CN108878594A - 一种硅异质结光伏电池及其制造方法 - Google Patents

一种硅异质结光伏电池及其制造方法 Download PDF

Info

Publication number
CN108878594A
CN108878594A CN201811034073.7A CN201811034073A CN108878594A CN 108878594 A CN108878594 A CN 108878594A CN 201811034073 A CN201811034073 A CN 201811034073A CN 108878594 A CN108878594 A CN 108878594A
Authority
CN
China
Prior art keywords
silicon layer
crystalline silicon
type non
doping concentration
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201811034073.7A
Other languages
English (en)
Other versions
CN108878594B (zh
Inventor
管先炳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Yuanlian Technology Pioneer Park Management Co ltd
Original Assignee
Suzhou Qian Zheng Technology Consulting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Qian Zheng Technology Consulting Co Ltd filed Critical Suzhou Qian Zheng Technology Consulting Co Ltd
Priority to CN201811034073.7A priority Critical patent/CN108878594B/zh
Publication of CN108878594A publication Critical patent/CN108878594A/zh
Application granted granted Critical
Publication of CN108878594B publication Critical patent/CN108878594B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/20Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
    • H01L31/202Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic Table
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0256Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
    • H01L31/0264Inorganic materials
    • H01L31/028Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic Table
    • H01L31/0288Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic Table characterised by the doping material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0352Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
    • H01L31/035272Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
    • H01L31/03529Shape of the potential jump barrier or surface barrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0376Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including amorphous semiconductors
    • H01L31/03762Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including amorphous semiconductors including only elements of Group IV of the Periodic Table
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/072Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
    • H01L31/0725Multiple junction or tandem solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/072Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
    • H01L31/0745Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type comprising a AIVBIV heterojunction, e.g. Si/Ge, SiGe/Si or Si/SiC solar cells
    • H01L31/0747Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type comprising a AIVBIV heterojunction, e.g. Si/Ge, SiGe/Si or Si/SiC solar cells comprising a heterojunction of crystalline and amorphous materials, e.g. heterojunction with intrinsic thin layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/548Amorphous silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Energy (AREA)
  • Chemical & Material Sciences (AREA)
  • Sustainable Development (AREA)
  • Inorganic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Photovoltaic Devices (AREA)

Abstract

本发明涉及一种硅异质结光伏电池及其制造方法,该方法包括以下步骤:对所述N型单晶硅片进行双面制绒处理;在所述N型单晶硅片的上表面依次沉积第一本征非晶硅层、第一P型非晶硅层、第二P型非晶硅层、第三P型非晶硅层、第四P型非晶硅层;接着在所述N型单晶硅片的下表面依次沉积第二本征非晶硅层、第一N型非晶硅层、第二N型非晶硅层、第三N型非晶硅层以及第四N型非晶硅层;接着在所述第四P型非晶硅层上沉积第一透明导电层,接着在所述第四N型非晶硅层上沉积第二透明导电层;接着在所述第一透明导电层上沉积正面电极,并在所述第二透明导电层上沉积背面电极。

Description

一种硅异质结光伏电池及其制造方法
技术领域
本发明涉及光伏电池技术领域,特别是涉及一种硅异质结光伏电池及其制造方法。
背景技术
石化能源作为不可再生能源,由于大量的使用消耗导致石化能源逐渐枯竭,新型可再生能源如太阳能、风能逐渐兴起。太阳能电池作为一种直接将太阳能转换为电能的装置,具有装配形式多样、取之不尽、用之不竭、绿色无污染等优点,近年来得到了大力发展。太阳能电池的种类繁多,具体包括单晶硅太阳能电池、多晶硅太阳能电池、硅异质结太阳能电池、非晶硅薄膜太阳能电池、砷化镓太阳能电池、铜铟镓硒系太阳能电池、碲化镉太阳能电池、染料敏化电池、有机太阳能电池、有机无机杂化太阳能电池、钙钛矿太阳能电池等种类的太阳能电池。其中,在硅异质结太阳能电池的发展历程中,通常是改善硅基底的掺杂类型、硅基底的表面形貌、栅极的制备工艺、透明导电层的退火工艺以及电池的具体结构等工艺,以提高硅异质结太阳能电池的光电转换效率。
发明内容
本发明的目的是克服上述现有技术的不足,提供一种硅异质结光伏电池及其制造方法。
为实现上述目的,本发明采用的技术方案是:
一种硅异质结光伏电池的制造方法,包括以下步骤:
1)提供一N型单晶硅片,对所述N型单晶硅片进行双面制绒处理,在所述N型单晶硅片的上表面和下表面均形成类金字塔微结构;
2)接着对所述N型单晶硅片进行甲基化处理,以在所述N型单晶硅片的上下表面形成Si-CH3键;
3)接着在所述N型单晶硅片的上表面沉积第一本征非晶硅层,接着在所述第一本征非晶硅层上沉积第一P型非晶硅层;
4)接着在第一P型非晶硅层上沉积第二P型非晶硅层,其中,所述第二P型非晶硅层的掺杂浓度小于所述第一P型非晶硅层的掺杂浓度,且所述第二P型非晶硅层的掺杂浓度大于所述N型单晶硅片的掺杂浓度;
5)接着在第二P型非晶硅层上沉积第三P型非晶硅层,其中,所述第三P型非晶硅层的掺杂浓度大于所述第二P型非晶硅层的掺杂浓度,且所述第三P型非晶硅层的掺杂浓度小于所述第一P型非晶硅层的掺杂浓度;
6)接着在第三P型非晶硅层上沉积第四P型非晶硅层,其中,所述第四P型非晶硅层的掺杂浓度大于所述第一P型非晶硅层的掺杂浓度;
7)接着在所述N型单晶硅片的下表面依次沉积第二本征非晶硅层、第一N型非晶硅层、第二N型非晶硅层、第三N型非晶硅层以及第四N型非晶硅层,其中,所述第二N型非晶硅层的掺杂浓度大于所述N型单晶硅片的掺杂浓度,所述第二N型非晶硅层的掺杂浓度以及所述第三N型非晶硅层的掺杂浓度小于所述第一N型非晶硅层的掺杂浓度,所述第三N型非晶硅层的掺杂浓度大于所述第二N型非晶硅层的掺杂浓度,所述第四N型非晶硅层的掺杂浓度大于所述第一N型非晶硅层的掺杂浓度;
8)接着在所述第四P型非晶硅层上沉积第一透明导电层,接着在所述第四N型非晶硅层上沉积第二透明导电层;
9)接着在所述第一透明导电层上沉积正面电极,并在所述第二透明导电层上沉积背面电极。
作为优选,在所述步骤(2)中,首先将所述N型单晶硅片在HF溶液中处理5-10分钟,接着将该N型单晶硅片浸入饱和五氯化磷的氯苯溶液中并在110-120℃下保持2-4小时,然后将该N型单晶硅片浸入甲基氯化镁的四氢呋喃溶液中并在60-80℃下保持9-12小时,最后清洗该N型单晶硅片。
作为优选,在所述步骤(3)中,所述第一本征非晶硅层的厚度为5-8纳米,所述第一P型非晶硅层的厚度为1-2纳米,所述第一P型非晶硅层的掺杂浓度为3×1019cm-3-2×1020cm-3
作为优选,在所述步骤(4)-(6)中,所述第二P型非晶硅层的厚度为2-3纳米,所述第三P型非晶硅层的厚度为1-2纳米,第四P型非晶硅层的厚度为1.5-2.5纳米,所述第二P型非晶硅层的掺杂浓度为5×1018cm-3-6×1019cm-3,所述N型单晶硅片的掺杂浓度为1017cm-3-3×1018cm-3,所述第三P型非晶硅层的掺杂浓度为1019cm-3-1020cm-3,所述第四P型非晶硅层的掺杂浓度为8×1019cm-3-6×1020cm-3
作为优选,在所述步骤(7)中,所述第二本征非晶硅层的厚度为5-10纳米,所述第一N型非晶硅层的厚度为1-2纳米,所述第二N型非晶硅层的厚度为2.5-3.5纳米,所述第三N型非晶硅层的厚度为2-3纳米,所述第四N型非晶硅层的厚度为1-2纳米。
作为优选,在所述步骤(7)中,所述第一N型非晶硅层的掺杂浓度为5×1019cm-3-6×1020cm-3,所述第二N型非晶硅层的掺杂浓度为8×1018cm-3-9×1019cm-3,所述第三P型非晶硅层的掺杂浓度为2×1019cm-3-2×1020cm-3,所述第四P型非晶硅层的掺杂浓度为1020cm-3-1021cm-3
作为优选,在所述步骤(8)中,所述第一透明导电层和所述第二透明导电层的厚度为200-600纳米,所述第一透明导电层和所述第二透明导电层的材质为AZO、ITO、FTO、石墨烯、银纳米线以及碳纳米管中的一种或多种。
作为优选,在所述步骤(9)中,所述正面电极和所述背面电极的厚度为300-800纳米,所述正面电极和所述背面电极的材质为银、铜、金、钛、钯、铝中的一种或多种。
本发明还提出一种硅异质结光伏电池,其采用上述方法制备形成的。
本发明与现有技术相比具有下列优点:
本发明的硅异质结光伏电池的制造过程中,选择N型单晶硅片为硅基底,通过优化N型单晶硅片的上下表面的P型非晶硅层和N型非晶硅层的层数、各子层的厚度以及各子层的掺杂浓度的大小关系以及具体数值,有利于该硅异质结光伏电池中的电子和空穴的分离与传输,进而有效提高了该硅异质结光伏电池的短路电流和填充因子,进而提高该硅异质结光伏电池的光电转换效率。同时本发明的制造方法简单易行,且与现有的制备工艺相兼容。
附图说明
图1为本发明的硅异质结光伏电池的结构示意图。
具体实施方式
本发明提出一种硅异质结光伏电池的制造方法,包括以下步骤:
1)提供一N型单晶硅片,对所述N型单晶硅片进行双面制绒处理,在所述N型单晶硅片的上表面和下表面均形成类金字塔微结构。
2)接着对所述N型单晶硅片进行甲基化处理,以在所述N型单晶硅片的上下表面形成Si-CH3键,具体步骤为:首先将所述N型单晶硅片在HF溶液中处理5-10分钟,接着将该N型单晶硅片浸入饱和五氯化磷的氯苯溶液中并在110-120℃下保持2-4小时,然后将该N型单晶硅片浸入甲基氯化镁的四氢呋喃溶液中并在60-80℃下保持9-12小时,最后清洗该N型单晶硅片。
3)接着在所述N型单晶硅片的上表面沉积第一本征非晶硅层,接着在所述第一本征非晶硅层上沉积第一P型非晶硅层,其中,所述第一本征非晶硅层的厚度为5-8纳米,所述第一P型非晶硅层的厚度为1-2纳米,所述第一P型非晶硅层的掺杂浓度为3×1019cm-3-2×1020cm-3
4)接着在第一P型非晶硅层上沉积第二P型非晶硅层,其中,所述第二P型非晶硅层的掺杂浓度小于所述第一P型非晶硅层的掺杂浓度,且所述第二P型非晶硅层的掺杂浓度大于所述N型单晶硅片的掺杂浓度。
5)接着在第二P型非晶硅层上沉积第三P型非晶硅层,其中,所述第三P型非晶硅层的掺杂浓度大于所述第二P型非晶硅层的掺杂浓度,且所述第三P型非晶硅层的掺杂浓度小于所述第一P型非晶硅层的掺杂浓度。
6)接着在第三P型非晶硅层上沉积第四P型非晶硅层,其中,所述第四P型非晶硅层的掺杂浓度大于所述第一P型非晶硅层的掺杂浓度。
在所述步骤(4)-(6)中,所述第二P型非晶硅层的厚度为2-3纳米,所述第三P型非晶硅层的厚度为1-2纳米,第四P型非晶硅层的厚度为1.5-2.5纳米,所述第二P型非晶硅层的掺杂浓度为5×1018cm-3-6×1019cm-3,所述N型单晶硅片的掺杂浓度为1017cm-3-3×1018cm-3,所述第三P型非晶硅层的掺杂浓度为1019cm-3-1020cm-3,所述第四P型非晶硅层的掺杂浓度为8×1019cm-3-6×1020cm-3
7)接着在所述N型单晶硅片的下表面依次沉积第二本征非晶硅层、第一N型非晶硅层、第二N型非晶硅层、第三N型非晶硅层以及第四N型非晶硅层,其中,所述第二N型非晶硅层的掺杂浓度大于所述N型单晶硅片的掺杂浓度,所述第二N型非晶硅层的掺杂浓度以及所述第三N型非晶硅层的掺杂浓度小于所述第一N型非晶硅层的掺杂浓度,所述第三N型非晶硅层的掺杂浓度大于所述第二N型非晶硅层的掺杂浓度,所述第四N型非晶硅层的掺杂浓度大于所述第一N型非晶硅层的掺杂浓度,其中,所述第二本征非晶硅层的厚度为5-10纳米,所述第一N型非晶硅层的厚度为1-2纳米,所述第二N型非晶硅层的厚度为2.5-3.5纳米,所述第三N型非晶硅层的厚度为2-3纳米,所述第四N型非晶硅层的厚度为1-2纳米,所述第一N型非晶硅层的掺杂浓度为5×1019cm-3-6×1020cm-3,所述第二N型非晶硅层的掺杂浓度为8×1018cm-3-9×1019cm-3,所述第三P型非晶硅层的掺杂浓度为2×1019cm-3-2×1020cm-3,所述第四P型非晶硅层的掺杂浓度为1020cm-3-1021cm-3
8)接着在所述第四P型非晶硅层上沉积第一透明导电层,接着在所述第四N型非晶硅层上沉积第二透明导电层,所述第一透明导电层和所述第二透明导电层的厚度为200-600纳米,所述第一透明导电层和所述第二透明导电层的材质为AZO、ITO、FTO、石墨烯、银纳米线以及碳纳米管中的一种或多种。
9)接着在所述第一透明导电层上沉积正面电极,并在所述第二透明导电层上沉积背面电极,其中,所述正面电极和所述背面电极的厚度为300-800纳米,所述正面电极和所述背面电极的材质为银、铜、金、钛、钯、铝中的一种或多种。
如图1所示,本发明提出一种硅异质结光伏电池,所述硅异质结光伏电池包括N型单晶硅片1,在所述N型单晶硅片1的上表面依次设置有第一本征非晶硅层2、第一P型非晶硅层31、第二P型非晶硅层32、第三P型非晶硅层33、第四P型非晶硅层34、第一透明导电层4以及正面电极5,在所述N型单晶硅片1的下表面依次设置有第二本征非晶硅层6、第一N型非晶硅层71、第二N型非晶硅层72、第三N型非晶硅层73、第四N型非晶硅层74、第二透明导电层8以及背面电极9。
实施例1:
一种硅异质结光伏电池的制造方法,包括以下步骤:
1)提供一N型单晶硅片,对所述N型单晶硅片进行双面制绒处理,在所述N型单晶硅片的上表面和下表面均形成类金字塔微结构。
2)接着对所述N型单晶硅片进行甲基化处理,以在所述N型单晶硅片的上下表面形成Si-CH3键,具体步骤为:首先将所述N型单晶硅片在HF溶液中处理8分钟,接着将该N型单晶硅片浸入饱和五氯化磷的氯苯溶液中并在115℃下保持3小时,然后将该N型单晶硅片浸入甲基氯化镁的四氢呋喃溶液中并在75℃下保持10小时,最后清洗该N型单晶硅片。
3)接着在所述N型单晶硅片的上表面沉积第一本征非晶硅层,接着在所述第一本征非晶硅层上沉积第一P型非晶硅层,其中,所述第一本征非晶硅层的厚度为6纳米,所述第一P型非晶硅层的厚度为1.5纳米,所述第一P型非晶硅层的掺杂浓度为6×1019cm-3
4)接着在第一P型非晶硅层上沉积第二P型非晶硅层,其中,所述第二P型非晶硅层的掺杂浓度小于所述第一P型非晶硅层的掺杂浓度,且所述第二P型非晶硅层的掺杂浓度大于所述N型单晶硅片的掺杂浓度。
5)接着在第二P型非晶硅层上沉积第三P型非晶硅层,其中,所述第三P型非晶硅层的掺杂浓度大于所述第二P型非晶硅层的掺杂浓度,且所述第三P型非晶硅层的掺杂浓度小于所述第一P型非晶硅层的掺杂浓度。
6)接着在第三P型非晶硅层上沉积第四P型非晶硅层,其中,所述第四P型非晶硅层的掺杂浓度大于所述第一P型非晶硅层的掺杂浓度。
在所述步骤(4)-(6)中,所述第二P型非晶硅层的厚度为2.5纳米,所述第三P型非晶硅层的厚度为1.5纳米,第四P型非晶硅层的厚度为2纳米,所述第二P型非晶硅层的掺杂浓度为8×1018cm-3,所述N型单晶硅片的掺杂浓度为5×1017cm-3,所述第三P型非晶硅层的掺杂浓度为3×1019cm-3,所述第四P型非晶硅层的掺杂浓度为2×1020cm-3
7)接着在所述N型单晶硅片的下表面依次沉积第二本征非晶硅层、第一N型非晶硅层、第二N型非晶硅层、第三N型非晶硅层以及第四N型非晶硅层,其中,所述第二N型非晶硅层的掺杂浓度大于所述N型单晶硅片的掺杂浓度,所述第二N型非晶硅层的掺杂浓度以及所述第三N型非晶硅层的掺杂浓度小于所述第一N型非晶硅层的掺杂浓度,所述第三N型非晶硅层的掺杂浓度大于所述第二N型非晶硅层的掺杂浓度,所述第四N型非晶硅层的掺杂浓度大于所述第一N型非晶硅层的掺杂浓度,其中,所述第二本征非晶硅层的厚度为8纳米,所述第一N型非晶硅层的厚度为1.5纳米,所述第二N型非晶硅层的厚度为3纳米,所述第三N型非晶硅层的厚度为2.5纳米,所述第四N型非晶硅层的厚度为1.5纳米,所述第一N型非晶硅层的掺杂浓度为3×1020cm-3,所述第二N型非晶硅层的掺杂浓度为2×1019cm-3,所述第三P型非晶硅层的掺杂浓度为5×1019cm-3,所述第四P型非晶硅层的掺杂浓度为6×1020cm-3
8)接着在所述第四P型非晶硅层上沉积第一透明导电层,接着在所述第四N型非晶硅层上沉积第二透明导电层,所述第一透明导电层和所述第二透明导电层的厚度为400纳米,所述第一透明导电层和所述第二透明导电层的材质为AZO、ITO、FTO、石墨烯、银纳米线以及碳纳米管中的一种。
9)接着在所述第一透明导电层上沉积正面电极,并在所述第二透明导电层上沉积背面电极,其中,所述正面电极和所述背面电极的厚度为600纳米,所述正面电极和所述背面电极的材质为银。
该硅异质结光伏电池的效率为24.7%。
实施例2
一种硅异质结光伏电池的制造方法,包括以下步骤:
1)提供一N型单晶硅片,对所述N型单晶硅片进行双面制绒处理,在所述N型单晶硅片的上表面和下表面均形成类金字塔微结构。
2)接着对所述N型单晶硅片进行甲基化处理,以在所述N型单晶硅片的上下表面形成Si-CH3键,具体步骤为:首先将所述N型单晶硅片在HF溶液中处理10分钟,接着将该N型单晶硅片浸入饱和五氯化磷的氯苯溶液中并在120℃下保持2小时,然后将该N型单晶硅片浸入甲基氯化镁的四氢呋喃溶液中并在80℃下保持12小时,最后清洗该N型单晶硅片。
3)接着在所述N型单晶硅片的上表面沉积第一本征非晶硅层,接着在所述第一本征非晶硅层上沉积第一P型非晶硅层,其中,所述第一本征非晶硅层的厚度为8纳米,所述第一P型非晶硅层的厚度为2纳米,所述第一P型非晶硅层的掺杂浓度为1020cm-3
4)接着在第一P型非晶硅层上沉积第二P型非晶硅层,其中,所述第二P型非晶硅层的掺杂浓度小于所述第一P型非晶硅层的掺杂浓度,且所述第二P型非晶硅层的掺杂浓度大于所述N型单晶硅片的掺杂浓度。
5)接着在第二P型非晶硅层上沉积第三P型非晶硅层,其中,所述第三P型非晶硅层的掺杂浓度大于所述第二P型非晶硅层的掺杂浓度,且所述第三P型非晶硅层的掺杂浓度小于所述第一P型非晶硅层的掺杂浓度。
6)接着在第三P型非晶硅层上沉积第四P型非晶硅层,其中,所述第四P型非晶硅层的掺杂浓度大于所述第一P型非晶硅层的掺杂浓度。
在所述步骤(4)-(6)中,所述第二P型非晶硅层的厚度为2纳米,所述第三P型非晶硅层的厚度为1纳米,第四P型非晶硅层的厚度为2.5纳米,所述第二P型非晶硅层的掺杂浓度为1019cm-3,所述N型单晶硅片的掺杂浓度为2×1018cm-3,所述第三P型非晶硅层的掺杂浓度为5×1019cm-3,所述第四P型非晶硅层的掺杂浓度为5×1020cm-3
7)接着在所述N型单晶硅片的下表面依次沉积第二本征非晶硅层、第一N型非晶硅层、第二N型非晶硅层、第三N型非晶硅层以及第四N型非晶硅层,其中,所述第二N型非晶硅层的掺杂浓度大于所述N型单晶硅片的掺杂浓度,所述第二N型非晶硅层的掺杂浓度以及所述第三N型非晶硅层的掺杂浓度小于所述第一N型非晶硅层的掺杂浓度,所述第三N型非晶硅层的掺杂浓度大于所述第二N型非晶硅层的掺杂浓度,所述第四N型非晶硅层的掺杂浓度大于所述第一N型非晶硅层的掺杂浓度,其中,所述第二本征非晶硅层的厚度为8纳米,所述第一N型非晶硅层的厚度为1纳米,所述第二N型非晶硅层的厚度为3.5纳米,所述第三N型非晶硅层的厚度为2纳米,所述第四N型非晶硅层的厚度为2纳米,所述第一N型非晶硅层的掺杂浓度为3×1020cm-3,所述第二N型非晶硅层的掺杂浓度为1019cm-3,所述第三P型非晶硅层的掺杂浓度为6×1019cm-3,所述第四P型非晶硅层的掺杂浓度为8×1020cm-3
8)接着在所述第四P型非晶硅层上沉积第一透明导电层,接着在所述第四N型非晶硅层上沉积第二透明导电层,所述第一透明导电层和所述第二透明导电层的厚度为600纳米,所述第一透明导电层和所述第二透明导电层的材质为AZO、ITO、FTO、石墨烯、银纳米线以及碳纳米管中的多种。
9)接着在所述第一透明导电层上沉积正面电极,并在所述第二透明导电层上沉积背面电极,其中,所述正面电极和所述背面电极的厚度为800纳米,所述正面电极和所述背面电极为层叠的钛、钯以及银。
该硅异质结光伏电池的效率为24.2%。
以上所述是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本发明的保护范围。

Claims (9)

1.一种硅异质结光伏电池的制造方法,其特征在于:包括以下步骤:
1)提供一N型单晶硅片,对所述N型单晶硅片进行双面制绒处理,在所述N型单晶硅片的上表面和下表面均形成类金字塔微结构;
2)接着对所述N型单晶硅片进行甲基化处理,以在所述N型单晶硅片的上下表面形成Si-CH3键;
3)接着在所述N型单晶硅片的上表面沉积第一本征非晶硅层,接着在所述第一本征非晶硅层上沉积第一P型非晶硅层;
4)接着在第一P型非晶硅层上沉积第二P型非晶硅层,其中,所述第二P型非晶硅层的掺杂浓度小于所述第一P型非晶硅层的掺杂浓度,且所述第二P型非晶硅层的掺杂浓度大于所述N型单晶硅片的掺杂浓度;
5)接着在第二P型非晶硅层上沉积第三P型非晶硅层,其中,所述第三P型非晶硅层的掺杂浓度大于所述第二P型非晶硅层的掺杂浓度,且所述第三P型非晶硅层的掺杂浓度小于所述第一P型非晶硅层的掺杂浓度;
6)接着在第三P型非晶硅层上沉积第四P型非晶硅层,其中,所述第四P型非晶硅层的掺杂浓度大于所述第一P型非晶硅层的掺杂浓度;
7)接着在所述N型单晶硅片的下表面依次沉积第二本征非晶硅层、第一N型非晶硅层、第二N型非晶硅层、第三N型非晶硅层以及第四N型非晶硅层,其中,所述第二N型非晶硅层的掺杂浓度大于所述N型单晶硅片的掺杂浓度,所述第二N型非晶硅层的掺杂浓度以及所述第三N型非晶硅层的掺杂浓度小于所述第一N型非晶硅层的掺杂浓度,所述第三N型非晶硅层的掺杂浓度大于所述第二N型非晶硅层的掺杂浓度,所述第四N型非晶硅层的掺杂浓度大于所述第一N型非晶硅层的掺杂浓度;
8)接着在所述第四P型非晶硅层上沉积第一透明导电层,接着在所述第四N型非晶硅层上沉积第二透明导电层;
9)接着在所述第一透明导电层上沉积正面电极,并在所述第二透明导电层上沉积背面电极。
2.根据权利要求1所述的硅异质结光伏电池的制造方法,其特征在于:在所述步骤(2)中,首先将所述N型单晶硅片在HF溶液中处理5-10分钟,接着将该N型单晶硅片浸入饱和五氯化磷的氯苯溶液中并在110-120℃下保持2-4小时,然后将该N型单晶硅片浸入甲基氯化镁的四氢呋喃溶液中并在60-80℃下保持9-12小时,最后清洗该N型单晶硅片。
3.根据权利要求1所述的硅异质结光伏电池的制造方法,其特征在于:在所述步骤(3)中,所述第一本征非晶硅层的厚度为5-8纳米,所述第一P型非晶硅层的厚度为1-2纳米,所述第一P型非晶硅层的掺杂浓度为3×1019cm-3-2×1020cm-3
4.根据权利要求3所述的硅异质结光伏电池的制造方法,其特征在于:在所述步骤(4)-(6)中,所述第二P型非晶硅层的厚度为2-3纳米,所述第三P型非晶硅层的厚度为1-2纳米,第四P型非晶硅层的厚度为1.5-2.5纳米,所述第二P型非晶硅层的掺杂浓度为5×1018cm-3-6×1019cm-3,所述N型单晶硅片的掺杂浓度为1017cm-3-3×1018cm-3,所述第三P型非晶硅层的掺杂浓度为1019cm-3-1020cm-3,所述第四P型非晶硅层的掺杂浓度为8×1019cm-3-6×1020cm-3
5.根据权利要求4所述的硅异质结光伏电池的制造方法,其特征在于:在所述步骤(7)中,所述第二本征非晶硅层的厚度为5-10纳米,所述第一N型非晶硅层的厚度为1-2纳米,所述第二N型非晶硅层的厚度为2.5-3.5纳米,所述第三N型非晶硅层的厚度为2-3纳米,所述第四N型非晶硅层的厚度为1-2纳米。
6.根据权利要求5所述的硅异质结光伏电池的制造方法,其特征在于:在所述步骤(7)中,所述第一N型非晶硅层的掺杂浓度为5×1019cm-3-6×1020cm-3,所述第二N型非晶硅层的掺杂浓度为8×1018cm-3-9×1019cm-3,所述第三P型非晶硅层的掺杂浓度为2×1019cm-3-2×1020cm-3,所述第四P型非晶硅层的掺杂浓度为1020cm-3-1021cm-3
7.根据权利要求1所述的硅异质结光伏电池的制造方法,其特征在于:在所述步骤(8)中,所述第一透明导电层和所述第二透明导电层的厚度为200-600纳米,所述第一透明导电层和所述第二透明导电层的材质为AZO、ITO、FTO、石墨烯、银纳米线以及碳纳米管中的一种或多种。
8.根据权利要求1所述的硅异质结光伏电池的制备方法,其特征在于:在所述步骤(9)中,所述正面电极和所述背面电极的厚度为300-800纳米,所述正面电极和所述背面电极的材质为银、铜、金、钛、钯、铝中的一种或多种。
9.一种硅异质结光伏电池,其特征在于,采用权利要求1-8任一项所述的方法制备形成的。
CN201811034073.7A 2018-09-05 2018-09-05 一种硅异质结光伏电池及其制造方法 Expired - Fee Related CN108878594B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811034073.7A CN108878594B (zh) 2018-09-05 2018-09-05 一种硅异质结光伏电池及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811034073.7A CN108878594B (zh) 2018-09-05 2018-09-05 一种硅异质结光伏电池及其制造方法

Publications (2)

Publication Number Publication Date
CN108878594A true CN108878594A (zh) 2018-11-23
CN108878594B CN108878594B (zh) 2019-12-06

Family

ID=64323084

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811034073.7A Expired - Fee Related CN108878594B (zh) 2018-09-05 2018-09-05 一种硅异质结光伏电池及其制造方法

Country Status (1)

Country Link
CN (1) CN108878594B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110649083A (zh) * 2019-10-10 2020-01-03 苏州英凡瑞得光电技术有限公司 实现近红外到可见光转换的上转换器件及其制备方法
CN110690310A (zh) * 2019-10-28 2020-01-14 成都晔凡科技有限公司 异质结太阳能电池片、叠瓦组件及其制造方法
CN114361281A (zh) * 2020-09-29 2022-04-15 嘉兴阿特斯技术研究院有限公司 双面异质结太阳能电池及光伏组件

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201478322U (zh) * 2009-07-01 2010-05-19 宁波尤利卡太阳能科技发展有限公司 Hit太阳电池
CN102683468A (zh) * 2012-06-06 2012-09-19 南昌大学 一种晶硅异质结太阳电池的发射极结构
US20140242746A1 (en) * 2013-02-22 2014-08-28 King Abdulaziz City For Science And Technology Electrode formation for heterojunction solar cells
JP2015115458A (ja) * 2013-12-11 2015-06-22 三菱電機株式会社 太陽電池およびその製造方法
CN204558503U (zh) * 2014-12-31 2015-08-12 泉州市博泰半导体科技有限公司 一种具有非晶硅/微晶硅复合层的hit太阳能电池
CN104993006A (zh) * 2015-05-22 2015-10-21 暨南大学 一种过渡金属氧化物-硅异质结太阳能电池及其制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201478322U (zh) * 2009-07-01 2010-05-19 宁波尤利卡太阳能科技发展有限公司 Hit太阳电池
CN102683468A (zh) * 2012-06-06 2012-09-19 南昌大学 一种晶硅异质结太阳电池的发射极结构
US20140242746A1 (en) * 2013-02-22 2014-08-28 King Abdulaziz City For Science And Technology Electrode formation for heterojunction solar cells
JP2015115458A (ja) * 2013-12-11 2015-06-22 三菱電機株式会社 太陽電池およびその製造方法
CN204558503U (zh) * 2014-12-31 2015-08-12 泉州市博泰半导体科技有限公司 一种具有非晶硅/微晶硅复合层的hit太阳能电池
CN104993006A (zh) * 2015-05-22 2015-10-21 暨南大学 一种过渡金属氧化物-硅异质结太阳能电池及其制备方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110649083A (zh) * 2019-10-10 2020-01-03 苏州英凡瑞得光电技术有限公司 实现近红外到可见光转换的上转换器件及其制备方法
CN110649083B (zh) * 2019-10-10 2022-02-08 苏州英凡瑞得光电技术有限公司 实现近红外到可见光转换的上转换器件及其制备方法
CN110690310A (zh) * 2019-10-28 2020-01-14 成都晔凡科技有限公司 异质结太阳能电池片、叠瓦组件及其制造方法
CN114361281A (zh) * 2020-09-29 2022-04-15 嘉兴阿特斯技术研究院有限公司 双面异质结太阳能电池及光伏组件

Also Published As

Publication number Publication date
CN108878594B (zh) 2019-12-06

Similar Documents

Publication Publication Date Title
CN101369610A (zh) 一种新型结构硅纳米线太阳能电池
CN100576580C (zh) 太阳能电池的后制绒生产工艺
CN102254963A (zh) 一种石墨烯/硅柱阵列肖特基结光伏电池及其制造方法
CN108831967B (zh) 一种新型hit太阳能电池及其制备方法
CN108878594A (zh) 一种硅异质结光伏电池及其制造方法
CN110034193A (zh) 一种Topcon钝化结构的多细栅IBC电池及其制备方法
CN109980090A (zh) 一种高效三元有机太阳电池及其制备方法
CN102368503B (zh) 一种碳纳米管-硅异质结太阳能电池及其制作方法
CN108172657B (zh) 一种黑硅太阳能电池及其制备方法
CN106684160A (zh) 一种背结背接触太阳能电池
CN107104165A (zh) 一种基于石墨烯硅倒金字塔阵列肖特基光伏电池制造方法
CN104332522A (zh) 一种石墨烯双结太阳能电池及其制备方法
CN103219413A (zh) 一种石墨烯径向异质结太阳能电池及其制备方法
CN105552150B (zh) 单面横向梯度掺杂异质结电池及其制备方法
CN109309147B (zh) 一种n型单晶硅基太阳能电池及其制备方法
Cho et al. Efficiency enhanced emitter wrap-through (EWT) screen-printed solar cells with non-uniform thickness of silicon nitride passivation layer in via-holes
CN107068799B (zh) 一种光伏电站集成控制系统
CN109192798A (zh) P型单晶硅hit光伏电池及其制造方法
CN102738289B (zh) 异质结太阳能电池及其制作方法
CN106449815A (zh) 基于非晶硅薄膜的异质结太阳能电池器件的制备方法
CN102403406B (zh) 一种背接触硅太阳能电池的制备方法
CN104842073A (zh) 一种薄膜太阳能电池的激光刻蚀方法及装置
CN104078567B (zh) 混合太阳能电池及其制备方法、空穴输运层形成方法
CN202977494U (zh) 一种晶体硅\非晶硅双节双面电池
CN102208459A (zh) 基于ZnO纳米线的高效硅基薄膜太阳能电池及制造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20191114

Address after: 215131 no.959, Jiayuan Road, Yuanhe street, Xiangcheng District, Suzhou City, Jiangsu Province

Applicant after: Suzhou Yuanlian Technology Pioneer Park Management Co.,Ltd.

Address before: Kolding road high tech Zone of Suzhou City, Jiangsu province 215000 No. 78 Building No. 5 Room 101

Applicant before: SUZHOU QIANZHENG TECHNOLOGY CONSULTING Co.,Ltd.

GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20191206