CN206023708U - Package sealing with laser voltage-control oscillator module structure - Google Patents
Package sealing with laser voltage-control oscillator module structure Download PDFInfo
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- CN206023708U CN206023708U CN201621008484.5U CN201621008484U CN206023708U CN 206023708 U CN206023708 U CN 206023708U CN 201621008484 U CN201621008484 U CN 201621008484U CN 206023708 U CN206023708 U CN 206023708U
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- housing
- earthing rod
- control oscillator
- oscillator module
- package sealing
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Abstract
The utility model discloses a kind of package sealing with laser voltage-control oscillator module structure, the summit portion of housing caves inward and is formed with cavity, and the base section of cavity caves inward the deep gouge being formed with for mounting circuit boards；RF isolation is weldingly fixed in cavity, and the SMA adapters being arranged on the wall of housing side side can be matched fixation with RF isolation, and SMP adapters are weldingly fixed on the opposite side side wall on housing；Capping plate lid is located at the open upper and air-tight packaging of cavity, and the one end for feeding insulator and earthing rod is welded on the opposite side side wall of housing, and other end edge stretches out perpendicular to the direction of side wall；Wherein, earthing rod is one, and feed insulator is two, and earthing rod is arranged between two feed insulators.The package sealing with laser voltage-control oscillator module sealing structure is good, long service life, reliability high.
Description
Technical field
This utility model is related to microwave telecommunication devices, in particular it relates to package sealing with laser voltage-control oscillator module structure.
Background technology
Voltage controlled oscillator has just been communicated since its birth always, electronics, navigation, space flight and medical domain are played the part of emphatically
Role is wanted, especially in a communications system, is the important critical component of microwave circuit.
In recent years, with the fast development in communications electronics field, requirement more and more higher to electronic equipment, to VCO
This critical component of device is even more so.Therefore, it is badly in need of providing a kind of good airproof performance, long service life, reliability high laser
Sealing voltage-control oscillator module structure.
Utility model content
The purpose of this utility model is to provide a kind of package sealing with laser voltage-control oscillator module structure, and the package sealing with laser is voltage-controlled to shake
Swing device modular structure good airproof performance, long service life, reliability high.
To achieve these goals, this utility model provides a kind of package sealing with laser voltage-control oscillator module structure, including
Housing, RF isolation, SMA adapters, feed insulator, earthing rod, SMP adapters and capping plate；
The summit portion of housing caves inward and is formed with cavity, and the base section of cavity caves inward and is formed with for installing
The deep gouge of circuit board；
RF isolation is weldingly fixed in cavity, and the SMA adapters being arranged on the wall of housing side side can be with
RF isolation matches fixation, and SMP adapters are weldingly fixed on the opposite side side wall on housing；
Capping plate lid is located at the open upper and air-tight packaging of cavity, and the one end for feeding insulator and earthing rod is welded on shell
On the opposite side side wall of body, and other end edge stretches out perpendicular to the direction of side wall；Wherein,
Earthing rod is one, and feed insulator is two, and earthing rod is arranged between two feed insulators.
Preferably, on housing deep gouge, the installing hole of SMP adapters, the installing hole of RF isolation, feed insulator
Layer of metal silver is coated with the installing hole of installing hole and earthing rod, and is passed through on the outer surface of the remainder on housing
Conductive yellow is processed.
Preferably, four corners of capping plate are 1.5mm for the thickness of rounding and capping plate.
Preferably, the surface of capping plate is processed through conductive yellow.
Preferably, earthing rod is that two coaxially connected cylindrical members of head and the tail are constituted, the diameter of two cylindrical members
Of different sizes, wherein, the big cylindrical member of diameter is matched with the earthing rod installing hole on housing, the little cylindrical structure of diameter
Part is ground lead.
Preferably, the outer surface of earthing rod is coated with one layer of Gold plated Layer.
According to above-mentioned technical proposal, RF isolation in this utility model is welded on housing；SMA adapters and radio frequency
Insulator matches and passes through screw, packing ring, spring washer and is fixed on housing；SMP adapters are welded on housing；Feed insulator
It is welded on housing；Earthing rod is welded on housing；Capping plate completes air-tight packaging with housing by Laser Welding.Shell structure
Part is provided with 4 installation fixing threaded holes, and the installation for module is fixed；Shell structure part left side wall is provided with 1 SMP adapter and installs
Hole；Shell structure part right side wall is provided with the sub- installing hole of 1 RF isolation, and is provided with 2 SMA adapter installation screws；Housing is tied
Component lower wall is provided with 2 feed insulator installing holes and 1 earthing rod installing hole；The laser welding side wall of shell structure part
Thickness is 0.8mm, height 1.5mm；Shell structure part is provided with deep gouge structure, for mounting circuit boards.The laser being so designed that is close
Envelope voltage-control oscillator module sealing structure is good, long service life, reliability are high.
Other feature and advantage of the present utility model will be described in detail in subsequent specific embodiment part.
Description of the drawings
Accompanying drawing is further understood to of the present utility model for providing, and constitutes a part for description, and following
Specific embodiment be used for together explaining this utility model, but do not constitute to restriction of the present utility model.In the accompanying drawings：
Fig. 1 is the package sealing with laser voltage-control oscillator module structure in a kind of embodiment according to this utility model offer
Front view；
Fig. 2 is the package sealing with laser voltage-control oscillator module structure in a kind of embodiment according to this utility model offer
Side view.
Description of reference numerals
1- housing 2- RF isolations
3-SMA adapters 4- feeds insulator
5- earthing rod 6-SMP adapters
7- covers plate
Specific embodiment
Specific embodiment of the present utility model is described in detail below in conjunction with accompanying drawing.It should be appreciated that herein
Described specific embodiment is merely to illustrate and explains this utility model, is not limited to this utility model.
In this utility model, in the case where contrary explanation is not made, " inside and outside " etc. is only included in the noun of locality in term
Represent orientation of the term under normal service condition, or be skilled artisan understands that be commonly called as, and be not construed as to this
The restriction of term.
Referring to Fig. 1, this utility model provides a kind of package sealing with laser voltage-control oscillator module structure, exhausted including housing 1, radio frequency
Edge 2, SMA adapters 3, feed insulator 4, earthing rod 5, SMP adapters 6 (as shown in Figure 2) and capping plate 7；
The summit portion of housing 1 caves inward and is formed with cavity, and the base section of cavity caves inward and is formed with for pacifying
The deep gouge of device, circuit board；
RF isolation 2 is weldingly fixed in cavity, and the SMA adapters 3 being arranged on 1 side side wall of housing can
Match fixation with RF isolation 2, SMP adapters 6 are weldingly fixed on the opposite side side wall on housing 1；
The capping lid of plate 7 is located at the open upper and air-tight packaging of cavity, and the one end for feeding insulator 4 and earthing rod 5 is welded
On the opposite side side wall of housing 1, and other end edge stretches out perpendicular to the direction of side wall；Wherein,
Earthing rod 5 is one, and feed insulator 4 is two, and earthing rod 5 is arranged between two feed insulators 4.
By above-mentioned technical proposal, RF isolation 2 is welded on housing 1；SMA adapters 3 and RF isolation 2 phases of son
Match somebody with somebody and pass through screw, packing ring, spring washer to be fixed on housing 1；SMP adapters 6 are welded on housing 1；Feed insulator 4 is welded on
On housing 1；Earthing rod 5 is welded on housing 1；Capping plate 7 completes air-tight packaging with housing 1 by Laser Welding.1 structure of housing
Part is provided with 4 installation fixing threaded holes, and the installation for module is fixed；1 structural member left side wall of housing is provided with 1 SMP adapter 6 pacifies
Dress hole；1 structural member right side wall of housing is provided with 1 RF isolation 2 installing hole of son, and is provided with 23 installation screws of SMA adapters；Shell
1 structural member lower wall of body is provided with 2 feed 4 installing holes of insulator and 15 installing hole of earthing rod；The laser of 1 structural member of housing
Welding edge wall thickness is 0.8mm, height 1.5mm；1 structural member of housing is provided with deep gouge structure, for mounting circuit boards.It is so designed that
Package sealing with laser voltage-control oscillator module sealing structure is good, long service life, reliability are high.
In the present embodiment, in order to improve the mechanical strength of each parts of package sealing with laser voltage-control oscillator module structure
And metallicity, it is preferable that the deep gouge, the installing hole of SMP adapters 6, the installing hole of RF isolation 2, feed insulation on housing 1
Layer of metal silver, and the appearance of remainder housing 1 on are coated with the installing hole of the installing hole and earthing rod 5 of son 4
Process through conductive yellow on face.
Assemble for convenience, prevent each parts of package sealing with laser voltage-control oscillator module structure from mutually scratching in assembling
Impaired, four corners of preferably capping plate 7 are 1.5mm for the thickness of rounding and capping plate 7.
Additionally, in order that the raising of aluminum alloy surface corrosion resistance, increases the reliability of product, it is preferable that capping plate 7
Surface is processed through conductive yellow.
Earthing rod 5 is two coaxially connected cylindrical member compositions of head and the tail, and the diameter of two cylindrical members is not
With wherein, the big cylindrical member of diameter is matched with 5 installing hole of earthing rod on housing 1, and the little cylindrical member of diameter is
Ground lead.
In order to improve the weldability of earthing rod 5, it is preferable that the outer surface of earthing rod 5 is coated with one layer of Gold plated Layer.
Preferred implementation of the present utility model is described in detail above in association with accompanying drawing, but, this utility model is not limited
Detail in above-mentioned embodiment, in range of the technology design of the present utility model, can be to skill of the present utility model
Art scheme carries out multiple simple variants, and these simple variants belong to protection domain of the present utility model.
It is further to note that each particular technique feature described in above-mentioned specific embodiment, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, this utility model is to each
Plant possible compound mode no longer separately to illustrate.
Additionally, combination in any can also be carried out between a variety of embodiments of the present utility model, as long as which is not disobeyed
Thought of the present utility model is carried on the back, which should equally be considered as content disclosed in the utility model.
Claims (6)
1. a kind of package sealing with laser voltage-control oscillator module structure, it is characterised in that including housing (1), RF isolation (2), SMA
Adapter (3), feed insulator (4), earthing rod (5), SMP adapters (6) and capping plate (7)；
The summit portion of housing (1) caves inward and is formed with cavity, and the base section of the cavity caves inward and is formed with
Deep gouge for mounting circuit boards；
RF isolation (2) is weldingly fixed in the cavity, and the institute being arranged on the wall of the housing (1) side side
State SMA adapters (3) to match fixation with RF isolation (2), SMP adapters (6) are weldingly fixed on institute
State on the opposite side side wall on housing (1)；
Capping plate (7) lid is located at the cavity open upper and air-tight packaging, feed insulator (4) and earthing rod
(5) one end is welded on the opposite side side wall of the housing (1), and the other end along perpendicular to the direction of side wall to extension
Stretch；Wherein,
Described earthing rod (5) are one, and feed insulator (4) is two, and earthing rod (5) are arranged on two feedbacks
Between electric(al) insulator (4).
2. package sealing with laser voltage-control oscillator module structure according to claim 1, it is characterised in that on housing (1)
The deep gouge, the installing hole of the SMP adapters (6), the RF isolation installing hole of (2), the feed insulator
(4) layer of metal silver is coated with installing hole and the installing hole of the earthing rod (5), and its on the housing (1)
Process through conductive yellow on the outer surface of remaining part point.
3. package sealing with laser voltage-control oscillator module structure according to claim 1, it is characterised in that capping plate (7)
Four corners be the thickness of rounding and the capping plate (7) be 1.5mm.
4. package sealing with laser voltage-control oscillator module structure according to claim 3, it is characterised in that capping plate (7)
Surface process through conductive yellow.
5. package sealing with laser voltage-control oscillator module structure according to claim 1, it is characterised in that earthing rod (5)
Constitute for two coaxially connected cylindrical members of head and the tail, the diameter of described two cylindrical members is different, wherein, diameter
The big cylindrical member is matched with earthing rod (5) installing hole on the housing (1), the little described cylindrical structure of diameter
Part is ground lead.
6. package sealing with laser voltage-control oscillator module structure according to claim 5, it is characterised in that earthing rod (5)
Outer surface be coated with one layer of Gold plated Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621008484.5U CN206023708U (en) | 2016-08-31 | 2016-08-31 | Package sealing with laser voltage-control oscillator module structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621008484.5U CN206023708U (en) | 2016-08-31 | 2016-08-31 | Package sealing with laser voltage-control oscillator module structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206023708U true CN206023708U (en) | 2017-03-15 |
Family
ID=58256291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621008484.5U Active CN206023708U (en) | 2016-08-31 | 2016-08-31 | Package sealing with laser voltage-control oscillator module structure |
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| CN (1) | CN206023708U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107271976A (en) * | 2017-06-21 | 2017-10-20 | 安徽华东光电技术研究所 | The preparation method of S-band frequency synthesizer |
| CN107745167A (en) * | 2017-09-19 | 2018-03-02 | 安徽华东光电技术研究所 | A kind of preparation method of the oscillator module of multifrequency point |
| CN108873191A (en) * | 2018-06-25 | 2018-11-23 | 重庆霓扬科技有限责任公司 | A kind of integrated microwave photon device package casing |
| CN108873190A (en) * | 2018-06-25 | 2018-11-23 | 重庆霓扬科技有限责任公司 | A kind of integrated opto-electronic receiver module and its production technology containing low-noise amplifier |
-
2016
- 2016-08-31 CN CN201621008484.5U patent/CN206023708U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107271976A (en) * | 2017-06-21 | 2017-10-20 | 安徽华东光电技术研究所 | The preparation method of S-band frequency synthesizer |
| CN107745167A (en) * | 2017-09-19 | 2018-03-02 | 安徽华东光电技术研究所 | A kind of preparation method of the oscillator module of multifrequency point |
| CN108873191A (en) * | 2018-06-25 | 2018-11-23 | 重庆霓扬科技有限责任公司 | A kind of integrated microwave photon device package casing |
| CN108873190A (en) * | 2018-06-25 | 2018-11-23 | 重庆霓扬科技有限责任公司 | A kind of integrated opto-electronic receiver module and its production technology containing low-noise amplifier |
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