CN108882509B - Corrosion-resistant circuit board - Google Patents
Corrosion-resistant circuit board Download PDFInfo
- Publication number
- CN108882509B CN108882509B CN201810977294.1A CN201810977294A CN108882509B CN 108882509 B CN108882509 B CN 108882509B CN 201810977294 A CN201810977294 A CN 201810977294A CN 108882509 B CN108882509 B CN 108882509B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- corrosion
- resistant
- board body
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
Abstract
The invention discloses a novel corrosion-resistant circuit board, which comprises a circuit board body, a sealing ball, a corrosion-resistant liquid, heat-conducting columns, a seal, a sealing sheet, a corrosion-resistant layer and an electrical boundary, wherein the electrical boundary is fixed on the circuit board body and is provided with a plurality of heat-conducting columns; this novel corrosion-resistant circuit board is through being provided with the heat dissipation post on the circuit board body, can be quick disperse the heat that circuit board self produced in to the environment, is equipped with the closed ball on the heat dissipation post, and the anticorrosion liquid in the closed ball can flow before the circuit board corrodes, and the opposite side of circuit board body is provided with corrosion-resistant membrane, and these both can make the corrosion resistance of circuit board in the use obtain improving to promote the life of circuit board.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a corrosion-resistant circuit board which can enhance the corrosion resistance of the circuit board and prolong the service life of the circuit board.
Background
Printed circuit boards, also known as printed circuit boards, are supports for electronic components, in which metal conductors are used as lines for connecting the electronic components. Conventional circuit boards are called printed circuit boards or printed circuit boards because the circuit traces and patterns are formed by a process of printing an etching resist.
Because electronic products are continuously miniaturized and refined, most circuit boards are manufactured by attaching an etching resist, exposing and developing the circuit boards, and etching the circuit boards. The flexible printed circuit board is also called FPC board, which is a flexible printed circuit board with high reliability and excellent performance and is made of polyimide or polyester film as a base material. The high-density light-weight LED lamp has the characteristics of high wiring density, light weight, thin thickness and good bending property.
In the using process of the circuit board, the circuit board is often placed in an environment containing corrosive substances due to various conditions, and the problem of corrosion resistance is a real reason for damaging the circuit board, so that the circuit board is easy to corrode, and the problem of limiting the application field of the PCB is very urgent, and a circuit board structure with higher corrosion resistance is urgently needed in the market.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides the corrosion-resistant circuit board, the heat generated by the circuit board can be quickly dissipated to the environment by arranging the heat dissipation column on the circuit board body, the heat dissipation column is provided with the closed ball, the corrosion-resistant liquid in the closed ball flows out before the circuit board is corroded, and the other side of the circuit board body is provided with the corrosion-resistant film, so that the corrosion resistance of the circuit board in the using process can be improved, and the service life of the circuit board is prolonged.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention comprises a circuit board body, a sealing ball, an anticorrosive liquid, a heat conducting column, a seal, a sealing sheet, an anticorrosive layer and an electrical boundary; an electrical boundary is fixed on the circuit board body, a plurality of heat conduction columns are arranged on the electrical boundary, sealing balls are arranged on the heat conduction columns, the interior of each sealing ball is filled with anti-corrosion liquid, a seal is arranged on the cavity and plugged by a sealing sheet, and an anti-corrosion layer is arranged on one side of the circuit board body.
Furthermore, the circuit board body can be a ceramic circuit board, an alumina ceramic circuit board and an aluminum nitride ceramic circuit board.
Furthermore, a cavity structure is arranged in the closed ball.
Further, the anti-corrosion liquid is specifically sol.
Furthermore, the heat conduction column is made of copper.
Furthermore, the connection mode of the closed ball and the heat conduction column is threaded connection.
Furthermore, the sealing sheet material can be phenolic cotton paper, epoxy resin, glass cloth, polyester, aluminum nitride and silicon carbide. The corrosion-resistant layer is made of phenolic resin.
The invention has the beneficial effects that the heat generated by the circuit board can be quickly dissipated to the environment by arranging the heat dissipation column on the circuit board body, the sealing ball is arranged on the heat dissipation column, the anti-corrosion liquid in the sealing ball flows out before the circuit board is corroded, and the anti-corrosion film is arranged on the other side of the circuit board body, so that the corrosion resistance of the circuit board in the using process can be improved by the sealing ball and the corrosion resistance film, and the service life of the circuit board is prolonged.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a block diagram of an embodiment of the present invention.
FIG. 2 is a block diagram of an embodiment of the present invention for connecting the circuit board body to the electrical boundary.
In the drawings
1. A circuit board body;
2. closing the ball;
3. preservative solution;
4. a heat-conducting column;
5. sealing;
6. sealing a sheet;
7. a corrosion-resistant layer;
8. an electrical boundary.
Detailed Description
In the embodiment shown in fig. 1-2, the invention comprises a circuit board body 1, a sealing ball 2, an anticorrosive liquid 3, a heat conduction column 4, a seal 5, a sealing sheet 6, a corrosion-resistant layer 7 and an electrical boundary 8. An electrical boundary 8 is fixed on the circuit board body 1, the electrical boundary 8 is provided with a plurality of heat conduction columns 4, sealing balls 2 are arranged on the heat conduction columns 4, the sealing balls 2 are filled with anti-corrosion liquid 3, a cavity of the sealing balls 2 is provided with a seal 5, the seal 5 is plugged by a sealing sheet 6, and one side of the circuit board body 1 is provided with an anti-corrosion layer 7.
Further specifically, the circuit board body 1 may be a ceramic circuit board, an alumina ceramic circuit board, or an aluminum nitride ceramic circuit board. Further specifically, a cavity structure is arranged in the closed ball 2; the anti-corrosion liquid 3 is specifically sol.
More specifically, the heat conducting column 4 is made of copper; the connection mode of the sealing ball 2 and the heat conduction column 4 is threaded connection.
More specifically, the sealing sheet 6 may be made of phenolic cotton paper, epoxy resin, glass cloth, polyester, aluminum nitride, or silicon carbide; the corrosion-resistant layer 7 is made of phenolic resin.
In the specific implementation, the heat-conducting column 4 is made of copper, which has good ductility and high thermal and electrical conductivity, and is the most commonly used material for cables, electric and electronic components. The four heat-conducting columns 4 are arranged on the electrical boundary of the circuit board, so that the heat of the electronic element in the middle can be dispersed, and the conductivity of copper cannot influence the performance of the electronic element, thereby prolonging the service life of the electronic element on the circuit board body 1 to a great extent and reducing the power consumption of the electronic element. The preservative solution 3 is a sol which is liquefied and semi-fluid and has the property similar to that of a fluid. The sol can be transformed into a gel in a semi-solid state with a certain elasticity, a process called gelation.
The closed ball 2 is a cavity which is a container suitable for sol, and the sol in the cavity is not easy to generate a gel effect. The sealing ball 2 is a cavity, the sealing sheet 6 is made of polyester, and the base material of the circuit board body 1 is also made of polyester. The polyester is a general name of polymers obtained by polycondensation of polyhydric alcohol and polybasic acid, and is an engineering plastic with excellent performance and wide application. After the surface of the circuit board is slightly corroded, the sealing sheet 6 is also corroded, but the sealing sheet 6 in the invention is thin, so the sealing sheet can be damaged after being slightly corroded, the sol in the cavity can flow out through the sealing opening 5, then the surface of the circuit board is gradually covered, after a period of time, the gel effect occurs, the sol is changed into gel, and then a layer of anti-corrosion film is added to the slightly corroded circuit board, and the service life of the circuit board can be greatly prolonged by the covering of the anti-corrosion film.
In specific implementation, the connection mode of the sealing ball 2 and the heat conducting column 4 is threaded connection, after the sol flows out, no filler is filled in the sealing ball 2, at the moment, the sealing ball 2 can be taken down, and the sol is injected into the cavity again; after a certain period of time, the sol at the seal 5 is converted into a gel by the gelling action, at which time the closing ball can be mounted on the heat-conducting column again. When the gel covered on the surface of the circuit board body 1 is gradually corroded, the gel at the seal 5 is also corroded, the sol flows out again to cover the surface of the circuit board body 1, and the steps can be repeated continuously.
The corrosion-resistant layer 7 is made of phenolic resin material, the phenolic resin is good corrosion-resistant material, and the corrosion resistance of the finished circuit board in the using process can be improved through the corrosion-resistant layer 7, so that the service life of the circuit board can be prolonged.
It will be appreciated by those skilled in the art that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The embodiments disclosed above are illustrative and not exclusive in all respects. All changes which come within the scope of or equivalence to the invention are intended to be embraced therein.
Claims (7)
1. A corrosion-resistant circuit board comprises a circuit board body, and is characterized in that: the circuit board comprises a circuit board body and is characterized by also comprising a sealing ball, an anti-corrosion liquid, heat conduction columns, a seal, a sealing sheet, an anti-corrosion layer and an electrical boundary, wherein the electrical boundary is fixed on the circuit board body and is provided with a plurality of heat conduction columns, the sealing ball is arranged on the heat conduction columns, and the interior of the sealing ball is filled with the anti-corrosion liquid; the inside of the closed ball is of a cavity structure; the cavity is provided with a seal, the seal is plugged by a sealing sheet, and one side of the circuit board body is provided with a corrosion-resistant layer.
2. A corrosion-resistant circuit board according to claim 1, wherein: the circuit board body can be an aluminum oxide ceramic circuit board or an aluminum nitride ceramic circuit board.
3. A corrosion-resistant circuit board according to claim 2, wherein: the anti-corrosion liquid is specifically sol.
4. A corrosion-resistant circuit board according to claim 1, wherein: the heat conduction column is made of copper.
5. A corrosion-resistant circuit board according to claim 1, wherein: the connection mode of the sealing ball and the heat conduction column is threaded connection.
6. A corrosion-resistant circuit board according to claim 2, wherein: the sealing sheet material can be epoxy resin or polyester.
7. A corrosion-resistant circuit board according to claim 2, wherein: the corrosion-resistant layer is made of phenolic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810977294.1A CN108882509B (en) | 2018-08-26 | 2018-08-26 | Corrosion-resistant circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810977294.1A CN108882509B (en) | 2018-08-26 | 2018-08-26 | Corrosion-resistant circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108882509A CN108882509A (en) | 2018-11-23 |
| CN108882509B true CN108882509B (en) | 2021-02-05 |
Family
ID=64321639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810977294.1A Active CN108882509B (en) | 2018-08-26 | 2018-08-26 | Corrosion-resistant circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108882509B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7356920B2 (en) * | 2004-11-12 | 2008-04-15 | Palo Alto Research Center Incorporated | Micro-machined structure production using encapsulation |
| CN105621342A (en) * | 2015-12-29 | 2016-06-01 | 苏州工业园区纳米产业技术研究院有限公司 | MEMS release auxiliary structure and preparation method thereof |
| CN206807858U (en) * | 2017-06-09 | 2017-12-26 | 梅州宝得电子有限公司 | A kind of corrosion-resistant circuit board of novel fire resistant |
| CN207835914U (en) * | 2018-02-05 | 2018-09-07 | 梅州市山美电子有限公司 | A kind of corrosion resistant type circuit board |
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2018
- 2018-08-26 CN CN201810977294.1A patent/CN108882509B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN108882509A (en) | 2018-11-23 |
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| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210108 Address after: 351100 Chigang overseas Chinese Economic Development Zone, Putian City, Fujian Province Applicant after: PUTIAN JIAYI TECHNOLOGY Co.,Ltd. Address before: 311833 No.241, Meidian, zhangmeita village, Donghe Township, Zhuji City, Shaoxing City, Zhejiang Province Applicant before: Chen Zhaojun |
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| GR01 | Patent grant |