CN108899270A - A kind of chip production method - Google Patents
A kind of chip production method Download PDFInfo
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- CN108899270A CN108899270A CN201810754949.9A CN201810754949A CN108899270A CN 108899270 A CN108899270 A CN 108899270A CN 201810754949 A CN201810754949 A CN 201810754949A CN 108899270 A CN108899270 A CN 108899270A
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- workbench
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
The present invention relates to chip production technical field, specifically a kind of chip production method, the litho machine used in this method includes bottom plate, height adjusting structure, workbench, detection structure, LED light, dust accumulation structure and vacuum pump；Bottom plate and between the workbench of chip placement be equipped with adjust height height adjusting structure；The inside of workbench, which is equipped with, provides the vacuum pump of negative pressure；Workbench is equipped with the LED light for detection chip and the detection structure for chip placement；The bottom end of workbench is equipped with the dust accumulation structure for storing dust.The use of vacuum pump cooperation detection structure of the invention realizes the internal negative pressure of dust accumulation structure, dust scrap convenient for will test on the chip in structure is pressed into the inside of dust accumulation structure, convenient for quickly handling the dust after photoetching, the use for the LED light cooperation detection structure being arranged on workbench is convenient for detecting the chip of photoetching while handling dust, it the time for having saved manufacturing procedure, greatly improves work efficiency.
Description
Technical field
The present invention relates to chip production technical field, specifically a kind of chip production method.
Background technique
Litho machine (Mask Aligner) also known as：Mask registration exposure machine, exposure system, lithography system etc..Common light
Quarter, machine was mask alignment photoetching, general photoetching process to undergo silicon wafer surface cleaning drying, linging, spin coating photoresist, it is soft dry,
Alignment exposure, it is rear dry, development, it is hard dry, the processes such as etching, need timely to remove the dust of chip after to chip lithography process
And its quality of detection photoetching.
However the litho machine used in traditional chip production dust processing after the completion of photoetching chip is inconvenient, is using
Be inconvenient to detect photoetching quality afterwards.
Summary of the invention
For the problems of the prior art, the present invention provides a kind of chip production method, the photoetching that is used in this method
The use of vacuum pump cooperation detection structure in machine realizes the internal negative pressure of dust accumulation structure, convenient for will test the chip in structure
On dust scrap be pressed into the inside of dust accumulation structure, convenient for quickly handling the dust after photoetching, the LED light being arranged on workbench
The use of cooperation detection structure has saved manufacturing procedure convenient for detecting while handling dust to the chip of photoetching
Time greatly improves work efficiency, and height adjusting structure is set between workbench and bottom plate, convenient for according to the height of user
The height for adjusting workbench, improves usage comfort.
The technical solution adopted by the present invention to solve the technical problems is：A kind of chip production method, this method include with
Lower step：
S1, the silicon wafer for choosing good quality clean silicon wafer, silicon wafer are placed on cleaning machine and carries out physics to it
Cleaning is drawn off stand-by after the completion of cleaning；
S2 carries out note phosphorus to it using machine after the completion of Wafer Cleaning and attached phosphorus operates；
S3 separates silicon wafer using cutting blade after the completion of operation；
S4 carries out single side blast to the silicon wafer separated after the completion of separation, places it in sand-blasting machine to silicon wafer
Single side carry out sandblasting, cleaned after the completion of sandblasting, then for use；
S5, carries out spray boron operation for the silicon wafer after single side blast, coats one layer dissolved with diboron trioxide and nitre in sandblasting face
The mixed solvent of sour aluminium；
Silicon wafer is placed in 1000 DEG C of high-temperature services 5 hours or so, is diffused into phosphorus atoms inside silicon wafer by S6；
S7, the silicon wafer after diffusion, which was placed in hydrofluoric acid after a couple of days, makes it carry out silicon wafer separation automatically；
Silicon wafer after separation is placed in sand-blasting machine by S8, continues blast, sandblasting to the two sides of the silicon wafer after separation
It is cleaned after the completion, for use；
S9 by the silicon wafer painting photoresist after the completion of cleaning and then register mask plate and exposes, then uses developer solution
It dissolves not photosensitive photoresist layer, dissolve the silicon dioxide layer of no photoresist protection with corrosive liquid, finally remove
Photosensitive photoresist layer, i.e. completion photoetching；
S10 carries out wet etching to the silicon wafer after the completion of photoetching, so that it is removed the material of shielding film, then cleaned
It is clean stand-by；
S11, will be etched after silicon wafer carry out surface metalation processing, so that it is seemed that more satin is beautiful, so
A photoetching treatment is carried out to silicon wafer again afterwards；
S12, even if completing the production of chip after the completion of processing；
The litho machine used in the above method includes bottom plate, height adjusting structure, workbench, detection structure, LED light, product
Dirt structure and vacuum pump；The bottom plate and between the workbench of chip placement be equipped with adjust height the height tune
Section structure, and the height adjusting structure is detachably connected with the workbench；The inside of the workbench, which is equipped with, provides negative pressure
The vacuum pump；The workbench is equipped with the LED light for detection chip and the detection for chip placement
Structure, and the detection structure engages with the workbench；The bottom end of the workbench is equipped with the product for storing dust
Dirt structure, the dust accumulation structure and the detection structure correspond, and the dust accumulation structure engages with the workbench.
Specifically, the bottom plate is equipped with the storage organization for storing tool, the storage organization includes support frame, deposits
Storage tank and handle, the support frame as described above being used to support are fixed on the bottom plate, and the inside of support frame as described above is equipped with multiple sizes not
The storage box of the same rectangular configuration for storing tool, the storage box is slidably connected with support frame as described above, described to deposit
The end of storage tank is equipped with the handle；It waits when in use, pulls the handle, the storage box and support frame as described above sliding connect
It connects, life appliance is placed on to the inside of the storage box, the setting of the storage box greatly improves convenient for storage life appliance
The cleaning of processing environment.
Specifically, the height adjusting structure include sliding sleeve, limiting slot, adjusting rod, gag lever post, actuating sleeve, connecting rod and
Fixing sleeve；The bottom end of the bottom plate is set there are four the sliding sleeve of the cylindrical structure for guiding, and the sliding sleeve deviates from described
One end circumferencial direction of bottom plate is equipped with the limiting slot for secondary limit of triangular prism structure, and the inside of the sliding sleeve is set
There is the adjusting rod with the externally threaded cylindrical structure for being used to adjust height of cylindrical structure, is set on the adjusting rod
Have a connecting rod of the regular hexagon structure for guiding, the connecting rod be fixed on the described solid of the workbench bottom end
Fixed set rotation connection, the connecting rod are equipped with the actuating sleeve for the regular hexagon structure for driving being slidably connected, institute
The bottom end for stating actuating sleeve sets that there are two for cooperating the gag lever post of limiting slot sliding limit；The driving is slided first
Set, engages the gag lever post of the actuating sleeve bottom end not with the limiting slot, then turns the adjusting rod by spanner,
The adjusting rod is threadedly coupled with the sliding sleeve, while the connecting rod and the fixing sleeve rotate, and adjust the workbench
Highly, it is applicable in the operator suitable for different height, the adjusting rod has external screw thread, has the function of automatic spacing, together
When by sliding the actuating sleeve, engage the gag lever post with the limiting slot, to the secondary limit of adjusting rod progress, greatly
Stability is improved greatly.
Specifically, the workbench of one end of the vacuum pump is equipped with the rectangular configuration being detachably connected for examining
Repair the access panel of maintenance；When the vacuum pump is overhauled in cleaning, the bolt between the access panel and the workbench is dismantled, it will
The vacuum pump takes out cleaning and maintenance.
Specifically, the detection structure includes sealing ring, diversion trench, support plate, air cushion and placing groove, on the workbench
The side wall of the placing groove for chip placement equipped with prismatic table shape structure, the placing groove is equipped with for the described of detection
LED light, the support plate for chip placement rectangular configuration engage through the placing groove with the workbench, the branch
The sealing ring is held between fagging and the workbench, the cross section that the support plate is equipped with sex-limited distribution is trapezoidal
For the diversion trench of conflux, the support plate between two adjacent diversion trenches is equipped with having for linear distribution
The air cushion of the hemispherical dome structure of accommodating cavity；Chip is placed on the air cushion in the support plate, the LED light
It is radiated at chip surface, convenient for detecting while ash disposal to chip photoetching quality, the air cushion is with accommodating cavity
Hemispherical dome structure, the air cushion contraction distortion when chip contradicts the air cushion effectively prevent chip to contradict the air cushion
Chip is damaged, detection quality is improved, the cross section of the diversion trench is trapezium structure, is convenient for wind gathering, makes the ash of chip surface
Dirt cleaning effect is more preferable, and the support plate engages with the workbench, the support plate easy to disassemble, carries out to the support plate
Cleaning replacement, the setting of the sealing ring enhance the leakproofness of the support plate Yu the workbench junction, improve and remove
Dirt effect.
Specifically, the dust accumulation structure includes guide rod, pull rod, containing box, vent, dust stratification protrusion and gasket, institute
It states containing box to be slidably connected with the workbench, be contradicted for the containing box of dust accumulation and the support plate, the containing box
Bottom end be equipped with tri-prismoid structure for limit the guide rod being slidably connected with the workbench, the containing box
One end be equipped with the pull rod, it is that trapezium structure is used to seal that the containing box and the workbench junction, which are equipped with cross section,
The gasket, and the gasket and the workbench contradict, and the side wall of the containing box is equipped with to be accommodated with hemispherical
The dust stratification protrusion for dust stratification of the hemispherical dome structure of cavity, the dust stratification protrusion are equipped with close to one end of the support plate
The vent of the truncated cone-shaped structure for being connected to the vacuum pump for air draft；The vacuum pump is started to work, the receipts
The inner air of case received is discharged from the vent, and the inside of the containing box forms negative pressure, and outside air is by the support plate
On the dust scrap of chip suck the inside of the containing box, dust is intercepted by the dust stratification protrusion, and air is from the row
Air holes discharge intercepts dust in the inside of the containing box, and the dust stratification protrusion is hemispherical dome structure, while the institute of truncated cone-shaped
The setting for stating vent, effectively preventing the containing box blocking influences dust removing effects.
Beneficial effects of the present invention：
(1) use of a kind of chip production method of the present invention, vacuum pump cooperation detection structure realizes dust accumulation knot
The internal negative pressure of structure, the dust scrap convenient for will test on the chip in structure are pressed into the inside of dust accumulation structure, convenient for quick
Dust after handling photoetching.
(2) a kind of chip production method of the present invention, the use for the LED light cooperation detection structure being arranged on workbench
Convenient for being detected while handling dust to the chip of photoetching, the time of manufacturing procedure is saved, work is substantially increased
Make efficiency.
(3) a kind of chip production method of the present invention, height adjusting structure are set between workbench and bottom plate, are convenient for
The height that workbench is adjusted according to the height of user, improves usage comfort.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is the structural schematic diagram for the litho machine that this method uses；
Fig. 2 is the portion A shown in FIG. 1 enlarged diagram；
Fig. 3 is the attachment structure schematic diagram of workbench shown in FIG. 1 and guide rod；
Fig. 4 is the portion B shown in Fig. 3 enlarged diagram；
Fig. 5 is the attachment structure schematic diagram of containing box shown in Fig. 4 and dust stratification protrusion.
In figure：1, bottom plate, 2, storage organization, 21, support frame, 22, storage box, 23, handle, 3, height adjusting structure, 31,
Sliding sleeve, 32, limiting slot, 33, adjusting rod, 34, gag lever post, 35, actuating sleeve, 36, connecting rod, 37, fixing sleeve, 4, workbench, 5,
Access panel, 6, detection structure, 61, sealing ring, 62, diversion trench, 63, support plate, 64, air cushion, 65, placing groove, 7, LED light, 8,
Dust accumulation structure, 81, guide rod, 82, pull rod, 83, containing box, 84, vent, 85, dust stratification protrusion, 86, gasket, 9, vacuum
Pump.
Specific embodiment
In order to be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, tie below
Specific embodiment is closed, the present invention is further explained.
As shown in figures 1 and 3, a kind of chip production method of the present invention, this approach includes the following steps：
S1, the silicon wafer for choosing good quality clean silicon wafer, silicon wafer are placed on cleaning machine and carries out ultrasound to it
Wave physical cleaning is drawn off stand-by after the completion of cleaning；
S2 carries out note phosphorus to it using machine after the completion of Wafer Cleaning and attached phosphorus operates；
S3 separates silicon wafer using cutting blade after the completion of operation, notch is avoided to tilt, and grinding apparatus is then utilized
It polishes notch；
S4 carries out single side blast to the silicon wafer separated after the completion of separation, places it in sand-blasting machine to silicon wafer
Single side carry out sandblasting, cleaned after the completion of sandblasting, then for use；
S5, carries out spray boron operation for the silicon wafer after single side blast, coats one layer dissolved with diboron trioxide and nitre in sandblasting face
The mixed solvent of sour aluminium；
Silicon wafer is placed in 1000 DEG C of high-temperature services 5 hours or so, phosphorus atoms is made slowly adequately to be diffused into silicon wafer by S6
It is internal；
S7, the silicon wafer after diffusion, which was placed in hydrofluoric acid after a couple of days, makes it carry out silicon wafer separation automatically；
Silicon wafer after separation is placed in sand-blasting machine by S8, continues blast, sandblasting to the two sides of the silicon wafer after separation
It is cleaned after the completion, for use；
S9 by the silicon wafer painting photoresist after the completion of cleaning and then register mask plate and exposes, then uses developer solution
It dissolves not photosensitive photoresist layer, dissolve the silicon dioxide layer of no photoresist protection with corrosive liquid, finally remove
Photosensitive photoresist layer, i.e. completion photoetching；
S10 carries out wet etching to the silicon wafer after the completion of photoetching, so that it is removed the material of shielding film, then cleaned
It is clean stand-by；
S11, will be etched after silicon wafer carry out surface metalation processing, so that it is seemed that more satin is beautiful, so
A photoetching treatment is carried out to silicon wafer again afterwards；
S12, even if completing the production of chip after the completion of processing；
The litho machine used in the above method includes bottom plate 1, height adjusting structure 3, workbench 4, detection structure 6, LED light
7, dust accumulation structure 8 and vacuum pump 9；The bottom plate 1 and between the workbench 4 of chip placement be equipped with adjust height institute
Height adjusting structure 3 is stated, and the height adjusting structure 3 is detachably connected with the workbench 4；The inside of the workbench 4
The vacuum pump 9 equipped with offer negative pressure；The workbench 4 be equipped with for detection chip the LED light 7 be used for place
The detection structure 6 of chip, and the detection structure 6 engages with the workbench 4；The bottom end of the workbench 4, which is equipped with, to be used
In the dust accumulation structure 8 of storage dust, the dust accumulation structure 8 is corresponded with the detection structure 6, the dust accumulation structure 8
Engage with the workbench 4.
Specifically, as shown in Figure 1, a kind of chip production method of the present invention, the bottom plate 1 are equipped with for storing
The storage organization 2 of tool, the storage organization 2 include support frame 21, storage box 22 and handle 23, the support being used to support
Frame 21 is fixed on the bottom plate 1, and the inside of support frame as described above 21 is equipped with multiple rectangle knots for being used to store tool of different sizes
The storage box 22 of structure, the storage box 22 are slidably connected with support frame as described above 21, and the end of the storage box 22 is equipped with institute
State handle 23；It waits when in use, pulls the handle 23, the storage box 22 is slidably connected with support frame as described above 21, will live
Apparatus is placed on the inside of the storage box 22, and the setting of the storage box 22 substantially increases and adds convenient for storage life appliance
The cleaning of work environment.
Specifically, as shown in Figures 2 and 3, a kind of chip production method of the present invention, the height adjusting structure 3
Including sliding sleeve 31, limiting slot 32, adjusting rod 33, gag lever post 34, actuating sleeve 35, connecting rod 36 and fixing sleeve 37；The bottom plate 1
Bottom end is set there are four the sliding sleeve 31 of the cylindrical structure for guiding, and the sliding sleeve 31 is round away from one end of the bottom plate 1
Circumferential direction is equipped with the limiting slot 32 for secondary limit of triangular prism structure, and the inside of the sliding sleeve 31 is equipped with cylindrical body
The adjusting rod 33 with the externally threaded cylindrical structure for being used to adjust height of structure, the adjusting rod 33, which is equipped with, to be used
In the connecting rod 36 of the regular hexagon structure of guiding, the connecting rod 36 be fixed on the described of 4 bottom end of workbench
Fixing sleeve 37 is rotatablely connected, and the connecting rod 36 is equipped with the driving for the regular hexagon structure for driving being slidably connected
Set 35, the bottom end of the actuating sleeve 35 set that there are two for cooperating the gag lever post 34 of the limiting slot 32 sliding limit；It is first
The actuating sleeve 35 is first slided, engages the gag lever post 34 of 35 bottom end of actuating sleeve not with the limiting slot 32, then
Turn the adjusting rod 33 by spanner, the adjusting rod 33 is threadedly coupled with the sliding sleeve 31, while the connecting rod 36 with
The fixing sleeve 37 rotates, and adjusts the height of the workbench 4, is applicable in the operator suitable for different height, the tune
Pole 33 has external screw thread, has the function of automatic spacing, while by sliding the actuating sleeve 35, making the gag lever post 34 and institute
The engaging of limiting slot 32 is stated, secondary limit is carried out to the adjusting rod 33, substantially increases stability.
Specifically, as shown in Figure 1, a kind of chip production method of the present invention, one end of the vacuum pump 9 it is described
Workbench 4 is equipped with the access panel 5 for repair and maintenance for the rectangular configuration being detachably connected；The vacuum pump is overhauled in cleaning
When 9, the bolt between the access panel 5 and the workbench 4 is dismantled, the vacuum pump 9 is taken out into cleaning and maintenance.
Specifically, shown in as shown in Figure 1, Figure 3 and Figure 4, a kind of chip production method of the present invention, the detection structure 6
Including sealing ring 61, diversion trench 62, support plate 63, air cushion 64 and placing groove 65, the workbench 4 is equipped with prismatic table shape structure
For the placing groove 65 of chip placement, the side wall of the placing groove 65 is equipped with the LED light 7 for detection, for putting
The support plate 63 for setting chip rectangular configuration engages through the placing groove 65 with the workbench 4, the support plate 63
The sealing ring 61 is held between the workbench 4, the cross section that the support plate 63 is equipped with sex-limited distribution is trapezoidal
The diversion trench 62 for conflux, the support plate 63 between the diversion trench 62 of adjacent two is equipped with linear point
The air cushion 64 of the hemispherical dome structure with accommodating cavity of cloth；Chip is placed on the air cushion in the support plate 63
On 64, the LED light 7 is radiated at chip surface, convenient for being detected while ash disposal to chip photoetching quality, the air cushion
64 be the hemispherical dome structure with accommodating cavity, 64 contraction distortion of air cushion when chip contradicts air cushion 64, effectively
It preventing chip from contradicting the air cushion 64 and damages chip, improve detection quality, the cross section of the diversion trench 62 is trapezium structure,
Convenient for wind gathering, keep the dust cleaning effect of chip surface more preferable, the support plate 63 engages with the workbench 4, easy to disassemble
The support plate 63 carries out cleaning replacement to the support plate 63, and the setting of the sealing ring 61 enhances the support plate 63
With the leakproofness of 4 junction of workbench, dust removing effects are improved.
Specifically, as shown in Fig. 3, Fig. 4 and Fig. 5, a kind of chip production method of the present invention, the dust accumulation structure 8
Including guide rod 81, pull rod 82, containing box 83, vent 84, dust stratification protrusion 85 and gasket 86, the containing box 83 with it is described
Workbench 4 is slidably connected, and contradicts for the containing box 83 of dust accumulation and the support plate 63, the bottom end of the containing box 83 is set
There is the guide rod 81 being slidably connected with the workbench 4 for limit of tri-prismoid structure, the containing box 83
One end is equipped with the pull rod 82, and it is being used for for trapezium structure that the containing box 83, which is equipped with cross section with 4 junction of workbench,
The gasket 86 of sealing, and the gasket 86 and the workbench 4 contradict, the side wall of the containing box 83, which is equipped with, to be had
The dust stratification protrusion 85 for dust stratification of the hemispherical dome structure of hemispherical accommodating cavity, the dust stratification protrusion 85 is close to the branch
One end of fagging 63 is equipped with the vent 84 of the truncated cone-shaped structure for being connected to the vacuum pump 9 for air draft；It is described true
Sky pump 9 is started to work, and the inner air of the containing box 83 is discharged from the vent 84, and the inside of the containing box 83 is formed
The dust scrap of chip in the support plate 63 is sucked the inside of the containing box 83 by negative pressure, outside air, and dust passes through
Dust stratification protrusion 85 intercepts, and air be discharged from the vent 84, makes dust interception in the inside of the containing box 83, described
Dust stratification protrusion 85 is hemispherical dome structure, while the setting of the vent 84 of truncated cone-shaped effectively prevents the containing box
83 blockings influence dust removing effects.
The bottom plate 1 is fixed on to the side of litho machine first, according to the height of user adjust height adjusting structure 3 from
And the height of workbench 4 is adjusted, the chip after processing is placed in detection structure 6, opening for LED light 7 and vacuum pump 9 is opened
It closes, vacuum pump 9 cooperates the use of detection structure 6 to realize the internal negative pressure of dust accumulation structure 8, will test on the chip in structure 6
Dust scrap be pressed into the inside of dust accumulation structure 8, quickly handle the dust after photoetching, the LED light 7 being arranged on workbench 4 is matched
The use of detection structure 6 is closed convenient for detecting while handling dust to the chip of photoetching, is stored when by daily necessity zero
In the inside of storage organization 2；Specifically have：
(1) bottom plate 1 is fixed on to the side of litho machine, first sliding actuating sleeve 35 first, makes the limit of 35 bottom end of actuating sleeve
Position bar 34 does not engage with limiting slot 32, then turns adjusting rod 33 by spanner, adjusting rod 33 is threadedly coupled with sliding sleeve 31, simultaneously
Connecting rod 36 and fixing sleeve 37 rotate, and adjust the height of workbench 4, are applicable in the operator suitable for different height, adjust
Bar 33 has external screw thread, has the function of automatic spacing, while by sliding actuating sleeve 35, blocks gag lever post 34 and limiting slot 32
It closes, secondary limit is carried out to adjusting rod 33, substantially increases stability；
(2) chip after processing is placed in support plate 63, opens the switch of LED light 7 and vacuum pump 9, chip is put
It sets on the air cushion 64 in support plate 63, LED light 7 is radiated at chip surface, is convenient for while ash disposal to chip photoetching quality
It being detected, air cushion 64 is the hemispherical dome structure with accommodating cavity, 64 contraction distortion of air cushion at chip conflict air cushion 64,
It effectively prevent chip to contradict air cushion 64 and damages chip, improve detection quality, the cross section of diversion trench 62 is trapezium structure, is convenient for
Wind gathering keeps the dust cleaning effect of chip surface more preferable, and support plate 63 engages with workbench 4, support plate 63 easy to disassemble, to branch
Fagging 63 carries out cleaning replacement, and the setting of sealing ring 61 enhances the leakproofness of support plate 63 Yu 4 junction of workbench, improves
The inner air of dust removing effects, containing box 83 is discharged from vent 84, and the inside of containing box 83 forms negative pressure, and outside air will prop up
The inside of the dust scrap sucking containing box 83 of chip on fagging 63, dust are intercepted by dust stratification protrusion 85, and air is from air draft
Hole 84 is discharged, and intercepts dust in the inside of containing box 83, and dust stratification protrusion 85 is hemispherical dome structure, while the vent of truncated cone-shaped
84 setting, effectively preventing the blocking of containing box 83 influences dust removing effects；
(3) it waits when in use, pulls handle 23, storage box 22 is slidably connected with support frame 21, life appliance is placed on
The inside of storage box 22, the setting of storage box 22 substantially increase the cleaning of processing environment convenient for storage life appliance；
(4) when vacuum pump 9 is overhauled in cleaning, the bolt between access panel 5 and workbench 4 is dismantled, vacuum pump 9 is taken out clearly
Reason and maintenance.
Vacuum pump 9 of the invention cooperates the use of detection structure 6 to realize the internal negative pressure of dust accumulation structure 8, is convenient for examine
Dust scrap on chip on geodesic structure 6 is pressed into the inside of dust accumulation structure 8, convenient for quickly handling the dust after photoetching, work
Make the use of the LED light 7 being arranged on platform 4 cooperation detection structure 6 convenient for examining while handling dust to the chip of photoetching
It surveys, has saved the time of manufacturing procedure, greatly improved work efficiency, height adjusting structure 3 is set to workbench 4 and bottom plate 1
Between, convenient for adjusting the height of workbench 4 according to the height of user, improve usage comfort.
The basic principles, main features and advantages of the invention have been shown and described above.The technical staff of the industry should
Understand, the present invention is not limited to the above embodiments, and the description in above embodiment and specification only illustrates the present invention
Principle, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these variation and
Improvement is both fallen in the scope of protection of present invention.The claimed scope of the invention is by appended claims and its equivalent
Object defines.
Claims (6)
1. a kind of chip production method, which is characterized in that this approach includes the following steps：
S1, the silicon wafer for choosing good quality clean silicon wafer, silicon wafer are placed on cleaning machine and carries out physical cleaning to it,
It is drawn off after the completion of cleaning stand-by；
S2 carries out note phosphorus to it using machine after the completion of Wafer Cleaning and attached phosphorus operates；
S3 separates silicon wafer using cutting blade after the completion of operation；
S4 carries out single side blast to the silicon wafer separated after the completion of separation, places it in the list in sand-blasting machine to silicon wafer
Face carries out sandblasting, is cleaned after the completion of sandblasting, then for use；
S5, carries out spray boron operation for the silicon wafer after single side blast, coats one layer dissolved with diboron trioxide and aluminum nitrate in sandblasting face
Mixed solvent；
Silicon wafer is placed in 1000 DEG C of high-temperature services 5 hours or so, is diffused into phosphorus atoms inside silicon wafer by S6；
S7, the silicon wafer after diffusion, which was placed in hydrofluoric acid after a couple of days, makes it carry out silicon wafer separation automatically；
Silicon wafer after separation is placed in sand-blasting machine by S8, continues blast to the two sides of the silicon wafer after separation, sandblasting is completed
After cleaned, for use；
S9 by the silicon wafer painting photoresist after the completion of cleaning and then register mask plate and exposes, then uses developing solution dissolution
Not photosensitive photoresist layer, the silicon dioxide layer that no photoresist protection is dissolved with corrosive liquid, finally remove and have felt
The photoresist layer of light, i.e. completion photoetching；
S10 carries out wet etching to the silicon wafer after the completion of photoetching, so that it is removed the material of shielding film, then cleaned up
For use；
S11, will be etched after silicon wafer carry out surface metalation processing, so that it is seemed that more satin is beautiful, then again
Photoetching treatment is carried out to silicon wafer；
S12, even if completing the production of chip after the completion of processing；
The litho machine used in the above method include bottom plate (1), height adjusting structure (3), workbench (4), detection structure (6),
LED light (7), dust accumulation structure (8) and vacuum pump (9)；The bottom plate (1) and for chip placement the workbench (4) between
Equipped with the height adjusting structure (3) for adjusting height, and the height adjusting structure (3) and the workbench (4) are detachable
Connection；The inside of the workbench (4), which is equipped with, provides the vacuum pump (9) of negative pressure；The workbench (4) is equipped with for examining
Survey the LED light (7) of chip and the detection structure (6) for being used for chip placement, and the detection structure (6) and the work
Make platform (4) engaging；The bottom end of the workbench (4) is equipped with the dust accumulation structure (8) for storing dust, the dust accumulation structure
(8) it is corresponded with the detection structure (6), the dust accumulation structure (8) engages with the workbench (4).
2. a kind of chip production method according to claim 1, it is characterised in that：The bottom plate (1) is equipped with for receiving
Receive the storage organization (2) of tool, the storage organization (2) includes support frame (21), storage box (22) and handle (23), for branch
The support frame as described above (21) of support is fixed on the bottom plate (1), and the inside of support frame as described above (21) is equipped with multiple use of different sizes
In the storage box (22) of the rectangular configuration of storage tool, the storage box (22) is slidably connected with support frame as described above (21),
The end of the storage box (22) is equipped with the handle (23).
3. a kind of chip production method according to claim 1, it is characterised in that：The height adjusting structure (3) includes
Sliding sleeve (31), limiting slot (32), adjusting rod (33), gag lever post (34), actuating sleeve (35), connecting rod (36) and fixing sleeve (37)；
The bottom end of the bottom plate (1) is set there are four the sliding sleeve (31) of the cylindrical structure for guiding, and the sliding sleeve (31) is deviated from
One end circumferencial direction of the bottom plate (1) is equipped with the limiting slot (32) for secondary limit of triangular prism structure, described
The inside of sliding sleeve (31) is equipped with the adjusting with the externally threaded cylindrical structure for being used to adjust height of cylindrical structure
Bar (33), the adjusting rod (33) are equipped with the connecting rod (36) of the regular hexagon structure for guiding, the connecting rod
(36) it is rotatablely connected with the fixing sleeve (37) for being fixed on the workbench (4) bottom end, the connecting rod (36), which is equipped with, to be slided
The actuating sleeve (35) of the regular hexagon structure for driving of dynamic connection, the bottom end of the actuating sleeve (35) set that there are two use
In the gag lever post (34) for cooperating limiting slot (32) the sliding limit.
4. a kind of chip production method according to claim 1, it is characterised in that：The institute of one end of the vacuum pump (9)
State the access panel (5) for repair and maintenance that workbench (4) are equipped with the rectangular configuration being detachably connected.
5. a kind of chip production method according to claim 1, it is characterised in that：The detection structure (6) includes sealing
(61), diversion trench (62), support plate (63), air cushion (64) and placing groove (65) are enclosed, the workbench (4) is equipped with prismatic table shape knot
The placing groove (65) for chip placement of structure, the side wall of the placing groove (65) are equipped with the LED light for detection
(7), block for the support plate (63) of chip placement rectangular configuration through the placing groove (65) and the workbench (4)
It closes, is held between the support plate (63) and the workbench (4) sealing ring (61), the support plate (63) is equipped with
The cross section of sex-limited distribution is the trapezoidal diversion trench (62) for conflux, between the diversion trench (62) of adjacent two
The support plate (63) be equipped with linear distribution the hemispherical dome structure with accommodating cavity the air cushion (64).
6. a kind of chip production method according to claim 5, it is characterised in that：The dust accumulation structure (8) includes guiding
Bar (81), pull rod (82), containing box (83), vent (84), dust stratification raised (85) and gasket (86), the containing box (83)
It is slidably connected, is contradicted for the containing box (83) of dust accumulation and the support plate (63), the storage with the workbench (4)
The bottom end of case (83) is equipped with the guide rod being slidably connected with the workbench (4) for limit of tri-prismoid structure
(81), one end of the containing box (83) is equipped with the pull rod (82), the containing box (83) and the workbench (4) junction
It is the gasket (86) for sealing of trapezium structure equipped with cross section, and the gasket (86) and the workbench
(4) it contradicts, the side wall of the containing box (83) is equipped with the institute for dust stratification of the hemispherical dome structure with hemispherical accommodating cavity
Dust stratification protrusion (85) is stated, the dust stratification raised (85) is equipped with close to the one end of the support plate (63) and is connected to institute for air draft
State the vent (84) of the truncated cone-shaped structure of vacuum pump (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810754949.9A CN108899270A (en) | 2018-07-11 | 2018-07-11 | A kind of chip production method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810754949.9A CN108899270A (en) | 2018-07-11 | 2018-07-11 | A kind of chip production method |
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| CN108899270A true CN108899270A (en) | 2018-11-27 |
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| CN201810754949.9A Pending CN108899270A (en) | 2018-07-11 | 2018-07-11 | A kind of chip production method |
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| Country | Link |
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| CN (1) | CN108899270A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110176416A (en) * | 2019-05-08 | 2019-08-27 | 深圳市中科智诚科技有限公司 | A kind of heavy duty detergent chip picking-up apparatus with dedusting function |
| CN110491822A (en) * | 2019-08-05 | 2019-11-22 | 深圳市律远汇智科技有限公司 | A kind of chip pickup apparatus with automatic maintenance function |
| CN112461859A (en) * | 2020-11-23 | 2021-03-09 | 王耀通 | Intelligent separation and comparison device for integrated circuit chip production line |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202693998U (en) * | 2012-08-10 | 2013-01-23 | 东莞市五株电子科技有限公司 | Compound type film alignment work bench |
| CN103606523A (en) * | 2013-11-06 | 2014-02-26 | 蚌埠天宇机械工具有限公司 | GPP diode chip production process |
| CN204599977U (en) * | 2015-03-12 | 2015-09-02 | 中国民用航空飞行学院 | A kind of multi-function turntable |
| CN105374602A (en) * | 2015-12-02 | 2016-03-02 | 宁波速普电子有限公司 | Novel self-locking mechanism |
| CN105945027A (en) * | 2016-05-21 | 2016-09-21 | 中山弗雷德机械有限公司 | Mechanical multi-adaption type dust removal working frame part |
| CN107442518A (en) * | 2016-05-31 | 2017-12-08 | 上海微电子装备（集团）股份有限公司 | A kind of photo-etching machine work-piece platform automatic cleaning apparatus and method |
-
2018
- 2018-07-11 CN CN201810754949.9A patent/CN108899270A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202693998U (en) * | 2012-08-10 | 2013-01-23 | 东莞市五株电子科技有限公司 | Compound type film alignment work bench |
| CN103606523A (en) * | 2013-11-06 | 2014-02-26 | 蚌埠天宇机械工具有限公司 | GPP diode chip production process |
| CN204599977U (en) * | 2015-03-12 | 2015-09-02 | 中国民用航空飞行学院 | A kind of multi-function turntable |
| CN105374602A (en) * | 2015-12-02 | 2016-03-02 | 宁波速普电子有限公司 | Novel self-locking mechanism |
| CN105945027A (en) * | 2016-05-21 | 2016-09-21 | 中山弗雷德机械有限公司 | Mechanical multi-adaption type dust removal working frame part |
| CN107442518A (en) * | 2016-05-31 | 2017-12-08 | 上海微电子装备（集团）股份有限公司 | A kind of photo-etching machine work-piece platform automatic cleaning apparatus and method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110176416A (en) * | 2019-05-08 | 2019-08-27 | 深圳市中科智诚科技有限公司 | A kind of heavy duty detergent chip picking-up apparatus with dedusting function |
| CN110491822A (en) * | 2019-08-05 | 2019-11-22 | 深圳市律远汇智科技有限公司 | A kind of chip pickup apparatus with automatic maintenance function |
| CN112461859A (en) * | 2020-11-23 | 2021-03-09 | 王耀通 | Intelligent separation and comparison device for integrated circuit chip production line |
| CN112461859B (en) * | 2020-11-23 | 2024-01-26 | 优百顺集团有限公司 | Intelligent separation comparison device for integrated circuit chip production line |
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