CN108864809A - A kind of photocurable polyimide solder mask - Google Patents
A kind of photocurable polyimide solder mask Download PDFInfo
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- CN108864809A CN108864809A CN201810849166.9A CN201810849166A CN108864809A CN 108864809 A CN108864809 A CN 108864809A CN 201810849166 A CN201810849166 A CN 201810849166A CN 108864809 A CN108864809 A CN 108864809A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
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Abstract
The invention discloses a kind of photocurable polyimide solder masks, are made of following methods：（1）It is 0.5-0.7 by molal weight ratio:1 aromatic tetracarboxylic dianhydride monomer is dissolved in organic solvent with diamine monomer to be reacted, and obtains polyamic acid, wherein diamine monomer is mixed by dimer diamine monomer and Long carbon chain aliphatic diamine monomers；（2）Polyamic acid is subjected to cyclization, obtains soluble polyimide solution；（3）Crosslinking agent is added into soluble polyimide solution, constant temperature stirs 1h, and excessive double bond grafting monomer is then added and carries out graft reaction；（4）Photoinitiator is added after the completion of graft reaction and carries out synthetic reaction to get photocurable polyimide solder mask.Photocurable polyimide solder mask dielectric constant of the invention and low-dielectric loss are low, can reduce the processing technology in flexible printed circuit board production process, reduce production cost, are suitable for high frequency high capacity transmission.
Description
Technical field
The present invention relates to flexible printed circuit board field more particularly to a kind of photocurable polyimide solder masks.
Background technique
Flexible printed circuit board, also known as flexible circuit board, flexible circuit board, flex circuit application, soft board, English are FPC
(abbreviation of Flexible Printed Circuit) is a kind of special printed circuit board.Its feature is light-weight, thickness
It is thin, soft, flexible, it is mainly used for many products such as mobile phone, laptop, PDA, digital camera, liquid crystal display.It is soft
Property printed circuit board is mainly made of substrate, solid, copper foil, protective film and reinforcement, such as the simplest single-layer flexible of structure
Plate is followed successively by from top to bottom：In addition substrate, solid, copper foil, solid, protective film can increase in lowest level as needed and mend
By force.
With current information, the progress of the communication technology, electronics and IT products have marched toward Gigahertz（GHz）Epoch, it is high
The signal transmission of speed, high frequency, large capacity is the important technical basis of Information of Development, wherein showing the most outstanding is digital view
Product is interrogated, they realize the integration transmission of synchronous transfer voice, video signal and data；Networking widely available simultaneously,
The progress of the high capacity of information is advanced, however due to being easy decaying during high frequency signal transmission, in order to be protection flexibility
Wiring board further decreases the transmission loss in flexible circuit board, then needing to be arranged in flexible circuit board has low dielectric normal
Number（Dk）With low-dielectric loss tangent（Df）Adhesive composition or solder mask etc., the most commonly used is cover films for tradition, still
That there are processing technologys is cumbersome for cover film, needs the problem of putting into a large amount of manpowers, gradually can be directly coated at present or screen printing
The photocuring solder mask brushed in flexible circuit board is substituted, however the solder mask that market is sold now is mostly thermosetting property welding resistance
Ink does not have low-k and low-dielectric loss tangent, is unable to satisfy high-frequency high-speed transmission device.
Summary of the invention
It is an object of the invention to overcome defect described in the prior art, to provide a kind of photocurable polyimide resistance
Solder paste ink, photocurable polyimide solder mask dielectric constant of the invention and dielectric loss are low, environment-friendly high-efficiency, can reduce flexibility
Printed wiring board（FPC）Processing technology in production process reduces production cost, is suitable for high frequency high capacity transmission, caters to 5G
The growth requirement in market.
To achieve the goals above, the present invention provides the following technical solutions：
A kind of photocurable polyimide solder mask, is made of following methods：
（1）It is 0.5-0.7 by molal weight ratio:1 aromatic tetracarboxylic dianhydride monomer and diamine monomer is dissolved in organic solvent,
70-72 DEG C at a temperature of react 5-8h, polyamic acid is obtained, wherein the diamine monomer is by dimer diamine monomer and Long carbon chain rouge
Fat race diamine monomer mixes；
（2）The polyamic acid is subjected to cyclization, obtains soluble polyimide solution；
（3）Crosslinking agent is added into the polyimide solution of the solubility, constant temperature stirs 1h, excessive double bond is then added and transfers
Order body carries out graft reaction, obtains photo curable polyimide solution；
（4）Photoinitiator is added into the photo curable polyimide solution and carries out synthetic reaction to get photocuring polyamides
Imines solder mask.
Preferably：Step（1）Described in aromatic tetracarboxylic dianhydride monomer prior to the diamine monomer be added it is described organic
In solvent.
Preferably：Step（1）Described in aromatic tetracarboxylic dianhydride monomer be 3 ', 3 ' 4 ', 4 '-benzophenone tetrabasic carboxylic acids two
Acid anhydride, equal benzene tertacarbonic acid's dianhydride, 3,3 ', 4,4 ' one biphenyltetracaboxylic dianhydrides, 3,3 ', 4,4 '-diphenyl sulfone tetracarboxylic dianhydrides, 3,
3 ', 4,4 '-diphenylketone tetracarboxylic dianhydrides, 2,3,3 ', 4 '-diphenyl ether tetracarboxylic dianhydrides, 2,3,3 ', 4 '-diphenylketones four
Carboxylic acid dianhydride, 2,2- are bis-（3,3 ', 4,4 '-tetracarboxylic phenyl）One of tetrafluoropropane dianhydride, hexafluorodianhydride (6FDA) are a variety of.
Preferably：Step（1）Described in the backbone c atoms number of Long carbon chain aliphatic diamine be 6-20.
Further：Step（1）Described in Long carbon chain aliphatic diamine be one of hexamethylene diamine, octamethylenediamine or certain herbaceous plants with big flowers diamines
Or it is a variety of.
Preferably：Step（2）Described in cyclization reaction temperature be 140-160 DEG C, reaction time 10-12h, institute
The dynamic viscosity for stating soluble polyimide solution is 8000-50000 centipoise.
Preferably：Step（3）Described in crosslinking agent be triphenylphosphine, the additive amount of the crosslinking agent is described soluble
The 0.5-1wt% of solid content in polyimide solution, the temperature of the constant temperature are 90-100 DEG C.
Preferably：Step（3）The molal weight of middle double bond grafting monomer be added is the polyimides of the solubility
1.42-2 times of remaining diamines in solution.
Preferably：Step（3）Described in double bond grafting monomer be glycidyl methacrylate and/or ethylacrylic acid
Ethylene oxidic ester.
Preferably：Step（4）Described in photoinitiator be 2,4,6 trimethylbenzoyl diphenyl phosphate oxidations, 2,4,6- tri-
One or more of methyl benzoyl etherophosphoric acid, 4- dimethylamino-benzoic acid ethyl ester, the additive amount of the initiator is
The 0.5-5wt% of solid content in the photo curable polyimide solution.
Preferably：Step（4）Described in synthetic reaction temperature be 90-110 DEG C, reaction time 4-6h.
Polyimides refers to the quasi polymer for containing imide ring (- CO-NH-CO-) on main chain, wherein to contain phthaloyl
The polymer of imine structure is mostly important.According to the chemical structure of repetitive unit, polyimides can be divided into aliphatic, semiaromatic
Race and three kinds of aromatic polyimide.According to thermal property, thermoplasticity and Thermocurable polyimide can be divided into.Polyimides is comprehensive
One of optimal high-molecular organic material of performance, high temperature resistant is up to 400 DEG C or more, -200 ~ 300 DEG C of long-term use temperature range, nothing
Sharp melting point, high insulating property, 103 hertz of lower dielectric constants 4.0, dielectric loss only 0.004 ~ 0.007 belong to F to H.Polyimides
As a kind of special engineered material, has been widely used and led in Aeronautics and Astronautics, microelectronics, nanometer, liquid crystal, seperation film, laser etc.
Domain.
Compared with prior art, the invention has the advantages that：
Photocurable polyimide solder mask of the invention is by photo curable polyimide solution and photoinitiator and crosslinking agent
Synthesis, wherein photo curable polyimide solution is then to generate polyamic acid using diamines and two anhydride reactants, then in thermalization
Polyimides is generated, although the synthetic method of this polyimides is more common, it is well known that, dianhydride, diamines kind are numerous
More, different group credit unions obtains the polyimides of different performance, determines that the mainly first step of polyimides performance synthesizes polyamides
The reaction of amino acid, the dianhydride in the first step of the present invention reaction use aromatic tetracarboxylic dianhydride monomer, and diamines is by dimer diamine list
Body and Long carbon chain aliphatic diamine monomers mix, wherein the molal weight of aromatic tetracarboxylic dianhydride monomer and diamine monomer
Than controlling in 0.5-0.7:1, it is hereby achieved that sufficiently high molecular weight, so that the photocurable polyimide welding resistance of subsequent preparation
Ink has lower dielectric properties, can be adapted for high frequency high capacity transmission to cater to the growth requirement in the market 5G；It is opposite
It is more environmentally-friendly and efficient for traditional thermo-cured ink, it can directly replace flexible circuit board cover film, reduce FPC（It is soft
Property printed wiring board）Processing technology in production process achievees the purpose that reduce cost.
Specific embodiment
Technical solution of the present invention will be clearly and completely described below, it is clear that described embodiment is this hair
Bright a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not having
Every other embodiment obtained under the premise of creative work is made, shall fall within the protection scope of the present invention.In addition, below
Technical characteristic involved in described different embodiments of the present invention as long as they do not conflict with each other can be mutual
In conjunction with.
It should be noted that 3 ' obtained used, 3 ' 4 ', 4 '-benzophenone tetracarboxylic dianhydrides are by day in following embodiments
Jin Zhongtai Chemical Industry Science Co., Ltd provides；PRIAMINE 1075 in dimer diamine is by Croda Coatings &
Polymers is provided, and versamine 551 is provided by Japanese BASF AG；PRIAMINE 1074 is by CRODA
Japan KK is provided；Hexamethylene diamine and certain herbaceous plants with big flowers diamines are provided by nylon Chemical Co., Ltd. of English Weida；Hexafluorodianhydride (6FDA) is many safe by Tianjin
Chemical Industry Science Co., Ltd provides；
Embodiment 1：
A kind of photocurable polyimide solder mask, is made of following methods：
（1）In a nitrogen environment, by 160.00g commercially available 3 ', 3 ' 4 ', 4 '-benzophenone tetracarboxylic dianhydrides（BTDA）Be dissolved in by
In the organic solvent of 720.00g cyclohexanone and 200.00g hexahydrotoluene composition, 70 DEG C are heated to, after BTDA all dissolution,
After addition mixes diamine monomer by the dimer diamine of 116.28g and the hexamethylene diamine of 68.40g, and constant temperature is stirred to react 5h, obtain
To polyamic acid solution；
（2）The polyamic acid is heated to 140 DEG C, carries out the cyclization of 10h constant temperature, obtaining dynamic viscosity is 25000 centipoises
Soluble polyimide solution；
（3）Be added the triphenylphosphine of 5.36g into the photo curable polyimide solution, additive amount be equivalent to can light it is solid
The 0.5wt% of solid content in the polyimide solution of change, and 1h is stirred to react in 95 DEG C of thermostatic；
（4）Then the glycidyl methacrylate of 42.27g is added, molal weight is equivalent to soluble polyimides
Remaining 1.42 times of diamines in solution, then carries out graft reaction, cooling after isothermal reaction 4h, obtain end be double bond can light it is solid
The polyimide solution of change；
（5）It is eventually adding the 2,4,6- trimethylbenzoyl etherophosphoric acid of 19.34g（TPO）, additive amount be equivalent to can light it is solid
The 0.5wt% of solid content in the polyimide solution of change, obtains required solder mask after mixing.
Embodiment 2
A kind of photocurable polyimide solder mask, is made of following methods：
（1）In a nitrogen environment, the commercially available hexafluorodianhydride (6FDA) of 160.00g is dissolved in by 720.00g cyclohexanone and 200.00g methyl ring
Hexane composition organic solvent in, be heated to 70 DEG C, after BTDA all dissolution after, be added by 116.28g dimer diamine and
After the hexamethylene diamine of 68.40g mixes diamine monomer, and constant temperature is stirred to react 5h, polyamic acid solution is obtained；
（2）The polyamic acid is heated to 140 DEG C, carries out the cyclization of 10h constant temperature, obtaining dynamic viscosity is 40000 centipoises
Soluble polyimide solution；
（3）Be added the triphenylphosphine of 5.36g into the photo curable polyimide solution, additive amount be equivalent to can light it is solid
The 0.5wt% of solid content in the polyimide solution of change, and 1h is stirred to react in 95 DEG C of thermostatic；
（4）Then the glycidyl methacrylate of 42.27g is added, molal weight is equivalent to soluble polyimides
Remaining 1.42 times of diamines in solution, then carries out graft reaction, cooling after isothermal reaction 4h, obtain end be double bond can light it is solid
The polyimide solution of change；
（5）It is eventually adding the 2,4,6- trimethylbenzoyl etherophosphoric acid of 19.34g（TPO）, additive amount be equivalent to can light it is solid
The 0.5wt% of solid content in the polyimide solution of change, obtains required solder mask after mixing.
Embodiment 3
A kind of photocurable polyimide solder mask, is made of following methods：
（1）In a nitrogen environment, by 160.00g commercially available 3 ', 3 ' 4 ', 4 '-benzophenone tetracarboxylic dianhydrides（BTDA）Be dissolved in by
In the organic solvent of 720.00g cyclohexanone and 200.00g hexahydrotoluene composition, 70 DEG C are heated to, after BTDA all dissolution,
After addition mixes diamine monomer by the dimer diamine of 116.28g and the certain herbaceous plants with big flowers diamines of 68.40g, and constant temperature is stirred to react 5h, obtain
To polyamic acid solution；
（2）The polyamic acid is heated to 140 DEG C, carries out the cyclization of 10h constant temperature, obtaining dynamic viscosity is 30000 centipoises
Soluble polyimide solution；
（3）Be added the triphenylphosphine of 5.36g into the photo curable polyimide solution, additive amount be equivalent to can light it is solid
The 0.5wt% of solid content in the polyimide solution of change, and 1h is stirred to react in 95 DEG C of thermostatic；
（4）Then the glycidyl methacrylate of 42.27g is added, molal weight is equivalent to soluble polyimides
Remaining 1.42 times of diamines in solution, then carries out graft reaction, cooling after isothermal reaction 4h, obtain end be double bond can light it is solid
The polyimide solution of change；
（5）It is eventually adding the 2,4,6- trimethylbenzoyl etherophosphoric acid of 19.34g（TPO）, additive amount be equivalent to can light it is solid
The 0.5wt% of solid content in the polyimide solution of change, obtains required solder mask after mixing.
Embodiment 4
A kind of photocurable polyimide solder mask, is made of following methods：
（1）In a nitrogen environment, by it is commercially available with arbitrary proportion mix 3,3 ', 4,4 '-diphenyl sulfone tetracarboxylic dianhydrides, 3,
The aromatic tetracarboxylic dianhydride that 3 ', 4,4 '-diphenyl ether tetracarboxylic dianhydrides, 3,3 ', 4,4 '-diphenylketone tetracarboxylic dianhydrides are constituted
Monomer is dissolved in the organic solvent being made of cyclohexanone and hexahydrotoluene, is heated to 71 DEG C, to aromatic tetracarboxylic dianhydride list
All after dissolution, the diamine monomer being made of the dimer diamine, octamethylenediamine, certain herbaceous plants with big flowers diamines mixed with arbitrary proportion is added, and permanent in body
After temperature is stirred to react 5-8h, polyamic acid solution is obtained, wherein mole matter of aromatic tetracarboxylic dianhydride monomer and diamine monomer
Amount is than being 0.5-0.7:1, the mass ratio of cyclohexanone and hexahydrotoluene is 18:5；
（2）The polyamic acid is heated to 150 DEG C, carries out the cyclization of 11h constant temperature, obtaining dynamic viscosity is 8000 centipoises
Soluble polyimide solution；
（3）It is solid in photo curable polyimide solution that additive amount is added into the photo curable polyimide solution
The 0.5wt% triphenylphosphine of content, and 1h is stirred to react in 90 DEG C of thermostatic；
（4）Then the Glycidyl methacrylate that molal weight is remaining 1.6 times of diamines in soluble polyimide solution is added
The mixture of glyceride and glycidyl ethacrylate carries out graft reaction, wherein glycidyl methacrylate and second
Base glycidyl acrylate is mixed with arbitrary proportion, cooling after isothermal reaction 4h, and obtaining end is the photo curable of double bond
Polyimide solution；
（5）It is eventually adding the photoinitiator that additive amount is the 0.5wt% of solid content in photo curable polyimide solution, light
Initiator is 2,4,6 trimethylbenzoyl diphenyl phosphate oxidations, the 2,4,6- trimethylbenzoyl phosphorus mixed with arbitrary proportion
Acetoacetic ester and 4- dimethylamino-benzoic acid ethyl ester, obtain required solder mask after mixing.
Embodiment 5
A kind of photocurable polyimide solder mask, is made of following methods：
（1）In a nitrogen environment, by it is commercially available with arbitrary proportion mix 2,3,3 ', 4 '-diphenyl ether tetracarboxylic dianhydrides, 2,3,
3 ', 4 '-diphenylketone tetracarboxylic dianhydrides, 2,2- are bis-（3,3 ', 4,4 '-tetracarboxylic phenyl）Tetrafluoropropane dianhydride is dissolved in by cyclohexanone
In the organic solvent of hexahydrotoluene composition, 72 DEG C are heated to, after aromatic tetracarboxylic dianhydride monomer all dissolution, is added
The diamine monomer being made of the dimer diamine, octamethylenediamine, certain herbaceous plants with big flowers diamines that are mixed with arbitrary proportion, and after constant temperature is stirred to react 8h, it obtains
To polyamic acid solution, wherein the molal weight of aromatic tetracarboxylic dianhydride monomer and diamine monomer ratio is 0.7:1, cyclohexanone and
The mass ratio of hexahydrotoluene is 18:5；
（2）The polyamic acid is heated to 160 DEG C, carries out the cyclization of 12h constant temperature, obtaining dynamic viscosity is 50000 centipoises
Soluble polyimide solution；
（3）It is solid in photo curable polyimide solution that additive amount is added into the photo curable polyimide solution
The 1wt% triphenylphosphine of content, and 1h is stirred to react in 110 DEG C of thermostatic；
（4）Then it is sweet that the Glycidyl methacrylate that molal weight is remaining 2 times of diamines in soluble polyimide solution is added
Grease and/or glycidyl ethacrylate carry out graft reaction, cooling after isothermal reaction 4h, obtain end be double bond can
The polyimide solution of photocuring；
（5）It is eventually adding 4- dimethylamino-benzene that additive amount is the 5wt% of solid content in photo curable polyimide solution
Ethyl formate obtains required solder mask after mixing.
Operation instruction is printed in photocuring solder mask of the invention with screen printing mode the single sided board of 18um copper thickness
On, after 150 DEG C are toasted 3 minutes, obtain the polyimide film that film thickness is about 20um.The above single sided board, which is placed in intensity of illumination, is
100mW/cm2Mercury lamp under, irradiate 2 minutes, polyimides can be made to be fully cured.
Experimental example：
Below using the IPC TM-650 5.5.3.7- in electronics interconnection Association Standard (printed circuit employer's organization of the U.S.)
The sample E insulation resistance of 1998 couples of 1-3 of the embodiment of the present invention and existing photocuring solder mask is verified, and concrete outcome is such as
Shown in table 1：
As can be seen from Table 1, lower Jie is all had compared to the embodiment of the present invention 1-3 for existing photocuring solder mask
Electrical property can be adapted for high frequency high capacity transmission to cater to the growth requirement in the market 5G.
The foregoing is merely a specific embodiment of the invention, but scope of protection of the present invention is not limited thereto, any
In the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by those familiar with the art, all answers
It is included within the scope of the present invention.Therefore, protection scope of the present invention should be with the scope of protection of the claims
It is quasi-.
Claims (10)
1. a kind of photocurable polyimide solder mask, which is characterized in that be made of following methods：
（1）It is 0.5-0.7 by molal weight ratio:1 aromatic tetracarboxylic dianhydride monomer and diamine monomer is dissolved in organic solvent,
70-72 DEG C at a temperature of react 5-8h, polyamic acid is obtained, wherein the diamine monomer is by dimer diamine monomer and Long carbon chain rouge
Fat race diamine monomer mixes；
（2）The polyamic acid is subjected to cyclization, obtains soluble polyimide solution；
（3）Crosslinking agent is added into the polyimide solution of the solubility, constant temperature stirs 1h, excessive double bond is then added and transfers
Order body carries out graft reaction, obtains photo curable polyimide solution；
（4）Photoinitiator is added into the photo curable polyimide solution and carries out synthetic reaction to get photocuring polyamides
Imines solder mask.
2. photocurable polyimide solder mask according to claim 1, which is characterized in that step（1）Described in fragrance
Race's tetracarboxylic dianhydride's monomer is added in the organic solvent prior to the diamine monomer.
3. photocurable polyimide solder mask according to claim 1, which is characterized in that step（1）Described in fragrance
Race's tetracarboxylic dianhydride's monomer is 3 ', 3 ' 4 ', 4 '-benzophenone tetracarboxylic dianhydrides, equal benzene tertacarbonic acid's dianhydride, 3,3 ', 4,4 ' one two
Phenyl tetracarboxylic dianhydride, 3,3 ', 4,4 '-diphenyl sulfone tetracarboxylic dianhydrides, 3,3 ', 4,4 '-diphenylketone tetracarboxylic dianhydrides, 2,3,
3 ', 4 '-diphenyl ether tetracarboxylic dianhydrides, 2,3,3 ', 4 '-diphenylketone tetracarboxylic dianhydrides, 2,2- are bis-（3,3 ', 4,4 '-tetracarboxylics
Phenyl）One of tetrafluoropropane dianhydride, hexafluorodianhydride (6FDA) are a variety of.
4. photocurable polyimide solder mask according to claim 1, which is characterized in that step（1）Described in long carbon
The backbone c atoms number of chain fatty race diamines is 6-20.
5. photocurable polyimide solder mask according to claim 1, which is characterized in that step（2）Described in be cyclized
The reaction temperature of reaction is 140-160 DEG C, reaction time 10-12h, the dynamic viscosity of the polyimide solution of the solubility
For 8000-50000 centipoise.
6. photocurable polyimide solder mask according to claim 1, which is characterized in that step（3）Described in be crosslinked
Agent is triphenylphosphine, and the additive amount of the crosslinking agent is the 0.5- of solid content in the polyimide solution of the solubility
1wt%, the temperature of the constant temperature are 90-100 DEG C.
7. photocurable polyimide solder mask according to claim 1, which is characterized in that step（3）It is middle be added
The molal weight of double bond grafting monomer is 1.42-2 times of remaining diamines in the polyimide solution of the solubility.
8. photocurable polyimide solder mask according to claim 1, which is characterized in that step（3）Described in double bond
Grafting monomer is glycidyl methacrylate and/or glycidyl ethacrylate.
9. photocurable polyimide solder mask according to claim 1, which is characterized in that step（4）Described in light draw
Hair agent is 2,4,6 trimethylbenzoyl diphenyl phosphate oxidations, 2,4,6- trimethylbenzoyl etherophosphoric acid, 4- dimethylamino-
One or more of ethyl benzoate, the additive amount of the initiator are solid in the photo curable polyimide solution
The 0.5-5wt% of content.
10. photocurable polyimide solder mask according to claim 1, which is characterized in that step（4）Described in synthesize
The temperature of reaction is 90-110 DEG C, reaction time 4-6h.
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| CN201810849166.9A CN108864809A (en) | 2018-07-28 | 2018-07-28 | A kind of photocurable polyimide solder mask |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115806754A (en) * | 2022-12-07 | 2023-03-17 | 连州市祥丰化工有限公司 | Photosensitive imaging developing-formed conductive ink, preparation method thereof and circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8105752B2 (en) * | 2008-10-08 | 2012-01-31 | Eternal Chemical Co., Ltd. | Photosensitive polyimides |
| CN103145988A (en) * | 2013-02-28 | 2013-06-12 | 中山大学 | Polyimide oligomer and liquid photoimagable solder resist ink |
| CN105085911A (en) * | 2014-05-07 | 2015-11-25 | 台虹科技股份有限公司 | Photosensitive polyimide composition, main agent of composition, preparation method for main agent of composition and polyimide welding-proof film prepared from composition |
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2018
- 2018-07-28 CN CN201810849166.9A patent/CN108864809A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8105752B2 (en) * | 2008-10-08 | 2012-01-31 | Eternal Chemical Co., Ltd. | Photosensitive polyimides |
| CN103145988A (en) * | 2013-02-28 | 2013-06-12 | 中山大学 | Polyimide oligomer and liquid photoimagable solder resist ink |
| CN105085911A (en) * | 2014-05-07 | 2015-11-25 | 台虹科技股份有限公司 | Photosensitive polyimide composition, main agent of composition, preparation method for main agent of composition and polyimide welding-proof film prepared from composition |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115806754A (en) * | 2022-12-07 | 2023-03-17 | 连州市祥丰化工有限公司 | Photosensitive imaging developing-formed conductive ink, preparation method thereof and circuit board |
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