CN108870340B - Heat radiation structure - Google Patents
Heat radiation structure Download PDFInfo
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- CN108870340B CN108870340B CN201810371178.5A CN201810371178A CN108870340B CN 108870340 B CN108870340 B CN 108870340B CN 201810371178 A CN201810371178 A CN 201810371178A CN 108870340 B CN108870340 B CN 108870340B
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- heat dissipation
- heat
- air
- plate
- heat dissipating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V25/00—Safety devices structurally associated with lighting devices
- F21V25/10—Safety devices structurally associated with lighting devices coming into action when lighting device is overloaded, e.g. thermal switch
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
- F21V29/673—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for intake
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The present invention relates to a heat dissipation structure. The heat radiation structure includes: the heat dissipation device comprises a shell, a heat dissipation plate, two limiting blocks, a plurality of heat dissipation bodies and a micro fan, wherein the shell is provided with a through heat dissipation through hole, and the shell is also provided with limiting grooves at two opposite sides of the heat dissipation through hole; the shell is also provided with an accommodating groove and a heat dissipation channel, and the accommodating groove is communicated with the heat dissipation through hole through the heat dissipation channel; the radiating plate is covered with a radiating through hole; the two limiting blocks are respectively arranged on two sides of the heat dissipation plate, and each limiting block is correspondingly embedded in one limiting groove; the plurality of heat dissipation bodies are arranged on the heat dissipation plate and are accommodated in the heat dissipation through holes; the micro fan is installed in the accommodating groove, and the input end of the micro fan faces the heat dissipation channel. The heat dissipation structure can quickly dissipate and conduct heat to the outside, and effectively improves the heat dissipation efficiency.
Description
Technical Field
The invention relates to the technical field of lamp heat dissipation, in particular to a heat dissipation structure.
Background
The heat dissipation structure is often used for heat dissipation of a lamp, and particularly for heat dissipation of an LED lamp. Because the LED lamp generates a large amount of heat during working, the heat accumulation will affect the service life of the lamp wick in the LED lamp. It is therefore desirable to quickly dissipate heat that has collected inside the LED lamp to the outside.
However, the existing heat dissipation structure often cannot well dissipate heat accumulated inside the LED lamp to the outside, which seriously affects the lighting effect and the service life of the LED lamp, and the reason for this is that the design of the heat dissipation structure of the existing LED lamp is not reasonable, resulting in low heat dissipation efficiency of the LED lamp.
Disclosure of Invention
Therefore, it is necessary to provide a heat dissipation structure for improving the heat dissipation efficiency.
A heat dissipation structure includes: the heat dissipation device comprises a shell, a heat dissipation plate, two limiting blocks, a plurality of heat dissipation bodies and a micro fan, wherein the shell is provided with a through heat dissipation through hole, and the shell is also provided with limiting grooves at two opposite sides of the heat dissipation through hole; the shell is also provided with an accommodating groove and a heat dissipation channel, and the accommodating groove is communicated with the heat dissipation through port through the heat dissipation channel; the heat dissipation plate covers the heat dissipation through hole; the two limiting blocks are respectively arranged on two sides of the heat dissipation plate, and each limiting block is correspondingly embedded in one limiting groove; the plurality of heat dissipation bodies are arranged on the heat dissipation plate and are accommodated in the heat dissipation through holes; the micro fan is installed in the accommodating groove, and an input end of the micro fan faces the heat dissipation channel.
In one embodiment, the housing is a rectangular parallelepiped structure.
In one embodiment, the heat dissipating through-openings have a rectangular cross-section.
In one embodiment, the retaining groove has a rectangular cross-section.
In one embodiment, the length of the limiting groove is smaller than that of the heat dissipation through opening.
In one embodiment, the heat dissipation plate has a rectangular parallelepiped structure.
In one embodiment, the heat dissipation plate and the heat dissipation through opening are mutually matched.
In one embodiment, the limiting block is of a cuboid structure.
In one embodiment, the limiting block and the limiting groove are matched with each other.
In one embodiment, the heat dissipation plate and the two limit blocks are integrally formed.
According to the heat dissipation structure, the shell, the heat dissipation plate and the two limiting blocks are used for forming the heat dissipation structure with a compact structure, and the heat dissipation plate is used for mounting the LED lamp panel, so that heat generated by the LED lamp panel is conducted to the heat dissipation plate and then conducted to the heat dissipation body; and the miniature fan is used for absorbing heat in the heat dissipation body through the heat dissipation channel and enabling air-cooled air to overflow into the heat dissipation body under the action of negative pressure during working, so that the heat can be quickly dissipated and conducted to the outside through air-cooled air entering and dual heat dissipation driving of heat flowing out from the heat dissipation channel when the temperature of the heat dissipation body rises, and the heat dissipation efficiency is effectively improved in a forced heat dissipation mode through the increase of the miniature fan.
Drawings
FIG. 1 is a schematic diagram of a heat dissipation structure according to an embodiment;
FIG. 2 is a schematic view of an embodiment of a disassembled heat dissipation structure;
fig. 3 is a disassembled structural diagram of a heat dissipation structure in another embodiment.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
For example, a heat dissipation structure comprises a shell, a heat dissipation plate, two limiting blocks, a plurality of heat dissipation bodies and a micro fan, wherein the shell is provided with a penetrating heat dissipation through opening, and the shell is also provided with limiting grooves on two opposite sides of the heat dissipation through opening; the shell is also provided with an accommodating groove and a heat dissipation channel, and the accommodating groove is communicated with the heat dissipation through port through the heat dissipation channel; the heat dissipation plate covers the heat dissipation through hole; the two limiting blocks are respectively arranged on two sides of the heat dissipation plate, and each limiting block is correspondingly embedded in one limiting groove; the plurality of heat dissipation bodies are arranged on the heat dissipation plate and are accommodated in the heat dissipation through holes; the micro fan is installed in the containing groove, the input end of the micro fan faces the heat dissipation channel, namely the air inlet end of the micro fan faces the heat dissipation channel, the air outlet end of the micro fan deviates from the heat dissipation channel, and when the micro fan is started, hot air of the heat dissipation channel is drawn out from the heat dissipation channel by the micro fan.
In this way, a radiating structure with a compact structure is formed by the shell, the radiating plate and the two limiting blocks, the radiating plate is used for installing the LED lamp panel, and therefore heat generated by the LED lamp panel is conducted to the radiating plate and then conducted to the radiating body; and the miniature fan is used for absorbing heat in the heat dissipation body through the heat dissipation channel and enabling air-cooled air to overflow into the heat dissipation body under the action of negative pressure during working, so that the heat can be quickly dissipated and conducted to the outside when the temperature of the heat dissipation body rises through the entering of the air-cooled air and the dual heat dissipation driving of the heat flowing out from the heat dissipation channel, and the heat dissipation efficiency is effectively improved.
In one embodiment, the housing is a rectangular parallelepiped structure. The heat dissipation through opening has a rectangular cross section. The limiting groove is provided with a rectangular cross section. The length of the limiting groove is smaller than that of the heat dissipation through opening. The heat dissipation plate is of a cuboid structure. The heat dissipation plate is matched with the heat dissipation through hole. The limiting block is of a cuboid structure. The limiting block is matched with the limiting groove. The heat dissipation plate and the two limiting blocks are integrally formed. So that the heat dissipation structure is relatively compact, reasonable and orderly.
To further explain the above heat dissipation structure, so as to fully disclose the structure and principle of the heat dissipation structure, please refer to fig. 1, fig. 2 and fig. 3 for further explanation of the structure and principle of the heat dissipation structure.
For example, a heat dissipation structure 10 includes: the heat dissipation device comprises a shell 100, a heat dissipation plate 200, two limit blocks 300, a plurality of heat dissipation bodies 400 and a micro fan 500. The housing 100 may be made of aluminum alloy, or may be made of aluminum alloy and plastic. The casing 100 is used for providing a mounting support function, and is used for collectively mounting the heat dissipation plate 200, the two limit blocks 300, the plurality of heat dissipation bodies 400 and the micro fan 500; meanwhile, the housing 100 is also used to be mounted externally to implement a lighting function in combination with the LED lamp panel. The heat dissipation plate 200 may be made of an aluminum alloy material, or may be made of an aluminum alloy and plastic. The heat dissipation plate 200 is used for installing an LED lamp panel, namely a PCB (printed Circuit Board) integrated with LED lamp beads, so that heat generated by the LED lamp panel during working can be conducted to the outside through the heat dissipation plate 200. The two limiting blocks 300 can be made of aluminum alloy materials or can be formed by compounding aluminum alloy and plastic. The two stoppers 300 are mainly used for cooperating with the heat sink 200 to fix the heat sink 200 on the housing 100. The heat sink 400 is made of an aluminum alloy material, and absorbs and conducts heat conducted from the heat sink 200. The micro fan 500 serves to blow air toward the case 100 to dissipate heat accumulated in the heat radiator 400.
The housing 100 is opened with a heat dissipating through-hole 110. For example, the heat dissipating ports 110 have a rectangular cross-section, and for example, the heat dissipating ports 110 have a circular cross-section, which facilitates mold-open production. The housing 100 further has a limiting groove 120 formed on two opposite sides of the heat dissipating through-hole 110. For example, the restraint slot 120 has a rectangular cross-section. The limiting groove 120 is communicated with the heat dissipation port 110. In other words, the housing 100 is formed with the limiting groove 120 and the heat dissipating through-hole 110 communicating with each other, and the limiting groove 120 and the heat dissipating through-hole 110 communicate with each other as a whole. In this embodiment, the length of the limiting groove 120 is smaller than the length of the heat dissipating port 110, so that the limiting groove 120 with a shorter length is disposed outside the heat dissipating port 110, so as to facilitate the installation of the two limiting blocks 300 and further fix the heat dissipating plate 200.
For example, the case 100 has a rectangular parallelepiped structure; as another example, the housing 100 is a cube; as another example, the housing 100 has a triangular prism structure. Preferably, the housing 100 has a rectangular parallelepiped structure. The housing 100 has a receiving groove 130 and a heat dissipating channel 140, the receiving groove 130 is communicated with the heat dissipating port 110 through the heat dissipating channel 140, so that the receiving groove 130, the heat dissipating channel 140 and the heat dissipating port 110 are communicated with each other, so that air can circulate in the receiving groove 130, the heat dissipating channel 140 and the heat dissipating port 110, and the heat collected in the heat dissipating port 110 can be taken away in time.
For example, the heat sink 200 has a rectangular parallelepiped structure. The heat dissipation plate 200 covers the heat dissipation opening 110. For example, the heat dissipation plate 200 and the heat dissipation port 110 are engaged with each other. That is to say, the length and width of the heat dissipation plate 200 are equal to the length and width of the heat dissipation through holes 110, so that the heat dissipation plate 200 completely covers the heat dissipation through holes 110, and after the heat dissipation plate 200 completely covers the heat dissipation through holes 110, the surface of the heat dissipation plate 200 is flush with the surface where the edges of the heat dissipation through holes 110 are located, thereby making the whole structure more compact, reasonable and orderly. In this embodiment, the heat dissipation plate 200 is a plate-shaped structure made of an aluminum alloy material.
For facilitating the mounting of the LED lamp panel, for example, the heat dissipation plate is provided with a fixing groove in which the LED lamp panel is disposed. For example, the LED lamp panel is welded in the fixing groove; in another example, the LED lamp panel is printed and disposed in the fixing groove. For example, the fixing groove is provided on a surface of the heat dissipating plate facing away from the heat dissipating through hole. It can be understood that the shape structure of the fixing groove can be the same as that of the LED lamp panel, and therefore the LED lamp panel can be conveniently installed. So, the heat that produces when the work behind the LED lamp plate access external power source can be quick conduct to the LED lamp plate and do not influence thermal conductivity.
For example, the stopper 300 has a rectangular parallelepiped structure. For example, the heat dissipation plate 200 is integrally formed with the two stoppers 300. The two stoppers 300 are respectively disposed on two sides of the heat dissipation plate 200, and each stopper 300 is correspondingly embedded in one of the stopper grooves 120. The limiting block 300 is engaged with the limiting groove 120. In order to quickly mount and dismount the heat dissipation plate 200, for example, the end of the limiting groove 120 is provided with a clamping protrusion 121, the end of the limiting block 300 is correspondingly provided with a clamping groove 310, and the clamping protrusion 121 is clamped in the clamping groove 310. For example, both ends of spacing groove 120 are provided with the block arch 121 respectively, the both ends of stopper 300 correspond respectively and have been seted up block recess 310, can utilize block arch 121 and block recess 310's block to be connected like this, can be fixed stopper 300 card income under the effect of exerting external force a little fast in an installation, and can take out stopper 300 from spacing groove 120 fast under the effect of exerting external force a little at a dismantlement in-process, so realized quick installation and dismantlement stopper 300, its essence is indirect quick installation of having realized and dismantles heating panel 200, thereby production efficiency has been improved.
The plurality of heat sinks 400 are mounted on the heat sink 200 and are received in the heat dissipating through holes 110. For example, the plurality of heat sinks 400 are uniformly distributed on the heat dissipation plate 200, and all of the heat sinks 400 are received in the heat dissipation openings 110. It can be understood that the depth of the heat dissipating through holes 110 is large enough to accommodate all of the heat sinks 400, and therefore, in the embodiment, the depth of the heat dissipating through holes 110 is greater than or equal to the sum of the height of the heat dissipating plate 200 and the height of the heat sinks 400. In order to prevent heat of the heat sink 200 from being accumulated due to heat loss during the heat of the heat sink 200 is transferred to the heat sink 400, for example, the heat sink 400 and the heat sink 200 are integrally formed. Specifically, the heat sink 400 includes a heat slug 410 and a plurality of heat dissipation studs 420, the heat slug 410 is connected to the heat sink 200, and the plurality of heat dissipation studs 420 are disposed on the heat slug 410. For example, the heat dissipation block 410 is integrally formed with the heat dissipation plate 200. For improving the radiating efficiency, the quantity of radiator is corresponding with the quantity of the lamp pearl on the LED lamp plate, and each lamp pearl corresponds a radiator, that is to say, when the quantity of the lamp pearl on the LED lamp plate is five, the quantity of radiator also corresponds to five, and, the radiator corresponds the setting with lamp pearl on the LED lamp plate mutually back on the body, the radiator has increased the heat dissipation plate thickness like this, the increase of knowing thickness can absorb more heat, so make the heat that the lamp pearl on the LED lamp plate produced can be absorbed by the radiator by a large amount of fast, it is specific to further absorb by a plurality of heat dissipation posts after being absorbed by the radiating block and give off to the outside.
The micro fan 500 is mounted in the receiving groove 130, and an input end of the micro fan 500 faces the heat dissipation channel 140. For example, the receiving groove 130 is disposed at a side of the heat dissipating port 110; preferably, the receiving groove 130 is provided inside the housing 100. In other embodiments, the receiving groove 130 may be a semi-closed cavity located inside the housing 100. In this embodiment, the micro fan 500 is a customized fan, and the overall appearance and volume thereof is processed to be suitable for the size of the accommodating slot 130, and only the function of rotating and blowing air is retained. The micro fan 500 is connected with an external power supply through a wire, so that when the micro fan 500 works, the input end of the micro fan 500 facing the heat dissipation channel 140 draws out air of the heat dissipation port 110, so that a space with relatively small air pressure is formed in the heat dissipation port 110, the space with relatively small air pressure can more stably and firmly cover the heat dissipation plate 200 on the heat dissipation port 110 under the action of atmospheric pressure, on the other hand, external air can enter the heat dissipation port 110 through a gap between the heat dissipation plate 200 and the housing 100, preferably, an air inlet channel is formed between the heat dissipation plate 200 and the housing 100, so that external cold air can enter the heat dissipation port 110 to absorb heat and the air heated under the action of the micro fan is sent out to the outside, thus forming a circulating air flow channel, and thus, the temperature of the heat dissipation channel 140 can be forcibly and rapidly reduced, thereby improving the heat dissipation efficiency of the heat dissipation plate 200.
Above-mentioned heat radiation structure is used for forming compact structure's heat radiation structure through casing 100, heating panel 200 and two stopper 300, and heating panel 200 is used for installing the LED lamp plate, and the heat that the LED lamp plate produced like this will conduct to heating panel 200 and get into the conduction to in radiator 400. And, the micro fan 500 is used for absorbing heat in the heat sink through the heat dissipation channel 140 and allowing air-cooled air to overflow into the heat sink under the action of negative pressure during operation, so that under the dual heat dissipation driving of air-cooled air entering and heat flowing out from the heat dissipation channel 140, when the temperature of the heat sink 400 rises, heat can be quickly dissipated and conducted to the outside, and thus the heat dissipation efficiency is effectively improved in a forced heat dissipation manner by adding the micro fan 500.
For example, the housing 100 is opened with a screw hole 150, and the housing 100 is mounted on the outer shell of the external light fixture through the screw hole 150. For example, the number of the screw holes 150 is two, and the two screw holes 150 are respectively provided at both sides of the housing 100. In this embodiment, two screw holes 150 are respectively disposed at two opposite corner regions of the housing 100. It can be understood that, after the housing 100 is installed on the housing of the external lamp through the threaded hole 150, the bottom of the heat dissipating through hole 110 is blocked, so that the heat dissipating through hole 110 forms a relatively closed space under the covering function of the heat dissipating plate 200, and of course, because the bottom of the heat dissipating through hole 110 is blocked and the covering function of the heat dissipating plate 200 does not completely seal the heat dissipating through hole 110, under the function of the micro fan 500, the external air can still enter the heat dissipating through hole 110, so as to achieve an efficient heat dissipating effect.
Further, in order to improve the heat dissipation efficiency, the micro fan comprises an upper micro fan and a lower micro fan, and the upper micro fan and the lower micro fan are respectively arranged at the top and the bottom of the shell. For example, the casing comprises a heat dissipation inner casing, a first built-in absorber plate, a second built-in absorber plate, an upper air guiding bent portion, a lower air guiding bent portion, an air inlet port, an air guiding guide groove, an upper air gathering cavity, a ventilation perforation, a middle air gathering cavity, a lower air gathering cavity, a reinforcing block, a heat dissipation fixing column, at least two positioning fixing portions and an air exhaust outlet. For example, the heat dissipation inner shell, the first internal heat absorption plate, the second internal heat absorption plate, the upper wind guiding bending portion, the lower wind guiding bending portion, the air inlet port, the wind guiding channel, the upper wind gathering cavity, the ventilation through hole, the middle wind gathering cavity, the lower wind gathering cavity, the reinforcing block, the heat dissipation fixing column, the at least two positioning fixing portions, the air exhaust outlet and the like are integrally formed by aluminum casting. In this embodiment, the heat dissipation inner casing is a wall of the accommodating groove. For example, the first and second built-in absorber plates are oppositely disposed. In this embodiment, the first internal heat absorbing plate and the second internal heat absorbing plate are arranged in parallel. For example, the housing includes two fixing portions respectively disposed near the top and the bottom of the heat dissipation inner housing. The upper air gathering cavity, the middle air gathering cavity and the lower air gathering cavity are communicated with each other. It can be understood that, in order to further improve the heat dissipation efficiency, the casing is provided with above-mentioned structure respectively in the both sides of heat dissipation opening, and miniature fan also corresponds the setting. Both sides can work simultaneously like this, have greatly improved the radiating efficiency.
For example, the heat dissipation inner shell is hollow cuboid structure, and the air inlet opening intercommunication heat dissipation channel for absorb the heat in the heat dissipation opening through heat dissipation channel. For example, the appearance of heat dissipation inner shell is square cavity frame body, adopts rigid plastic to make, and the hollow inside of heat dissipation inner shell is separated by two fixed part and is set into three plenum respectively by last to down in vertical direction: the upper wind gathering cavity, the middle wind gathering cavity and the lower wind gathering cavity are communicated through the ventilation through holes, and the lower wind gathering cavity is communicated with the middle wind gathering cavity through the lower miniature fan, so that the heat of the shell can be taken out of the environment outside the shell in an air cooling mode after the upper wind gathering cavity, the middle wind gathering cavity and the lower wind gathering cavity are communicated with each other and ventilate.
For example, the first built-in absorber plate, the second built-in absorber plate, the upper micro fan, the lower micro fan, the upper wind guiding bending portion, the lower wind guiding bending portion, the reinforcing block, the wind guiding groove, the heat dissipation fixing column, and the positioning fixing portion are disposed inside the heat dissipation inner shell. For example, the positioning fixing part close to the top of the heat dissipation inner shell and the top of the heat dissipation inner shell form the upper wind gathering cavity. For example, the positioning fixing part close to the bottom of the heat dissipation inner shell and the bottom of the heat dissipation inner shell form the lower wind gathering cavity. For example, the middle air collecting cavity is formed between the positioning fixing part close to the bottom of the heat dissipation inner shell and the heat dissipation fixing column.
It can be understood that a plurality of radiators have absorbed the heat of the LED lamp panel and the air in the heating heat dissipation opening forms hot-blastly, consequently in order to control by hot-blastly from the overhead wind chamber that gathers that heat dissipation channel gets into to through in put gather wind chamber by first built-in absorber plate and the built-in absorber plate absorption heat back of second, a small part of hot-blastly from the overhead wind chamber of gathering flows, for example, air inlet opening, induced air guide slot, overhead micro fan and last wind-guiding flexion etc. set up in overhead wind chamber of gathering. For example, the air inlet opening is opened in a lateral wall of the overhead air gathering chamber, and a plurality of grids arranged in an array manner are further arranged along the periphery of the air inlet opening in an extending manner and used for preventing cockroaches, mosquitoes and the like from entering the air inlet opening. Correspondingly, the overhead micro fan is arranged on the other side wall of the overhead air gathering cavity of the relative air inlet port, an induced air guide groove is formed between the overhead micro fan and the air inlet port through a plastic plate, namely the induced air guide groove is communicated with the air inlet port, the induced air guide groove is arranged in a sealing mode, and the induced air guide groove is only communicated with the overhead micro fan and the air inlet port. Therefore, when the upper miniature fan works, the pressure intensity of the induced air guide groove on the two sides of the upper miniature fan and the air inlet opening is unequal, and the pressure intensity of the induced air guide groove on the side of the upper miniature fan is smaller than the pressure intensity of the induced air guide groove on the side of the air inlet opening, so that the air inlet opening can continuously feed hot air for the upper miniature fan to dissipate heat. In order to facilitate rapid flowing to the ventilation perforation, for example, an upper air guiding bending portion is further disposed on an inner side wall of the upper air gathering chamber, the inner side wall is close to one side of the upper micro fan, the upper air guiding bending portion is made of an aluminum alloy material, and the upper air guiding bending portion is a portion with an arc-shaped surface or a hemispherical or circular arc-shaped groove, the inner surface of the portion with the arc-shaped surface or the hemispherical or circular arc-shaped groove is rough, and a hemispherical or circular arc-shaped opening of the portion faces the ventilation perforation, so that when the upper micro fan works, hot air blows towards the upper air guiding bending portion, partial heat can be absorbed by the rough surface, and the hot air continues to turn back to the ventilation perforation while being absorbed by the upper air guiding bending portion and flows to.
For example, cold air enters the upper air gathering cavity, passes through the ventilation perforation and then enters the middle air gathering cavity. Two positioning fixing parts which are positioned on the lower side of the upper wind gathering cavity inside the heat dissipation inner shell form the middle wind gathering cavity, for example, the positioning fixing parts are of plate-shaped structures and are made of aluminum alloy materials. In addition, the first built-in heat absorbing plate is mounted on the positioning fixing part close to one side of the upper air gathering cavity, and the first built-in heat absorbing plate is further connected with the second built-in heat absorbing plate through the reinforcing block so as to reinforce the relative fixing positions of the first built-in heat absorbing plate and the second built-in heat absorbing plate. In order to enhance the heat washing effect of the first internal heat absorbing plate, the first internal heat absorbing plate is made of sheet aluminum alloy, for example, the first internal heat absorbing plate made of sheet aluminum alloy is formed into a disc-shaped structure by a winding processing mode. For example, the structure of the first internal heat absorbing plate can be made of a hollow double-ring winding structure, a double-layer winding structure, a single-layer disc winding structure, and the like. Preferably, the first built-in heat absorption plate with a double-layer winding structure and high-efficiency heat absorption of the flaky aluminum alloy is adopted, so that the heat absorption efficiency of the first built-in heat absorption plate is improved, and the heat dissipation efficiency is further improved.
It can be understood, for make LED lamp plate and the outside circular telegram of installing on the heating panel, the casing is provided with the wire, the casing be provided with wire electric connection's power input end, be used for inserting external power source, the wire is used for bridging external power source and LED lamp plate, consequently, in order to promote the security performance of casing, the built-in absorber plate of second still is provided with the fuse, for example, the fuse includes the fuse, for example, the fuse is installed at power input end, make when the electric current of installing the LED lamp plate on the heating panel is unusual. For example, when the voltage rises or the current is overloaded, the fuse fuses to cut off the electrical connection between the power supply and the LED lamp panel installed on the heat dissipation plate, so that the safe operation of the circuit is ensured. For example, install the LED lamp plate on the heating panel and still be provided with safety switch, for example, safety switch includes that two kinds of expend with heat and contract with cold different sheetmetals of coefficient press the bimetallic strip of making together, for example, be provided with power button switch in the effect scope of the deformation of bimetallic strip, bimetallic strip effect is at power button switch when bimetallic strip is heated and takes place deformation, when the LED lamp plate of installing on the heating panel leads to the high temperature because of the heat dissipation is bad promptly, safety switch can the power failure to guarantee circuit safety operation.
For example, the heat flowing through the middle air-gathering cavity is partially absorbed, and the other part of the heat flows from the middle air-gathering cavity to the lower air-gathering cavity through the lower micro-fan under the action of the pressure difference of the air flow. Namely, when the lower miniature fan works, the pressure difference is generated between the middle air gathering cavity and the lower air gathering cavity, and under the action of the pressure difference, hot air in the middle air gathering cavity flows to the lower air gathering cavity. It can be understood that the lower wind gathering cavity is composed of a positioning fixing part at the bottom of the middle wind gathering cavity and the bottom of the shell. After the hot air flow of the middle air gathering cavity enters the lower air gathering cavity, the hot air flows to the exhaust outlet under the action of the lower air guide bending part, and finally the hot air flow with heat is exhausted out of the shell through the exhaust outlet. Therefore, the heat gathered by the heat dissipation body can be quickly and efficiently dissipated to the outside, and the heat dissipation efficiency is greatly improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A heat dissipation structure, comprising:
the shell is provided with a through heat dissipation port, and the shell is also provided with limiting grooves at two opposite sides of the heat dissipation port; the shell is also provided with an accommodating groove and a heat dissipation channel, and the accommodating groove is communicated with the heat dissipation through port through the heat dissipation channel;
the heat dissipation plate is covered with the heat dissipation through hole;
the two limiting blocks are respectively arranged on two sides of the heat dissipation plate, and each limiting block is correspondingly embedded in one limiting groove;
the plurality of heat dissipation bodies are arranged on the heat dissipation plate and are accommodated in the heat dissipation through holes;
the micro fan is arranged in the accommodating groove, and the input end of the micro fan faces the heat dissipation channel; the micro fan comprises an upper micro fan and a lower micro fan; the shell comprises a heat dissipation inner shell, a first built-in heat absorption plate, a second built-in heat absorption plate, an upper air guiding bent part, a lower air guiding bent part, an air inlet opening, an air guiding guide groove, a ventilation through hole, two positioning fixing parts and an air exhaust outlet; the heat dissipation inner shell is a groove wall of the containing groove; the upper miniature fan and the lower miniature fan are respectively arranged at the top and the bottom of the shell; the two fixing parts are respectively arranged at positions close to the top and the bottom of the heat dissipation inner shell; the air inlet port is communicated with the heat dissipation channel; the hollow inside of the heat dissipation inner shell is divided into three air chambers by two positioning fixing parts from top to bottom in the vertical direction: the wind collecting device comprises an upper wind collecting cavity, a middle wind collecting cavity and a lower wind collecting cavity, wherein the upper wind collecting cavity is communicated with the middle wind collecting cavity through a ventilation perforation, and the lower wind collecting cavity is communicated with the middle wind collecting cavity through the lower miniature fan; the first built-in heat absorbing plate and the second built-in heat absorbing plate are arranged in the middle air gathering cavity; the air inlet port is formed in one side wall of the upper air gathering cavity, the upper micro fan is arranged on the other side wall of the upper air gathering cavity opposite to the air inlet port, and an air inducing guide groove is formed between the upper micro fan and the air inlet port through a plastic plate; an upper air guide bending part is further arranged on the inner side wall of the upper air gathering cavity close to one side of the upper miniature fan, the upper air guide bending part is a part with an arc-shaped surface or a hemispherical or circular arc-shaped groove, and the hemispherical or circular arc-shaped opening of the upper air gathering cavity faces the ventilation through hole; the lower air guide bending part is positioned in the lower air gathering cavity, and the lower air gathering cavity is communicated with the outside through the air exhaust outlet.
2. The heat dissipating structure of claim 1, wherein the housing is a rectangular parallelepiped structure.
3. The heat dissipating structure of claim 2, wherein the heat dissipating through-openings have a rectangular cross-section.
4. The heat dissipating structure of claim 3, wherein the limiting groove has a rectangular cross section.
5. The heat dissipating structure of claim 4, wherein the length of the retaining groove is less than the length of the heat dissipating port.
6. The heat dissipating structure of claim 5, wherein the heat dissipating plate has a rectangular parallelepiped structure.
7. The heat dissipating structure of claim 6, wherein the heat dissipating plate and the heat dissipating through-hole are engaged with each other.
8. The heat dissipating structure of claim 7, wherein the limiting block is a rectangular parallelepiped.
9. The heat dissipating structure of claim 8, wherein the limiting blocks are engaged with the limiting grooves.
10. The heat dissipating structure of claim 9, wherein the heat dissipating plate is integrally formed with the two stoppers.
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| CN201810371178.5A CN108870340B (en) | 2018-04-24 | 2018-04-24 | Heat radiation structure |
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| CN201810371178.5A CN108870340B (en) | 2018-04-24 | 2018-04-24 | Heat radiation structure |
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| CN1753193A (en) * | 2004-09-21 | 2006-03-29 | 盟立光能科技股份有限公司 | Luminous diode module for vehicle |
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| CN102022707B (en) * | 2009-09-15 | 2013-05-29 | 建准电机工业股份有限公司 | Heat radiating device of light module |
| KR101414650B1 (en) * | 2012-05-09 | 2014-07-03 | 엘지전자 주식회사 | Lighting apparatus |
| JP2014107021A (en) * | 2012-11-22 | 2014-06-09 | Toshiba Lighting & Technology Corp | Luminaire |
| CN106690482B (en) * | 2017-01-19 | 2019-01-25 | 深圳市联奕实业有限公司 | Miniature radiating subassembly and air-ventilating garments |
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| CN201903031U (en) * | 2010-11-26 | 2011-07-20 | 索士亚科技股份有限公司 | Radiating module for LED lamp |
| CN202561696U (en) * | 2012-04-20 | 2012-11-28 | 黄智辉 | Efficiently-dissipating heat-dissipation module of light-emitting diode (LED) lamps |
| CN204593182U (en) * | 2015-04-29 | 2015-08-26 | 张艳艳 | A kind of removable LED illumination lamp of quick heat radiating |
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