CN108878245B - 闸阀装置和基板处理系统 - Google Patents

闸阀装置和基板处理系统 Download PDF

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Publication number
CN108878245B
CN108878245B CN201810442611.XA CN201810442611A CN108878245B CN 108878245 B CN108878245 B CN 108878245B CN 201810442611 A CN201810442611 A CN 201810442611A CN 108878245 B CN108878245 B CN 108878245B
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CN
China
Prior art keywords
carrying
out port
gate valve
upper portion
opening
Prior art date
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Active
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CN201810442611.XA
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English (en)
Chinese (zh)
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CN108878245A (zh
Inventor
大森贵史
锅山裕树
三枝直也
伊藤毅
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
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Publication of CN108878245A publication Critical patent/CN108878245A/zh
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Publication of CN108878245B publication Critical patent/CN108878245B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
    • F16K3/30—Details
    • F16K3/314—Forms or constructions of slides; Attachment of the slide to the spindle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/04—Construction of housing; Use of materials therefor of sliding valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Valve Housings (AREA)
  • Details Of Valves (AREA)
  • Plasma Technology (AREA)
CN201810442611.XA 2017-05-11 2018-05-10 闸阀装置和基板处理系统 Active CN108878245B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017094612A JP6899697B2 (ja) 2017-05-11 2017-05-11 ゲートバルブ装置及び基板処理システム
JP2017-094612 2017-05-11

Publications (2)

Publication Number Publication Date
CN108878245A CN108878245A (zh) 2018-11-23
CN108878245B true CN108878245B (zh) 2020-06-09

Family

ID=64333639

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810442611.XA Active CN108878245B (zh) 2017-05-11 2018-05-10 闸阀装置和基板处理系统

Country Status (4)

Country Link
JP (1) JP6899697B2 (ko)
KR (1) KR102100032B1 (ko)
CN (1) CN108878245B (ko)
TW (1) TWI759470B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111326385B (zh) * 2018-12-13 2022-06-24 江苏鲁汶仪器有限公司 一种真空腔室

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05196150A (ja) * 1991-09-30 1993-08-06 Tokyo Electron Yamanashi Kk ゲートバルブ
JP3043848U (ja) 1997-05-28 1997-12-02 株式会社プレオ つけまつ毛ケース
JP3652688B2 (ja) * 2003-02-27 2005-05-25 株式会社旭精機 開閉装置
US7214274B2 (en) 2003-03-17 2007-05-08 Tokyo Electron Limited Method and apparatus for thermally insulating adjacent temperature controlled processing chambers
US20060045668A1 (en) * 2004-07-19 2006-03-02 Grabowski Al W System for handling of wafers within a process tool
JP5044931B2 (ja) * 2005-10-31 2012-10-10 東京エレクトロン株式会社 ガス供給装置及び基板処理装置
JP2007273620A (ja) * 2006-03-30 2007-10-18 Tokyo Electron Ltd 基板搬送装置及び基板処理装置
JP2009230870A (ja) 2008-03-19 2009-10-08 Hitachi Plant Technologies Ltd 有機ｅｌパネル組立てシステム
JP5389684B2 (ja) * 2010-01-29 2014-01-15 東京エレクトロン株式会社 ゲートバルブ及びそれを用いた基板処理装置
WO2012099064A1 (ja) * 2011-01-18 2012-07-26 株式会社日立国際電気 基板処理装置、基板支持具及び半導体装置の製造方法
JP6184832B2 (ja) * 2013-10-22 2017-08-23 東京エレクトロン株式会社 ゲートバルブ装置及びプラズマ処理装置
KR101604178B1 (ko) 2014-01-06 2016-03-16 가톨릭대학교 산학협력단 약물에 의한 간 손상의 예측 및 진단을 위한 바이오마커
JP6557523B2 (ja) * 2015-06-19 2019-08-07 株式会社日立ハイテクノロジーズ プラズマ処理装置

Also Published As

Publication number Publication date
CN108878245A (zh) 2018-11-23
TWI759470B (zh) 2022-04-01
JP6899697B2 (ja) 2021-07-07
KR102100032B1 (ko) 2020-04-10
JP2018189218A (ja) 2018-11-29
TW201901838A (zh) 2019-01-01
KR20180124730A (ko) 2018-11-21

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