CN108873191A - A kind of integrated microwave photon device package casing - Google Patents
A kind of integrated microwave photon device package casing Download PDFInfo
- Publication number
- CN108873191A CN108873191A CN201810658648.6A CN201810658648A CN108873191A CN 108873191 A CN108873191 A CN 108873191A CN 201810658648 A CN201810658648 A CN 201810658648A CN 108873191 A CN108873191 A CN 108873191A
- Authority
- CN
- China
- Prior art keywords
- shell
- cover plate
- microwave photon
- radio
- device package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The present invention provides a kind of integrated microwave photon device package casing based on hybrid integrated technology.The shell can cut down material production metal shell shell using high mechanical strength, and case surface is gold-plated, is convenient for parallel seam welding and solder welding, guarantee Shell；In structure, it is designed by integrated upper and lower chambers structure, the critical components such as photoelectricity hybrid integrated substrate, power supply board are physically isolated completely, the electrical connection of upper and lower cavity is realized by inner wall perforated design, the problems such as effectively solving function division, compact reliable installation and size Control, so that shell is had the characteristics that dexterous type is integrated, the requirement of high reliability under a variety of application environments can be met.
Description
Technical field
The present invention relates to one kind to be suitable for microwave photon device integrated package shell.
Background technique
Microwave photon technology flourishes, so that microwave signal optical transport is as signal in radar, electronic warfare system link
Mainstream technology is transmitted, has the characteristics that bandwidth availability ratio is big, transmission range is long, Anti-amyloid-β antibody.Microwave current photonic device master
The kit form of discrete form is used, i.e. photoelectric conversion device and electric amplifier is by cable connection, and there are sizes greatly, radio frequency
The disadvantages of performance difference and poor reliability.For shell mechanism, existing discrete type microwave photon device is in structure design
It has the following disadvantages：1, outer dimension is larger：Photonic device with electronic device is relatively independent is connect by cable, cause
Packaging appearance size is bigger than normal；2, environmental suitability：Non-airtight encapsulation, under the conditions of high heat and humidity, device is easy short-circuit failure；
3, Mechanical Reliability is poor：Structure is not compact, Mechanical Reliability is not high, can under the higher application conditions of mechanical oscillation intensity
It is difficult to meet the requirements by property.
Summary of the invention
In view of existing Discrete device packaging structure there are the shortcomings that, the present invention provides a kind of integrated microwave photon devices
Package casing, by the material structure photonic device different with manufacture craft and electronic device in same shell integration packaging, group
It is combined, has the characteristics that small in size, at low cost, multifunctional unit, high reliablity, photonic device and electronics can be given full play to
The performance of device can effectively solve the problem that the problems such as discrete type microwave photon device Mechanical Reliability is low, environmental suitability is poor.
In order to achieve the above object, the invention adopts the following technical scheme：A kind of integrated microwave photon device encapsulation
Shell, including shell and the upper cover plate and lower cover plate that are connect with the shell both ends, it is characterised in that：The shell includes four
A side and the partition being vertically connected in the middle part of four sides, the partition by shell be divided into accommodating ceramic substrate epicoele and
The cavity of resorption of power supply board is accommodated, is additionally provided with intercommunicating pore on the partition；The upper cover plate is connect with the shell upper end to close
The epicoele, the lower cover plate are connect with the shell lower end to close the cavity of resorption；Connect on the one of side of shell
It is connected to radio-frequency maser, is connected with tail optical fiber on the side opposite with the side.
Further, the side of the shell connection radio-frequency maser is equipped with radio frequency interface and RF isolation, the radio frequency
Interface two sides are equipped with radio-frequency maser location hole；The radio-frequency maser is connect by screw with the radio-frequency maser location hole, is fixed on described
On side；The RF isolation interest tin boxing is connected in the housing side.
Further, side lower where the tail optical fiber is equipped with the boss with casing mounting hole, is equipped with optical fiber among top
Interface is pierced by the tail optical fiber optical fiber interface, and solder is fused on shell.
Further, the optical fiber interface and the radio frequency interface are in same rectilinear direction.
Further, power supply lead wire is additionally provided on the shell another side, the power supply lead wire high temperature brazing is in shell
On.
Further, the shell, upper cover plate, lower cover plate are using that can cut down material mechanical machine-shaping, and outer surface is gold-plated, institute
Upper cover plate and lower cover plate parallel seam welding are stated on the shell.
In conclusion the present invention can cut down material production metal shell shell, case surface plating using high mechanical strength material
Gold is convenient for parallel seam welding and solder welding, guarantees Shell；In structure, set by integrated upper and lower chambers structure
Meter, the critical components such as photoelectricity hybrid integrated substrate, driving plate are physically isolated completely；It is electrically connected by the realization of inner wall perforated design
The problems such as connecing, effectively solving function division, compact reliable installation and size Control, makes shell have the integrated spy of dexterous type
Point can meet a variety of application environment adaptability and high reliability request.
Detailed description of the invention
Fig. 1 is each component assembling decomposition view of integrated microwave photon device outer case.
Fig. 2 is microwave photon device outer case shell top view.
Fig. 3 is microwave photon device outer case shell bottom view.
Fig. 4 is microwave photon device outer case shell side view.
Fig. 5 is another side view of microwave photon device outer case shell.
Fig. 6 is integrated microwave photon device outer case enclosure interior component assembling top sectional.
Fig. 7 is sectional view under integrated microwave photon device outer case enclosure interior component assembling.
Fig. 8 is integrated microwave photon device outer case shape front view.
Specific embodiment
Integrated photoelectricity microwave amplification receiver part shell is used with reference to the accompanying drawing as embodiment to make into one the present invention
Walk explanation.
A kind of integrated microwave photon device package casing as shown in Figures 1 to 8, including shell 1 and with the shell
The upper cover plate 2 and lower cover plate 3 of 1 both ends of body connection, it is characterised in that：The shell 1 includes four sides and is vertically connected at
Partition 101 in the middle part of four sides, the partition 101 divide shell 1 to accommodate the epicoele of ceramic substrate 4 and accommodating power supply board
5 cavity of resorption is additionally provided with intercommunicating pore 102 on the partition 101；The upper cover plate 2 connect described to close with 1 upper end of shell
Epicoele, the lower cover plate 3 are connect with 1 lower end of shell to close the cavity of resorption；The shell 1 connects on one of side
There is radio-frequency maser 6, tail optical fiber 7 is connected on the side opposite with the side.Ceramic substrate 2 can by realize Nian Jie with partition of conducting resinl
The flatness of the fixation leaned on, partition 101 should be better than 50 μm, and shell upper chamber depth is mainly by the height of component on ceramic substrate
It determines.Shell bottom chamber installs power supply board 5, and the intercommunicating pore 102 on partition 101 is corresponding with the hole location on power supply board 5,
It is fixed with conducting resinl.The depth of lower chambers is determined according to the element heights of power supply board 5.
Further, the side that the shell 1 connects radio-frequency maser 6 is equipped with radio frequency interface 108 and RF isolation 104,
108 two sides of radio frequency interface are equipped with radio-frequency maser location hole 107；The radio-frequency maser 6 passes through screw and the radio-frequency maser location hole
107 connections, are fixed on the side；The sub 104 gold medal tin boxing of the RF isolation are connected on 1 side of shell.
Further, the 7 place side lower of tail optical fiber is equipped with the boss with casing mounting hole 103, sets among top
There is optical fiber interface 105, the tail optical fiber 7 is pierced by from optical fiber interface 105, and solder is fused on shell, the position of pigtail coupling
For the center of optical fiber soldering opening.
Further, the optical fiber interface 105 is with the radio frequency interface 108 in same rectilinear direction.
Further, power supply lead wire 106,106 high temperature brazing of power supply lead wire are additionally provided on 1 another side of shell
In on shell.
Further, the shell 1, upper cover plate 2, lower cover plate 3 are plated using that can cut down material mechanical machine-shaping, outer surface
Gold, the upper cover plate 2 and 3 parallel seam welding of lower cover plate are on the shell 1.The coefficient of expansion that material can be cut down is smaller, is convenient for high frequency
The encapsulation of device.Case surface is gold-plated, is convenient for parallel seam welding and solder welding, guarantees Shell.
There are optional alternative solutions in the following aspects for technical solution of the present invention：
(1) shell mechanism design can be changed by designs such as the directions of change optical fiber interface 105 and radio frequency interface 108；
(2) upper and lower chambers is realized by intercommunicating pore and is electrically connected, and can also be substituted by sintering insulated sub- gage system.
(3) shell radio frequency interface can be substituted by direct sintering radio frequency connector；
(4) substrate conducting glue sticking mode can be substituted by eutectic welding manner.
Technical solution provided by inventive embodiments is described in detail above, specific case pair used herein
The principle and embodiment of the embodiment of the present invention are expounded, and the explanation of above embodiments is only applicable to help to understand this hair
The principle of bright embodiment；At the same time, for those skilled in the art, according to an embodiment of the present invention, in specific embodiment
And there will be changes in application range, in conclusion the contents of this specification are not to be construed as limiting the invention.
Claims (6)
1. a kind of integrated microwave photon device package casing is connect upper including shell (1) and with the shell (1) both ends
Cover board (2) and lower cover plate (3), it is characterised in that：The shell (1) includes four sides and is vertically connected in four sides
Shell (1) is divided into the epicoele and accommodating power supply board of accommodating ceramic substrate (4) by the partition (101) in portion, the partition (101)
(5) cavity of resorption is additionally provided with intercommunicating pore (102) on the partition (101)；The upper cover plate (2) connect with the shell (1) upper end
To close the epicoele, the lower cover plate (3) is connect with the shell (1) lower end to close the cavity of resorption；The shell (1) its
In be connected with radio-frequency maser (6) on a side, tail optical fiber (7) are connected on the side opposite with the side.
2. according to a kind of integrated microwave photon device package casing described in claim 1, it is characterised in that：The shell (1)
The side for connecting radio-frequency maser (6) is equipped with radio frequency interface (108) and RF isolation is sub (104), radio frequency interface (108) two sides
Equipped with radio-frequency maser location hole (107)；The radio-frequency maser (6) is connect by screw with the radio-frequency maser location hole (107), is fixed on
On the side；The golden tin boxing of the RF isolation (104) is connected on the shell (1) side.
3. according to a kind of integrated microwave photon device package casing described in claim 1, it is characterised in that：The tail optical fiber (7)
Place side lower is equipped with the boss with casing mounting hole (103), is equipped with optical fiber interface (105) among top, the tail optical fiber (7)
It is pierced by from optical fiber interface (105), and solder is fused on shell.
4. according to a kind of integrated microwave photon device package casing described in claim 3, it is characterised in that：The optical fiber interface
(105) with the radio frequency interface (108) in same rectilinear direction.
5. according to a kind of integrated microwave photon device package casing described in claim 1, it is characterised in that：The shell (1)
It is additionally provided on another side power supply lead wire (106), power supply lead wire (106) high temperature brazing is on shell.
6. according to a kind of integrated microwave photon device package casing described in claim 1, it is characterised in that：The shell (1),
Upper cover plate (2), lower cover plate (3) are using that can cut down material mechanical machine-shaping, and outer surface is gold-plated, the upper cover plate (2) and lower cover plate
(3) parallel seam welding is on the shell (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810658648.6A CN108873191A (en) | 2018-06-25 | 2018-06-25 | A kind of integrated microwave photon device package casing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810658648.6A CN108873191A (en) | 2018-06-25 | 2018-06-25 | A kind of integrated microwave photon device package casing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108873191A true CN108873191A (en) | 2018-11-23 |
Family
ID=64295453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810658648.6A Pending CN108873191A (en) | 2018-06-25 | 2018-06-25 | A kind of integrated microwave photon device package casing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108873191A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112828414A (en) * | 2020-12-30 | 2021-05-25 | 中国航天科工集团八五一一研究所 | Integrated sintering tool for micro-assembly substrate connector |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2674648Y (en) * | 2003-12-31 | 2005-01-26 | 贵研铂业股份有限公司 | Hermetic sealing composite cover plate for integrated circuit |
| CN103944524A (en) * | 2014-04-28 | 2014-07-23 | 北京遥测技术研究所 | Ka frequency band frequency conversion module based on SMT packaging device |
| CN205123748U (en) * | 2015-10-28 | 2016-03-30 | 合肥正阳光电科技有限责任公司 | Compact radio frequency light emission module |
| CN206023708U (en) * | 2016-08-31 | 2017-03-15 | 安徽华东光电技术研究所 | Package sealing with laser voltage-control oscillator module structure |
-
2018
- 2018-06-25 CN CN201810658648.6A patent/CN108873191A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2674648Y (en) * | 2003-12-31 | 2005-01-26 | 贵研铂业股份有限公司 | Hermetic sealing composite cover plate for integrated circuit |
| CN103944524A (en) * | 2014-04-28 | 2014-07-23 | 北京遥测技术研究所 | Ka frequency band frequency conversion module based on SMT packaging device |
| CN205123748U (en) * | 2015-10-28 | 2016-03-30 | 合肥正阳光电科技有限责任公司 | Compact radio frequency light emission module |
| CN206023708U (en) * | 2016-08-31 | 2017-03-15 | 安徽华东光电技术研究所 | Package sealing with laser voltage-control oscillator module structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112828414A (en) * | 2020-12-30 | 2021-05-25 | 中国航天科工集团八五一一研究所 | Integrated sintering tool for micro-assembly substrate connector |
| CN112828414B (en) * | 2020-12-30 | 2022-09-13 | 中国航天科工集团八五一一研究所 | Integrated sintering tool for micro-assembly substrate connector |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20181123 |
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| WD01 | Invention patent application deemed withdrawn after publication |