CN108802113A - A kind of flexible gas sensor core chip architecture - Google Patents
A kind of flexible gas sensor core chip architecture Download PDFInfo
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- CN108802113A CN108802113A CN201810373184.4A CN201810373184A CN108802113A CN 108802113 A CN108802113 A CN 108802113A CN 201810373184 A CN201810373184 A CN 201810373184A CN 108802113 A CN108802113 A CN 108802113A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/125—Composition of the body, e.g. the composition of its sensitive layer
- G01N27/127—Composition of the body, e.g. the composition of its sensitive layer comprising nanoparticles
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Abstract
The present invention provides a kind of flexible gas sensor core chip architectures,It includes flexible substrate,Flexible gas sensing unit and flexbie overlay,Flexible gas sensing unit is multiple and interval setting from each other,Each flexible gas sensing unit includes flexible lower electrode and flexible top electrode,Gas sensitization layer is set between the lower electrode of flexibility and flexible top electrode,Wire is set in flexible substrate as connection electrode,Flexbie overlay following settings wire is as connection electrode,The lower electrode of flexibility is connect with the wire in flexible substrate respectively,Flexible top electrode is connect with the wire below flexbie overlay,There is hole on flexbie overlay,The position of hole setting is at the interval location between flexible gas sensing unit and avoids the wire in flexbie overlay,Solves the problems, such as the encapsulation under current gas sensor flexible demand,Flexible gas sensor is realized by the encapsulating structure,The application scenarios of gas sensor are made to be expanded.
Description
Technical field
The invention belongs to gas sensor technical field more particularly to a kind of flexible gas sensor core chip architectures.
Background technology
Gas sensor is a kind of converter that certain gas volume fraction is converted to corresponding electric signal.Detecting head passes through
Gas sensor improves gaseous sample, generally includes to filter out impurity and interference gas, drying or refrigeration processing instrument are aobvious
Show part.Gas sensor is divided into：Semiconductor gas sensor, electrochemical gas sensor, catalytic combustion method gas sensor,
Thermal conductivity gas sensor, infrared gas sensor etc., semiconductor-type gas sensor are to utilize some metal oxides half
Conductor material, at a certain temperature, the principle manufacture that conductivity changes with the variation of environmental gas composition.For example, wine
Smart sensor, when exactly encountering alcohol gas at high temperature using stannic oxide, prepared by principle that resistance can strongly reduce.Half
Conductor type gas sensor can be efficiently used for：Methane, ethane, propane, butane, alcohol, formaldehyde, carbon monoxide, titanium dioxide
Detect to many gases such as carbon, ethylene, acetylene, vinyl chloride, styrene, acrylic acid.Especially, this sensor is of low cost,
It is suitable for the demand of domestic gas detection.Following several semiconductor-type gas sensors are successful：Methane (natural gas, natural pond
Gas), alcohol, carbon monoxide (town gas), hydrogen sulfide, ammonia (including amine, hydrazine), the sensor of high quality can meet
The needs of industrial detection.Semiconductor-type gas sensor also has as a drawback that：Stability is poor, affected by environment larger；Especially
It, the selectivity of each sensor is not unique, and output parameter can not determine.Therefore, metering standard should not be applied to
The place really required.There is new addition in the main supplier of current this sensor recently in Japanese (inventor), followed by China
South Korea, also there is comparable work in other countries such as U.S. in this respect, but always without importing mainstream, China is in this neck
The manpower of domain input and time are all no less than Japan, but since national policy for many years is oriented to and the originals such as social information's occlusion
Cause, the semiconductor-type gas sensor performance quality that China is popular in market are all far inferior to japanese product, it is believed that, with market into
Step, the further rise of Private Capital, in domestic semiconductor-type gas sensor reached and surmounted it is Japanese it is horizontal in a few days
It can wait for.
Under current research state, need that gas sensor configuration is optimized and studied under new opplication scene
Application, such as in current wearable device field, it is also required to when using gas sensor has flexibility, it is therefore desirable to provide
A kind of gas sensor encapsulation applied under flexible scene.
Invention content
In order to solve the problems, such as the encapsulation under current gas sensor flexible demand, flexible air is realized by the encapsulating structure
Body sensor makes the application scenarios of gas sensor be expanded, and the present invention provides a kind of flexible gas sensor chip knots
Structure comprising flexible substrate, flexible gas sensing unit and flexbie overlay, the flexible gas sensing unit are multiple and mutual
Between be spaced setting, each flexible gas sensing unit includes flexible lower electrode and flexible top electrode, the flexible lower electrode and
Gas sensitization layer is set between flexible top electrode, and setting wire is as connection electrode, the flexible cover in the flexible substrate
Layer following settings wire is connect as connection electrode, the flexible lower electrode with the wire in the flexible substrate respectively,
The flexibility top electrode is connect with the wire below the flexbie overlay, has hole, the hole setting on the flexbie overlay
Position at interval location between flexible gas sensing unit and avoid the wire in flexbie overlay.
Further, described two gas sensing unit spacing are more than the transverse width of the gas sensing unit.
Further, the flexible substrate lower surface also sets up contact site, and the contact site consists of metal, the flexibility
Wire in substrate and the flexbie overlay is connected from different contact sites respectively is used as output electrode.
Further, venthole is additionally provided in the flexible substrate, the position of the venthole is sensed in flexible gas
At interval location between unit and avoid the wire in flexible substrate and contact site.
Further, the flexible top electrode and the flexible lower electrode include nano silver wire and polymeric base layer.
Further, be additionally provided with network polymerization nitride layer in the gas sensitization layer, the network polymerization nitride layer use with
The identical material of polymeric base layer is formed.
Further, for the multiple flexible gas sensing unit according to array arrangement, the array includes m rows n row, wherein m
> 3, n are more than 4, and the gas sensitization layer in each row sensing unit uses identical gas sensitive material.
Further, each row are respectively provided with public electrode in the array, and the public electrode is arranged in the flexibility
On cap rock.
The beneficial effects of the invention are as follows：The present invention provides a kind of flexible gas sensor core chip architectures comprising flexible
Substrate, flexible gas sensing unit and flexbie overlay, the flexible gas sensing unit are multiple and interval setting from each other,
Each flexible gas sensing unit includes flexible lower electrode and flexible top electrode, between the flexible lower electrode and flexible top electrode
Gas sensitization layer is set, and setting wire is as connection electrode, the flexbie overlay following settings metal in the flexible substrate
Silk is used as connection electrode, the flexible lower electrode to be connect with the wire in the flexible substrate respectively, the flexibility top electrode
It is connect with the wire below the flexbie overlay, there is hole, the position of the hole setting is in flexible air on the flexbie overlay
At interval location between body sensing unit and the wire in flexbie overlay is avoided, solving current gas sensor flexibility needs
The problem of encapsulation under asking, realizes flexible gas sensor by the encapsulating structure, the application scenarios of gas sensor is made to obtain
Extension.
Description of the drawings
Fig. 1 is the schematic diagram of flexible gas sensor core chip architecture of the present invention.
Specific implementation mode
To facilitate the understanding of the present invention, below with reference to relevant drawings to invention is more fully described.In attached drawing
Give the preferred embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.Keep the understanding to the disclosure more saturating on the contrary, purpose of providing these embodiments is
It is thorough comprehensive.
Invention is further described in detail below in conjunction with the accompanying drawings and the specific embodiments.
It is the schematic diagram of flexible gas sensor core chip architecture of the present invention referring to Fig. 1, Fig. 1, the present invention provides a kind of soft
Property gas sensor chip structure comprising flexible substrate 1, flexible gas sensing unit 2 and flexbie overlay 3, the flexible air
Body sensing unit 2 is multiple and interval setting from each other, and each flexible gas sensing unit 2 includes flexible lower electrode 4 and soft
Property top electrode 5, setting gas sensitization layer 6 between the flexible lower electrode 4 and flexible top electrode 5 is arranged in the flexible substrate 1
Wire as connection electrode, 3 following settings wire of the flexbie overlay as connection electrode, the flexible lower electrode 4 with
Wire connection in the flexible substrate 1 respectively, the flexibility top electrode 5 connect with the wire below the flexbie overlay 3
It connects, there is hole 7, interval location of the position that the hole 7 is arranged between flexible gas sensing unit 2 on the flexbie overlay 3
Place and avoid the wire in flexbie overlay 3.
Further, described two gas sensing unit spacing are more than the transverse width of the gas sensing unit.
Further, 1 lower surface of the flexible substrate also sets up contact site, and the contact site consists of metal, described soft
Property substrate 1 and the flexbie overlay 3 in wire respectively from different contact sites be connected be used as output electrode.
Further, venthole 7 is additionally provided in the flexible substrate 1, the position of the venthole 7 is passed in flexible gas
At interval location between sense unit 2 and avoid the wire in flexible substrate 1 and contact site.
Further, the flexible top electrode 5 and the flexible lower electrode 4 include nano silver wire and polymeric base layer.
Further, be additionally provided with network polymerization nitride layer in the gas sensitization layer 6, the network polymerization nitride layer use with
The identical material of polymeric base layer is formed.
Further, for the multiple flexible gas sensing unit 2 according to array arrangement, the array includes m rows n row, wherein m
> 3, n are more than 4, and the gas sensitization layer 6 in each row sensing unit uses identical gas sensitive material.
Further, each row are respectively provided with public electrode in the array, and the public electrode is arranged in the flexibility
On cap rock 3.
The present invention provides a kind of flexible gas sensor core chip architectures comprising flexible substrate, flexible gas sensing are single
Member and flexbie overlay, the flexible gas sensing unit are multiple and interval setting from each other, and each flexible gas sensing is single
Member includes flexible lower electrode and flexible top electrode, and gas sensitization layer, institute is arranged between the flexible lower electrode and flexible top electrode
It states and wire is set in flexible substrate as connection electrode, the flexbie overlay following settings wire is as connection electrode, institute
It states electrode under flexibility to connect with the wire in the flexible substrate respectively, below the flexibility top electrode and the flexbie overlay
Wire connection, there is hole, between the position of the hole setting is between flexible gas sensing unit on the flexbie overlay
At position and the wire in flexbie overlay is avoided, solves the problems, such as the encapsulation under current gas sensor flexible demand,
Flexible gas sensor is realized by the encapsulating structure, and the application scenarios of gas sensor is made to be expanded.
Relationship described in attached drawing is used to only for illustration, should not be understood as the limitation to this patent, it is clear that this
The above embodiment is merely an example for clearly illustrating the present invention for invention, and is not to embodiments of the present invention
Restriction.For those of ordinary skill in the art, other not similar shapes can also be made on the basis of the above description
The variation or variation of formula.There is no necessity and possibility to exhaust all the enbodiments.It is all in the spirit and principles in the present invention
Within made by all any modification, equivalent and improvement etc., should all be included in the scope of protection of the claims of the present invention.
Claims (8)
1. a kind of flexible gas sensor core chip architecture comprising flexible substrate, flexible gas sensing unit and flexbie overlay,
It is characterized in that, the flexible gas sensing unit is multiple and interval setting from each other, each flexible gas sensing unit packet
Electrode and flexible top electrode under flexibility are included, gas sensitization layer is set between the flexible lower electrode and flexible top electrode, it is described soft
Property substrate in setting wire as connection electrode, the flexbie overlay following settings wire is described soft as connection electrode
Property under electrode connect with the wire in the flexible substrate respectively, the gold below the flexibility top electrode and the flexbie overlay
Belong to silk connection, there is hole, gap digit of the position that the hole is arranged between flexible gas sensing unit on the flexbie overlay
The place of setting and avoid the wire in flexbie overlay.
2. flexible gas sensor core chip architecture according to claim 1, which is characterized in that two gas sensing lists
First spacing is more than the transverse width of the gas sensing unit.
3. flexible gas sensor core chip architecture according to claim 1 or 2, which is characterized in that under the flexible substrate
Surface also sets up contact site, and the contact site consists of metal, the wire in the flexible substrate and the flexbie overlay point
It is not connected from different contact sites and is used as output electrode.
4. flexible gas sensor core chip architecture according to claim 3, which is characterized in that also set in the flexible substrate
It is equipped with venthole, the position of the venthole is at the interval location between flexible gas sensing unit and avoids in flexible substrate
Wire and contact site.
5. flexible gas sensor core chip architecture according to claim 1, which is characterized in that the flexibility top electrode and institute
It includes nano silver wire and polymeric base layer to state electrode under flexibility.
6. flexible gas sensor core chip architecture according to claim 5, which is characterized in that in the gas sensitization layer also
It is provided with network polymerization nitride layer, the network polymerization nitride layer is formed using material identical with polymeric base layer.
7. flexible gas sensor core chip architecture according to claim 1, which is characterized in that the multiple flexible gas passes
Unit is felt according to array arrangement, and the array includes m rows n row, and wherein m > 3, n are more than 4, and the gas in each row sensing unit
Body sensitive layer uses identical gas sensitive material.
8. flexible gas sensor core chip architecture according to claim 7, which is characterized in that each row point in the array
Not Ju You public electrode, the public electrode is arranged on the flexbie overlay.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810373184.4A CN108802113A (en) | 2018-04-24 | 2018-04-24 | A kind of flexible gas sensor core chip architecture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810373184.4A CN108802113A (en) | 2018-04-24 | 2018-04-24 | A kind of flexible gas sensor core chip architecture |
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| Publication Number | Publication Date |
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| CN108802113A true CN108802113A (en) | 2018-11-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810373184.4A Withdrawn CN108802113A (en) | 2018-04-24 | 2018-04-24 | A kind of flexible gas sensor core chip architecture |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109813470A (en) * | 2019-03-25 | 2019-05-28 | 重庆大学 | A kind of highly sensitive and wide-range pressure sensor |
| CN111103331A (en) * | 2019-12-27 | 2020-05-05 | 安徽芯淮电子有限公司 | Full-flexible heatable gas sensor and manufacturing method thereof |
-
2018
- 2018-04-24 CN CN201810373184.4A patent/CN108802113A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109813470A (en) * | 2019-03-25 | 2019-05-28 | 重庆大学 | A kind of highly sensitive and wide-range pressure sensor |
| CN111103331A (en) * | 2019-12-27 | 2020-05-05 | 安徽芯淮电子有限公司 | Full-flexible heatable gas sensor and manufacturing method thereof |
| CN111103331B (en) * | 2019-12-27 | 2021-05-25 | 安徽芯淮电子有限公司 | Full-flexible heatable gas sensor and manufacturing method thereof |
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Application publication date: 20181113 |