CN108943453B - Texturing cutting device for producing monocrystalline silicon wafers - Google Patents
Texturing cutting device for producing monocrystalline silicon wafers Download PDFInfo
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- CN108943453B CN108943453B CN201810833543.XA CN201810833543A CN108943453B CN 108943453 B CN108943453 B CN 108943453B CN 201810833543 A CN201810833543 A CN 201810833543A CN 108943453 B CN108943453 B CN 108943453B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/08—Etching
- C30B33/10—Etching in solutions or melts
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crushing And Pulverization Processes (AREA)
- Treatment Of Fiber Materials (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention discloses a texturing cutting device for producing monocrystalline silicon wafers, which comprises a rack (1), wherein an electric slide rail (2), a storage frame (3) and a moving platform (4) are arranged on the rack (1), the moving platform (4) is connected with a first hydraulic cylinder (5), a damping table (6), a high-speed motor (7) and a rotating shaft (8), a cleaning liquid inlet pipe (9), a texturing liquid inlet pipe (10) and a diamond saw blade (11) are arranged on the rotating shaft (8), and a diamond wire (12), a cleaning liquid channel (14) and a texturing liquid channel (15) are arranged on the diamond saw blade (11); the electric sliding rail (2) is connected with an automatic steering and collecting device (29); a first inductor (16) and a second inductor (17) are arranged on the mobile platform (4); an infrared detection device (42) is arranged on the electric slide rail (2). The invention can improve the working efficiency and the cutting precision, and has the advantages of lower manufacturing cost, convenient use, high safety and convenient collection.
Description
Technical Field
The invention relates to a monocrystalline silicon cutting device, in particular to a texturing cutting device for producing monocrystalline silicon slices.
Background
The existing monocrystalline silicon wafer cutting device mainly adopts a plurality of ultrafine diamond wires arranged in parallel to move back and forth to complete the cutting of monocrystalline silicon segments, once one of the ultrafine diamond wires is broken, the cutting device needs to be stopped completely to replace the diamond wire, so that the working efficiency is reduced, and generally, after the cutting is completed, a worker needs to send the cut monocrystalline silicon wafer into a texturing device to perform texturing on a cutting surface, so that the damage to the cutting surface is reduced, and the labor intensity is high; simultaneously, before a plurality of superfine diamond wires are used for cutting, the tensity of each superfine diamond wire and the parallel degree between two superfine diamond wires need to be adjusted, and the use is inconvenient. Therefore, the existing monocrystalline silicon wafer cutting device has the problems of lower working efficiency, higher labor intensity and inconvenient use.
Disclosure of Invention
The invention aims to provide a texturing cutting device for producing monocrystalline silicon wafers. The invention not only can improve the working efficiency, but also has the advantages of lower labor intensity and convenient use.
The technical scheme of the invention is as follows: the texture-making cutting device for producing the monocrystalline silicon wafer comprises a rack, wherein two electric slide rails which are symmetrically arranged are arranged on the rack, and a plurality of uniformly distributed object-placing frames are arranged between the two electric slide rails; a moving platform is arranged on one side of the electric slide rail, and a first hydraulic cylinder is connected to the moving platform; a damping table is arranged on the top surface of the mobile platform, and a high-speed motor is arranged on the damping table; a rotating shaft is arranged on the high-speed motor, a cleaning liquid inlet pipe is arranged on the rotating shaft, and a texturing liquid inlet pipe is arranged on one side of the cleaning liquid inlet pipe; a plurality of diamond saw blades which are uniformly distributed are arranged on the rotating shaft, and diamond wires are arranged at the edges of the diamond saw blades; two side surfaces of the diamond saw blade are respectively provided with a first groove, and each first groove is internally provided with a plurality of cleaning fluid channels and texturing fluid channels; each cleaning liquid channel is connected with a cleaning liquid inlet pipe, and each texturing liquid channel is connected with a texturing liquid inlet pipe; one end of the electric sliding rail is connected with an automatic steering and collecting device; a first inductor and a second inductor are arranged on a moving path of the moving platform; and an infrared detection device is arranged at the position, corresponding to the middle part of the mobile platform, on the electric slide rail.
In the texturing and cutting device for producing monocrystalline silicon wafers, the two side walls of the object placing frame are provided with the cutting grooves which are uniformly distributed, and the bottom surface of the object placing frame is provided with the first comb teeth which are uniformly distributed.
In the texturing and cutting device for producing the monocrystalline silicon wafer, a controller is installed on one side face of the rack, and the electric slide rail, the first hydraulic cylinder, the high-speed motor, the first inductor, the second inductor and the infrared detection device are all electrically connected with the controller.
In the texturing and cutting device for producing monocrystalline silicon wafers, the automatic steering and collecting device comprises a conveying platform, wherein steering frames arranged in a honeycomb shape are mounted on the conveying platform; a third motor is arranged in each steering frame, and each third motor is connected with a first steering wheel; one side of each third motor is provided with a fourth motor, and the other side of each third motor is provided with a fifth motor; each fourth motor is connected with a second steering wheel; each fifth motor is connected with a third steering wheel; one end of each conveying platform is provided with a feeding channel, and one end of each feeding channel is connected with a material collecting frame; be provided with the base plate in the frame that gathers materials, be provided with a plurality of evenly distributed's buffer spring between the bottom surface of base plate and frame that gathers materials, all cup jointed flexible pipe on every buffer spring.
In the texturing and cutting device for producing monocrystalline silicon wafers, the third motor, the fourth motor and the fifth motor are distributed in a triangular shape.
In the texturing cutting device for producing monocrystalline silicon wafers, each cleaning liquid channel is communicated with each other, and each texturing liquid channel is also communicated with each other; the rotating shaft is provided with a protective cover, and a second liquid collecting tank is arranged below the rotating shaft.
Compared with the prior art, the invention improves the existing monocrystalline silicon wafer cutting device, firstly, a monocrystalline silicon block is placed in the object placing frame, the monocrystalline silicon block is driven to move forwards by the electric sliding rail, after the monocrystalline silicon block moves to the infrared detection device of the moving platform, the rotating shaft is driven to rotate at high speed by the high-speed motor, and the rotating shaft drives the diamond saw blade to rotate at high speed, so that the monocrystalline silicon block is sliced, the whole device has a simple structure, the manufacturing cost is lower, and the use is convenient; in the cutting process, the texturing solution and the water washing solution are conveyed to the surface of the monocrystalline silicon wafer through the cleaning solution channel and the texturing solution channel to realize the cutting and texturing at the same time, so that the subsequent texturing steps are reduced, the labor intensity is reduced, and the working efficiency can be improved; by arranging the damping table, the resonance phenomenon of the high-speed motor on the moving platform during working can be reduced, and the moving platform is prevented from shaking in the cutting process to influence the cutting effect; simultaneously, through setting up first inductor, second inductor and infrared detection device, detect moving platform's removal distance and the shift position who puts the thing frame respectively, the appearance makes diamond saw blade in the cutting process, can be accurate through putting the thing frame and cut the monocrystalline silicon section, improved cutting accuracy. In addition, the cutting frame is provided with the plurality of cutting grooves and the first comb teeth which are uniformly distributed, so that the cutting uniformity and the cutting evenness can be ensured, and the down-flowing wool making liquid and the down-flowing water washing liquid in the cutting process can flow into the second liquid collecting groove conveniently; the controller is arranged to control the corresponding motor or hydraulic cylinder to start or open and close, so that the use is further facilitated; the transportation direction of the monocrystalline silicon wafers in the material collecting frame is changed by changing the starting and stopping of different motors in each steering frame through arranging the steering frames arranged in a honeycomb manner, and the triangular distribution of the third motor, the fourth motor and the fifth motor is arranged in each steering frame, so that the collection of finished monocrystalline silicon wafers is facilitated; through install the protection casing on the axis of rotation, the security of cutting has been improved. Therefore, the invention not only can improve the working efficiency and the cutting precision, but also has the advantages of lower manufacturing cost, convenient use, high safety and convenient collection.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of a diamond saw blade configuration;
FIG. 3 is a schematic view of the storage rack;
FIG. 4 is a schematic view of the structure of the turn-around block;
FIG. 5 is a schematic view of the internal structure of the aggregate box;
fig. 6 is a partially enlarged view of a portion a in fig. 1.
The labels in the figures are: 1-a frame, 2-an electric sliding rail, 3-a storage frame, 4-a moving platform, 5-a first hydraulic cylinder, 6-a shock absorption table, 7-a high-speed motor, 8-a rotating shaft, 9-a cleaning liquid inlet pipe, 10-a texturing liquid inlet pipe, 11-a diamond saw blade, 12-a diamond wire, 13-a first groove, 14-a cleaning liquid channel, 15-a texturing liquid channel, 16-a first inductor, 17-a second inductor, 29-an automatic steering collection device, 30-a cutting groove, 31-a first comb tooth, 42-an infrared detection device, 43-a controller, 55-a conveying platform, 56-a steering frame, 57-a third motor, 58-a first steering wheel, 59-a fourth motor and 60-a fifth motor, 61-a second steering wheel, 62-a third steering wheel, 63-a feeding channel, 64-a collecting frame, 65-a base plate, 66-a buffer spring, 67-a telescopic pipe, 68-a protective cover and 69-a second collecting tank.
Detailed Description
The invention is further illustrated by the following figures and examples, which are not to be construed as limiting the invention.
Examples are given. The texture etching cutting device for producing the monocrystalline silicon wafer comprises a frame 1, wherein two electric slide rails 2 which are symmetrically arranged are arranged on the frame 1, and a plurality of uniformly distributed object placing frames 3 are arranged between the two electric slide rails 2; a moving platform 4 is arranged on one side of the electric sliding rail 2, and a first hydraulic cylinder 5 is connected to the moving platform 4; a damping table 6 is arranged on the top surface of the movable platform 4, and a high-speed motor 7 is arranged on the damping table 6; a rotating shaft 8 is arranged on the high-speed motor 7, a cleaning liquid inlet pipe 9 is arranged on the rotating shaft 8, and a texturing liquid inlet pipe 10 is arranged on one side of the cleaning liquid inlet pipe 9; a plurality of diamond saw blades 11 which are uniformly distributed are arranged on the rotating shaft 8, and diamond wires 12 are arranged at the edges of the diamond saw blades 11; two side surfaces of the diamond saw blade 11 are respectively provided with a first groove 13, and a plurality of cleaning liquid channels 14 and a plurality of texturing liquid channels 15 are arranged in each first groove 13; each cleaning liquid channel 14 is connected with a cleaning liquid inlet pipe 9, and each texturing liquid channel 15 is connected with a texturing liquid inlet pipe 10; one end of the electric sliding rail 2 is connected with an automatic steering collecting device 29; a first inductor 16 and a second inductor 17 are arranged on the moving path of the moving platform 4; and an infrared detection device 42 is arranged on the electric slide rail 2 corresponding to the middle part of the mobile platform 4.
A plurality of cutting grooves 30 which are uniformly distributed are arranged on two side walls of the object placing frame 3, and a plurality of first comb teeth 31 which are uniformly distributed are arranged on the bottom surface of the object placing frame 3; a controller 43 is installed on one side surface of the rack 1, and the electric slide rail 2, the first hydraulic cylinder 5, the high-speed motor 7, the first sensor 16, the second sensor 17 and the infrared detection device 42 are all electrically connected with the controller 43; the automatic steering collecting device 29 comprises a conveying platform 55, and steering frames 56 arranged in a honeycomb manner are mounted on the conveying platform 55; a third motor 57 is arranged in each steering frame 56, and each third motor 57 is connected with a first steering wheel 58; one side of each third motor 57 is provided with a fourth motor 59, and the other side is provided with a fifth motor 60; each fourth motor 59 is connected with a second steering wheel 61; each fifth motor 60 is connected with a third steering wheel 62; one end of the conveying platform 55 is provided with a feeding channel 63, and one end of each feeding channel 63 is connected with a material collecting frame 64; a base plate 65 is arranged in the material collecting frame 64, a plurality of buffer springs 66 which are uniformly distributed are arranged between the base plate 65 and the bottom surface of the material collecting frame 64, and each buffer spring 66 is sleeved with a telescopic pipe 67; the third motor 57, the fourth motor 59 and the fifth motor 60 are distributed in a triangular shape; each cleaning liquid channel 14 is communicated with each other, and each texturing liquid channel 15 is also communicated with each other; the rotating shaft 8 is provided with a protective cover 68, and a second liquid collecting tank 69 is arranged below the rotating shaft 8.
The working principle is as follows: the controller 43 employed in the present invention is a programmable PLC controller, which may be of the specific type FX2N-48MRD, FX2C-64ERD, SIMATICs7-200 or FP 1-C40.
When the device is used, the whole device is connected with a power supply, then the controller 43 is turned on, the controller 43 controls the first inductor 16, the second inductor 17 and the infrared detection device 42 to be started, then the monocrystalline silicon section with the slices is placed in the storage frame 3, and the electric sliding rail 2 is started; after the electric sliding rail 2 is started, the object placing frame 3 and the monocrystalline silicon section in the object placing frame 3 are driven to move forwards together, after a period of time, the infrared detection device 42 is blocked by the object placing frame 3, at this time, the infrared detection device 42 detects the object placing frame 3 and sends a closing signal to the controller 43, and the controller 43 controls the electric sliding rail 2 to stop after receiving the sent closing signal and controls the first hydraulic cylinder 5 and the high-speed motor 7 to start; after the first hydraulic cylinder 5 is started, the moving platform 4 is pushed to move towards the electric slide rail 2; after the high-speed motor 7 is started, the rotating shaft 8 can be driven to rotate at a high speed, the diamond saw blade 11 can be driven to rotate at a high speed by the high-speed rotation of the rotating shaft 8, and the diamond saw blade 11 rotates and slices the monocrystalline silicon section in the storage frame 3 through the cutting groove 30 under the combined action of the first hydraulic cylinder 5 and the high-speed motor 7; during cutting, feeding cleaning liquid and texturing liquid into the cleaning liquid channel 14 and the texturing liquid channel 15 through the cleaning liquid inlet pipe 9 and the texturing liquid inlet pipe 10, wherein the cleaning liquid and the texturing liquid can contact with the cutting surface of the monocrystalline silicon section along with the diamond saw blade 11 to texture the cutting surface of the monocrystalline silicon piece under the cutting; when the front end of the mobile platform 4 contacts the second sensor 17, the second sensor 17 sends a sensing signal to the controller 43, the controller 43 determines that the cutting is finished after receiving the sensing signal sent by the second sensor 17, controls the high-speed motor 7 to be turned off, and controls the first hydraulic cylinder 5 to run reversely; the first hydraulic cylinder 5 drives the moving platform 4 to return to the initial position, when the front section of the moving platform 4 contacts the first sensor 16, the first sensor 16 sends a sensing signal to the controller 43, the controller 43 controls the first hydraulic cylinder 5 to stop after receiving the sensing signal, and controls the electric sliding rail 2 to start at the same time, and after the electric sliding rail 2 is started, the electric sliding rail can drive the object placing frame 3 and the cut monocrystalline silicon wafer to move together on the conveying platform 55 of the automatic steering collecting device 29.
After the object placing frame 3 and the monocrystalline silicon wafer enter the conveying platform 55, the third motor 57, the fourth motor 59 and the fifth motor 60 in each turning frame 56 are started, the third motor 57, the fourth motor 59 and the fifth motor 60 are started to drive the first turning wheel 58, the second turning wheel 61 and the third turning wheel 62 to rotate, so that the object placing frame 3 and the monocrystalline silicon wafer enter the substrate 65 in the material collecting frame 64 through the feeding channel 63, when the object placing frame 3 moves to the substrate 65, because the weight of the object placing frame 3 and the monocrystalline silicon wafer inside can have a downward pressure on the substrate 65, the buffer spring 66 is compressed, the substrate 65 moves downwards for a certain distance, and the next object placing frame 3 can enter conveniently; meanwhile, after one of the material collecting frames 64 is filled with the materials, the transportation path of the first steering wheel 58, the second steering wheel 61 and the third steering wheel 62 to the object placing frames 3 can be changed by adjusting the starting and stopping of the third motor 57, the fourth motor 59 and the fifth motor 60, the phenomenon that the object placing frames 3 are stacked on the conveying platform 55 can not occur, the use is facilitated, and the flexibility is improved.
Claims (5)
1. The texture-making cutting device for producing the monocrystalline silicon piece is characterized in that: the device comprises a rack (1), wherein two electric slide rails (2) which are symmetrically arranged are arranged on the rack (1), and a plurality of uniformly distributed object placing frames (3) are arranged between the two electric slide rails (2); a moving platform (4) is arranged on one side of the electric sliding rail (2), and a first hydraulic cylinder (5) is connected to the moving platform (4); a damping table (6) is arranged on the top surface of the movable platform (4), and a high-speed motor (7) is arranged on the damping table (6); a rotating shaft (8) is installed on the high-speed motor (7), a cleaning liquid inlet pipe (9) is installed on the rotating shaft (8), and a texturing liquid inlet pipe (10) is arranged on one side of the cleaning liquid inlet pipe (9); a plurality of diamond saw blades (11) which are uniformly distributed are arranged on the rotating shaft (8), and diamond wires (12) are arranged at the edges of the diamond saw blades (11); two side surfaces of the diamond saw blade (11) are respectively provided with a first groove (13), and a plurality of cleaning liquid channels (14) and texturing liquid channels (15) are respectively arranged in each first groove (13); each cleaning liquid channel (14) is connected with a cleaning liquid inlet pipe (9), and each texturing liquid channel (15) is connected with a texturing liquid inlet pipe (10); one end of the electric sliding rail (2) is connected with an automatic steering and collecting device (29); a first inductor (16) and a second inductor (17) are arranged on the moving path of the moving platform (4); an infrared detection device (42) is arranged on the electric sliding rail (2) corresponding to the middle part of the mobile platform (4); the automatic steering collecting device (29) comprises a conveying platform (55), and steering frames (56) arranged in a honeycomb shape are mounted on the conveying platform (55); a third motor (57) is arranged in each steering frame (56), and each third motor (57) is connected with a first steering wheel (58); one side of each third motor (57) is provided with a fourth motor (59), and the other side of each third motor is provided with a fifth motor (60); each fourth motor (59) is connected with a second steering wheel (61); each fifth motor (60) is connected with a third steering wheel (62); one end of each conveying platform (55) is provided with a feeding channel (63), and one end of each feeding channel (63) is connected with a material collecting frame (64); a base plate (65) is arranged in the collecting frame (64), a plurality of buffer springs (66) which are uniformly distributed are arranged between the base plate (65) and the bottom surface of the collecting frame (64), and each buffer spring (66) is sleeved with a telescopic pipe (67).
2. The texture-making and cutting apparatus for producing a single-crystal silicon wafer according to claim 1, wherein: be equipped with many evenly distributed's cutting groove (30) on the both sides wall of putting thing frame (3), be equipped with many evenly distributed's first broach (31) on the bottom surface of putting thing frame (3).
3. The texture-making and cutting apparatus for producing a single-crystal silicon wafer according to claim 1, wherein: install controller (43) on the side of frame (1), electric slide rail (2), first pneumatic cylinder (5), high-speed motor (7), first inductor (16), second inductor (17) and infrared detection device (42) all with controller (43) electric connection.
4. The texture-making and cutting apparatus for producing a single-crystal silicon wafer according to claim 1, wherein: the third motor (57), the fourth motor (59) and the fifth motor (60) are distributed in a triangular shape.
5. The texture-making and cutting apparatus for producing a single-crystal silicon wafer according to any one of claims 1 to 4, wherein: each cleaning liquid channel (14) is communicated with each other, and each texturing liquid channel (15) is also communicated with each other; the rotating shaft (8) is provided with a protective cover (68), and a second liquid collecting tank (69) is arranged below the rotating shaft (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810833543.XA CN108943453B (en) | 2018-07-26 | 2018-07-26 | Texturing cutting device for producing monocrystalline silicon wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810833543.XA CN108943453B (en) | 2018-07-26 | 2018-07-26 | Texturing cutting device for producing monocrystalline silicon wafers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108943453A CN108943453A (en) | 2018-12-07 |
| CN108943453B true CN108943453B (en) | 2020-05-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810833543.XA Expired - Fee Related CN108943453B (en) | 2018-07-26 | 2018-07-26 | Texturing cutting device for producing monocrystalline silicon wafers |
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Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100433376C (en) * | 2007-08-07 | 2008-11-12 | 南京航空航天大学 | Integrated processing method for cotton cutting of solar silicon and its device |
| KR101619466B1 (en) * | 2010-03-26 | 2016-05-11 | 삼성전자주식회사 | Apparatus for mouning semiconductor device |
| CN201699001U (en) * | 2010-06-30 | 2011-01-05 | 英利能源（中国）有限公司 | Silicon wafer basket conveying line |
| CN202592546U (en) * | 2011-12-15 | 2012-12-12 | 谭凯元 | Crystal ingot cutting machine |
| KR101923531B1 (en) * | 2011-12-23 | 2018-11-30 | 삼성전자주식회사 | Apparatus of bonding semiconductor chip |
| NL2009147C2 (en) * | 2012-07-06 | 2014-01-07 | Fico Bv | DEVICE AND METHOD FOR SEPARATING, AT LEAST PARTIAL DRYING AND INSPECTION OF ELECTRONIC COMPONENTS. |
| CN205631054U (en) * | 2016-05-23 | 2016-10-12 | 上海日进机床有限公司 | Silicon rod continuous operation system |
| CN207014538U (en) * | 2017-07-14 | 2018-02-16 | 大连圣迈新建材有限公司 | Cement foaming insulation board diced system |
| CN107634024B (en) * | 2017-07-27 | 2023-11-10 | 罗博特科智能科技股份有限公司 | Silicon wafer batch transfer device |
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Granted publication date: 20200522 Termination date: 20210726 |