight is 15 parts of polymaleic anhydride of 600,4.4 parts of tetramethyl sodium hydroxide (25% aqueous solution), methyl polysilicone
0.3 part of alkane type defoaming agent, 6 parts of triethanolamine borate ester, 0.9 part of fungicide, 9.6 parts of deionized water.
4. a kind of solar silicon wafers cutting fluid according to claim 1, which is characterized in that the triethanolamine borate ester by
Boric acid and triethanolamine are mixed.
5. a kind of solar silicon wafers cutting fluid according to claim 1, which is characterized in that the tall oil triethanolamine ester
It is mixed by tall oil and triethanolamine.
6. a kind of solar silicon wafers cutting fluid according to claim 1, which is characterized in that the deionized water is available originally
Water replaces, but need to add into 0.2% disodium ethylene diamine tetraacetate.
7. a kind of preparation method of solar silicon wafers cutting fluid according to any one of claim 1 to 3, feature exist
In including the following steps:
S1, by boric acid and 120 degree of triethanolamine Hybrid Heating, when heating a length of half an hour synthesizes triethanolamine borate ester；
S2, tall oil and triethanolamine be mixed and heated to 80 degree, when heating a length of half an hour synthesizes three ethyl alcohol of tall oil
Amine ester；
S3, aqueous polyethers, polyethylene glycol, alkyl phenol polyoxyethylene ether, tall oil triethanolamine ester, poly- Malaysia are put into measuring cup
It is right after acid anhydrides, tetramethyl sodium hydroxide, polymethyl-siloxane type defoaming agent, triethanolamine borate ester, fungicide, deionized water
It is at the uniform velocity stirred, and is mixed them thoroughly to get solar silicon wafers cutting fluid.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811006419.2A CN108949303A (en) | 2018-08-30 | 2018-08-30 | A kind of solar silicon wafers cutting fluid and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811006419.2A CN108949303A (en) | 2018-08-30 | 2018-08-30 | A kind of solar silicon wafers cutting fluid and preparation method thereof |
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| CN108949303A true CN108949303A (en) | 2018-12-07 |
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| CN102071090A (en) * | 2009-11-20 | 2011-05-25 | 安集微电子（上海）有限公司 | Wire cutting solution for solar silicon slice |
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| RU2597599C1 (en) * | 2015-08-07 | 2016-09-10 | Общество с ограниченной ответственностью "ПРОФМАСЛО" | Cooling lubricant concentrate |
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2018
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| CN101712907A (en) * | 2009-08-26 | 2010-05-26 | 辽阳科隆化学品有限公司 | Composition and application combination of water-soluble silicon material cutting fluid |
| WO2011044716A1 (en) * | 2009-10-16 | 2011-04-21 | Dow Global Technologies Llc | Cutting fluids with improved performance |
| CN102071090A (en) * | 2009-11-20 | 2011-05-25 | 安集微电子（上海）有限公司 | Wire cutting solution for solar silicon slice |
| CN103695145A (en) * | 2013-12-31 | 2014-04-02 | 镇江市港南电子有限公司 | Novel silicon wafer cutting liquid |
| CN104450132A (en) * | 2014-10-31 | 2015-03-25 | 江南大学 | Special line-cutting fluid for diamond and preparation method of line-cutting fluid |
| RU2597599C1 (en) * | 2015-08-07 | 2016-09-10 | Общество с ограниченной ответственностью "ПРОФМАСЛО" | Cooling lubricant concentrate |
| CN106566417A (en) * | 2016-10-28 | 2017-04-19 | 扬州翠佛堂珠宝有限公司 | Grinding liquid for crystal |
| CN107474907A (en) * | 2017-10-09 | 2017-12-15 | 东莞市德虏克新材料科技有限公司 | A kind of metalworking fluid |
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| 刘晓风等: "高悬浮性β-SiC研磨液制备工艺研究", 《金刚石与磨料磨具工程》 * |
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