CN108857863A - A kind of shockproof grinding wafer machine - Google Patents
A kind of shockproof grinding wafer machine Download PDFInfo
- Publication number
- CN108857863A CN108857863A CN201810709481.1A CN201810709481A CN108857863A CN 108857863 A CN108857863 A CN 108857863A CN 201810709481 A CN201810709481 A CN 201810709481A CN 108857863 A CN108857863 A CN 108857863A
- Authority
- CN
- China
- Prior art keywords
- grinding
- wafer
- runner
- fixed
- machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0015—Hanging grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention discloses a kind of shockproof grinding wafer machines, including grinding wafer machine ontology, the upper surface of the grinding wafer machine ontology is provided with grinding base, the grinding base is fixed on the upper surface of grinding wafer machine ontology, the grinding base is internally provided with runner, the outer surface of the runner is provided with cleaning brush, and the inside of the grinding base offers clast delivery pipe, and the clast delivery pipe runs through the inside of grinding wafer machine ontology and extends to the bottom of grinding wafer machine ontology；Using rotating electric machine, runner, ground cover, abrasive wheel and buffer spring, drive runner by rotating electric machine, simultaneous grinding wheel is close to wafer under the action of buffer spring, grind wafer rotation, the efficiency for improving grinding wafer reduces the time of grinding wafer, and support rod and bearing are used below wafer slot, making wafer, wafer slot increases the balance degree of wafer polishing by rotating under the action of grinding around bearing during the grinding process.
Description
Technical field
The invention belongs to grinding wafer equipment technical fields, and in particular to a kind of shockproof grinding wafer machine.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer；
It can be processed on silicon and is fabricated to various circuit component structures, and become the IC product for having specific electrical functionality.The original of wafer
Beginning material is silicon, and there is nexhaustible silica on earth's crust surface.Silica ore is refined via electric arc furnaces, hydrochloric acid chlorine
Change, and after distilling, the polysilicon of high-purity has been made, wherein the size of wafer is respectively 8 inches and 12 inches.Existing crystalline substance
During use, grinding wafer stability is poor for circle grinder, be easy to cause wafer to occur deflection during grinding, drops
The problem of low grinding wafer qualification rate, thus it is proposed that a kind of shockproof grinding wafer machine.
Summary of the invention
The purpose of the present invention is to provide a kind of shockproof grinding wafer machines, to solve crystalline substance mentioned above in the background art
During use, grinding wafer stability is poor for circle grinder, be easy to cause wafer to occur deflection during grinding, drops
The problem of low grinding wafer qualification rate.
To achieve the above object, the present invention provides the following technical solutions：A kind of shockproof grinding wafer machine, including wafer are ground
Mill body, the upper surface of the grinding wafer machine ontology are provided with grinding base, and the grinding base is fixed on grinding wafer machine sheet
The upper surface of body, the grinding base are internally provided with runner, and the outer surface of the runner is provided with cleaning brush, the grinding base
Inside offer clast delivery pipe, the clast delivery pipe through grinding wafer machine ontology inside and extend to grinding wafer
The bottom of machine ontology.
Preferably, restraining position ring block is arranged in the inner surface of the grinding base, and one end of the stop collar is fixed on grinding base
Inner surface, the other end of the stop collar are embedded into the bottom of runner, and stabilizer is provided with above the stop collar, described flat
One end of weighing apparatus wheel is fixed on the bottom of runner.
Preferably, the lower surface of the runner is provided with rotating electric machine, and one end of the rotating electric machine is fixed on runner
Lower surface, the other end of the runner are fixed on the inside of grinding wafer machine ontology.
Preferably, the runner is internally provided with bearing, is provided with wafer slot, the wafer slot above the runner
Lower surface be provided with support rod, one end of the support rod is fixed on the lower surface of wafer slot, the other end of the support rod
It is fixed on the inside of bearing.
Preferably, telescopic hydraulic machine, one end of the telescopic hydraulic machine are provided with above the grinding wafer machine ontology
Be fixed on the top of grinding wafer machine ontology, the other end of the telescopic hydraulic machine is provided with ground cover, the ground cover it is interior
Portion is provided with abrasive wheel, and the upper surface of the abrasive wheel is provided with buffer spring, and one end of the buffer spring is fixed on grinding
The other end of the upper surface of wheel, the buffer spring is fixed on the inside of ground cover.
Compared with prior art, the beneficial effects of the invention are as follows：It is gentle using rotating electric machine, runner, ground cover, abrasive wheel
Spring is rushed, drives runner by rotating electric machine, simultaneous grinding wheel is close to wafer under the action of buffer spring, rotates wafer
It is ground, improves the efficiency of grinding wafer, reduced the time of grinding wafer, support rod and bearing are used below wafer slot,
Making wafer, wafer slot under the action of grinding around bearing by rotating during the grinding process, the balance degree of increase wafer polishing,
Wafer processing capacity caused by avoiding runner outer ring walking path excessive is excessive, increases the qualification rate of wafer processing, using cleaning brush,
Clast delivery pipe, stop collar and stabilizer, the clast under grinding are focused in clast delivery pipe by cleaning brush, and it is clear to increase clast
The convenience removed reduces the time that clast is removed, while stabilizer is mobile in stop collar upper surface, improves runner in grinding base
The mobile stability in portion, improves the accuracy of grinding wafer.
Detailed description of the invention
Fig. 1 is grinding wafer machine structural schematic diagram of the invention；
Fig. 2 is grinding base of the invention and rotaring wheel structure schematic diagram；
Fig. 3 is grinding base of the invention and runner top view；
In figure：1, grinding wafer machine ontology；2, grinding base；3, runner；4, cleaning brush；5, clast delivery pipe；6, stop collar；7, it puts down
Weighing apparatus wheel；8, rotating electric machine；9, wafer slot；10, support rod；11, bearing；12, telescopic hydraulic machine；13, ground cover；14, abrasive wheel；
15, buffer spring.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Embodiment one:
Fig. 1, Fig. 2 and Fig. 3 are please referred to, the present invention provides a kind of technical solution：A kind of shockproof grinding wafer machine, including wafer are ground
Mill body 1, the upper surface of grinding wafer machine ontology 1 are provided with grinding base 2, and grinding base 2 is fixed by welding in grinding wafer
The upper surface of machine ontology 1, grinding base 2 are internally provided with runner 3, and the outer surface of runner 3 is provided with cleaning brush 4, cleaning brush 4
One end is fixed by welding in the outer surface of runner 3, and the inside of grinding base 2 offers clast delivery pipe 5, and clast delivery pipe 5 passes through
The inside of transcrystalline circle grinder body 1 and the bottom for extending to grinding wafer machine ontology 1.
In order to improve the balance of the rotation of runner 3, the precision of wafer processing is improved, in the present embodiment, it is preferred that grinding base
2 inner surface is arranged restraining position ring block 6, and one end of stop collar 6 is fixed by welding in the inner surface of grinding base 2, stop collar 6 it is another
One end is embedded into the bottom of runner 3, and the top of stop collar 6 is provided with stabilizer 7, and one end of stabilizer 7 is fixed on the bottom of runner 3
Portion.
In order to improve the efficiency of grinding wafer, reduce the time of wafer processing, in the present embodiment, it is preferred that under runner 3
Surface is provided with rotating electric machine 8, and one end of rotating electric machine 8 is fixed by welding in the lower surface of runner 3, the other end of runner 3
It is fixed by welding in the inside of grinding wafer machine ontology 1.
Grinding wafer caused by order to avoid outer ring walking path is long during grinding wafer is excessive, improves grinding wafer
Consistency, in the present embodiment, it is preferred that runner 3 is internally provided with bearing 11, and bearing 11 inlays the inside for being fixed on runner 3,
The top of runner 3 is provided with wafer slot 9, and the lower surface of wafer slot 9 is provided with support rod 10, and one end of support rod 10 passes through welding
It is fixed on the lower surface of wafer slot 9, the other end of support rod 10 is fixed on the inside of bearing 11.
In order to avoid abrasive wheel 14 and wafer contacts stress are excessive, the safety of grinding wafer is improved, it is excellent in the present embodiment
Choosing, the top of grinding wafer machine ontology 1 is provided with telescopic hydraulic machine 12, and one end of telescopic hydraulic machine 12 is bolted on
The top of grinding wafer machine ontology 1, the other end of telescopic hydraulic machine 12 are provided with ground cover 13, and ground cover 13 is internally provided with
Abrasive wheel 14, the upper surface of abrasive wheel 14 are provided with buffer spring 15, and one end of buffer spring 15 is fixed by welding in grinding
The upper surface of wheel 14, the other end of buffer spring 15 are fixed by welding in the inside of ground cover 13.
Embodiment two:
Fig. 1, Fig. 2 and Fig. 3 are please referred to, the present invention provides a kind of technical solution：A kind of shockproof grinding wafer machine, including wafer are ground
Mill body 1, the upper surface of grinding wafer machine ontology 1 are provided with grinding base 2, and grinding base 2 and grinding wafer machine ontology 1 are integrated
Formula structure, grinding base 2 are internally provided with runner 3, and the outer surface of runner 3 is provided with cleaning brush 4, and one end of cleaning brush 4 passes through
It is weldingly fixed on the outer surface of runner 3, the inside of grinding base 2 offers clast delivery pipe 5, and clast delivery pipe 5 is ground through wafer
The inside of mill body 1 and the bottom for extending to grinding wafer machine ontology 1.
In order to improve the balance of the rotation of runner 3, the precision of wafer processing is improved, in the present embodiment, it is preferred that grinding base
2 inner surface is arranged restraining position ring block 6, and one end of stop collar 6 is fixed by welding in the inner surface of grinding base 2, stop collar 6 it is another
One end is embedded into the bottom of runner 3, and the top of stop collar 6 is provided with stabilizer 7, and one end of stabilizer 7 is fixed on the bottom of runner 3
Portion.
In order to improve the efficiency of grinding wafer, reduce the time of wafer processing, in the present embodiment, it is preferred that under runner 3
Surface is provided with rotating electric machine 8, and one end of rotating electric machine 8 is fixed by welding in the lower surface of runner 3, the other end of runner 3
It is fixed by welding in the inside of grinding wafer machine ontology 1.
Grinding wafer caused by order to avoid outer ring walking path is long during grinding wafer is excessive, improves grinding wafer
Consistency, in the present embodiment, it is preferred that runner 3 is internally provided with bearing 11, and bearing 11 inlays the inside for being fixed on runner 3,
The top of runner 3 is provided with wafer slot 9, and the lower surface of wafer slot 9 is provided with support rod 10, and one end of support rod 10 passes through welding
It is fixed on the lower surface of wafer slot 9, the other end of support rod 10 is fixed on the inside of bearing 11.
In order to avoid abrasive wheel 14 and wafer contacts stress are excessive, the safety of grinding wafer is improved, it is excellent in the present embodiment
Choosing, the top of grinding wafer machine ontology 1 is provided with telescopic hydraulic machine 12, and one end of telescopic hydraulic machine 12 is bolted on
The top of grinding wafer machine ontology 1, the other end of telescopic hydraulic machine 12 are provided with ground cover 13, and ground cover 13 is internally provided with
Abrasive wheel 14, the upper surface of abrasive wheel 14 are provided with buffer spring 15, and one end of buffer spring 15 is fixed by welding in grinding
The upper surface of wheel 14, the other end of buffer spring 15 are fixed by welding in the inside of ground cover 13.
The working principle of the invention and process for using：In use, wafer is placed on the inside of wafer slot 9, start at this time
Telescopic hydraulic machine 12 and rotating electric machine 8, at this time telescopic hydraulic machine 12 by it is flexible make ground cover 13 by buffer spring 15 with
Abrasive wheel 14 slowly close to the top of runner 3 and contacts the lower surface of abrasive wheel 14 with the upper surface of wafer, simultaneous buffering bullet
Spring 15 keeps constant abrasive wheel 14 and the contact pressure of wafer by flexible, while runner 3 turns under the action of rotating electric machine 8
It is dynamic, so that wafer is polished by the rotation of runner 3, while the wafer inside wafer slot 9 under the action of abrasive wheel 14 around axis
It holds 11 to rotate in the top of runner 3, while the clast under wafer polishing falls to the inside of grinding base 2, cleaning brush 4 is turning at this time
In the inner rotation of grinding base 2 under the action of wheel 3, so that clast is entered 5 inside of clast delivery pipe and discharge.
The wherein model Y2-112M-24KW of rotating electric machine 8, the model CX-SD90 of telescopic hydraulic machine 12.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (5)
1. a kind of shockproof grinding wafer machine, including grinding wafer machine ontology（1）, it is characterised in that：The grinding wafer machine sheet
Body（1）Upper surface be provided with grinding base（2）, the grinding base（2）It is fixed on grinding wafer machine ontology（1）Upper surface, institute
State grinding base（2）Be internally provided with runner（3）, the runner（3）Outer surface be provided with cleaning brush（4）, the grinding base
（2）Inside offer clast delivery pipe（5）, the clast delivery pipe（5）Through grinding wafer machine ontology（1）Inside and prolong
Extend to grinding wafer machine ontology（1）Bottom.
2. a kind of shockproof grinding wafer machine according to claim 1, it is characterised in that：The grinding base（2）Interior table
Restraining position ring block is arranged in face（6）, the stop collar（6）One end be fixed on grinding base（2）Inner surface, the stop collar（6）'s
The other end is embedded into runner（3）Bottom, the stop collar（6）Top be provided with stabilizer（7）, the stabilizer（7）'s
One end is fixed on runner（3）Bottom.
3. a kind of shockproof grinding wafer machine according to claim 1, it is characterised in that：The runner（3）Lower surface
It is provided with rotating electric machine（8）, the rotating electric machine（8）One end be fixed on runner（3）Lower surface, the runner（3）It is another
One end is fixed on grinding wafer machine ontology（1）Inside.
4. a kind of shockproof grinding wafer machine according to claim 1, it is characterised in that：The runner（3）Inside set
It is equipped with bearing（11）, the runner（3）Top be provided with wafer slot（9）, the wafer slot（9）Lower surface be provided with support
Bar（10）, the support rod（10）One end be fixed on wafer slot（9）Lower surface, the support rod（10）The other end fix
In bearing（11）Inside.
5. a kind of shockproof grinding wafer machine according to claim 1, it is characterised in that：The grinding wafer machine ontology
（1）Top be provided with telescopic hydraulic machine（12）, the telescopic hydraulic machine（12）One end be fixed on grinding wafer machine ontology（1）
Top, the telescopic hydraulic machine（12）The other end be provided with ground cover（13）, the ground cover（13）Be internally provided with
Abrasive wheel（14）, the abrasive wheel（14）Upper surface be provided with buffer spring（15）, the buffer spring（15）One end it is solid
It is scheduled on abrasive wheel（14）Upper surface, the buffer spring（15）The other end be fixed on ground cover（13）Inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810709481.1A CN108857863A (en) | 2018-07-02 | 2018-07-02 | A kind of shockproof grinding wafer machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810709481.1A CN108857863A (en) | 2018-07-02 | 2018-07-02 | A kind of shockproof grinding wafer machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108857863A true CN108857863A (en) | 2018-11-23 |
Family
ID=64298146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810709481.1A Pending CN108857863A (en) | 2018-07-02 | 2018-07-02 | A kind of shockproof grinding wafer machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108857863A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111203807A (en) * | 2020-01-13 | 2020-05-29 | 刘和平 | Chemical mechanical polishing machine |
| CN112497051A (en) * | 2020-11-19 | 2021-03-16 | 临漳县澳皇网络科技有限公司 | Ultra-thin wafer processingequipment |
| CN114770343A (en) * | 2022-04-07 | 2022-07-22 | 安徽超宇磁电科技有限公司 | Burnishing machine is used in electric motor rotor production |
-
2018
- 2018-07-02 CN CN201810709481.1A patent/CN108857863A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111203807A (en) * | 2020-01-13 | 2020-05-29 | 刘和平 | Chemical mechanical polishing machine |
| CN111203807B (en) * | 2020-01-13 | 2021-05-11 | 诸暨雅言科技有限公司 | Chemical mechanical polishing machine |
| CN112497051A (en) * | 2020-11-19 | 2021-03-16 | 临漳县澳皇网络科技有限公司 | Ultra-thin wafer processingequipment |
| CN114770343A (en) * | 2022-04-07 | 2022-07-22 | 安徽超宇磁电科技有限公司 | Burnishing machine is used in electric motor rotor production |
| CN114770343B (en) * | 2022-04-07 | 2023-08-15 | 安徽超宇磁电科技有限公司 | Polishing machine for motor rotor production |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20181123 |
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| WD01 | Invention patent application deemed withdrawn after publication |