CN108875194A - A kind of testing impedance figure automatic generation method for printed wiring board - Google Patents
A kind of testing impedance figure automatic generation method for printed wiring board Download PDFInfo
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- CN108875194A CN108875194A CN201810604194.4A CN201810604194A CN108875194A CN 108875194 A CN108875194 A CN 108875194A CN 201810604194 A CN201810604194 A CN 201810604194A CN 108875194 A CN108875194 A CN 108875194A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
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Abstract
The present invention provides a kind of testing impedance figure automatic generation methods for printed wiring board comprising following implementation steps：1) by first impedance information input module input impedance information into processing unit, impedance information includes impedance type number and the first impedance image information parameter；2) impedance type required for processing unit identifies impedance type number and transfers out from impedance type database, and the second impedance information input module is recalled under each impedance type；3) the second impedance image information parameter is inputted into processing unit by the second impedance information input module；4) processing unit recalls corresponding figure according to the first impedance image information parameter and the second impedance image information parameter of input from shape library, and corresponding testing impedance figure is then shown on plate.The problem of autochart function may be implemented in the present invention compared to the prior art, efficiently solves original manual modification low efficiency and is easy error.
Description
Technical field
The present invention relates to printed wiring board fields, in particular to a kind of testing impedance figure for printed wiring board
Shape automatic generation method.
Background technique
Various signal transmitting are had in conductor in printed wiring board, must improve its frequency to improve its transmission rate
Rate.If route itself is because of the factors such as etching, laminated thickness, conductor width difference, it will cause impedance value that must change, make its letter
Number distortion, cause wiring board service performance decline, so needing to control impedance value in the fabrication process in a certain range.How
Impedance value is managed in assist side, it is necessary in the engineering process design phase, design individual impedance strip and be managed and tested.
However, the fixation specification that current machinery equipment is popped one's head in, is unable to satisfy ever-changing route design, it is necessary in Process Design
The resolution chart of fixed specification is added, however most of wiring board design substantive cannot change, thus increase that must be additional
The design of impedance strip forms resolution chart.
Current Normal practice mainly applies fixed format template, by taking simplest single line characteristic impedance template as an example,
It needs to make an amendment the following contents on the basis of template：The size (this, which changes, influences the design of periphery copper sheet) of location hole, instrument connection
Size (this, which changes, influences pad and the design of periphery copper sheet), (every group of impedance line has not for impedance line width and the distance apart from copper sheet
With requirement), the selection (every group of impedance line has different layers not require) of impedance layer, reference layer selection (every group of impedance line pair
The reference layer answered has differences) and impedance serial number (every group of Impedance pattern corresponds to different serial numbers) etc..
Thus, the major defect of present testing impedance graphical design method is：
1) it takes a long time, low efficiency：The modification of template, all needs personnel to be manually operated, and the content of modification is more, every group of resistance
It is anti-to need 10-20 minutes, if being related to multiple groups impedance, in addition increase the design of impedance typesetting, time-consuming will be multiplied；
2) it is easy entanglement：The modification of every group of impedance design is up to 10 or more, the unqualified nothing that will lead to impedance of a parameter
Method measurement or measuring error, in the case that multiple groups resistance requirements exist simultaneously, the probability of error will be greatly increased.
Summary of the invention
In consideration of it, graphic designs effect can be effectively improved the present invention provides one kind and improve the use of parameter accuracy
In the testing impedance figure automatic generation method of printed wiring board.
The present invention provides a kind of testing impedance figure automatic generation methods for printed wiring board comprising following real
Apply step：
1) by first impedance information input module input impedance information into processing unit, impedance information includes impedance kind
Class number and the first impedance image information parameter；
2) impedance type required for processing unit identifies impedance type number and transfers out from impedance type database,
And the second impedance information input module is recalled under each impedance type；
3) the second impedance image information parameter is inputted into processing unit by the second impedance information input module；
4) processing unit is according to the first impedance image information parameter of input and the second impedance image information parameter from figure
Corresponding figure is recalled in library, and corresponding testing impedance figure is then shown on plate.
Further, parameter correction module is provided in above-mentioned processing unit, parameter correction module determines the first of input
Impedance image information parameter and the second impedance image information parameter then determine to input parameter if information parameter exceeds setting range
It is wrong.
Further, above-mentioned parameter corrects module and recalls validation of information interface mould automatically after determining that input parameter is wrong
Block, validation of information interface module direct information connect shape library, recall reasonable parameter area for making by parameter proximity
User's selection.
Further, above-mentioned first impedance image information parameter includes pore size information parameter.
Further, above-mentioned pore size information parameter includes impedance location hole dimension information parameter and testing impedance pore size
Information parameter.
Further, above-mentioned second impedance image information parameter includes impedance reference layer information parameter.
Further, above-mentioned second impedance image information parameter include impedance line width, impedance line away from and impedance away from copper.
Further, above-mentioned shape library includes line graph library unit and hole pattern library unit, line graph library unit and hole
Figure library unit while information link position parameter module.
A kind of testing impedance figure automatic generation method for printed wiring board provided by the present invention, compared to existing
There is technology mainly to have the following advantages that：Utilize set automatic generation method, it is possible to reduce individual's operation modification, input are crucial
Impedance parameter, realize autochart function, thus efficiently solve original manual modification low efficiency and be easy error the problem of.
Detailed description of the invention
By reading the following detailed description of the preferred embodiment, various other advantages and benefits are common for this field
Technical staff will become clear.The drawings are only for the purpose of illustrating a preferred embodiment, and is not considered as to the present invention
Limitation.And throughout the drawings, the same reference numbers will be used to refer to the same parts.In the accompanying drawings：
Fig. 1 is a kind of testing impedance figure automatic generation method for printed wiring board provided in an embodiment of the present invention
Implementation flow chart；
Fig. 2 is in a kind of testing impedance figure automatic generation method for printed wiring board provided in an embodiment of the present invention
The surface chart of related first impedance information input module；
Fig. 3 is in a kind of testing impedance figure automatic generation method for printed wiring board provided in an embodiment of the present invention
The surface chart of related second impedance information input module；
Fig. 4 is in a kind of testing impedance figure automatic generation method for printed wiring board provided in an embodiment of the present invention
The surface chart of related parameter correction module；
Fig. 5 is in a kind of testing impedance figure automatic generation method for printed wiring board provided in an embodiment of the present invention
Output pattern.
Specific embodiment
Exemplary embodiments of the present disclosure are described in more detail below with reference to accompanying drawings.Although showing the disclosure in attached drawing
Exemplary embodiment, it being understood, however, that may be realized in various forms the disclosure without should be by embodiments set forth here
It is limited.On the contrary, these embodiments are provided to facilitate a more thoroughly understanding of the present invention, and can be by the scope of the present disclosure
It is fully disclosed to those skilled in the art.
Embodiment one：
Referring to Fig. 1 to Fig. 5, a kind of testing impedance for printed wiring board provided in an embodiment of the present invention is shown in figure
Figure automatic generation method comprising following implementation steps：
S1：By first impedance information input module input impedance information into processing unit, impedance information includes impedance
Type number and the first impedance image information parameter, the surface chart of the first impedance information input module is as shown in Fig. 2, the first resistance
Anti- image information parameter includes impedance location hole dimension information parameter and testing impedance pore size information parameter；
S2：Processing unit identification impedance type number simultaneously transfers out required impedance kind from impedance type database
Class, and the second impedance information input module is recalled under each impedance type；
S3：The second impedance image information parameter is inputted into processing unit by the second impedance information input module, second
The surface chart of impedance information input module as shown in figure 3, the second impedance image information parameter include impedance reference layer information parameter,
Impedance line width, impedance line away from and impedance away from copper；
S4：Processing unit is according to the first impedance image information parameter of input and the second impedance image information parameter from figure
Corresponding figure is recalled in library, and corresponding testing impedance figure is then shown on plate.
A kind of testing impedance figure automatic generation method for printed wiring board provided by the present embodiment, compared to
The prior art mainly has the following advantages that：Utilize set automatic generation method, it is possible to reduce individual's operation modification, input are closed
The impedance parameter of key realizes autochart function, to efficiently solve original manual modification low efficiency and be easy asking for error
Topic.
Embodiment two：
With continued reference to Fig. 4, a kind of impedance for printed wiring board provided by Embodiment 2 of the present invention is shown in figure and is surveyed
Attempt shape automatic generation method, the present embodiment is also further made that following as improved on the basis of the above embodiments
Technical solution：Parameter correction module is provided in processing unit, parameter correction module determines the first impedance image information of input
Parameter and the second impedance image information parameter then determine that input parameter is wrong if information parameter exceeds setting range；Parameter correction
Module recalls validation of information interface module, the connection of validation of information interface module direct information automatically after determining that input parameter is wrong
Shape library recalls reasonable parameter area by parameter proximity and selects for user.By above-mentioned setting, ginseng can be formed
Several rapid correction, user is without knowing that accurate data can fast implement the correct adjustment of parameter.
With continued reference to Fig. 5, shape library includes line graph library unit and hole pattern library unit, line graph library unit and hole pattern
Information link position parameter module, the figure ultimately produced are as shown in Figure 5 simultaneously for shape library unit.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (8)
1. a kind of testing impedance figure automatic generation method for printed wiring board, which is characterized in that walked including following implementation
Suddenly：
1) by first impedance information input module input impedance information into processing unit, the impedance information includes impedance kind
Class number and the first impedance image information parameter；
2) impedance type required for processing unit identifies the impedance type number and transfers out from impedance type database,
And the second impedance information input module is recalled under each impedance type；
3) the second impedance image information parameter is inputted into processing unit by the second impedance information input module；
4) processing unit is joined according to the first impedance image information parameter of input and the second impedance image information
Number recalls corresponding figure from shape library, and corresponding testing impedance figure is then shown on plate.
2. a kind of testing impedance figure automatic generation method for printed wiring board according to claim 1, feature
It is, parameter correction module is provided in the processing unit, and the parameter correction module determines first impedance of input
Image information parameter and the second impedance image information parameter then determine to input parameter if information parameter exceeds setting range
It is wrong.
3. a kind of testing impedance figure automatic generation method for printed wiring board according to claim 2, feature
It is, the parameter correction module recalls validation of information interface module after determining that input parameter is wrong automatically, and the information is true
Recognize interface module direct information and connect the shape library, reasonable parameter area is recalled by parameter proximity and is selected for user
It selects.
4. a kind of testing impedance figure automatic generation method for printed wiring board according to claim 1, feature
It is, the first impedance image information parameter includes pore size information parameter.
5. a kind of testing impedance figure automatic generation method for printed wiring board according to claim 4, feature
It is, the pore size information parameter includes impedance location hole dimension information parameter and testing impedance pore size information parameter.
6. a kind of testing impedance figure automatic generation method for printed wiring board according to claim 1, feature
It is, the second impedance image information parameter includes impedance reference layer information parameter.
7. a kind of testing impedance figure automatic generation method for printed wiring board according to claim 1 or 6, special
Sign is, the second impedance image information parameter include impedance line width, impedance line away from and impedance away from copper.
8. a kind of testing impedance figure automatic generation method for printed wiring board according to claim 1, feature
It is, the shape library includes line graph library unit and hole pattern library unit, the line graph library unit and the hole pattern
Library unit while information link position parameter module.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810604194.4A CN108875194A (en) | 2018-06-12 | 2018-06-12 | A kind of testing impedance figure automatic generation method for printed wiring board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810604194.4A CN108875194A (en) | 2018-06-12 | 2018-06-12 | A kind of testing impedance figure automatic generation method for printed wiring board |
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| CN108875194A true CN108875194A (en) | 2018-11-23 |
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| CN201810604194.4A Pending CN108875194A (en) | 2018-06-12 | 2018-06-12 | A kind of testing impedance figure automatic generation method for printed wiring board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112946365A (en) * | 2021-03-01 | 2021-06-11 | 广州广合科技股份有限公司 | Method for automatically making impedance test file, electronic equipment and storage medium |
| CN113268940A (en) * | 2021-05-07 | 2021-08-17 | 胜宏科技（惠州）股份有限公司 | Automatic generation method and system of impedance test strip |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101526972A (en) * | 2009-04-21 | 2009-09-09 | 上海闻泰电子科技有限公司 | Setting device of circuit board and method thereof |
| CN107908828A (en) * | 2017-10-26 | 2018-04-13 | 惠州市金百泽电路科技有限公司 | A kind of automatic method for making pcb board testing impedance bar |
-
2018
- 2018-06-12 CN CN201810604194.4A patent/CN108875194A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101526972A (en) * | 2009-04-21 | 2009-09-09 | 上海闻泰电子科技有限公司 | Setting device of circuit board and method thereof |
| CN107908828A (en) * | 2017-10-26 | 2018-04-13 | 惠州市金百泽电路科技有限公司 | A kind of automatic method for making pcb board testing impedance bar |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112946365A (en) * | 2021-03-01 | 2021-06-11 | 广州广合科技股份有限公司 | Method for automatically making impedance test file, electronic equipment and storage medium |
| CN112946365B (en) * | 2021-03-01 | 2024-05-28 | 广州广合科技股份有限公司 | Method for automatically manufacturing impedance test file, electronic equipment and storage medium |
| CN113268940A (en) * | 2021-05-07 | 2021-08-17 | 胜宏科技（惠州）股份有限公司 | Automatic generation method and system of impedance test strip |
| CN113268940B (en) * | 2021-05-07 | 2024-03-29 | 胜宏科技（惠州）股份有限公司 | Automatic generation method and system of impedance test strip |
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