CN208391781U - A kind of shockproof grinding wafer machine - Google Patents
A kind of shockproof grinding wafer machine Download PDFInfo
- Publication number
- CN208391781U CN208391781U CN201821045073.2U CN201821045073U CN208391781U CN 208391781 U CN208391781 U CN 208391781U CN 201821045073 U CN201821045073 U CN 201821045073U CN 208391781 U CN208391781 U CN 208391781U
- Authority
- CN
- China
- Prior art keywords
- grinding
- wafer
- runner
- fixed
- machine ontology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The utility model discloses a kind of shockproof grinding wafer machines, including grinding wafer machine ontology, the upper surface of the grinding wafer machine ontology is provided with grinding base, the grinding base is fixed on the upper surface of grinding wafer machine ontology, the grinding base is internally provided with runner, the outer surface of the runner is provided with cleaning brush, and the inside of the grinding base offers clast delivery pipe, and the clast delivery pipe runs through the inside of grinding wafer machine ontology and extends to the bottom of grinding wafer machine ontology；Using rotating electric machine, runner, ground cover, abrasive wheel and buffer spring, drive runner by rotating electric machine, simultaneous grinding wheel is close to wafer under the action of buffer spring, grind wafer rotation, the efficiency for improving grinding wafer reduces the time of grinding wafer, and support rod and bearing are used below wafer slot, making wafer, wafer slot increases the balance degree of wafer polishing by rotating under the action of grinding around bearing during the grinding process.
Description
Technical field
The utility model belongs to grinding wafer equipment technical field, and in particular to a kind of shockproof grinding wafer machine.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer；
It can be processed on silicon and is fabricated to various circuit component structures, and become the IC product for having specific electrical functionality.The original of wafer
Beginning material is silicon, and there is nexhaustible silica on earth's crust surface.Silica ore is refined via electric arc furnaces, hydrochloric acid chlorine
Change, and after distilling, the polysilicon of high-purity has been made, wherein the size of wafer is respectively 8 inches and 12 inches.Existing crystalline substance
During use, grinding wafer stability is poor for circle grinder, be easy to cause wafer to occur deflection during grinding, drops
The problem of low grinding wafer qualification rate, thus it is proposed that a kind of shockproof grinding wafer machine.
Utility model content
The purpose of this utility model is to provide a kind of shockproof grinding wafer machines, to solve to propose in above-mentioned background technique
Grinding wafer machine during use, grinding wafer stability is poor, and wafer is be easy to cause to occur during grinding partially
Tiltedly, the problem of reducing grinding wafer qualification rate.
To achieve the above object, the utility model provides the following technical solutions: a kind of shockproof grinding wafer machine, including crystalline substance
Circle grinder body, the upper surface of the grinding wafer machine ontology are provided with grinding base, and the grinding base is fixed on grinding wafer
The upper surface of machine ontology, the grinding base are internally provided with runner, and the outer surface of the runner is provided with cleaning brush, described to grind
The inside of mill seat offers clast delivery pipe, and the clast delivery pipe runs through the inside of grinding wafer machine ontology and extends to wafer
The bottom of grinder body.
Preferably, restraining position ring block is arranged in the inner surface of the grinding base, and one end of the stop collar is fixed on grinding base
Inner surface, the other end of the stop collar are embedded into the bottom of runner, and stabilizer is provided with above the stop collar, described flat
One end of weighing apparatus wheel is fixed on the bottom of runner.
Preferably, the lower surface of the runner is provided with rotating electric machine, and one end of the rotating electric machine is fixed on runner
Lower surface, the other end of the runner are fixed on the inside of grinding wafer machine ontology.
Preferably, the runner is internally provided with bearing, is provided with wafer slot, the wafer slot above the runner
Lower surface be provided with support rod, one end of the support rod is fixed on the lower surface of wafer slot, the other end of the support rod
It is fixed on the inside of bearing.
Preferably, telescopic hydraulic machine, one end of the telescopic hydraulic machine are provided with above the grinding wafer machine ontology
Be fixed on the top of grinding wafer machine ontology, the other end of the telescopic hydraulic machine is provided with ground cover, the ground cover it is interior
Portion is provided with abrasive wheel, and the upper surface of the abrasive wheel is provided with buffer spring, and one end of the buffer spring is fixed on grinding
The other end of the upper surface of wheel, the buffer spring is fixed on the inside of ground cover.
Compared with prior art, the utility model has the beneficial effects that using rotating electric machine, runner, ground cover, abrasive wheel
And buffer spring, drive runner by rotating electric machine, simultaneous grinding wheel is close to wafer under the action of buffer spring, makes wafer
Rotation is ground, and is improved the efficiency of grinding wafer, is reduced the time of grinding wafer, and support rod and axis are used below wafer slot
It holds, making wafer, wafer slot increases the balanced journey of wafer polishing by rotating under the action of grinding around bearing during the grinding process
Degree, wafer processing capacity caused by avoiding runner outer ring walking path excessive is excessive, increases the qualification rate of wafer processing, using cleaning
Brush, clast delivery pipe, stop collar and stabilizer, the clast under grinding are focused in clast delivery pipe by cleaning brush, are increased broken
It considers the convenience removed to be worth doing, reduces the time that clast is removed, while stabilizer is mobile in stop collar upper surface, improve runner and grinding
The internal mobile stability of seat, improves the accuracy of grinding wafer.
Detailed description of the invention
Fig. 1 is the grinding wafer machine structural schematic diagram of the utility model；
Fig. 2 is the grinding base and rotaring wheel structure schematic diagram of the utility model；
Fig. 3 is the grinding base and runner top view of the utility model；
In figure: 1, grinding wafer machine ontology；2, grinding base；3, runner；4, cleaning brush；5, clast delivery pipe；6, stop collar；
7, stabilizer；8, rotating electric machine；9, wafer slot；10, support rod；11, bearing；12, telescopic hydraulic machine；13, ground cover；14, it grinds
Emery wheel；15, buffer spring.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Embodiment one:
Fig. 1, Fig. 2 and Fig. 3 are please referred to, the utility model provides a kind of technical solution: a kind of shockproof grinding wafer machine, packet
Grinding wafer machine ontology 1 is included, the upper surface of grinding wafer machine ontology 1 is provided with grinding base 2, and grinding base 2 is fixed by welding in
The upper surface of grinding wafer machine ontology 1, grinding base 2 are internally provided with runner 3, and the outer surface of runner 3 is provided with cleaning brush 4,
One end of cleaning brush 4 is fixed by welding in the outer surface of runner 3, and the inside of grinding base 2 offers clast delivery pipe 5, clast
Delivery pipe 5 runs through the inside of grinding wafer machine ontology 1 and extends to the bottom of grinding wafer machine ontology 1.
In order to improve the balance of the rotation of runner 3, the precision of wafer processing is improved, in the present embodiment, it is preferred that grinding base
2 inner surface is arranged restraining position ring block 6, and one end of stop collar 6 is fixed by welding in the inner surface of grinding base 2, stop collar 6 it is another
One end is embedded into the bottom of runner 3, and the top of stop collar 6 is provided with stabilizer 7, and one end of stabilizer 7 is fixed on the bottom of runner 3
Portion.
In order to improve the efficiency of grinding wafer, reduce the time of wafer processing, in the present embodiment, it is preferred that under runner 3
Surface is provided with rotating electric machine 8, and one end of rotating electric machine 8 is fixed by welding in the lower surface of runner 3, the other end of runner 3
It is fixed by welding in the inside of grinding wafer machine ontology 1.
Grinding wafer caused by order to avoid outer ring walking path is long during grinding wafer is excessive, improves grinding wafer
Consistency, in the present embodiment, it is preferred that runner 3 is internally provided with bearing 11, and bearing 11 inlays the inside for being fixed on runner 3,
The top of runner 3 is provided with wafer slot 9, and the lower surface of wafer slot 9 is provided with support rod 10, and one end of support rod 10 passes through welding
It is fixed on the lower surface of wafer slot 9, the other end of support rod 10 is fixed on the inside of bearing 11.
In order to avoid abrasive wheel 14 and wafer contacts stress are excessive, the safety of grinding wafer is improved, it is excellent in the present embodiment
Choosing, the top of grinding wafer machine ontology 1 is provided with telescopic hydraulic machine 12, and one end of telescopic hydraulic machine 12 is bolted on
The top of grinding wafer machine ontology 1, the other end of telescopic hydraulic machine 12 are provided with ground cover 13, and ground cover 13 is internally provided with
Abrasive wheel 14, the upper surface of abrasive wheel 14 are provided with buffer spring 15, and one end of buffer spring 15 is fixed by welding in grinding
The upper surface of wheel 14, the other end of buffer spring 15 are fixed by welding in the inside of ground cover 13.
Embodiment two:
Fig. 1, Fig. 2 and Fig. 3 are please referred to, the utility model provides a kind of technical solution: a kind of shockproof grinding wafer machine, packet
Grinding wafer machine ontology 1 is included, the upper surface of grinding wafer machine ontology 1 is provided with grinding base 2, grinding base 2 and grinding wafer machine sheet
Body 1 is an integral structure, and grinding base 2 is internally provided with runner 3, and the outer surface of runner 3 is provided with cleaning brush 4, cleaning brush 4
One end is fixed by welding in the outer surface of runner 3, and the inside of grinding base 2 offers clast delivery pipe 5, and clast delivery pipe 5 passes through
The inside of transcrystalline circle grinder body 1 and the bottom for extending to grinding wafer machine ontology 1.
In order to improve the balance of the rotation of runner 3, the precision of wafer processing is improved, in the present embodiment, it is preferred that grinding base
2 inner surface is arranged restraining position ring block 6, and one end of stop collar 6 is fixed by welding in the inner surface of grinding base 2, stop collar 6 it is another
One end is embedded into the bottom of runner 3, and the top of stop collar 6 is provided with stabilizer 7, and one end of stabilizer 7 is fixed on the bottom of runner 3
Portion.
In order to improve the efficiency of grinding wafer, reduce the time of wafer processing, in the present embodiment, it is preferred that under runner 3
Surface is provided with rotating electric machine 8, and one end of rotating electric machine 8 is fixed by welding in the lower surface of runner 3, the other end of runner 3
It is fixed by welding in the inside of grinding wafer machine ontology 1.
Grinding wafer caused by order to avoid outer ring walking path is long during grinding wafer is excessive, improves grinding wafer
Consistency, in the present embodiment, it is preferred that runner 3 is internally provided with bearing 11, and bearing 11 inlays the inside for being fixed on runner 3,
The top of runner 3 is provided with wafer slot 9, and the lower surface of wafer slot 9 is provided with support rod 10, and one end of support rod 10 passes through welding
It is fixed on the lower surface of wafer slot 9, the other end of support rod 10 is fixed on the inside of bearing 11.
In order to avoid abrasive wheel 14 and wafer contacts stress are excessive, the safety of grinding wafer is improved, it is excellent in the present embodiment
Choosing, the top of grinding wafer machine ontology 1 is provided with telescopic hydraulic machine 12, and one end of telescopic hydraulic machine 12 is bolted on
The top of grinding wafer machine ontology 1, the other end of telescopic hydraulic machine 12 are provided with ground cover 13, and ground cover 13 is internally provided with
Abrasive wheel 14, the upper surface of abrasive wheel 14 are provided with buffer spring 15, and one end of buffer spring 15 is fixed by welding in grinding
The upper surface of wheel 14, the other end of buffer spring 15 are fixed by welding in the inside of ground cover 13.
The working principle and process for using of the utility model: in use, wafer is placed on the inside of wafer slot 9, at this time
Start telescopic hydraulic machine 12 and rotating electric machine 8, telescopic hydraulic machine 12 makes ground cover 13 pass through buffer spring 15 by flexible at this time
It slowly close to the top of runner 3 and contacts the lower surface of abrasive wheel 14 with the upper surface of wafer with abrasive wheel 14, delays simultaneously
Rushing spring 15 keeps constant abrasive wheel 14 and the contact pressure of wafer by flexible, while runner 3 is in the effect of rotating electric machine 8
Lower rotation, make wafer by runner 3 rotation polish, while the wafer inside wafer slot 9 under the action of abrasive wheel 14 around
Bearing 11 rotated in the top of runner 3, while the clast under wafer polishing falls to the inside of grinding base 2, at this time cleaning brush 4
In the inner rotation of grinding base 2 under the action of runner 3, so that clast is entered 5 inside of clast delivery pipe and discharge.
The wherein model Y2-112M-24KW of rotating electric machine 8, the model CX-SD90 of telescopic hydraulic machine 12.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of shockproof grinding wafer machine, including grinding wafer machine ontology (1), it is characterised in that: the grinding wafer machine sheet
The upper surface of body (1) is provided with grinding base (2), and the grinding base (2) is fixed on the upper surface of grinding wafer machine ontology (1), institute
Being internally provided with runner (3) for grinding base (2) is stated, the outer surface of the runner (3) is provided with cleaning brush (4), the grinding base
(2) inside offers clast delivery pipe (5), and the clast delivery pipe (5) is run through the inside of grinding wafer machine ontology (1) and prolonged
Extend to the bottom of grinding wafer machine ontology (1).
2. a kind of shockproof grinding wafer machine according to claim 1, it is characterised in that: the interior table of the grinding base (2)
Restraining position ring block (6) are arranged in face, and one end of the stop collar (6) is fixed on the inner surface of grinding base (2), the stop collar (6)
The other end is embedded into the bottom of runner (3), is provided with stabilizer (7) above the stop collar (6), the stabilizer (7)
One end is fixed on the bottom of runner (3).
3. a kind of shockproof grinding wafer machine according to claim 1, it is characterised in that: the lower surface of the runner (3)
Be provided with rotating electric machine (8), one end of the rotating electric machine (8) is fixed on the lower surface of runner (3), the runner (3) it is another
One end is fixed on the inside of grinding wafer machine ontology (1).
4. a kind of shockproof grinding wafer machine according to claim 1, it is characterised in that: the inside of the runner (3) is set
It is equipped with bearing (11), is provided with wafer slot (9) above the runner (3), the lower surface of the wafer slot (9) is provided with support
Bar (10), one end of the support rod (10) are fixed on the lower surface of wafer slot (9), and the other end of the support rod (10) is fixed
In the inside of bearing (11).
5. a kind of shockproof grinding wafer machine according to claim 1, it is characterised in that: the grinding wafer machine ontology
(1) it is provided with above telescopic hydraulic machine (12), one end of the telescopic hydraulic machine (12) is fixed on grinding wafer machine ontology (1)
Top, the other end of the telescopic hydraulic machine (12) is provided with ground cover (13), and ground cover (13) are internally provided with
The upper surface of abrasive wheel (14), the abrasive wheel (14) is provided with buffer spring (15), and one end of the buffer spring (15) is solid
It is scheduled on the upper surface of abrasive wheel (14), the other end of the buffer spring (15) is fixed on the inside of ground cover (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821045073.2U CN208391781U (en) | 2018-07-02 | 2018-07-02 | A kind of shockproof grinding wafer machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821045073.2U CN208391781U (en) | 2018-07-02 | 2018-07-02 | A kind of shockproof grinding wafer machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208391781U true CN208391781U (en) | 2019-01-18 |
Family
ID=65130665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821045073.2U Active CN208391781U (en) | 2018-07-02 | 2018-07-02 | A kind of shockproof grinding wafer machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208391781U (en) |
-
2018
- 2018-07-02 CN CN201821045073.2U patent/CN208391781U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201872037U (en) | Quartz plate chamfering device and subsequent quartz plate processing system | |
| CN108857863A (en) | A kind of shockproof grinding wafer machine | |
| CN108081076A (en) | A kind of novel numerical control grinding machine | |
| CN109176267A (en) | A kind of auto parts and components sanding and polishing device | |
| CN208391781U (en) | A kind of shockproof grinding wafer machine | |
| CN210281866U (en) | Ceramic ball grinding device convenient to fix | |
| CN107520725A (en) | A kind of polysilicon flaw-piece expects differential grinding process apparatus and method end to end | |
| CN204149007U (en) | A kind of grinding pad adjuster | |
| CN205928161U (en) | Glass edge grinding machine | |
| CN108581821A (en) | A kind of wafer processing automatic discharging grinder | |
| JP2003179017A (en) | Polisher and polishing pad dressing method therein | |
| CN209598886U (en) | A kind of horizontal graphite electrode surface workpiece polishing mechanism | |
| CN210968195U (en) | Polycrystalline silicon polishing device | |
| CN208614464U (en) | A kind of axis class and plate parts sanding and polishing device | |
| CN207930417U (en) | A kind of large-size pipe outer surface grinding machine | |
| CN217071785U (en) | Device for deburring and chamfering end of rotary spring | |
| CN206140255U (en) | Burnishing and polishing device | |
| CN217833221U (en) | Feeder of grinding machine | |
| CN110497325A (en) | It is a kind of for grinding the corase grinding and fine grinding integral type grinding wheel that stainless steel bearing uses | |
| CN204149028U (en) | A kind of lapping device | |
| CN105364682B (en) | Steel finished surface abrasive dust device | |
| CN205254698U (en) | Be used for column part precision finishing centerless grinder | |
| CN205552222U (en) | Emery wheel microseism grinding machanism of rectangular array | |
| CN108544376A (en) | A kind of high stability abrasive machine chip removal device | |
| CN207155599U (en) | A kind of device for the grinding of wafer monolithic |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |