CN108882549B - 一种单面柔性线路板的丝印设备及制作方法 - Google Patents
一种单面柔性线路板的丝印设备及制作方法 Download PDFInfo
- Publication number
- CN108882549B CN108882549B CN201810979918.3A CN201810979918A CN108882549B CN 108882549 B CN108882549 B CN 108882549B CN 201810979918 A CN201810979918 A CN 201810979918A CN 108882549 B CN108882549 B CN 108882549B
- Authority
- CN
- China
- Prior art keywords
- metal foil
- machine
- protective film
- pattern
- screen printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000007650 screen-printing Methods 0.000 title claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 claims abstract description 80
- 239000002184 metal Substances 0.000 claims abstract description 80
- 239000011888 foil Substances 0.000 claims abstract description 75
- 230000001681 protective effect Effects 0.000 claims abstract description 51
- 229910000679 solder Inorganic materials 0.000 claims abstract description 47
- 238000000034 method Methods 0.000 claims abstract description 45
- 238000010030 laminating Methods 0.000 claims abstract description 23
- 238000005530 etching Methods 0.000 claims abstract description 19
- 238000003466 welding Methods 0.000 claims abstract description 18
- 238000007639 printing Methods 0.000 claims abstract description 16
- 238000004080 punching Methods 0.000 claims abstract description 10
- 238000007599 discharging Methods 0.000 claims description 14
- 230000008685 targeting Effects 0.000 claims description 8
- 238000005096 rolling process Methods 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 4
- 239000000428 dust Substances 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 4
- 229920002799 BoPET Polymers 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 7
- 230000008602 contraction Effects 0.000 abstract description 5
- 238000001723 curing Methods 0.000 description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010022 rotary screen printing Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010096 film blowing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/12—Machines with auxiliary equipment, e.g. for drying printed articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810979918.3A CN108882549B (zh) | 2018-08-27 | 2018-08-27 | 一种单面柔性线路板的丝印设备及制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810979918.3A CN108882549B (zh) | 2018-08-27 | 2018-08-27 | 一种单面柔性线路板的丝印设备及制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108882549A CN108882549A (zh) | 2018-11-23 |
CN108882549B true CN108882549B (zh) | 2024-01-30 |
Family
ID=64322134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810979918.3A Active CN108882549B (zh) | 2018-08-27 | 2018-08-27 | 一种单面柔性线路板的丝印设备及制作方法 |
Country Status (1)
Country | Link |
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CN (1) | CN108882549B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109803498A (zh) * | 2018-12-13 | 2019-05-24 | 赣州明高科技股份有限公司 | 一种可替代双面柔性线路板的单面柔性线路板的制作方法 |
CN110139498A (zh) * | 2019-06-06 | 2019-08-16 | 恒赫鼎富(苏州)电子有限公司 | 柔性线路板防焊覆膜工艺 |
CN112437552A (zh) * | 2019-08-24 | 2021-03-02 | 王定锋 | 一种阻焊是油墨阻焊的双层导线电路板及其制作方法 |
CN110740588B (zh) * | 2019-09-29 | 2021-01-15 | 武汉大学 | Fpc自动阻焊生产线及方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104411108A (zh) * | 2014-11-24 | 2015-03-11 | 东莞康源电子有限公司 | 阻焊油墨线路板的制作方法 |
CN104602457A (zh) * | 2015-01-01 | 2015-05-06 | 王定锋 | 一种制作线路板的新方法及其制作的线路板 |
WO2015110003A1 (zh) * | 2014-01-24 | 2015-07-30 | 广州兴森快捷电路科技有限公司 | 一种阶梯阻焊的封装产品制作方法 |
CN105824393A (zh) * | 2015-01-23 | 2016-08-03 | 三星电子株式会社 | 片上系统、管理其功率的方法和电子装置 |
CN106034378A (zh) * | 2015-03-11 | 2016-10-19 | 深圳市英内尔科技有限公司 | 一种新型材质的卷对卷柔性线路板及其制作方法 |
CN106686902A (zh) * | 2017-01-24 | 2017-05-17 | 江西省木林森光电科技有限公司 | 一种线路板线路印刷方法及线路印刷设备 |
CN107770953A (zh) * | 2017-10-12 | 2018-03-06 | 安捷利(番禺)电子实业有限公司 | 一种基于可分离铜箔的单面柔性线路板及其贴膜制备方法 |
CN108112171A (zh) * | 2017-12-20 | 2018-06-01 | 厦门市铂联科技股份有限公司 | 一种卷式fpc线路图形制作设备及方法 |
CN209134695U (zh) * | 2018-08-27 | 2019-07-19 | 新余市木林森线路板有限公司 | 一种单面柔性线路板的丝印设备 |
-
2018
- 2018-08-27 CN CN201810979918.3A patent/CN108882549B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015110003A1 (zh) * | 2014-01-24 | 2015-07-30 | 广州兴森快捷电路科技有限公司 | 一种阶梯阻焊的封装产品制作方法 |
CN104411108A (zh) * | 2014-11-24 | 2015-03-11 | 东莞康源电子有限公司 | 阻焊油墨线路板的制作方法 |
CN104602457A (zh) * | 2015-01-01 | 2015-05-06 | 王定锋 | 一种制作线路板的新方法及其制作的线路板 |
CN105824393A (zh) * | 2015-01-23 | 2016-08-03 | 三星电子株式会社 | 片上系统、管理其功率的方法和电子装置 |
CN106034378A (zh) * | 2015-03-11 | 2016-10-19 | 深圳市英内尔科技有限公司 | 一种新型材质的卷对卷柔性线路板及其制作方法 |
CN106686902A (zh) * | 2017-01-24 | 2017-05-17 | 江西省木林森光电科技有限公司 | 一种线路板线路印刷方法及线路印刷设备 |
CN107770953A (zh) * | 2017-10-12 | 2018-03-06 | 安捷利(番禺)电子实业有限公司 | 一种基于可分离铜箔的单面柔性线路板及其贴膜制备方法 |
CN108112171A (zh) * | 2017-12-20 | 2018-06-01 | 厦门市铂联科技股份有限公司 | 一种卷式fpc线路图形制作设备及方法 |
CN209134695U (zh) * | 2018-08-27 | 2019-07-19 | 新余市木林森线路板有限公司 | 一种单面柔性线路板的丝印设备 |
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Publication number | Publication date |
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CN108882549A (zh) | 2018-11-23 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 338000 No. 2688 Hengshan Road, Xinyu High-tech Development Zone, Jiangxi Province Applicant after: XINYU MULINSEN CIRCUIT BOARD Co.,Ltd. Address before: 338004 Guangming Road 1688, Xinyu High-tech Development Zone, Jiangxi Province Applicant before: JIANGXI MULINSEN PHOTOELECTRIC TECHNOLOGY CO.,LTD. |
|
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 338000 No. 2688, hengsan Road, high tech Development Zone, Xinyu City, Jiangxi Province Applicant after: Xinyu Mulinsen Electronics Co.,Ltd. Address before: 338000 No. 2688, hengsan Road, high tech Development Zone, Xinyu City, Jiangxi Province Applicant before: XINYU MULINSEN CIRCUIT BOARD Co.,Ltd. |
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GR01 | Patent grant |