CN108875571B - Fingerprint identification module assembly method, fingerprint identification module and electronic device - Google Patents
Fingerprint identification module assembly method, fingerprint identification module and electronic device Download PDFInfo
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- CN108875571B CN108875571B CN201810445246.8A CN201810445246A CN108875571B CN 108875571 B CN108875571 B CN 108875571B CN 201810445246 A CN201810445246 A CN 201810445246A CN 108875571 B CN108875571 B CN 108875571B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/1365—Matching; Classification
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/94—Hardware or software architectures specially adapted for image or video understanding
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Abstract
The application provides a fingerprint identification module assembly method, a fingerprint identification module and an electronic device. The fingerprint identification module assembling method comprises the following steps: providing a flexible circuit board, wherein the flexible circuit board comprises a mounting surface, the mounting surface comprises a first preset area and a second preset area, the second preset area is annular, the second preset area surrounds the first preset area, and the second preset area and the first preset area are arranged at intervals; providing a fingerprint identification chip and a decorative ring, wherein the decorative ring comprises an inner side wall, an accommodating space is defined by the inner side wall, and the fingerprint identification chip is arranged in the accommodating space; providing a fixing piece, wherein the fixing piece covers the first preset area and the second preset area; the fingerprint identification chip passes through the mounting is fixed first predetermineeing the region, decorate the circle and pass through the mounting is fixed second predetermineeing the region.
Description
Technical Field
The application relates to the technical field of electronics, in particular to a fingerprint identification module assembling method, a fingerprint identification module and an electronic device.
Background
Electronic devices such as mobile phones are widely used because they are portable and have many integrated functions. In order to take privacy considerations, such as the usage authority of the electronic device, a fingerprint recognition module is generally disposed on a housing of the electronic device. Fingerprint identification module is used for gathering user's fingerprint signal including decorating circle and fingerprint identification chip, when the fingerprint identification chip, decorates the position that the circle is used for instructing the fingerprint identification chip. However, the conventional fingerprint identification module has many processes during assembly, so that the assembly of the fingerprint identification module is complicated.
Disclosure of Invention
The application provides a fingerprint identification module assembling method, which comprises the following steps:
providing a flexible circuit board, wherein the flexible circuit board comprises a mounting surface, the mounting surface comprises a first preset area and a second preset area, the second preset area is annular, the second preset area surrounds the first preset area, and the second preset area and the first preset area are arranged at intervals;
providing a fingerprint identification chip and a decorative ring, wherein the decorative ring comprises an inner side wall, an accommodating space is defined by the inner side wall, and the fingerprint identification chip is arranged in the accommodating space;
providing a fixing piece, wherein the fixing piece covers the first preset area and the second preset area;
the fingerprint identification chip passes through the mounting is fixed first predetermineeing the region, decorate the circle and pass through the mounting is fixed second predetermineeing the region.
Compared with the prior art, the fingerprint identification module assembling method provided by the application has the advantages that the flexible circuit board is provided with the first preset area and the second preset area surrounding the first preset area, the fingerprint identification chip is arranged in the accommodating space surrounded by the decoration ring, and the fingerprint identification chip and the decoration ring are fixed on the flexible circuit board through the same fixing piece, so that the installation process of the decoration ring and the installation process of the fingerprint identification chip on the flexible circuit board are saved, and the process is saved.
The application also provides a fingerprint identification module. The fingerprint identification module comprises a decoration ring and a fingerprint sensor, the decoration ring comprises an inner side wall, an accommodating space is defined by the inner side wall, and the fingerprint sensor comprises a fingerprint identification chip and a flexible circuit board; the fingerprint identification chip accept in the accommodating space, flexible circuit board includes the installation face, the installation face includes that first predetermineeing regional and second and predetermineeing the region, the second is predetermineeing the region and is cyclic annularly, the second predetermines the region and encircles first predetermineeing the region just the second predetermineeing the region with first predetermineeing regional interval setting, the fingerprint identification chip reaches it fixes to decorate the circle through same mounting on the flexible circuit board, just the fingerprint identification chip passes through the mounting is fixed first predetermineeing the region, decorate the circle and pass through the mounting is fixed the second is predetermineeing the region.
The application also provides an electronic device. The electronic device comprises a shell and the fingerprint identification module, wherein the shell comprises an installation part, and the fingerprint identification module is installed on the shell through the installation part.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic flow chart illustrating an assembling method of a fingerprint identification module according to an embodiment of the present disclosure.
Fig. 2 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present application.
Fig. 3 is a schematic sectional view taken along line I-I in fig. 2.
Fig. 4 is a schematic cross-sectional view of the fingerprint identification chip assembled with the bezel.
Fig. 5 is a schematic view illustrating the fixing member covering the first predetermined area and the second predetermined area.
Fig. 6 is a schematic structural view of the fingerprint identification chip and the decoration ring fixed on the flexible circuit board.
Fig. 7 is a flowchart included in S400 in fig. 1.
Fig. 8 is a flowchart included in S310.
Fig. 9 is a schematic structural diagram of a fingerprint identification module according to the present application.
Fig. 10 is a schematic structural diagram of an electronic device provided in the present application.
Fig. 11 is a schematic sectional view taken along line II-II in fig. 10.
Detailed Description
In order that the above objects, features and advantages of the present application can be more clearly understood, a detailed description of the present application will be given below with reference to the accompanying drawings and detailed description. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
Referring to fig. 1, fig. 1 is a schematic flow chart illustrating an assembling method of a fingerprint identification module according to an embodiment of the present disclosure. The fingerprint identification module assembly method of the present application includes, but is not limited to, S100, S200, S300, and S400. S100, S200, S300, and S400 are described in detail below.
S100, providing a flexible circuit board 100, wherein the flexible circuit board 100 comprises an installation surface 110, the installation surface 110 comprises a first preset area 110a and a second preset area 110b, the second preset area 110b is annular, the second preset area 110b surrounds the first preset area 110a, and the second preset area 110b and the first preset area 110a are arranged at intervals. Referring to fig. 2 and 3, fig. 2 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present disclosure, and fig. 3 is a schematic cross-sectional diagram taken along line I-I in fig. 2.
S200, providing a fingerprint identification chip 210 and a decoration ring 300, wherein the decoration ring 300 comprises an inner side surface 310, an accommodating space 300a is enclosed by the inner side surface 310, and the fingerprint identification chip 210 is arranged in the accommodating space 300 a. Referring to fig. 4, fig. 4 is a schematic cross-sectional view illustrating the fingerprint identification chip and the decorative ring assembled together.
S300, providing a fixing member 400, wherein the fixing member 400 covers the first predetermined region 110a and the second predetermined region 110 b. Referring to fig. 5, fig. 5 is a schematic view illustrating the fixing element covering the first predetermined area and the second predetermined area.
S400, the fingerprint identification chip 210 is fixed to the first preset area 110a through the fixing member 400, and the decoration ring 300 is fixed to the second preset area 110b through the fixing member 400. Referring to fig. 6, fig. 6 is a schematic structural view of the fingerprint identification chip and the decoration ring fixed on the flexible circuit board.
Compared with the prior art, the fingerprint identification module 10 assembly method provided by the application has the advantages that the first preset area 100a and the second preset area 100b surrounding the first preset area 100a are arranged on the flexible circuit board 100, the fingerprint identification chip 210 is arranged in the accommodating space 300a surrounded by the decoration ring 300, the fingerprint identification chip 210 and the decoration ring 300 are fixed on the flexible circuit board 100 through the same fixing piece 400, so that the installation process of the decoration ring 300 and the installation process of the fingerprint identification chip 210 on the flexible circuit board 100 are saved, and the process is saved.
Further, S300 includes, but is not limited to including S310, and S310 is described in detail below.
S310, providing a solder, and covering the solder on the first predetermined area 110a and the second predetermined area 110b to form a solder layer.
Accordingly, referring to fig. 7, fig. 7 is a schematic flowchart included in S400 in fig. 1. The S400 includes S410, S420, S430, and S440. S410, S420, S430, and S440 are described in detail below.
S410, the fingerprint identification chip 210 is arranged in the first preset area 110a through the solder layer, and the decorative ring 300 is arranged in the second preset area 110b through the solder layer, so as to form a blank of the fingerprint identification module 10.
And S420, heating the blank of the fingerprint identification module 10 for a first preset time to reach a first preset temperature, so that the solder layer in the blank of the fingerprint identification module 10 is melted.
And S430, keeping the identification module blank at a second preset temperature for a second preset time, wherein the second preset temperature is less than the first preset temperature.
S440, cooling the blank of the fingerprint identification module 10 for a third predetermined time, solidifying the melted solder layer to form the fixing member 400, so as to fix the fingerprint identification chip 210 to the first predetermined area 110a, and fix the decorative ring 300 to the second predetermined area 110 b.
Further, referring to fig. 8, fig. 8 is a schematic flowchart included in S310. The step S310 of providing solder, and covering the solder on the first predetermined area 110a and the second predetermined area 110b to form a solder layer includes, but is not limited to, steps S311 and S312. S311 and S312 are described in detail below.
S311, providing a screen plate, wherein the screen plate comprises a first hollowed-out area in a preset shape, the screen plate is arranged on the installation surface 110 of the flexible circuit board 100, and the projection of the first hollowed-out area on the flexible circuit board 100 covers the first preset area 110a and the second preset area 110 b.
S312, coating solder on the first hollow area, and removing the screen to form a solder layer covering the first predetermined area 110a and the second predetermined area 110 b.
Further, the thickness of the solder of the second predetermined area 110b is greater than the thickness of the solder of the first predetermined area 110 a. Because the second preset area 110b surrounds the first preset area 110a, and the thickness of the solder of the second preset area 110b is greater than that of the solder of the first preset area 110a, even if the solder of the second preset area 110b flows towards the direction deviating from the first preset area 110a, the thickness of the solder of the second preset area 110b cannot be too low. When the thickness of the second predetermined region 110b is too low, and the decorative ring 300 is fixed to the second predetermined region 110b by the solder, the decorative ring 300 may be fixed to the flexible circuit board 100 poorly due to too small amount of the solder. Therefore, the present application can improve the firmness of the connection of the bezel 300 and the flexible circuit board 100 by setting the thickness of the solder of the second preset area 110b to be greater than the thickness of the solder of the first preset area 110 a.
Further, before S100, the method for assembling the fingerprint identification module 10 further includes a step I of providing a reinforcing plate 500. Then, the S100 specifically includes: providing a flexible circuit board 100, wherein the flexible circuit board 100 comprises a mounting surface 110, and the surface of the flexible circuit board 100 opposite to the mounting surface 110 is mounted on the reinforcing plate 500. The reinforcing plate 500 is used for supporting the flexible circuit board 100.
Further, in step I, providing a stiffener 500 and providing a flexible circuit board 100, where the flexible circuit board 100 includes a mounting surface 110, and a surface of the flexible circuit board 100 opposite to the mounting surface 110 is mounted on the stiffener 500, further includes: and step II, arranging a conductive adhesive film 600 on the surface of the reinforcing plate 500. At this time, "providing the flexible circuit board 100, the flexible circuit board 100 including the mounting surface 110, and a surface opposite to the mounting surface 110 mounted on the reinforcing plate 500" specifically includes: the flexible circuit board 100 is connected to the reinforcing plate 500 through the conductive adhesive film 600.
Further, the first predetermined area 110a is provided with a first positioning groove 110d, the second predetermined area 110b is provided with a second positioning groove 110e, the fingerprint identification chip 210 is fixed in the first positioning groove 110d through the fixing member 400, and the decorative ring 300 is fixed in the second positioning groove 110e through the fixing member 400. Please refer to fig. 3, 5 and 6.
Further, the assembly method of the fingerprint identification module 10 further includes S500, and the details of S500 are described below.
S500, providing a cover plate 700 (refer to fig. 6), where the cover plate 700 is disposed in the accommodating space 300a, and the cover plate 700 covers a surface of the fingerprint identification chip 210 far from the flexible circuit board 100.
The present application further provides a fingerprint identification module 10, and the fingerprint identification module 10 of the present application is introduced below by combining the aforementioned fingerprint identification module 10 assembling method. Referring to fig. 2 to 6 and fig. 9 together, fig. 9 is a schematic structural diagram of a fingerprint identification module according to the present application. Fingerprint identification module 10 includes dress circle 300 and fingerprint sensor 200. The bezel 300 includes an inner side 310, and the inner side 310 encloses an accommodation space 300 a. The fingerprint sensor 200 includes a fingerprint identification chip 210 and a flexible circuit board 100. The fingerprint identification chip 210 is accommodated in the accommodating space 300a, the flexible circuit board 100 includes an installation surface 110, and the installation surface 110 includes a first preset area 110a and a second preset area 110 b. The second preset area 110b is annular, the second preset area 110b surrounds the first preset area 110a, and the second preset area 110b and the first preset area 110a are arranged at intervals. The fingerprint identification chip 210 and the decoration ring 300 are fixed on the flexible circuit board 100 through the same fixing member 400, the fingerprint identification chip 210 is fixed on the first preset area 110a through the fixing member 400, and the decoration ring 300 is fixed on the second preset area 110b through the fixing member 400.
Further, a spacing region 110c is disposed between the first preset region 110a and the second preset region 110 b. The fixing member 400 includes a first fixing portion 410, a second fixing portion 420, and a sealing portion 430. The sealing part 430 is connected between the first fixing part 410 and the second fixing part 420. The first fixing portion 410 is disposed in the first predetermined area 110a, and is used for connecting the fingerprint sensor 200 and the flexible circuit board 100. The second fixing portion 420 is disposed in the second predetermined region 110b, and is used for connecting the decoration ring 300 and the flexible circuit board 100. The sealing part 430 is disposed at the interval region 110c and filled between the decorative ring 300 and the fingerprint recognition chip 210 to seal the decorative ring 300 and the fingerprint recognition chip 210. In this embodiment, the fixing member 400 is an integral structure. First fixed part 410 in mounting 400 is connected fingerprint sensor 200 with flexible circuit board 100 first predetermines regional 110a, the second fixed part 420 of mounting 400 is connected the fingerprint decorate circle 300 with flexible circuit board 100 second predetermines regional 110b, just sealing 430 is used for right decorate circle 300 with the clearance between the fingerprint identification chip 210 seals up, can play waterproof dirt-proof effect.
Further, a first positioning groove 110d is disposed in the first predetermined area 110a, and a second positioning groove 110e is disposed in the second predetermined area 110 b. The chip 210 is fixed in the first positioning groove 110d by the fixing member 400, and the decorative ring 300 is fixed in the second positioning groove 110e by the fixing member 400. The first positioning groove 110d is used for indicating a position where the fingerprint identification chip 210 is mounted, and for fixing the fingerprint identification chip 210, so as to prevent the fingerprint identification chip 210 from being displaced when the solder is melted. Likewise, the second positioning groove 110e is used for indicating the position where the bezel 300 is installed and for fixing the bezel 300 to prevent the bezel 300 from being displaced when the solder is melted.
Further, the fingerprint identification module 10 further includes a reinforcing plate 500, the reinforcing plate 500 is used for supporting the flexible circuit board 100, and the reinforcing plate 500 is disposed on the surface of the flexible circuit board 100 opposite to the mounting surface 110. Generally, the flexible circuit board 100 has low strength and is prone to curling, deformation and other defects during installation and use. The surface of the flexible circuit board 100 opposite to the mounting surface 110 is attached to the reinforcing plate 500 to protect the flexible circuit board 100 and support the flexible circuit board 100. In the present embodiment, the flexible circuit board 100 and the reinforcing plate 500 are both disposed outside the receiving space 300a formed by the inner surface 310 of the bezel 300. Further, the decorative ring 300 is electrically connected to the ground of the flexible printed circuit board 100 through the fixing member 400, the reinforcing plate 500 is made of metal, and the reinforcing plate 500 is electrically connected to the ground of the flexible printed circuit board 100 through the conductive adhesive film 600. The reinforcing plate 500 may be made of a metal material such as stainless steel. The reinforcing plate 500 is a large plate made of a metal material, and the reinforcing plate 500 forms a large ground while supporting the flexible circuit board 100. The decorative ring 300 is electrically connected with the ground pole of the flexible circuit board 100 through the fixing piece 400, and the ground pole of the flexible circuit board 100 is electrically connected with the reinforcing plate 500 through the conductive adhesive film 600, so that the decorative ring 300 is grounded, and static electricity on the decorative ring 300 can be conducted to the ground pole, thereby preventing the static electricity from damaging the fingerprint identification chip 210 arranged in the accommodating space 300a of the decorative ring 300.
Further, the bezel 300 includes a first end surface 330 and a second end surface 340 disposed opposite to each other. The first end surface 330 and the second end surface 340 are respectively connected to the inner side surface 310, and the receiving space 300a is located between the first end surface 330 and the second end surface 340. The first end surface 330 of the bezel 300 is disposed on the fixing member 400, the fingerprint identification module 10 further includes a cover plate 700, the cover plate 700 is disposed in the accommodating space 300a, the cover plate 700 is disposed adjacent to the second end surface 340, and the cover plate 700 covers the surface of the fingerprint identification chip 210 far away from the flexible circuit board 100. The cover plate 700 is disposed adjacent to the second end surface 340, and the cover plate 700 covers the surface of the fingerprint identification chip 210 far away from the flexible circuit board 100, so as to protect the fingerprint identification chip 210 and prevent the fingerprint identification chip 210 from being scratched. The cover plate 700 may be made of glass, ceramic, resin, or the like. The cover plate 700 and the fingerprint recognition chip 210 may be bonded by a Die Attach Film (DAF) to further fix the fingerprint recognition chip 210, and a user may approach or touch the cover plate 700 with a finger to enable the fingerprint recognition chip 210 to collect fingerprint information of the user. The peripheral side wall of the cover plate 700 may abut against the inner side surface 310 of the decorative ring 300. Further, the gap between the peripheral sidewall of the cover plate 700 and the inner side 310 of the bezel 300 may be filled with a sealant to prevent external water or dust from entering the accommodating space 300a, so as to improve the waterproof and dustproof performance of the fingerprint identification module 10.
Further, the bezel 300 includes an outer side 320. The outer side surface 320 and the inner side surface 310 are disposed opposite to each other, and the outer side surface 320 and the inner side surface 310 are respectively connected to the first end surface 330 and disposed on two sides of the second end surface 340. The height of the outer side surface 320 is greater than the height of the inner side surface 310, so that the second end surface 340 is recessed from the periphery of the outer side surface 320 to the receiving space 300 a. The height of the outer side surface 320 is greater than the height of the inner side surface 310, so that the second forging die is recessed from the periphery of the outer side surface 320 to the receiving space 300a, and a finger of a user can be guided to perform fingerprint detection.
Referring to fig. 10 and 11, fig. 10 is a schematic structural diagram of an electronic device according to the present application; fig. 11 is a schematic sectional view taken along line II-II in fig. 10. The electronic device 1 comprises a housing 20 and the fingerprint identification module 10 of any of the foregoing embodiments, wherein the housing 20 comprises an installation part 310, and the fingerprint identification module 10 is installed on the housing 20 through the installation part 310. The electronic device 1 includes, but is not limited to, a smart phone, an internet device (MID), an electronic book, a Portable Player Station (PSP), a Personal Digital Assistant (PDA), a teller machine, a gate, and the like. The electronic device 1 can collect the fingerprint information of the user through the fingerprint identification module 10 to further verify the identity of the user and the corresponding authority. The embodiment of the present invention is described by taking the electronic device 1 as a mobile phone as an example, and it is understood that the specific form of the electronic device 1 may be other, and is not limited herein. The casing 20 may be a part of a housing of the electronic device 1, for example, the casing 20 may be a front casing, a rear casing, or a side casing of the electronic device 1, in the embodiment of the present invention, the casing 20 is a rear casing of a mobile phone, the rear casing is opposite to a display screen 30 of the mobile phone, the fingerprint identification module 10 is a rear fingerprint identification module 10, and the fingerprint identification module 10 is disposed on the rear casing of the electronic device 1, so as not to affect the arrangement of the display screen 30, which is beneficial to improving the screen coverage of the electronic device 1. The mounting portion 310 is a mounting through hole formed in the housing 20, specifically, the housing 20 includes an outer surface and an inner surface, and the mounting through hole penetrates through the outer surface and the inner surface, where the outer surface is an appearance surface of the electronic device 1. Fingerprint identification module 10 is installed in the installation through-hole, and the user can learn the concrete position of fingerprint identification module 10 through the installation through-hole. The shape of the mounting through hole may be circular, rectangular, oval, racetrack, etc.
The electronic device 1 further includes a main board 220, the main board 220 is disposed in the housing 20 and the accommodating space surrounded by the display screen 30, and the main board 220 is disposed in the accommodating space. The fingerprint information collected by the fingerprint identification chip 210 can be transmitted to the main board 220 through the flexible circuit board 100 to be further processed by the processing element on the main board 220. Further, the flexible circuit board 100 may also transmit a driving signal of the processing element to the fingerprint identification chip 210 to drive the fingerprint identification chip 210 to transmit the driving signal. The driving signal may be an optical signal, an ultrasonic signal, or an electrical signal.
In this embodiment, all of the flexible circuit board 100 and the reinforcing plate 500, at least a portion of the fingerprint recognition chip 210, and a portion of the bezel 300 are received in the receiving space through the mounting through hole.
Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.
Claims (15)
1. The utility model provides a fingerprint identification module assembly method, its characterized in that, fingerprint identification module assembly method includes:
providing a flexible circuit board, wherein the flexible circuit board comprises a mounting surface, the mounting surface comprises a first preset area and a second preset area, the second preset area is annular, the second preset area surrounds the first preset area, and the second preset area and the first preset area are arranged at intervals;
providing a fingerprint identification chip and a decorative ring, wherein the decorative ring comprises an inner side surface, an accommodating space is enclosed by the inner side surface, and the fingerprint identification chip is arranged in the accommodating space;
providing solder, and covering the solder on the first preset area and the second preset area to form a solder layer;
the fingerprint identification chip is arranged in the first preset area through the solder layer, and the decoration ring is arranged in the second preset area through the solder layer to form a fingerprint identification module blank;
heating the fingerprint identification module blank for a first preset time to reach a first preset temperature so as to melt a solder layer in the fingerprint identification module blank;
keeping the identification module blank at a second preset temperature for a second preset time, wherein the second preset temperature is lower than the first preset temperature;
and cooling the fingerprint identification module blank for a third preset time, solidifying the melted solder layer to form a fixing piece, fixing the fingerprint identification chip to the first preset area, and fixing the decorative ring to the second preset area.
2. The fingerprint identification module assembly method of claim 1, wherein said providing solder to cover said first predetermined area and said second predetermined area to form a solder layer comprises:
providing a screen plate, wherein the screen plate comprises a first hollowed-out area with a preset shape, the screen plate is arranged on the installation surface of the flexible circuit board, and the projection of the first hollowed-out area on the flexible circuit board covers the first preset area and the second preset area;
and coating solder in the first hollow area, and removing the screen plate to form a solder layer covering the first preset area and the second preset area.
3. The fingerprint identification module assembly method of claim 2 wherein the thickness of the solder material of said second predetermined area is greater than the thickness of the solder material of said first predetermined area.
4. The fingerprint identification module assembly method of claim 1, wherein prior to said providing a flexible circuit board, said fingerprint identification module assembly method further comprises:
providing a reinforcing plate;
the "providing a flexible circuit board" includes:
and providing a flexible circuit board, wherein the flexible circuit board comprises a mounting surface, and the surface of the flexible circuit board opposite to the mounting surface is mounted on the reinforcing plate.
5. The fingerprint identification module assembly method of claim 4, wherein between providing a stiffener and providing a flexible circuit board, the flexible circuit board including a mounting surface, a surface of the flexible circuit board opposite to the mounting surface being mounted on the stiffener further comprises:
arranging a conductive adhesive film on the surface of the reinforcing plate;
"providing a flexible circuit board including a mounting surface, a surface opposite the mounting surface being mounted on the stiffener" includes:
and connecting the flexible circuit board with a reinforcing plate through the conductive adhesive film.
6. The assembly method of fingerprint identification module of claim 1 wherein said first predetermined area is provided with a first positioning groove, said second predetermined area is provided with a second positioning groove, said fingerprint identification chip is fixed in said first positioning groove by a fixing member formed by said solder layer, and said decorative ring is fixed in said second positioning groove by said fixing member.
7. The fingerprint identification module assembly method of claim 1, wherein the fingerprint identification module assembly method further comprises:
and providing a cover plate, wherein the cover plate is arranged in the accommodating space and covers the surface of the fingerprint identification chip far away from the flexible circuit board.
8. A fingerprint identification module is characterized by comprising a decorative ring and a fingerprint sensor, wherein the decorative ring comprises an inner side surface, an accommodating space is defined by the inner side surface, and the fingerprint sensor comprises a fingerprint identification chip and a flexible circuit board; the fingerprint identification chip is contained in the containing space, the flexible circuit board comprises a mounting surface, the mounting surface comprises a first preset region and a second preset region, the second preset region is annular, the second preset region surrounds the first preset region, the second preset region and the first preset region are arranged at intervals, the fingerprint identification chip and the decoration ring are fixed on the flexible circuit board through the same fixing piece, the fingerprint identification chip is fixed on the first preset region through the fixing piece, the decoration ring is fixed on the second preset region through the fixing piece, wherein the fixing piece heats the solder layer covering the first preset region and the second preset region for a first preset time to melt the solder layer at a first preset temperature, and keeps the second preset time at a second preset temperature, and cooling for a third preset time, wherein the second preset temperature is lower than the first preset temperature.
9. The fingerprint identification module of claim 8, wherein a spacing region is disposed between the first predefined area and the second predefined area, the fixing member includes a first fixing portion, a second fixing portion, and a sealing portion, the sealing portion is connected between the first fixing portion and the second fixing portion; the first fixing part is arranged in the first preset area and used for connecting the fingerprint sensor and the flexible circuit board; the second fixing part is arranged in the second preset area and used for connecting the decorative ring and the flexible circuit board; the sealing part is arranged in the interval area and filled between the decoration ring and the fingerprint identification chip so as to seal the decoration ring and the fingerprint identification chip.
10. The fingerprint identification module of claim 8, wherein the first predetermined area is provided with a first positioning groove, the second predetermined area is provided with a second positioning groove, the fingerprint identification chip is fixed in the first positioning groove by the fixing member, and the decorative ring is fixed in the second positioning groove by the fixing member.
11. The fingerprint identification module of claim 10, further comprising a stiffener configured to support the flexible circuit board, wherein the stiffener is disposed on a surface of the flexible circuit board opposite to the mounting surface.
12. The fingerprint identification module of claim 11, wherein the decorative ring is electrically connected to the ground of the flexible printed circuit board through the fixing member, the reinforcing plate is made of metal, and the reinforcing plate is electrically connected to the ground of the flexible printed circuit board through a conductive adhesive film.
13. The fingerprint identification module of claim 12, wherein the bezel includes a first end surface and a second end surface opposite to each other, the first end surface and the second end surface are respectively connected to the inner side surface, the receiving space is located between the first end surface and the second end surface, the first end surface of the bezel is disposed on the fixing member, the fingerprint identification module further includes a cover plate disposed in the receiving space, the cover plate is disposed adjacent to the second end surface, and the cover plate covers a surface of the fingerprint identification chip away from the flexible circuit board.
14. The fingerprint identification module of claim 13, wherein the bezel includes an outer side surface, the outer side surface is disposed opposite to the inner side surface, the outer side surface and the inner side surface are respectively connected to the first end surface and disposed on two sides of the second end surface, and a height of the outer side surface is greater than a height of the inner side surface, so that the second end surface is recessed from a periphery of the outer side surface into the receiving space.
15. An electronic device, comprising a housing and the fingerprint recognition module of any one of claims 8 to 14, wherein the housing comprises a mounting portion, and the fingerprint recognition module is mounted on the housing through the mounting portion.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810445246.8A CN108875571B (en) | 2018-05-10 | 2018-05-10 | Fingerprint identification module assembly method, fingerprint identification module and electronic device |
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| CN201810445246.8A CN108875571B (en) | 2018-05-10 | 2018-05-10 | Fingerprint identification module assembly method, fingerprint identification module and electronic device |
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| CN108875571A CN108875571A (en) | 2018-11-23 |
| CN108875571B true CN108875571B (en) | 2022-04-15 |
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| CN100592131C (en) * | 2007-10-24 | 2010-02-24 | 鸿富锦精密工业（深圳）有限公司 | Camera module group |
| CN102347242A (en) * | 2011-09-30 | 2012-02-08 | 常熟市广大电器有限公司 | Method for encapsulating multiple chips with small sizes |
| US9223429B2 (en) * | 2013-03-21 | 2015-12-29 | Htc Corporation | Touch module and electronic apparatus |
| TWI526940B (en) * | 2013-07-23 | 2016-03-21 | The card structure of smart card and its manufacturing method | |
| CN105825165B (en) * | 2015-11-20 | 2019-02-15 | 维沃移动通信有限公司 | A kind of fingerprint recognition mould group, terminal device and assembly method |
| CN206133367U (en) * | 2016-08-16 | 2017-04-26 | 广东欧珀移动通信有限公司 | Input group spare and terminal |
| CN107509352B (en) * | 2017-08-25 | 2019-06-07 | 维沃移动通信有限公司 | A kind of fixing means and mobile terminal of flexible circuit board FPC |
| CN107609539A (en) * | 2017-10-13 | 2018-01-19 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition module and electronic installation |
| CN107896259A (en) * | 2017-10-31 | 2018-04-10 | 广东欧珀移动通信有限公司 | Fingerprint recognition module and its assemble method and electronic installation |
| CN107786694A (en) * | 2017-10-31 | 2018-03-09 | 广东欧珀移动通信有限公司 | Fingerprint recognition module and its assemble method, housing unit and electronic installation |
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