CN108948656A - 一种空调继电器的环保型环氧密封组合物 - Google Patents
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- 239000004593 Epoxy Substances 0.000 title claims abstract description 16
- 238000007789 sealing Methods 0.000 title claims abstract description 16
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 28
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 13
- 239000003822 epoxy resin Substances 0.000 claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 10
- 239000010703 silicon Substances 0.000 claims abstract description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000007711 solidification Methods 0.000 claims abstract description 7
- 230000008023 solidification Effects 0.000 claims abstract description 7
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000004202 carbamide Substances 0.000 claims abstract description 5
- 239000013530 defoamer Substances 0.000 claims abstract description 5
- 239000004615 ingredient Substances 0.000 claims abstract description 4
- 239000000843 powder Substances 0.000 abstract description 4
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
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Abstract
本发明涉及环氧树脂，尤其涉及一种采用粉末固化剂的空调继电器的环氧密封组合物。一种空调继电器的环保型环氧密封组合物，该组合物包括：环氧树脂EL‑128E 54‑60%、双氰胺固化剂4‑5%、填料氧化铝AM210 25‑30%、咪唑固化剂5‑6%、陶氏732 2‑3%、有机脲促进剂UR‑300 1‑2%、色膏2‑3%、气相硅TS‑720 0.4‑0.5%；有机硅消泡剂0.03‑0.04%、所述百分比为重量百分比；将环氧树脂和双氰胺固化剂及咪唑固化剂混合后，加入填料氧化铝AM210，陶氏732和剩余组分，混合均匀，真空脱泡即成所述组合物。本发明的组合物固化温度低，使用方便，成本低。
Description
技术领域
本发明涉及环氧树脂，尤其涉及一种采用粉末固化剂的空调继电器的环氧密封组合物。
背景技术
作为空调继电器的密封组合物，环氧树脂以其良好的电气性能和机械性能得到了广泛的运用。当前，所有的环氧都是采用树脂组分和固化剂组分的形式。作为固化剂组分，有液态固化剂，也有粉末固化剂。
液态固化剂对存储要求很高，需要冷藏，而使用时候需要回温到环境温度，十分麻烦。
粉末固化剂能解决液态固化剂的上述问题，可直接使用，但是现有的固化剂要求近200℃的温度，加工成本高。
发明内容
本发明旨在克服现有技术的上述缺陷，提供一种空调继电器的环保型环氧密封组合物。本发明的組合物固化溫度低，使用方便，成本低。
本发明一种空调继电器的环保型环氧密封组合物，该组合物包括：
环氧树脂EL-128E 54-60%、
双氰胺 4-5%、
填料氧化铝AM210 25-30%、
咪唑固化剂 5-6%、
陶氏732 2-3%、
有机脲促进剂 UR-300 1-2%、
色膏 2-3%、
气相硅TS-720 0.4-0.5%；
有机硅消泡剂 0.03-0.04%、
所述百分比为重量百分比；
将环氧树脂和双氰胺固化剂及咪唑固化剂混合后，加入填料氧化铝AM210，陶氏732和剩余组分，混合均匀，真空脱泡即成所述组合物。。
所述的一种空调继电器的环保型环氧密封组合物，所述组合物的粘度40℃35000--40000cps。
所述的一种空调继电器的环保型环氧密封组合物，所述的组合物的固化温度是100℃-105℃。
本发明的組合物中，粉末状固化剂双氰胺的引入能让咪唑固化剂的固化温度降低到100℃左右，较业内的的170℃-180℃降低许多，同时反应中不会产生需要分离的胶油，更容易达到，降低了成本。本发明的组合物具有粉末类固化剂本身所具有的易于运输、操作方便的特性。
具体实施方式：
本发明本发明一种空调继电器的环保型环氧密封组合物，该组合物包括：
环氧树脂EL-128E 54-60%、
双氰胺 4-5%、
填料氧化铝AM210 25-30%、
咪唑固化剂 5-6%、
陶氏732 2-3%、
有机脲促进剂 UR-300 1-2%、
色膏 2-3%、
气相硅TS-720 0.4-0.5%；
有机硅消泡剂 0.03-0.04%、
所述百分比为重量百分比；
将环氧树脂和双氰胺固化剂及咪唑固化剂混合后，加入填料氧化铝AM210，陶氏732和剩余组分，混合均匀，真空脱泡即成所述组合物。
所述的一种空调继电器的环保型环氧密封组合物，所述组合物的粘度40℃35000--40000cps。
所述的一种空调继电器的环保型环氧密封组合物，所述的组合物的固化温度是100℃-105℃。
本发明的实施例见下表
表
| 实施例1 | 实施例2 | 实施例3 | |
| 环氧树脂EL-128E ，% | 54 | 60 | 54 |
| 双氰胺，% | 5 | 4 | 4 |
| 填料氧化铝AM210，% | 28 | 25 | 30 |
| 咪唑固化剂，% | 5 | 6 | 5 |
| 陶氏732，% | 2.5 | 2.48 | 3 |
| 有机脲促进剂 UR-300，% | 2 | 1 | 1 |
| 色膏，% | 3 | 1 | 2.57 |
| 气相硅TS-720，%，% | 0.5 | 0.5 | 0.4 |
| 有机硅消泡剂 | 0.03 | 0.02 | 0.03 |
| 粘度40℃，cps | 35000 | 40000 | 32500 |
| 固化温度℃ | 100-102 | 102-105 | 101-104 |
本领域的技术人员应当清楚，本实施方式描述的技术方案仅供理解本发明，而不应认为是对保护范围的限定。本发明的保护范围应当以权利要求书限定的范围为准，任何在权利要求书提供的技术方案的基础上做的变形替换都将落入本发明权利要求所保护的范围。
Claims (3)
1.一种空调继电器的环保型环氧密封组合物，其特征在于，该组合物包括：
环氧树脂EL-128E 54-60%、
双氰胺固化剂 4-5%、
填料氧化铝AM210 25-30%、
咪唑固化剂 5-6%、
陶氏732 2-3%、
有机脲促进剂 UR-300 1-2%、
色膏 2-3%、
气相硅TS-720 0.4-0.5%；
有机硅消泡剂 0.03-0.04%、
所述百分比为重量百分比；
将环氧树脂和双氰胺固化剂及咪唑固化剂混合后，加入填料氧化铝AM210，陶氏732和剩余组分，混合均匀，真空脱泡即成所述组合物。
2.根据权利要求1所述的一种空调继电器的环保型环氧密封组合物，其特征在于，所述组合物的粘度40℃ 35000--40000cps。
3.根据权利要求1所述的一种空调继电器的环保型环氧密封组合物，其特征在于，所述的组合物的固化温度是100℃-105℃。
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5390344A (en) * | 1977-01-21 | 1978-08-09 | Hitachi Ltd | Adhesive composition |
| JPH02145676A (ja) * | 1988-11-28 | 1990-06-05 | Hitachi Chem Co Ltd | 銅張積層板用銅箔接着剤 |
| CN103087664A (zh) * | 2013-01-29 | 2013-05-08 | 深圳市宝力科技有限公司 | 继电器液态环氧树脂灌封胶及其制备方法 |
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2017
- 2017-05-23 CN CN201710368036.9A patent/CN108948656A/zh active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5390344A (en) * | 1977-01-21 | 1978-08-09 | Hitachi Ltd | Adhesive composition |
| JPH02145676A (ja) * | 1988-11-28 | 1990-06-05 | Hitachi Chem Co Ltd | 銅張積層板用銅箔接着剤 |
| CN103087664A (zh) * | 2013-01-29 | 2013-05-08 | 深圳市宝力科技有限公司 | 继电器液态环氧树脂灌封胶及其制备方法 |
Non-Patent Citations (2)
| Title |
|---|
| 张志冬 等: "《胶接原理与实用胶接配方600种 上册》", 31 October 1985 * |
| 王德中: "《环氧树脂生产与应用》", 30 June 2001, 化学工业出版社 * |
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