CN108828425A - A kind of semiconductor test apparatus - Google Patents
A kind of semiconductor test apparatus Download PDFInfo
- Publication number
- CN108828425A CN108828425A CN201810778466.2A CN201810778466A CN108828425A CN 108828425 A CN108828425 A CN 108828425A CN 201810778466 A CN201810778466 A CN 201810778466A CN 108828425 A CN108828425 A CN 108828425A
- Authority
- CN
- China
- Prior art keywords
- probe
- base
- mounting base
- plate
- elastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
Abstract
The present invention relates to a kind of semiconductor test apparatus, including test box, bottom plate, intermediate box, camera cabin, PIB plate, opening is equipped at the top of intermediate box, mounting base is equipped at the top of intermediate box, mounting base is hollowed-out board, the probe base of annular is equipped with above mounting base, elastic component is equipped between probe base and mounting base, elastic component is applied with upward elastic force to probe base, the probe card of annular is equipped at the top of probe base, probe card is equipped with the elastic probe for stretching out probe card upwards, probe card is coaxial with probe base, mounting base is equipped with the peep hole coaxial with probe base, the shooting hole of face peep hole is equipped at the top of camera cabin, it is electrically connected between PIB plate and elastic probe by isometric cable.The present invention connects elastic probe and detection case by PIB plate, and line is convenient for weld, and loss is few in signals transmission, prevents signal interference, and elastic probe is convenient for being reliably electrically connected, and camera cabin and shooting hole are convenient for observation device docking situation.
Description
Technical field
The present invention relates to electronic testing instrument technical field, in particular to a kind of semiconductor test apparatus.
Background technique
Since semiconductor is usually small in size, is needed in test through switching device connecting detection instrument and be detected
Instrument, existing switching device are difficult to accurate assembly in assembly, lead to detection error easily occur when detection.
Summary of the invention
In view of the deficiencies of the prior art, the object of the present invention is to provide a kind of semiconductor test apparatus.
The technical solution adopted by the present invention to solve the technical problems is：A kind of semiconductor test apparatus, including test box,
It is set to the bottom plate at the top of the test box, the intermediate box being set to above the bottom plate, one end are protruded into the intermediate box
Camera cabin, the PIB plate being arranged between the bottom plate and test box, the intermediate box top are equipped with opening, the intermediate box top
Portion is equipped with mounting base, and the mounting base is hollowed-out board, and the probe base of annular, the probe base and institute are equipped with above the mounting base
It states and is equipped with elastic component between mounting base, the elastic component is applied with upward elastic force, the probe base top to the probe base
Probe card equipped with annular, the probe card are equipped with the elastic probe for stretching out probe card upwards, the probe card and the spy
Needle stand is coaxial, and the mounting base is equipped with the peep hole coaxial with the probe base, is equipped with described in face at the top of the camera cabin
The shooting hole of peep hole is electrically connected between the PIB plate and the elastic probe by isometric cable.
Elastic probe and detection case are connected by PIB plate in above-mentioned design, welded convenient for line, is damaged in signals transmission
Consumption is few, prevents signal interference, and elastic probe is convenient for being reliably electrically connected, and camera cabin and shooting hole are convenient for observation device docking feelings
Condition.
As the further improvement of the design, the mounting base be equipped with vertical guide pin, the probe base with it is described
For guide pin with merging along guide pin lifting, the guide pin makees 360 degree of annular arrays distributions around the observation axially bored line.It leads
It is convenient for being oriented to probe base to pin, convenient for being oriented to when docking convenient for the probe base to retraction, prevents probe base from deviating.
As the further improvement of the design, the test box side is equipped with positioning seat, and the positioning seat is equipped with vertical
Outer positioning pin, the outer location hole on the outer positioning pin and the pedestal cooperates, interior positioning pin is equipped at the top of the test box,
The interior positioning pin and the PIB plate cooperate.Outer positioning pin and interior positioning pin can be accurately positioned convenient for bottom plate and test box,
PIB plate is accurately docked with test box.
As the further improvement of the design, the bottom panel side is equipped with dismounting handle, convenient for that will dismount this equipment.
As the further improvement of the design, the probe base side is equipped with spiral channel, and bolt card slot one end is prolonged
The probe base top surface is extended to, the design is docked with test equipment more convenient.
As the further improvement of the design, the elastic component includes guide post, the spring covered on the guide post, institute
It states spring top and supports the only probe base, the spring bottom supports the only mounting base, the guide post top and the probe
Seat connection, the guidance column bottom matches to merge with the mounting base to be gone up and down along the mounting base.It is formed using spring and guide post
Elastic component, structure is simple, has good steering capability.
As the further improvement of the design, X-shaped positioning plate is equipped between the bottom plate and test box top, it is described
Four angles of X-shaped positioning plate are respectively provided with the outer baseline positioning hole of one with the outer detent fit, set in the middle part of the X-shaped positioning plate
There is the interior baseline positioning hole with the interior detent fit.X-shaped positioning plate can provide jointly for outer rationed marketing and interior positioning pin
Positioning datum, guarantee that PIB plate and test box accurately dock when installation, guarantee that PIB plate docks essence with test box in transportational process
The stabilization of degree.
The beneficial effects of the invention are as follows：The present invention connects elastic probe and detection case by PIB plate, welds convenient for line,
It is lost few in signals transmission, prevents signal interference, elastic probe is electrically connected convenient for reliable, and camera cabin and shooting hole are just
Situation is docked in observation device.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is overall structure diagram of the invention.
Fig. 2 is horizontal section schematic diagram of the invention.
Fig. 3 is longitudinal profile schematic diagram of the invention.
Fig. 4 is X-shaped positioning plate scheme of installation of the invention.
1. test box in figure, 2. bottom plates, 3.PIB plate, 4. intermediate boxs, 5. camera cabins, 6. mounting bases, 7. guide pins, 8.
Probe card, 9. springs, 10. guide posts, 11. elastic probes, 12. probe bases, 13. peep holes, 14. shooting holes, 15. positioning seats,
16. outer positioning pin, positioning pin in 17., 18. dismounting handles, 19. spiral channels, 20.X shape positioning plate, origin reference location in 21.
Hole, 22. outer baseline positioning holes.
Specific embodiment
Come that the present invention will be described in detail below in conjunction with attached drawing and specific embodiment, illustrative examples therein and says
It is bright to be only used to explain the present invention but not as a limitation of the invention.
Embodiment：A kind of semiconductor test apparatus including test box 1, the bottom plate 2 being set at the top of the test box 1, is set
The intermediate box 4 of 2 top of bottom plate, the camera cabin 5 that one end is protruded into the intermediate box 4, setting are placed in the bottom plate 2 and is surveyed
The PIB plate 3 between case 1 is tried, opening is equipped at the top of the intermediate box 4, is equipped with mounting base 6, the installation at the top of the intermediate box 4
Seat 6 is hollowed-out board, and the probe base 12 of annular is equipped with above the mounting base 6, is set between the probe base 12 and the mounting base 6
Flexible part, the elastic component are applied with upward elastic force to the probe base 12, are equipped with annular at the top of the probe base 12
Probe card 8, the probe card 8 are equipped with the elastic probe 11 for stretching out probe card 8 upwards, the probe card 8 and the probe base
12 is coaxial, and the mounting base 6 is equipped with the peep hole 13 coaxial with the probe base 12, is equipped with face at the top of the camera cabin 5
The shooting hole 14 of the peep hole 13 is electrically connected between the PIB plate 3 and the elastic probe 11 by isometric cable.
Elastic probe 11 and detection case are connected by PIB plate 3 in above-mentioned design, welded convenient for line, signals transmission
Middle loss is few, prevents signal interference, and elastic probe 11 is electrically connected convenient for reliable, and camera cabin 5 and shooting hole 14 are convenient for observation
Equipment interconnection situation.
As the further improvement of the design, the mounting base 6 is equipped with vertical guide pin 7, the probe base 12 with
For the guide pin 7 with merging along the guide pin 7 lifting, the guide pin 7 makees 360 degree of circular arrays around 13 axis of peep hole
Column distribution.Guide pin 7 is convenient for being oriented to probe base 12, convenient for being oriented to when docking convenient for the probe base 12 to retraction, prevents
Probe base 12 deviates.
As the further improvement of the design, 1 side of test box is equipped with positioning seat 15, and the positioning seat 15 is equipped with
Vertical outer positioning pin 16, the outer positioning pin 16 cooperate with the outer location hole on the pedestal, are equipped at the top of the test box 1
Interior positioning pin 17, the interior positioning pin 17 cooperate with the PIB plate 3.Outer positioning pin 16 and interior positioning pin 17 can be convenient for bottom plate 2
It is accurately positioned with test box 1, PIB plate 3 is accurately docked with test box 1.
As the further improvement of the design, 2 side of bottom plate is equipped with dismounting handle 18, convenient for that will dismount this equipment.
As the further improvement of the design, 12 side of probe base is equipped with spiral channel 19, the bolt card slot one
End extends to 12 top surface of probe base, the design is docked with test equipment more convenient.
As the further improvement of the design, the elastic component includes guide post 10, the bullet covered on the guide post 10
Spring 9 supports the only probe base 12 at the top of the spring 9, and the only mounting base 6 is supported in 9 bottom of spring, and the guide post 10 pushes up
Portion is connect with the probe base 12, and 10 bottom of guide post matches to merge with the mounting base 6 to be gone up and down along the mounting base 6.It adopts
Elastic component is formed with spring 9 and guide post 10, structure is simple, has good steering capability.
As the further improvement of the design, the bottom plate 2 and the test box are equipped with X-shaped positioning plate 20 between 1 top,
20 4 angles of the X-shaped positioning plate are respectively provided with the outer baseline positioning hole 22 cooperated with the outer positioning pin 16, and the X-shaped is fixed
The interior baseline positioning hole 21 cooperated with the interior positioning pin 17 is equipped in the middle part of the plate 20 of position.X-shaped positioning plate 20 can for outer rationed marketing with
And interior positioning pin 17 provides common positioning datum, when installation, guarantees that PIB plate 3 and test box 1 accurately dock, and protects in transportational process
Demonstrate,prove the stabilization of PIB plate 3 and 1 merging precision of test box.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (7)
1. a kind of semiconductor test apparatus, which is characterized in that including test box, the bottom plate being set at the top of the test box, set
Camera cabin that the intermediate box that is placed in above the bottom plate, one end protrude into the intermediate box is arranged in the bottom plate and test box
Between PIB plate, be equipped with opening at the top of the intermediate box, mounting base be equipped at the top of the intermediate box, the mounting base is hollow out
Plate, the mounting base top are equipped with the probe base of annular, elastic component, the bullet are equipped between the probe base and the mounting base
Property part be applied with upward elastic force to the probe base, the probe card of annular is equipped at the top of the probe base, on the probe card
Equipped with the upward elastic probe for stretching out probe card, the probe card and the probe base are coaxial, and the mounting base is equipped with and institute
State the coaxial peep hole of probe base, be equipped with the shooting hole of peep hole described in face at the top of the camera cabin, the PIB plate with it is described
It is electrically connected between elastic probe by isometric cable.
2. a kind of semiconductor test apparatus according to claim 1, characterized in that the mounting base is equipped with vertical lead
To pin, the probe base is with the guide pin with merging along guide pin lifting, and the guide pin is around the observation axially bored line
Make 360 degree of annular array distributions.
3. a kind of semiconductor test apparatus according to claim 1, characterized in that the test box side is equipped with positioning
Seat, the positioning seat are equipped with vertical outer positioning pin, and the outer location hole on the outer positioning pin and the pedestal cooperates, described
Interior positioning pin is equipped at the top of test box, the interior positioning pin and the PIB plate cooperate.
4. a kind of semiconductor test apparatus according to claim 1, characterized in that the bottom panel side is equipped with dismounting handle
Hand.
5. a kind of semiconductor test apparatus according to claim 1, characterized in that the probe base side is equipped with spiral card
Slot, bolt card slot one end extend to the probe base top surface.
6. a kind of semiconductor test apparatus according to claim 1, characterized in that the elastic component includes guide post, set
Spring on the guide post, the spring top support the only probe base, and the spring bottom supports the only mounting base, institute
It states and is connect at the top of guide post with the probe base, the guidance column bottom is matched with the mounting base and merged along the mounting base liter
Drop.
7. a kind of semiconductor test apparatus according to claim 3, characterized in that at the top of the bottom plate and the test box
Between be equipped with X-shaped positioning plate, four angles of the X-shaped positioning plate are respectively provided with the outer origin reference location of one with the outer detent fit
Hole, the X-shaped positioning plate middle part are equipped with the interior baseline positioning hole with the interior detent fit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810778466.2A CN108828425A (en) | 2018-07-16 | 2018-07-16 | A kind of semiconductor test apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810778466.2A CN108828425A (en) | 2018-07-16 | 2018-07-16 | A kind of semiconductor test apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108828425A true CN108828425A (en) | 2018-11-16 |
Family
ID=64140704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810778466.2A Pending CN108828425A (en) | 2018-07-16 | 2018-07-16 | A kind of semiconductor test apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108828425A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1745309A (en) * | 2002-12-20 | 2006-03-08 | 佛姆费克托公司 | Composite motion probing |
| US20070096756A1 (en) * | 2005-10-28 | 2007-05-03 | Teradyne, Inc. | Automatic testing equipment instrument card and probe cabling system and apparatus |
| CN101285865A (en) * | 2007-03-23 | 2008-10-15 | 东京毅力科创株式会社 | Method and apparatus for detecting tip position of probe, alignment method, and probe apparatus |
| CN101346635A (en) * | 2005-12-27 | 2009-01-14 | 株式会社爱德万测试 | TCP processing equipment and contraposition method for connection terminal in TCP processing equipment |
| CN102375252A (en) * | 2010-08-05 | 2012-03-14 | 塔工程有限公司 | Array test device and array test method |
| CN103460365A (en) * | 2011-04-13 | 2013-12-18 | 泰拉丁公司 | Probe-card interposer constructed using hexagonal modules |
| CN103472303A (en) * | 2013-09-10 | 2013-12-25 | 南通大学 | Multifunctional automatic four-point probe tester |
| CN103489807A (en) * | 2012-06-13 | 2014-01-01 | 台湾积体电路制造股份有限公司 | Method of test probe alignment control |
| CN203595732U (en) * | 2013-11-19 | 2014-05-14 | 深圳市博望电子有限公司 | Test probe stand |
| CN208580178U (en) * | 2018-07-16 | 2019-03-05 | 苏州肯美特设备集成有限公司 | A kind of semiconductor test apparatus |
-
2018
- 2018-07-16 CN CN201810778466.2A patent/CN108828425A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1745309A (en) * | 2002-12-20 | 2006-03-08 | 佛姆费克托公司 | Composite motion probing |
| US20070096756A1 (en) * | 2005-10-28 | 2007-05-03 | Teradyne, Inc. | Automatic testing equipment instrument card and probe cabling system and apparatus |
| CN101346635A (en) * | 2005-12-27 | 2009-01-14 | 株式会社爱德万测试 | TCP processing equipment and contraposition method for connection terminal in TCP processing equipment |
| CN101285865A (en) * | 2007-03-23 | 2008-10-15 | 东京毅力科创株式会社 | Method and apparatus for detecting tip position of probe, alignment method, and probe apparatus |
| CN102375252A (en) * | 2010-08-05 | 2012-03-14 | 塔工程有限公司 | Array test device and array test method |
| CN103460365A (en) * | 2011-04-13 | 2013-12-18 | 泰拉丁公司 | Probe-card interposer constructed using hexagonal modules |
| CN103489807A (en) * | 2012-06-13 | 2014-01-01 | 台湾积体电路制造股份有限公司 | Method of test probe alignment control |
| CN103472303A (en) * | 2013-09-10 | 2013-12-25 | 南通大学 | Multifunctional automatic four-point probe tester |
| CN203595732U (en) * | 2013-11-19 | 2014-05-14 | 深圳市博望电子有限公司 | Test probe stand |
| CN208580178U (en) * | 2018-07-16 | 2019-03-05 | 苏州肯美特设备集成有限公司 | A kind of semiconductor test apparatus |
Non-Patent Citations (1)
| Title |
|---|
| 雷绍充 等: "《 SOC测试》", vol. 1, 西安交通大学出版社, pages: 205 - 206 * |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: No. 1, Jiama Road, Luzhi Town, Wuzhong District, Suzhou City, Jiangsu Province, 215000 Applicant after: Suzhou Kemeite Equipment Integration Co.,Ltd. Address before: 215127 kemete equipment integration Co., Ltd., 89 Dongzhuang Road, Luzhi Town, Wuzhong District, Suzhou City, Jiangsu Province Applicant before: SUZHOU KEYMATE EQUIPMENT INTEGRATION CO.,LTD. |
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| CB02 | Change of applicant information |