CN108930054A - A kind of micro- 3D printing method of metal based on to self-assembled monolayers control technology - Google Patents
A kind of micro- 3D printing method of metal based on to self-assembled monolayers control technology Download PDFInfo
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- CN108930054A CN108930054A CN201811041502.3A CN201811041502A CN108930054A CN 108930054 A CN108930054 A CN 108930054A CN 201811041502 A CN201811041502 A CN 201811041502A CN 108930054 A CN108930054 A CN 108930054A
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- China
- Prior art keywords
- metal
- self
- assembled monolayers
- laser
- electroplate liquid
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/024—Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
Abstract
The present invention relates to a kind of 3D metallic print new methods based on to self-assembled monolayers control technology, belong to 3D metallic print and field of micro-Na manufacture.The 3D metallic print new method invented needs to be added a kind of special organic molecule in electroplate liquid, which can form one layer of densification and the good self-assembled monolayers of insulating properties by the whole surface of printing metal.The molecular film can will be effectively isolated by printout and electrolyte, can be blocked by electrochemical reaction all on printout workpiece surface.In print procedure, the metal ion that can make in electroplate liquid for applying certain amplitude by printout need to occur the reduction potential of reduction reaction.The effect of laser is to remove the self-assembled monolayers for being adsorbed on metal surface, makes metal directly and electrolyte contacts, so that electro-deposition be made to only occur in laser-irradiated domain, realize the metal increasing material manufacturing of designated position.
Description
Technical field
The invention belongs to increasing material manufacturing and field of micro-Na manufacture, be related to it is a kind of based on to self-assembled monolayers control technology,
The metal increasing material manufacturing new method of laser technology and electrochemical techniques.
Technical background
Increases material manufacturing technology is a kind of based on a kind of discrete dynamics models forming forming technique of thought.The technology by computer,
The workpiece such as CAD carry out slicing delamination to 3D solid, successively construct three-dimensional body with the section successively changed.The technology without
Mold and fixture are needed, and there is the ability of building complicated shape.At present for the 3D printing of the nonmetallic materials such as plastics
Basically reach the level of business application.But the 3D printing for metal, it is also constantly in laboratory stage at present.
The principle of current metal 3D printing technique is mainly metal powder sintered technology, and in addition there are also molten drops to print skill
Art, ultrasonic wave 3D metallic print technology etc..For metal powder sintered technology, the difference of heat source is used according to it, and can be divided into
Electron beam melting technology, electron beam welding technology and selective laser fusion technology etc..The principle of above-mentioned technology is very similar, can
Uniformly it is classified as the 3D metallic print based on ermal physics method；It requires metal powder in specified position high temperature melt, then
Solidification forms 3D metal solid.The thawing process of setting, which is normally resulted in, there is rough surface, stress collection by printing metal parts
In, coarse grains, nonuniform organization, stomata, low mechanical strength the problems such as.The above problem is the 3D metal using ermal physics method
Printing technique is very formidable.The limitation of Source size and metal powder size in addition, above-mentioned technology is heated, generally can not print spy
Levy metal component of the size less than a millimeter.
Electroplating technology and galvanoplastics are the metal increasing material manufacturing technique based on electrochemical techniques, are obtained in industry
Very extensive application.Current electroplating technology is commonly used in the surface treatment of metal parts, and thickness of coating is usually micro-
Meter level is other.Electroplating technology cannot be used for the reason of 3D metallic print and be to can not achieve the metal deposit of designated position.It is similar
With electroplating technology, galvanoplastics is another metal increases material manufacturing technology based on electrochemical principle.Galvanoplastics need by
Core model makes metal that electro-deposition occur on core model using electrochemical principle, then separates again with core model to realize metal product
Manufacture or duplication.
Summary of the invention
The purpose of the present invention is to provide a kind of increases material manufacturing technologies suitable for minute metallic components.
The principle of the present invention is: can form the self assembly of insulation and densification in metal surface by being added in electroplate liquid
The organic molecule of molecular film makes to be immersed in all being covered by self-assembled monolayers in electroplate liquid by printing metal part surface
Lid.When applying the potential that the metal ion in electroplate liquid can be made to be reduced to metal parts, the self-assembled monolayers of the insulation
Metal ion can be prevented in the electrochemical reaction of metal part surface, to make entire metal part surface that electricity will not all occur
Deposition.The technology utilizes laser beam or two-dimensional laser pattern with particular energy to shine metal part surface, is inhaled with removing
It is attached to the self-assembled monolayers on its surface.After self-assembled monolayers are removed, electrochemical deposition can occur in laser irradiation
Region.By controlling the motion profile of laser beam or the shape of two-dimensional laser pattern, that is, it can print out three-dimensional metal structure.
The features of the present invention is as follows:
1. metal increasing material manufacturing of the invention is the principle based on electrochemistry, life per minute of the metal on laser direction
Long speed is micron dimension, it is made to be very suitable to the manufacturing of minute metallic components.
2. since metal of the present invention increases material principle and plating unanimously, so metal parts of its printing manufacture is answered without heat
Power, workpiece high mechanical strength, and any surface finish.
3. printable to produce complicated minute metallic component by the variation of control laser pattern.
Detailed description of the invention
Fig. 1 is based on the 3D metallic print schematic illustration to self-assembled monolayers control technology
Specific embodiment
Referring to Fig. 1.The present invention is specially will based on the 3D metallic print new method to self-assembled monolayers control technology
Be added a kind of special organic molecule in electroplate liquid, the organic molecule can by printing metallic surface formed one layer of densification and
The good self-assembled monolayers of insulating properties.The molecular film can will be efficiently separated by printout and electrolyte, can be blocked and be beaten
The electrochemical reaction on printed document surface.It, need to be to the gold that can make in electroplate liquid for being applied certain amplitude by printout in print procedure
Belong to the reduction potential that reduction reaction occurs for ion.The effect of laser is that removal is adsorbed on the self-assembled monolayers of metal surface,
Make metal directly and electrolyte contacts, so that electro-deposition be made to only occur in laser-irradiated domain, realizes that the metal of designated position increases
Material manufacture.In print procedure, the energy density of laser used is advisable with can just remove self-assembled monolayers.Too big laser energy
The heat that metric density will lead to workpiece is melted, disfiguring workpiece.
When laser beam lesser using diameter, the carry out two-dimensional scanning to the point-by-point by-line of laser beam is needed in print procedure,
To realize larger area metal deposit.
The editable two-dimensional laser pattern of pattern form, the workpiece surface for directly projecting and being printed can also be used.It beats
During print, by adjusting the geometry of two-dimensional pattern, three-dimensional metal component can be printed.
Claims (3)
1. a kind of micro- 3D printing method of metal based on to self-assembled monolayers control technology, it is characterised in that: contain in electroplate liquid
There are an organic molecular species, what which can be spontaneous is adsorbed on the metal surface printed, is formed fine and close and insulation from group
Molecular film is filled, which can effectively realize the physical isolation of workpiece and electroplate liquid, block all electricity occurred in metal surface
Chemical reaction；In print procedure, need to apply to workpiece can make the metal ion in electroplate liquid that reduction reaction occur on its surface
Potential, while the self-assembled monolayers for being adsorbed on metal surface are removed using the suitable laser of energy density, make metal surface
Directly and plating solution contacts, so that controlling electrochemical deposition only occurs in laser-irradiated domain.
2. laser according to claim 1 can be the lesser laser beam of diameter, or two-dimensional shape editable
Laser pattern.
3. laser according to claim 1, energy density is advisable with can just remove self-assembled monolayers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811041502.3A CN108930054B (en) | 2018-09-07 | 2018-09-07 | Metal micro 3D printing method based on self-assembly molecular membrane control technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811041502.3A CN108930054B (en) | 2018-09-07 | 2018-09-07 | Metal micro 3D printing method based on self-assembly molecular membrane control technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108930054A true CN108930054A (en) | 2018-12-04 |
| CN108930054B CN108930054B (en) | 2020-06-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811041502.3A Active CN108930054B (en) | 2018-09-07 | 2018-09-07 | Metal micro 3D printing method based on self-assembly molecular membrane control technology |
Country Status (1)
| Country | Link |
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| CN (1) | CN108930054B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04109510A (en) * | 1990-08-30 | 1992-04-10 | Shin Etsu Polymer Co Ltd | Anisotropic conductive film and manufacture thereof |
| CN1348511A (en) * | 1999-02-27 | 2002-05-08 | 晏达科技有限公司 | Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method |
| US6468806B1 (en) * | 1996-10-02 | 2002-10-22 | Symyx Technologies, Inc. | Potential masking systems and methods for combinatorial library synthesis |
| CN1549669A (en) * | 2003-05-09 | 2004-11-24 | 三洋电机株式会社 | Method for producing plate body and method for producing circuit device utilizing the same plate body |
| CN101501249A (en) * | 2006-08-07 | 2009-08-05 | 株式会社自动网络技术研究所 | Partial plating method, laser plating equipment and plating member |
| CN103935954A (en) * | 2014-04-21 | 2014-07-23 | 陕西师范大学 | Method for positively and negatively etching noble metal by using self-assembly monomolecular film |
| CN106863770A (en) * | 2017-01-12 | 2017-06-20 | 南京航空航天大学 | The preparation method of the structural circuit unitary member based on fusion sediment forming technique |
| CN107400913A (en) * | 2016-05-19 | 2017-11-28 | 高·哈里·凡 | Electrochemical metal needle point 3D printer and Method of printing |
-
2018
- 2018-09-07 CN CN201811041502.3A patent/CN108930054B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04109510A (en) * | 1990-08-30 | 1992-04-10 | Shin Etsu Polymer Co Ltd | Anisotropic conductive film and manufacture thereof |
| US6468806B1 (en) * | 1996-10-02 | 2002-10-22 | Symyx Technologies, Inc. | Potential masking systems and methods for combinatorial library synthesis |
| CN1348511A (en) * | 1999-02-27 | 2002-05-08 | 晏达科技有限公司 | Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method |
| CN1549669A (en) * | 2003-05-09 | 2004-11-24 | 三洋电机株式会社 | Method for producing plate body and method for producing circuit device utilizing the same plate body |
| CN101501249A (en) * | 2006-08-07 | 2009-08-05 | 株式会社自动网络技术研究所 | Partial plating method, laser plating equipment and plating member |
| CN101501249B (en) * | 2006-08-07 | 2011-04-20 | 株式会社自动网络技术研究所 | Partial plating method, laser plating equipment and plating member |
| CN103935954A (en) * | 2014-04-21 | 2014-07-23 | 陕西师范大学 | Method for positively and negatively etching noble metal by using self-assembly monomolecular film |
| CN107400913A (en) * | 2016-05-19 | 2017-11-28 | 高·哈里·凡 | Electrochemical metal needle point 3D printer and Method of printing |
| CN106863770A (en) * | 2017-01-12 | 2017-06-20 | 南京航空航天大学 | The preparation method of the structural circuit unitary member based on fusion sediment forming technique |
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| CN108930054B (en) | 2020-06-09 |
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