CN108865054A - A kind of electronic equipment stop-leak compound with Thermal conductivity - Google Patents
A kind of electronic equipment stop-leak compound with Thermal conductivity Download PDFInfo
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- CN108865054A CN108865054A CN201810364132.0A CN201810364132A CN108865054A CN 108865054 A CN108865054 A CN 108865054A CN 201810364132 A CN201810364132 A CN 201810364132A CN 108865054 A CN108865054 A CN 108865054A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0856—Iron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/04—Antistatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to sealing material technical fields, and in particular to a kind of electronic equipment stop-leak compound with Thermal conductivity.The component of the stop-leak compound includes following substance：Dialkyl polydimethylsiloxane, silicone oil, inorganic filler, modified clay, glass micro mist, Nano diamond, metal powder, dibutyl tin dioctoate, plasticizer, fire retardant, antistatic agent, coupling agent, tackifier, preservative.Wherein, plasticizer is one of dibutyl phthalate, diisononyl phthalate, sebacic acid dibutyl ester, triphenyl phosphate, adipic acid dibutyl ester or any a variety of mixture；Tackifier are tert-butyl phenolic tackifying resins or octyl phenolic tackifying resins；Preservative is potassium sorbate or sodium benzoate.The sealing performance and waterproof performance of the stop-leak compound are outstanding, and have good insulation performance, heating conduction and antistatic property, are highly suitable for electronic equipment waterproof sealing.
Description
Technical field
The present invention relates to sealing material technical fields, and in particular to a kind of electronic equipment with Thermal conductivity is with close
Seal rouge.
Background technique
Stop-leak compound is a kind of body of paste substance collectively constituted by liquid material and solid material, is met under a certain pressure
In conjunction with object connection or encapsulation process requirement.General stop-leak compound is according to the object used and the difference of state, it is also necessary to be added more
Kind has corrosion-resistant, the additive of the performances such as high temperature resistant, fire-retardant.Wherein, due to the conditions such as temperature and humidity for working environment tool
There are very strict requirements, electronic equipment is needed in the manufacturing using the stop-leak compound or packaging plastic to various sealing waterproofness,
Short circuit occurs because of the presence of water or vapor come equipment during avoiding with this, causes the damage of equipment.
Conventional electronic equipment is mainly made of organic resin class bonding agent and inorganic filler with stop-leak compound, the sealing of material
Degree is high, adhesive effect is good.But since the heating conduction of material is poor, it is easy to cause the local temperature of equipment or element excessively high,
This can impact the performance and used life of element or equipment.Part stop-leak compound is in ingredient largely using metal powder
The heating conduction of material is improved, but this way can impact the insulation performance of stop-leak compound, it is serious to result even in
Equipment or element are damaged because of short circuit.
Summary of the invention
Aiming at the problems existing in the prior art, the electronic equipment that the present invention provides a kind of with Thermal conductivity is used
Stop-leak compound, the sealing performance and waterproof performance of the stop-leak compound are outstanding, and have good insulation performance, heating conduction and resist quiet
Electrical property is highly suitable for electronic equipment waterproof sealing.
In order to achieve the above object, the present invention is achieved through the following technical solutions：
A kind of electronic equipment stop-leak compound with Thermal conductivity, according to mass fraction, the component of the stop-leak compound include with
Lower substance：It is 80-90 parts of dialkyl polydimethylsiloxane, 15-23 parts of silicone oil, 15-20 parts of inorganic filler, clay 5-8 parts modified,
14-17 parts of glass micro mist, 6-9 parts of Nano diamond, 5-12 parts of metal powder, 1-3 parts of dibutyl tin dioctoate, plasticizer 12-
16 parts, 3-7 parts of fire retardant, 3-5 parts of antistatic agent, 1-3 parts of coupling agent, 2-3 parts of tackifier, 0.5-1.2 parts of preservative.
Preferably, according to mass fraction, the component of the stop-leak compound includes following substance：Dialkyl polydimethylsiloxane
It is 85-87 parts, 18-20 parts of silicone oil, 17-19 parts of inorganic filler, clay 6-7 parts modified, 15-16 parts of glass micro mist, Nano diamond
7-8 parts, 9-10 parts of metal powder, 2-3 parts of dibutyl tin dioctoate, 14-15 parts of plasticizer, 5-6 parts of fire retardant, antistatic agent 4-
5 parts, 1-2 parts of coupling agent, 2.4-2.7 parts of tackifier, 0.8-0.9 parts of preservative.
The preparation method of modified clay is as follows in the present invention：By inorganic clay and deionized water with 1:The mass ratio of 8-10 is mixed
Conjunction is configured to slurry, under 60-75 DEG C of water-bath state, sequentially adds cation modifier and anion-modified dose is stirred
It mixes；Wherein cation modifier is imidazoline, and dosage is the 3% of clay quality, and anion-modified dose is potassium sulfonate, and dosage is viscous
The 5% of soil property amount；It after constant temperature stirs 2h, is cooled to room temperature and is filtered, last drying obtains modified clay.
Preferably, inorganic filler is one of nanometer light calcium carbonate, white carbon black, nano silica.
Preferably, plasticizer is dibutyl phthalate, diisononyl phthalate, sebacic acid dibutyl ester, phosphoric acid
One of triphenylmethyl methacrylate, adipic acid dibutyl ester or any a variety of mixture.
Preferably, metal powder is ferrous alloy or copper-base alloy powder；Tackifier be tert-butyl phenolic tackifying resins or
Octyl phenolic tackifying resins.
Preferably, fire retardant is the mixture of aluminium hydroxide and antimony oxide, and the mass ratio of the two is 3:1；Preservative
For potassium sorbate or sodium benzoate.
The preparation method of stop-leak compound provided by the invention is as follows：According to mass fraction, by inorganic filler, modified clay, glass
Glass micro mist, Nano diamond, metal powder and fire retardant are uniformly mixing to obtain mixed powder in batch mixer in advance, by dihydroxy
Dimethyl silicone polymer is added in reaction kettle, and then coupling agent and antistatic agent are added in reaction kettle, with 85-90 DEG C
The revolving speed uniform stirring 20-25min of temperature and 250-300r/min obtains component A after cooling；By plasticizer, tackifier, anti-corrosion
Agent and dibutyl tin dioctoate are added in silicone oil, and 8-10min is mixed with the revolving speed of 200-250r/min in a kettle,
Obtain B component；By component A and B component according to 6:1 ratio is mixed to get required stop-leak compound.
The present invention has following beneficial effect：
The bonding agent ontology of the type stop-leak compound is made of dialkyl polydimethylsiloxane and silicone oil, and the cementability of material is strong, is filled out
Modified clay powder is also used in material, further increases the viscosity and stability of material of stop-leak compound, in order to improve leading for stop-leak compound
Hot property, the present invention have used metal powder, glass micro mist and Nano diamond powder in filler, wherein in order to avoid gold
Belong to powder and the influence to material insulation property is excessively added, the present invention is being used the ratio of conductive conducting filler
Example is greatly lowered, and glass micro mist is added to carry out reinforcement to the heating conduction of material.
In addition, also added antistatic agent in the present invention to improve the antistatic property of material, prevent stop-leak compound from using
Electrostatic is generated in journey, and element is damaged.The preservative of addition can be improved antibacterial of the material under high temperature, dampness and
Antiseptic property improves the service life of stop-leak compound.
Specific embodiment
Below with reference to embodiment, further description of the specific embodiments of the present invention, and following embodiment is only used for more
Technical solution of the present invention is clearly demonstrated, and not intended to limit the protection scope of the present invention.
Embodiment 1
A kind of electronic equipment stop-leak compound with Thermal conductivity, according to mass fraction, the component of the stop-leak compound include with
Lower substance：80 parts of dialkyl polydimethylsiloxane, 15 parts of silicone oil, 15 parts of inorganic filler, modified 5 parts of clay, glass micro mist 14
Part, 6 parts of Nano diamond, 5 parts of metal powder, 1 part of dibutyl tin dioctoate, 12 parts of plasticizer, 3 parts of fire retardant, antistatic agent 3
Part, 1 part of coupling agent, 2 parts of tackifier, 0.5 part of preservative.
In the present embodiment, the preparation method of modified clay is as follows：By inorganic clay and deionized water with 1:8 mass ratio is mixed
Conjunction is configured to slurry, under 60 DEG C of water-bath state, sequentially adds cation modifier and anion-modified dose is stirred；Its
Middle cation modifier is imidazoline, and dosage is the 3% of clay quality, and anion-modified dose is potassium sulfonate, and dosage is clay quality
5%；It after constant temperature stirs 2h, is cooled to room temperature and is filtered, last drying obtains modified clay.
Wherein, inorganic filler used in component is nanometer light calcium carbonate；Plasticizer is dibutyl phthalate；Gold
Category powder is iron(-)base powder；Tackifier are tert-butyl phenolic tackifying resins；Fire retardant is aluminium hydroxide and antimony oxide
Mixture, the mass ratio of the two is 3:1；Preservative is potassium sorbate.
The preparation method of stop-leak compound provided in this embodiment is as follows：According to mass fraction, by inorganic filler, modified clay,
Glass micro mist, Nano diamond, metal powder and fire retardant are uniformly mixing to obtain mixed powder in batch mixer in advance, by dihydroxy
Base dimethyl silicone polymer is added in reaction kettle, and then coupling agent and antistatic agent are added in reaction kettle, with 85 DEG C
The revolving speed uniform stirring 20min of temperature and 250r/min obtains component A after cooling；By plasticizer, tackifier, preservative and two
Two tin octoate of butyl is added in silicone oil, and 8min is mixed with the revolving speed of 200r/min in a kettle, obtains B component；By A
Component and B component are according to 6:1 ratio is mixed to get required stop-leak compound.
Embodiment 2
A kind of electronic equipment stop-leak compound with Thermal conductivity, according to mass fraction, the component of the stop-leak compound include with
Lower substance：90 parts of dialkyl polydimethylsiloxane, 23 parts of silicone oil, 20 parts of inorganic filler, modified 8 parts of clay, glass micro mist 17
Part, 9 parts of Nano diamond, 12 parts of metal powder, 3 parts of dibutyl tin dioctoate, 16 parts of plasticizer, 7 parts of fire retardant, antistatic agent
5 parts, 3 parts of coupling agent, 3 parts of tackifier, 1.2 parts of preservative.
In the present embodiment, the preparation method of modified clay is as follows：By inorganic clay and deionized water with 1:10 mass ratio
It is mixedly configured into slurry, under 75 DEG C of water-bath state, cation modifier is sequentially added and anion-modified dose is stirred；
Wherein cation modifier is imidazoline, and dosage is the 3% of clay quality, and anion-modified dose is potassium sulfonate, and dosage is clayey
The 5% of amount；It after constant temperature stirs 2h, is cooled to room temperature and is filtered, last drying obtains modified clay.
Wherein, inorganic filler used in component is white carbon black；Plasticizer phthalic acid dinonyl and sebacic acid two
The mixture of pungent rouge；Metal powder is copper-base alloy powder；Tackifier are octyl phenolic tackifying resins；Fire retardant is aluminium hydroxide
With the mixture of antimony oxide, the mass ratio of the two is 3:1；Preservative is sodium benzoate.
The preparation method of stop-leak compound provided in this embodiment is as follows：According to mass fraction, by inorganic filler, modified clay,
Glass micro mist, Nano diamond, metal powder and fire retardant are uniformly mixing to obtain mixed powder in batch mixer in advance, by dihydroxy
Base dimethyl silicone polymer is added in reaction kettle, and then coupling agent and antistatic agent are added in reaction kettle, with 90 DEG C
The revolving speed uniform stirring 25min of temperature and 300r/min obtains component A after cooling；By plasticizer, tackifier, preservative and two
Two tin octoate of butyl is added in silicone oil, and 10min is mixed with the revolving speed of 250r/min in a kettle, obtains B component；It will
Component A and B component are according to 6:1 ratio is mixed to get required stop-leak compound.
Embodiment 3
A kind of electronic equipment stop-leak compound with Thermal conductivity, according to mass fraction, the component of the stop-leak compound include with
Lower substance：85 parts of dialkyl polydimethylsiloxane, 19 parts of silicone oil, 17 parts of inorganic filler, modified 6 parts of clay, glass micro mist 15
Part, 8 parts of Nano diamond, 8 parts of metal powder, 2 parts of dibutyl tin dioctoate, 14 parts of plasticizer, 5 parts of fire retardant, antistatic agent 4
Part, 2 parts of coupling agent, 2.5 parts of tackifier, 0.8 part of preservative.
In the present embodiment, the preparation method of modified clay is as follows：By inorganic clay and deionized water with 1:9 mass ratio is mixed
Conjunction is configured to slurry, under 69 DEG C of water-bath state, sequentially adds cation modifier and anion-modified dose is stirred；Its
Middle cation modifier is imidazoline, and dosage is the 3% of clay quality, and anion-modified dose is potassium sulfonate, and dosage is clay quality
5%；It after constant temperature stirs 2h, is cooled to room temperature and is filtered, last drying obtains modified clay.
Wherein, inorganic filler used in component is nano silica；Plasticizer is triphenyl phosphate and adipic acid two
The mixture of pungent rouge；Metal powder is iron(-)base powder；Tackifier are octyl phenolic tackifying resins；Fire retardant is aluminium hydroxide
With the mixture of antimony oxide, the mass ratio of the two is 3:1；Preservative is sodium benzoate.
The preparation method of stop-leak compound provided in this embodiment is as follows：According to mass fraction, by inorganic filler, modified clay,
Glass micro mist, Nano diamond, metal powder and fire retardant are uniformly mixing to obtain mixed powder in batch mixer in advance, by dihydroxy
Base dimethyl silicone polymer is added in reaction kettle, and then coupling agent and antistatic agent are added in reaction kettle, with 88 DEG C
The revolving speed uniform stirring 23min of temperature and 270r/min obtains component A after cooling；By plasticizer, tackifier, preservative and two
Two tin octoate of butyl is added in silicone oil, and 9min is mixed with the revolving speed of 220r/min in a kettle, obtains B component；By A
Component and B component are according to 6:1 ratio is mixed to get required stop-leak compound.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, although referring to aforementioned reality
Applying example, invention is explained in detail, for those skilled in the art, still can be to aforementioned each implementation
Technical solution documented by example is modified or equivalent replacement of some of the technical features.It is all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (8)
1. a kind of electronic equipment stop-leak compound with Thermal conductivity, it is characterised in that：According to mass fraction, the sealing
The component of rouge includes following substance：80-90 parts of dialkyl polydimethylsiloxane, 15-23 parts of silicone oil, 15-20 parts of inorganic filler,
It is clay 5-8 parts modified, 14-17 parts of glass micro mist, 6-9 parts of Nano diamond, 5-12 parts of metal powder, dibutyl tin dioctoate 1-
3 parts, 12-16 parts of plasticizer, 3-7 parts of fire retardant, 3-5 parts of antistatic agent, 1-3 parts of coupling agent, 2-3 parts of tackifier, preservative
0.5-1.2 parts.
2. a kind of electronic equipment stop-leak compound with Thermal conductivity according to claim 1, it is characterised in that：It presses
According to mass fraction, the component of the stop-leak compound includes following substance：85-87 parts of dialkyl polydimethylsiloxane, silicone oil 18-20
Part, it is 17-19 parts of inorganic filler, clay 6-7 parts modified, 15-16 parts of glass micro mist, 7-8 parts of Nano diamond, metal powder 9-10
Part, 2-3 parts of dibutyl tin dioctoate, 14-15 parts of plasticizer, 5-6 parts of fire retardant, 4-5 parts of antistatic agent, 1-2 parts of coupling agent, increase
2.4-2.7 parts of stick, 0.8-0.9 parts of preservative.
3. a kind of electronic equipment stop-leak compound with Thermal conductivity according to claim 1, which is characterized in that institute
The preparation method for stating modified clay is as follows：By inorganic clay and deionized water with 1:The mass ratio of 8-10 is mixedly configured into slurry,
Under 60-75 DEG C of water-bath state, sequentially adds cation modifier and anion-modified dose is stirred；Wherein cation changes
Property agent be imidazoline, dosage be clay quality 3%, anion-modified dose be potassium sulfonate, dosage be clay quality 5%；Constant temperature
It after stirring 2h, is cooled to room temperature and is filtered, last drying obtains modified clay.
4. a kind of electronic equipment stop-leak compound with Thermal conductivity according to claim 1, it is characterised in that：Institute
Stating inorganic filler is one of nanometer light calcium carbonate, white carbon black, nano silica.
5. a kind of electronic equipment stop-leak compound with Thermal conductivity according to claim 1, it is characterised in that：Institute
Stating plasticizer is dibutyl phthalate, diisononyl phthalate, sebacic acid dibutyl ester, triphenyl phosphate, adipic acid
One of dibutyl ester or any a variety of mixture.
6. a kind of electronic equipment stop-leak compound with Thermal conductivity according to claim 1, it is characterised in that：Institute
Stating metal powder is ferrous alloy or copper-base alloy powder；Tackifier are tert-butyl phenolic tackifying resins or octyl phenolic tackifying tree
Rouge.
7. a kind of electronic equipment stop-leak compound with Thermal conductivity according to claim 1, it is characterised in that：Institute
The mixture that fire retardant is aluminium hydroxide and antimony oxide is stated, the mass ratio of the two is 3:1；Preservative is potassium sorbate or benzene
Sodium formate.
8. a kind of electronic equipment stop-leak compound with Thermal conductivity according to claim 1, which is characterized in that institute
The preparation method for stating stop-leak compound is as follows：According to mass fraction, by inorganic filler, modified clay, glass micro mist, Nano diamond,
Metal powder and fire retardant are uniformly mixing to obtain mixed powder in batch mixer in advance, dialkyl polydimethylsiloxane are added
Into reaction kettle, then coupling agent and antistatic agent are added in reaction kettle, with 85-90 DEG C of temperature and 250-300r/min
Revolving speed uniform stirring 20-25min, obtain component A after cooling；By plasticizer, tackifier, preservative and dibutyl tin dioctoate
It is added in silicone oil, 8-10min is mixed with the revolving speed of 200-250r/min in a kettle, obtains B component；By component A
With B component according to 6:1 ratio is mixed to get required stop-leak compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810364132.0A CN108865054A (en) | 2018-04-23 | 2018-04-23 | A kind of electronic equipment stop-leak compound with Thermal conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810364132.0A CN108865054A (en) | 2018-04-23 | 2018-04-23 | A kind of electronic equipment stop-leak compound with Thermal conductivity |
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| CN108865054A true CN108865054A (en) | 2018-11-23 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102020854A (en) * | 2010-11-19 | 2011-04-20 | 广东三和化工科技有限公司 | Single-component heat-resisting silicon sealant |
| CN104471012A (en) * | 2012-07-30 | 2015-03-25 | 道康宁公司 | Thermally conductive condensation reaction curable polyorganosiloxane composition and methods for the preparation and use of the composition |
| CN106047159A (en) * | 2016-07-15 | 2016-10-26 | 西安天元化工有限责任公司 | High-temperature-resistant material based on organic silicon resin |
-
2018
- 2018-04-23 CN CN201810364132.0A patent/CN108865054A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102020854A (en) * | 2010-11-19 | 2011-04-20 | 广东三和化工科技有限公司 | Single-component heat-resisting silicon sealant |
| CN104471012A (en) * | 2012-07-30 | 2015-03-25 | 道康宁公司 | Thermally conductive condensation reaction curable polyorganosiloxane composition and methods for the preparation and use of the composition |
| CN106047159A (en) * | 2016-07-15 | 2016-10-26 | 西安天元化工有限责任公司 | High-temperature-resistant material based on organic silicon resin |
Non-Patent Citations (4)
| Title |
|---|
| 周文英等，: "《聚合物基导热复合材料》", 30 June 2017, 国防工业出版社 * |
| 李子东等: "《胶黏剂助剂》", 30 June 2009, 四川科学技术出版社 * |
| 聂麦茜等，: "《有机化学》", 31 January 2014, 冶金工业出版社 * |
| 邢凤兰等: "《印染助剂》", 31 July 2008, 化学工业出版社 * |
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