CN218975431U - Radio frequency packaging structure and radio frequency device - Google Patents

Abstract

The application provides a radio frequency packaging structure and a radio frequency device, wherein the radio frequency packaging structure comprises: a package and a substrate; the package includes a top plate and a sidewall disposed about the top plate; an end of a side wall of the package is in sealing contact with the first surface of the substrate to form a sealed receiving cavity; a first pin is arranged on the outer surface of the packaging piece; the first surface of the substrate is configured to be provided with an electronic element and a signal interface; a second pin is arranged on the second surface of the substrate; and a microwave transmission line is arranged in the side wall of the packaging piece and is electrically connected with the first pin, the electronic element, the second pin and the signal interface. According to the radio frequency packaging structure, the first pin and the microwave transmission line are arranged on the packaging piece, space is not needed to be provided for the first pin and the microwave transmission line, and the utilization rate of the packaging piece is improved while the size of the radio frequency packaging structure is reduced.

Description

Radio frequency packaging structure and radio frequency device

Technical Field

The present application relates to the field of semiconductor packaging, and in particular, to a radio frequency packaging structure and a radio frequency device.

Background

A chip generally refers to an integrated circuit formed by a large number of microelectronic components (transistors, resistors, capacitors, diodes, etc.) on a substrate to form a chip. Packaging of chips generally refers to the process of assembling an integrated circuit into a chip end product, i.e., placing the integrated circuit die on a load-bearing substrate, pulling out the pins, and then securing and packaging the die as a unit.

The packaging of the chip mainly includes a lead frame, a laminate substrate, and a backplane carrier. The ever increasing functionality of chips places higher demands on the integration level of the chip. Based on the higher functionality requirements of the chip, correspondingly higher requirements are placed on more wiring and more space utilization. It is currently difficult to meet space utilization requirements for the packaging of chips.

Disclosure of Invention

In view of the foregoing, an object of the embodiments of the present application is to provide a radio frequency package structure and a radio frequency device, which can improve the space utilization of the radio frequency package structure and reduce the volume of the radio frequency package structure.

In a first aspect, an embodiment of the present application provides a radio frequency package structure, including: a package and a substrate; the package includes a top plate and a sidewall disposed about the top plate; an end of a side wall of the package is in sealing contact with the first surface of the substrate to form a sealed receiving cavity; a first pin is arranged on the outer surface of the packaging piece; the first surface of the substrate is configured to be provided with an electronic element and a signal interface; a second pin is arranged on the second surface of the substrate; and a microwave transmission line is arranged in the side wall of the packaging piece and is electrically connected with the first pin, the electronic element, the second pin and the signal interface.

In the implementation process, the package is set to be a structure of the top plate and the side wall, a cavity is formed between the side wall and the top plate, and the electronic element is arranged on the first surface of the substrate, so that after the end part of the side wall of the package is contacted with the first surface of the substrate, a sealed accommodating cavity can be formed, and the sealed accommodating cavity is used for accommodating the electronic element on the first surface of the substrate, so that the tightness of the electronic element in the radio frequency package structure is improved. In addition, through setting up first pin and microwave transmission line on the package, no longer need provide the space for first pin and microwave transmission line, reduce the volume of this radio frequency packaging structure when improving the utilization ratio of package.

In one embodiment, a first signal transmission line is arranged inside the top plate; one end of the first signal transmission line is connected with the first pin, and the other end of the first signal transmission line is connected with the microwave transmission line.

In the implementation process, the first signal transmission line connected with the first pin and the microwave transmission line is arranged inside the top plate, and a corresponding wire harness space is not required to be additionally arranged for the first signal transmission line, so that the utilization rate of the packaging piece is improved, and meanwhile, the volume of the radio frequency packaging structure is reduced.

In one embodiment, the substrate is internally provided with a second signal transmission line and a third signal transmission line; one end of the second signal transmission line is connected with the signal interface, and the other end of the second signal transmission line is connected with the input end of the electronic element; one end of the third signal transmission line is connected with the output end of the electronic element, and the other end of the third signal transmission line is connected with the second pin.

In the implementation process, the first signal transmission line connected with the electronic element and the microwave transmission line and the third signal transmission line connected with the electronic element and the second pin are arranged inside the substrate, and corresponding wire harness spaces are not required to be additionally arranged for the second signal transmission line and the third signal transmission line, so that the utilization rate of the substrate is improved, and meanwhile, the volume of the radio frequency packaging structure is reduced.

In one embodiment, the first surface comprises a top surface of the substrate and the second surface comprises a bottom surface disposed opposite the top surface.

In the implementation process, the first surface is set as the top surface of the substrate, and the electronic component and the signal interface are arranged on the first surface, so that after the end part of the side wall of the package is in sealing contact with the first surface of the substrate, the electronic component is in the accommodating cavity formed by the package and the first surface, and the accommodating cavity is sealed, so that the air tightness of the electronic component can be improved. In addition, the second surface is set to be the bottom surface of the substrate, so that the second pins are arranged on a plane opposite to the electronic element and the signal interface, the second pins and the electronic element can be well isolated, and meanwhile, the volume of the radio frequency packaging structure can be reduced.

In one embodiment, the first surface includes a top surface of the substrate and a side surface of the substrate, and the second surface includes a bottom surface disposed opposite the top surface.

In the implementation process, the first surface is set to be the top surface of the substrate and the side surface of the substrate, so that the radio frequency packaging structure can package more electronic elements, and the application scene of the radio frequency packaging structure is increased.

In one embodiment, the microwave transmission line is welded with the signal interface; wherein the soldered material comprises gold-tin solder.

In the implementation process, the welding has the advantages of good connection performance, good density and the like, and the connection strength and the tightness of the microwave transmission line and the signal interface can be improved by welding the microwave transmission line and the signal interface. In addition, because the gold-tin solder has the advantages of low melting point, high strength, good thermal fatigue resistance and the like, the gold-tin solder can be used as a welding material to improve the welding strength of the microwave transmission line and the signal interface, can prevent fatigue fracture caused by temperature circulation, can be used even under the condition of severe climate change, and increases the service scene of the radio frequency packaging structure.

In one embodiment, the end of the sidewall is welded to the first surface of the substrate.

In the implementation process, the end part of the side wall and the first surface of the substrate are welded, so that the connection strength of the end part of the side wall and the first surface of the substrate can be increased, the gap between the end part of the side wall and the first surface of the substrate is reduced, and the air tightness of the accommodating cavity is improved.

In one embodiment, the microwave transmission line is provided with a via hole; the signal interface is welded with the via hole through a welding material.

In the implementation process, the via hole of the microwave transmission line and the signal interface are welded through the welding material, so that the connection strength of the microwave transmission line and the signal interface can be enhanced. In addition, after the signal interface is welded with the through hole through the welding material, the end part of the side wall of the packaging piece can be in sealing contact with the first surface of the substrate to form a sealed accommodating cavity, and the end part of the side wall of the packaging piece and the first surface of the substrate do not need to be welded any more, so that the cost of the radio frequency packaging structure can be reduced while the packaging process is simplified.

In one embodiment, the electronic component includes: silicon-based chips, compound chips, power chips, and passive devices.

In the implementation process, the electronic element is set to be various types of chips and passive devices, so that the radio frequency packaging structure can be used for packaging various radio frequency chips, and the application scene of the radio frequency packaging structure is increased.

In a second aspect, embodiments of the present application further provide a radio frequency device, including: an electronic component, a first pin, a second pin, or a radio frequency package structure as described in any one of the possible implementations of the first aspect; the radio frequency packaging structure comprises a sealed accommodating cavity, a first outer surface and a second outer surface; the first pin is arranged on the first outer surface, and the second pin is arranged on the second outer surface; the electronic component is disposed in the accommodation chamber.

In the implementation process, the radio frequency device adopts the radio frequency packaging structure, the packaging part is arranged to be a structure of a top plate and a side wall, a cavity is formed between the side wall and the top plate, an electronic element is arranged on the first surface of the substrate, so that after the end part of the side wall of the packaging part is contacted with the first surface of the substrate, a sealed accommodating cavity can be formed, the sealed accommodating cavity is used for accommodating the electronic element on the first surface of the substrate, the sealing performance of the electronic element in the radio frequency packaging structure is improved, and the reliability of the radio frequency device is further improved. In addition, the first pin and the microwave transmission line are arranged on the packaging piece of the radio frequency packaging structure, so that space is not required to be provided for the first pin and the microwave transmission line, the utilization rate of the packaging structure is improved, the effective transmission of signals is ensured, and meanwhile, the volume of a radio frequency device adopting the radio frequency packaging structure is reduced.

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is an exploded cross-sectional view of a radio frequency package structure provided in an embodiment of the present application;

fig. 2 is a cross-sectional view of a radio frequency package structure according to an embodiment of the present application;

fig. 3 is a top view of a substrate according to an embodiment of the present disclosure.

Description of the drawings: 100-package, 110-top plate, 111-outer surface of package, 120-side wall, 121-end of side wall, 200-substrate, 210-first surface, 220-second surface, 300-first pin, 400-electronic component, 500-signal interface, 600-second pin, 700-microwave transmission line, 710-via, 800-first signal transmission line, 900-soldered material, 20-receiving cavity.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only to distinguish the description, and are not to be construed as indicating or implying relative importance.

In the description of the present application, it should be noted that, the terms "upper," "lower," "inner," "outer," and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, or an azimuth or a positional relationship commonly visited when applying for a product, only for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element to be referred must have a specific azimuth, be configured and operated in a specific azimuth, and therefore should not be interpreted as a limitation of the present application.

In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the connection may be direct or indirect via an intermediate medium, or may be internal communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

It should be noted that, without conflict, features in embodiments of the present application may be combined with each other.

Along with the rapid development of economy, the electronic products are widely applied to the life of people, and the characteristics of specific non-contact, high reading speed, no abrasion and the like of the radio frequency chip are widely applied to the electronic products, so that the radio frequency chip becomes an indispensable part in most electronic products. An important trend in rf chips is integration and miniaturization.

However, the radio frequency packaging technology commonly used at present is: leadframe substrate packaging techniques, etched inductors, passive devices on pins, chip stacking techniques, and so forth. As the size of the radio frequency chip package is smaller and smaller, the number of chips is larger and larger, and the sealing performance is realized, the development of the radio frequency chip is difficult to meet by the packaging technology.

In view of this, this application provides a radio frequency packaging structure, through setting up the package into roof and lateral wall's structure to with signal transmission line and microwave transmission line setting inside the package, no longer need provide the space for signal transmission line and microwave transmission line, so that this package can still hold various wiring when realizing the encapsulation, in order to improve the utilization ratio of package. In addition, a cavity is formed between the side wall and the top plate, and an electronic element is arranged on the first surface of the substrate, so that after the end part of the side wall of the packaging piece is contacted with the first surface of the substrate, a sealed accommodating cavity can be formed, and the sealed accommodating cavity is used for accommodating the electronic element on the first surface of the substrate, so that the tightness of the electronic element in the radio frequency packaging structure can be improved.

As shown in fig. 1, fig. 2, and fig. 3, a radio frequency package structure provided in an embodiment of the present application includes: package 100 and substrate 200.

Wherein the package 100 includes a top plate 110 and a sidewall 120, the sidewall 120 being disposed around the top plate 110. The end 121 of the side wall of the package 100 is in sealing contact with the first surface 210 of the substrate 200 to form a sealed receiving cavity 20. The first pins 300 are disposed on the outer surface 111 of the package; the first surface 210 of the substrate 200 is configured to dispose the electronic component 400 and the signal interface 500; the second surface 220 of the substrate 200 is provided with second pins 600.

The sidewall 120 of the package 100 is internally provided with a microwave transmission line 700, and the microwave transmission line 700 is electrically connected with the first pin 300, the electronic component 400, the second pin 600, and the signal interface 500.

The microwave transmission line 700 may be a similar axis radio frequency transmission line, a waveguide radio frequency transmission line, a microstrip radio frequency transmission line, etc., and the specific type of the microwave transmission line 700 may be adjusted according to the use scenario of the radio frequency package structure, which is not specifically limited in this application.

In some embodiments, the first pin 300 is connected to one end of the microwave transmission line 700, the other end of the microwave transmission line 700 is connected to one end of the electronic component 400 through the signal interface 500, and the other end of the electronic component 400 is connected to the second pin 600.

It will be appreciated that the microstrip 700 may be connected to the signal interface 500 by plugging, welding, adhesive, etc. The microwave transmission line 700 and the signal interface 500 are connected in different manners, so that the specific structure of the package 100 and the signal interface 500 can be adaptively adjusted, so that the sealed accommodating cavity 20 can be formed after the end 121 of the sidewall of the package 100 is in sealing contact with the first surface 210 of the substrate 200.

For example, when the microwave transmission line 700 is electrically connected to the signal interface 500 by plugging, the end of the coaxial transmission line connected to the signal interface 500 may suitably extend from the inside of the side wall 120, the signal interface 500 is an interface corresponding to the similar axial transmission line structure, and the portion of the coaxial transmission line extending from the inside of the side wall 120 is fully inserted into the signal interface 500. After the portion of the coaxial transmission line extending from the interior of the sidewall 120 is fully inserted into the signal interface 500, the end 121 of the sidewall of the package 100 is in sealing contact with the first surface 210 of the substrate 200, and the top plate 110, the sidewall 120 and the substrate 200 form a sealed housing cavity 20.

When the microwave transmission line 700 is electrically connected to the signal interface 500 by soldering, a via 710 is provided in the coaxial transmission line, and a soldering material is provided in the via 710 to solder the coaxial transmission line and the signal interface 500 by the soldering material. After the coaxial transmission line and the signal interface 500 are soldered, the end 121 of the sidewall of the package 100 is in sealing contact with the first surface 210 of the substrate 200, and the top plate 110, the sidewall 120 and the substrate 200 form a sealed housing cavity 20.

In some embodiments, the surfaces of the end 121 of the sidewall of the package 100 that contact the first surface 210 of the substrate 200 may also be all connected by welding, riveting, bonding, or the like. The specific connection manner between the end 121 of the sidewall of the package 100 and the first surface 210 of the substrate 200 may be selected according to practical situations, which is not particularly limited in this application.

The first surface 210 may be the top surface of the substrate 200, the side surface of the substrate 200, a combination of the top surface and the side surface of the substrate 200, or the like, and the first surface 210 may be selected according to practical situations, which is not particularly limited in this application.

Alternatively, the microwave transmission line 700 may be directly connected to the first pin 300 or may be indirectly connected to the first pin 300. The connection manner between the microwave transmission line 700 and the first pin 300 is adjusted according to the electronic component 400 of the rf package structure and the functions to be implemented, which are not particularly limited in this application.

The top plate 110 and the side wall 120 may be integrally formed or may be separately formed. When the top plate 110 and the side wall 120 are of a separate structure, the top plate 110 and the side wall 120 may be connected by welding, riveting, bonding, or the like. The connection manner of the top plate 110 and the side wall 120 may be adjusted according to practical situations, and the present application is not limited in particular.

Optionally, the electronic component 400 may include: active devices and passive devices. Such as active chips, passive chips, filters, radio frequency switches, etc. The selection of the electronic component 400 on the first surface 210 of the substrate 200 may be adjusted according to practical situations, which is not particularly limited in this application.

In the above implementation process, by arranging the package 100 in a structure of the top plate 110 and the side wall 120, a cavity is formed between the side wall 120 and the top plate 110, and the electronic component 400 is arranged on the first surface 210 of the substrate 200, so that after the end 121 of the side wall of the package 100 contacts the first surface 210 of the substrate 200, a sealed accommodating cavity 20 can be formed, and the sealed accommodating cavity 20 is used for accommodating the electronic component 400 on the first surface 210 of the substrate 200, so that the sealing performance of the electronic component 400 in the radio frequency package structure is improved. In addition, by providing the first pin 300 and the microwave transmission line 700 on the package 100, there is no need to provide a space for the first pin 300 and the microwave transmission line 700, and the volume of the radio frequency package structure is reduced while improving the utilization rate of the package 100.

In one possible implementation, the top plate 110 is internally provided with a first signal transmission line 800.

One end of the first signal transmission line 800 is connected to the first pin 300, and the other end of the first signal transmission line 800 is connected to the microwave transmission line 700. The number of the first signal transmission lines 800 may be one or more, and the number of the first signal transmission lines 800 is adjusted according to the functions to be implemented by the rf package structure and the type of the electronic component 400, which is not particularly limited in this application.

It will be appreciated that the number of microwave transmission lines 700 within the rf package is limited by the configuration of the sidewalls 120. When the electronic component 400 is more or needs to implement more functions, each first pin 300 may need to be connected to a plurality of signal lines, and a certain signal interaction may also exist between different first pins 300. At this time, the microwave transmission line 700 and the first pin 300 are directly connected to each other in such a manner that the functional requirements are not satisfied, and the corresponding first signal transmission line 800 is required to be provided according to the specific function and the electronic component 400, and the microwave transmission line 700 and the first pin 300 are connected through the first signal transmission line 800.

The first signal transmission line 800 herein may be wired on the top plate 110 according to a wiring rule such that the wiring within the top plate 110 satisfies an impedance requirement.

In some embodiments, the first signal transmission lines 800 in the top plate 110 are equally disposed.

In the above implementation process, by disposing the first signal transmission line 800 connecting the first pin 300 and the microwave transmission line 700 inside the top plate 110, it is not necessary to additionally provide a corresponding harness space for the first signal transmission line 800, and the volume of the radio frequency package structure is reduced while improving the utilization rate of the package 100.

In one possible implementation, the substrate 200 is internally provided with a second signal transmission line and a third signal transmission line.

One end of the second signal transmission line is connected with the signal interface 500, and the other end of the second signal transmission line is connected with the input end of the electronic element 400; one end of the third signal transmission line is connected to the output terminal of the electronic component 400, and the other end of the third signal transmission line is connected to the second pin 600.

The number of the second signal transmission lines and the third signal transmission lines may be one or more, and the number of the second signal transmission lines and the third signal transmission lines is adjusted according to the functions to be implemented by the radio frequency package structure and the types of the electronic components 400, which is not specifically limited in this application.

It will be appreciated that the number of microwave transmission lines 700 within the rf package is limited by the configuration of the sidewalls 120. When there are more electronic components 400 or more functions to be implemented, each microwave transmission line 700 may need to transmit different signals, and there may be a certain signal interaction between different microwave transmission lines 700. At this time, the microwave transmission line 700 and the electronic component 400 are directly connected to each other, so that the functional requirements are not satisfied, and a corresponding second signal transmission line is required to be provided according to the specific function and the electronic component 400, and the microwave transmission line 700 and the electronic component 400 are connected through the second signal transmission line.

The second signal transmission line may be wired on the substrate 200 according to a wiring rule so that the wiring within the substrate 200 satisfies an impedance requirement.

Similarly, when there are more electronic components 400 or more functions to be implemented, each electronic component 400 may need to transmit multiple signals, and there may be some signal interaction between different electronic components 400. At this time, the electronic component 400 and the second pin 600 are directly connected to each other, so that the functional requirements are not satisfied, and a corresponding third signal transmission line is required to be provided according to the specific function and the electronic component 400, and the microwave transmission line 700 and the electronic component 400 are connected through the third signal transmission line.

The third signal transmission line here may be wired on the substrate 200 according to a wiring rule so that the wiring within the substrate 200 satisfies the impedance requirement.

Alternatively, the second signal transmission line and the third signal transmission line may be the same type of signal line or may be different types of signal lines. The specific types and types of the second signal transmission line and the third signal transmission line can be adjusted according to actual conditions, and the application is not particularly limited.

In the above implementation process, by disposing the first signal transmission line 800 connecting the electronic component 400 and the microwave transmission line 700 and the third signal transmission line connecting the electronic component 400 and the second pin 600 inside the substrate 200, it is not necessary to additionally provide corresponding harness spaces for the second signal transmission line and the third signal transmission line, so that the volume of the radio frequency package structure is reduced while the utilization rate of the substrate 200 is improved.

In one possible implementation, the first surface 210 includes a top surface of the substrate 200 and the second surface 220 includes a bottom surface disposed opposite the top surface.

It will be appreciated that the signal interface 500 is disposed around the electronic component 400 on the top surface of the substrate 200, and that after the signal interface 500 is connected to the microwave transmission line 700, the package 100 and the top surface of the substrate 200 form a sealed receiving cavity 20 to receive the signal interface 500 within the sealed receiving cavity 20.

The specific setting position of the signal interface 500 may be adjusted according to practical situations, which is not specifically limited in this application.

The signal interface 500 may be disposed at a vertex position of the substrate 200, for example. Each vertex is provided with a signal interface 500.

Alternatively, the signal interface 500 may be disposed at an edge intermediate position of the top surface of the substrate 200. A signal interface 500 is disposed at a middle position of each edge of the top surface of the substrate 200.

Alternatively, the signal interface 500 may be disposed at any position of the edge of the top surface of the substrate 200. A plurality of signal interfaces 500 are correspondingly disposed at each edge of the top surface of the substrate 200.

In some embodiments, the second surface 220 may also include a side of the substrate 200.

The second pins 600 may be disposed only on the bottom surface of the substrate 200, may be disposed only on the side surface of the substrate 200, or may be disposed on both the bottom surface and the side surface of the substrate 200. The setting position of the second pins 600 can be adjusted according to the number of the second pins 600 and the manufacturing process of the substrate 200, which is not particularly limited in this application.

In the above-described implementation, by providing the first surface 210 as the top surface of the substrate 200 and providing the electronic component 400 and the signal interface 500 on the first surface 210 such that the electronic component 400 is within the accommodating cavity 20 formed by the package 100 and the first surface 210 after the end 121 of the sidewall of the package 100 is in sealing contact with the first surface 210 of the substrate 200, the air tightness of the electronic component 400 can be improved because the accommodating cavity 20 is sealed. In addition, the second surface 220 is set as the bottom surface of the substrate 200, so that the second pins 600 are arranged on the plane opposite to the electronic element 400 and the signal interface 500, which can better isolate the second pins 600 from the electronic element 400 and reduce the volume of the radio frequency package structure.

In one possible implementation, the first surface 210 includes a top surface of the substrate 200 and a side surface of the substrate 200, and the second surface 220 includes a bottom surface disposed opposite the top surface.

It will be appreciated that when there are more electronic components 400 to be packaged in the rf package structure, the electronic components 400 may be disposed on the top surface of the substrate 200, and the signal interface 500 may be disposed around the electronic components 400 on the side surface of the substrate 200. Alternatively, the electronic component 400 is disposed on the top surface of the substrate 200 and the side surface of the substrate 200, the signal interface 500 is disposed around the electronic component 400 on the side surface of the substrate 200, and so on. The arrangement of the electronic component 400 and the signal interface 500 may be adjusted according to practical situations, which is not particularly limited in this application.

If the signal interface 500 is disposed around the electronic component 400 on the side of the substrate 200, the sidewall 120 of the package 100 can be adjusted accordingly according to the manner in which the signal interface 500 is disposed. For example, the sidewalls 120 of the package 100 may have a symmetrical "L" shape structure to enable sealing contact with the sides of the substrate 200.

In the above implementation process, by setting the first surface 210 as the top surface of the substrate 200 and the side surface of the substrate 200, the radio frequency packaging structure can package more electronic elements 400, and the application scenario of the radio frequency packaging structure is increased.

In one possible implementation, the microstrip line 700 is soldered to the signal interface 500.

The microwave transmission line 700 may be directly welded to the signal interface 500, or may be welded by a welding material, and the welding manner of the microwave transmission line 700 and the signal interface 500 may be adjusted according to the actual situation, which is not particularly limited in this application.

The soldering material 900 includes gold-tin solder, tin-lead solder, pure copper solder, copper-zinc solder, and the like, and the soldering material 900 can be adjusted according to actual soldering requirements, and the application is not particularly limited.

In the above implementation process, since the welding has the advantages of good connection performance, good density, and the like, the connection strength and the tightness of the microwave transmission line 700 and the signal interface 500 can be improved by welding the microwave transmission line 700 and the signal interface 500.

In one possible implementation, the end 121 of the sidewall is welded to the first surface 210 of the substrate 200.

It will be appreciated that, due to the influence of the production process, the smoothness of the end 121 of the side wall and the first surface 210 of the substrate 200 may not reach the ideal state, and a certain gap may still exist between the end 121 of the side wall and the first surface 210 of the substrate 200 after the end 121 of the side wall contacts, thereby affecting the air tightness of the accommodating cavity 20. At this time, after the end 121 of the sidewall is in contact with the first surface 210 of the substrate 200, the end 121 of the sidewall may be welded to the first surface 210 of the substrate 200, so that a gap between the end 121 of the sidewall and the first surface 210 of the substrate 200 may be reduced, and the air tightness of the accommodating chamber 20 may be improved.

The connection of the end 121 of the sidewall to the first surface 210 of the substrate 200 may include laser welding, fusion welding, diffusion welding, etc. The welding mode can be adjusted according to actual conditions, and the welding mode is not particularly limited.

In the above implementation, by welding the end 121 of the sidewall with the first surface 210 of the substrate 200, the connection strength of the end 121 of the sidewall with the first surface 210 of the substrate 200 can be increased, the gap between the end 121 of the sidewall and the first surface 210 of the substrate 200 can be reduced, and the air tightness of the receiving chamber 20 can be improved. In addition, because the gold-tin solder has the advantages of low melting point, high strength, good thermal fatigue resistance and the like, the gold-tin solder can be used as the welding material 900 to improve the welding strength of the microwave transmission line 700 and the signal interface 500, can prevent fatigue fracture caused by temperature circulation, can be used even under the condition of severe climate change, and increases the use scene of the radio frequency packaging structure.

In one possible implementation, the microwave transmission line 700 is provided with a via 710; the signal interface 500 is soldered to the via 710 by a solder material.

It will be appreciated that when the microwave transmission line 700 is connected to the signal interface 500, the microwave transmission line 700 and the signal interface 500 may be welded together to enhance the connection strength of the microwave transmission line 700 and the signal interface 500. When the microwave transmission line 700 and the signal interface 500 are soldered, the microwave transmission line 700 and the signal interface 500 may be connected by a solder material after the solder material is placed in the via 710 to melt and solidify the solder material in the via 710.

In some embodiments, after the signal interface 500 is soldered to the via 710 through the soldering material, the end 121 of the sidewall of the package 100 and the first surface 210 of the substrate 200 may be in sealing contact to form the sealed accommodating cavity 20, and at this time, the end 121 of the sidewall of the package 100 and the first surface 210 of the substrate 200 need not be soldered.

In other embodiments, in some cases where the requirement for the air tightness of the electronic component 400 is high, after the signal interface 500 is soldered to the via 710 by using a soldering material, the end 121 of the sidewall of the package 100 and the first surface 210 of the substrate 200 may not meet the requirement for air tightness, and at this time, the end 121 of the sidewall of the package 100 may also be soldered to the first surface 210 of the substrate 200.

In the above implementation, the connection strength of the microwave transmission line 700 and the signal interface 500 may be enhanced by welding the via 710 of the microwave transmission line 700 and the signal interface 500 through a welding material. In addition, after the signal interface 500 is soldered to the via 710 through the soldering material, the end 121 of the sidewall of the package 100 and the first surface 210 of the substrate 200 may be in sealing contact to form the sealed accommodating cavity 20, so that the end 121 of the sidewall of the package 100 and the first surface 210 of the substrate 200 do not need to be soldered, and the cost of the radio frequency package structure can be reduced while simplifying the packaging process.

In one possible implementation, the electronic component 400 includes: silicon-based chips, compound chips, power chips, and passive devices.

The compound chip herein may include gallium arsenide chips, gallium phosphide chips, cadmium sulfide chips, and the like.

It should be understood that the electronic component 400 may further include a base chip, a communication chip, an interface chip, etc., and the electronic component 400 may be adjusted according to practical situations, which is not particularly limited in this application.

The passive devices may include resistors, inductors, resonators, filters, etc., and may be adjusted according to practical situations, which are not particularly limited in this application.

In the implementation process, the electronic element 400 is configured as multiple types of chips and passive devices, so that the radio frequency packaging structure can be used for packaging multiple radio frequency chips, and the application scenario of the radio frequency packaging structure is increased.

In one possible implementation manner, the embodiment of the application further provides a radio frequency device, including: the electronic component 400, the first pin 300, the second pin 600, and the rf package structure in the above embodiments.

Wherein the radio frequency package structure comprises a sealed receiving cavity 20, a first outer surface and a second outer surface; the first pin 300 is disposed on the first outer surface and the second pin 600 is disposed on the second outer surface; the electronic component 400 is disposed within the receiving chamber 20.

The first outer surface may be the outer surface 111 of the package and the second outer surface may be the bottom surface of the substrate 200.

In the implementation process, the radio frequency device adopts the radio frequency package structure, the radio frequency package structure sets the package 100 as a structure of a top plate 110 and a side wall 120, a cavity is formed between the side wall 120 and the top plate 110, and the electronic element 400 is disposed on the first surface 210 of the substrate 200, so that after the end 121 of the side wall of the package 100 contacts the first surface 210 of the substrate 200, a sealed accommodating cavity 20 can be formed, and the sealed accommodating cavity 20 is used for accommodating the electronic element 400 on the first surface 210 of the substrate 200, so that the tightness of the electronic element 400 in the radio frequency package structure is improved, and the reliability of the radio frequency device is further improved; meanwhile, the volume of the radio frequency device adopting the radio frequency packaging structure is reduced on the basis of improving the utilization rate of the packaging structure and ensuring effective signal transmission.

The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A radio frequency package structure, comprising: a package and a substrate;

the package includes a top plate and a sidewall disposed about the top plate;

an end of a side wall of the package is in sealing contact with the first surface of the substrate to form a sealed receiving cavity;

a first pin is arranged on the outer surface of the packaging piece;

the first surface of the substrate is configured to be provided with an electronic element and a signal interface; a second pin is arranged on the second surface of the substrate;

and a microwave transmission line is arranged in the side wall of the packaging piece and is electrically connected with the first pin, the electronic element, the second pin and the signal interface.

2. The radio frequency package structure according to claim 1, wherein a first signal transmission line is provided inside the top plate;

one end of the first signal transmission line is connected with the first pin, and the other end of the first signal transmission line is connected with the microwave transmission line.

3. The radio frequency package structure according to claim 1, wherein the substrate is internally provided with a second signal transmission line and a third signal transmission line;

one end of the second signal transmission line is connected with the signal interface, and the other end of the second signal transmission line is connected with the input end of the electronic element;

one end of the third signal transmission line is connected with the output end of the electronic element, and the other end of the third signal transmission line is connected with the second pin.

4. The radio frequency package structure of any of claims 1-3, wherein the first surface comprises a top surface of the substrate and the second surface comprises a bottom surface disposed opposite the top surface.

5. The radio frequency package structure of any of claims 1-3, wherein the first surface comprises a top surface of the substrate and a side surface of the substrate, and the second surface comprises a bottom surface disposed opposite the top surface.

6. A radio frequency package structure according to any one of claims 1-3, wherein the microwave transmission line is welded to the signal interface;

wherein the soldered material comprises gold-tin solder.

7. The radio frequency package structure of claim 6, wherein an end of the sidewall is soldered to the first surface of the substrate.

8. The radio frequency package structure according to claim 6, wherein the microwave transmission line is provided with a via hole;

the signal interface is welded with the via hole through a welding material.

9. A radio frequency package structure according to any of claims 1-3, wherein the electronic component comprises: silicon-based chips, compound chips, power chips, and passive devices.

10. A radio frequency device, comprising: an electronic component, a first pin, a second pin, and a radio frequency package structure of any of claims 1-9;

the radio frequency packaging structure comprises a sealed accommodating cavity, a first outer surface and a second outer surface;

the first pin is arranged on the first outer surface, and the second pin is arranged on the second outer surface;

the electronic component is disposed in the accommodation chamber.

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