CN108788360A - A kind of vacuum high-temperature soldering oven being quickly cooled down - Google Patents
A kind of vacuum high-temperature soldering oven being quickly cooled down Download PDFInfo
- Publication number
- CN108788360A CN108788360A CN201810495146.6A CN201810495146A CN108788360A CN 108788360 A CN108788360 A CN 108788360A CN 201810495146 A CN201810495146 A CN 201810495146A CN 108788360 A CN108788360 A CN 108788360A
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- China
- Prior art keywords
- vacuum
- soldering
- room
- cooled down
- furnace body
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of vacuum high-temperature soldering ovens being quickly cooled down, including furnace body, furnace body side is equipped with hermatic door, soldering room, heating room, cooling cycle room are equipped in furnace body, soldering is indoor to be equipped with soldering platform, it is brazed the heating room that upper end opening is equipped with below platform, the top for being brazed platform is equipped with cooling cycle room, and 2 groups and 2 groups or more of semiconductor cooling component is equipped in cooling cycle room；Cool guide sheet connects waffle slab, and thermally conductive sheet connects one end of circulation pipe, and the other end of circulation pipe and the bottom of soldering room are connected；Vacuum chamber is equipped with above furnace body.The invention discloses a kind of vacuum high-temperature soldering ovens being quickly cooled down, and not only effectively cooling noise reduction, reduction noise improve working environment；Meanwhile it realizing to the heat recovery and utilization in high temperature brazing stove.
Description
Technical field
The present invention relates to a kind of industrial furnace, specially a kind of vacuum high-temperature soldering oven being quickly cooled down.
Background technology
Soldering oven is a kind of equipment for solder bonding metal and brightness heat treatment.Suitable for the middle-size and small-size stainless of batch production
Steel part (tableware, cutter, hardware etc.), such as martensitic stain less steel bright quenching, tempering, austenitic stainless steel bright annealing.Very
Outage temperature soldering oven is most common one kind of existing soldering oven, and work efficiency is high, and soldering effect is good.
Soldering oven in the prior art has the following problems when in use：1, the poor problem of vacuum degree, while vacuum gauge
Tube capacity vulnerable to pollution is easy pollution vacuum gauge due in high-temperature calcination brazing process, will produce exhaust gas；2, in the prior art
General to carry out cooling processing using air cooling system, the noise that air cooling system generates is larger, is made an uproar although can enhance noise silencer to reduce
Sound, but still noise is larger, causes noise pollution, the entire workshop hummed that works, the working environment of worker is poor；3, hot
Measure recycling problem, cooling method in the prior art, it is difficult to effectively recycle heat, cause the loss of heat.
Invention content
To solve the above problems, the invention discloses a kind of vacuum high-temperature soldering ovens being quickly cooled down, it is not only effective to drop
Temperature drop is made an uproar, and noise is reduced, and improves working environment；Meanwhile it realizing to the heat recovery and utilization in high temperature brazing stove.
In order to reach object above, the present invention provides the following technical solutions：
A kind of vacuum high-temperature soldering oven being quickly cooled down, including furnace body, the furnace body side are equipped with hermatic door, the sealing door hinge
Chain link furnace body；Soldering room, heating room, cooling cycle room are equipped in the furnace body, the soldering interior is equipped with soldering platform, described
Brazing member to be placed on soldering platform, and the heating room of upper end opening is equipped with below the soldering platform, the heating is indoor to be equipped with heater,
The top of the soldering platform is equipped with cooling cycle room, and waffle slab is equipped between the soldering room and cooling cycle room；The cooling
2 groups and 2 groups or more of semiconductor cooling component is equipped in circular chamber；The semiconductor cooling component include thermally conductive sheet, cool guide sheet,
The hot junction of semiconductor chilling plate, the semiconductor chilling plate connects thermally conductive sheet, and the cold end of the semiconductor chilling plate connects conduction cooling
Piece, the cool guide sheet connect waffle slab, one end of the thermally conductive sheet connection circulation pipe, the other end and the soldering room of the circulation pipe
Bottom be connected, heat storage is equipped in the circulation pipe；Vacuum chamber is equipped with above the furnace body；In the vacuum chamber
Equipped with vacuum generator, vacuum gauge, the vacuum generator connects vacuum gauge, and the end of the vacuum gauge is located at cooling
In circular chamber；Filter is equipped in the vacuum gauge.
Further, the vacuum chamber side is equipped with sensing chamber, and the detection is indoor equipped with vacuum degree display, described true
Reciprocal of duty cycle display connects vacuum level detector by vacuum degree measurement pipeline, and the vacuum level detector is located at cooling cycle room
It is interior.
Further, the soldering is indoor is equipped with thermal insulation layer, and the thermal insulation layer is arranged in the top of soldering platform.
Further, the semiconductor chilling plate includes alumina ceramic plate, P-type semiconductor, N-type semiconductor, the oxygen
The one side for changing aluminium potsherd connects P-type semiconductor, and another side connects N-type semiconductor.
Further, the semiconductor cooling component includes 4 groups.
Further, the furnace body is equipped with observation window.Observation window facilitates observation soldering situation, and it is indoor to observe soldering
Situation.
Further, the end of the vacuum gauge is equipped with cone-shaped hood.Cone-shaped hood can accelerate the speed vacuumized.
The invention has the advantages that：
（1）The vacuum high-temperature soldering oven that the present invention is quickly cooled down, good refrigeration effect, speed is fast, can be quickly cooled down soldering furnace body.And
Refrigerant is not needed, sustainable quality, when work is not vibrated, noiseless.
（2）The vacuum high-temperature soldering oven that the present invention is quickly cooled down realizes that recycling for heat, heat pass through circulation pipe weight
It newly enters in soldering oven, realizes the heating to being brazed platform, to realize the heating to brazing member.
（3）The vacuum high-temperature soldering oven that the present invention is quickly cooled down, vacuum pumping rate is fast, and vacuum degree is high, while vacuum gauge
Not vulnerable to pollution.
（4）The vacuum high-temperature soldering oven that the present invention is quickly cooled down, structure novel realize automation control.
Description of the drawings
The internal structure schematic diagram of Fig. 1, the present invention；
The front view of Fig. 2, the present invention；
The left view of Fig. 3, the present invention.
Wherein：Furnace body 100, hermatic door 200, soldering room 1, heating room 2, cooling cycle room 3, soldering platform 4, heater 5, net
Panel 6, thermally conductive sheet 71, cool guide sheet 72, semiconductor chilling plate 73, circulation pipe 8, vacuum chamber 9, vacuum generator 10, vacuum gauge
11, filter 12, sensing chamber 13, vacuum degree display 14, vacuum degree measurement pipeline 15, vacuum level detector 16, thermal insulation layer 17,
Observation window 18, cone-shaped hood 19, heat storage 20.
Specific implementation mode
With reference to the accompanying drawings and detailed description, the present invention is furture elucidated, it should be understood that following specific implementation modes are only
For illustrating the present invention rather than limiting the scope of the invention.
As shown in Figure 1, Figure 2, Figure 3 shows, a kind of vacuum high-temperature soldering oven being quickly cooled down, including furnace body 100, furnace body side are set
There are hermatic door 200, hermatic door hinge connection furnace body；Soldering room 1, heating room 2, cooling cycle room 3 are equipped in furnace body, soldering is indoor
It equipped with soldering platform 4, is brazed on platform and places brazing member, soldering platform lower section is equipped with the heating room of upper end opening, and indoor be equipped with of heating adds
Hot device 5, the top for being brazed platform are equipped with cooling cycle room, are brazed between room and cooling cycle room and are equipped with waffle slab 6；Cooling cycle room
Inside it is equipped with 2 groups and 2 groups or more of semiconductor cooling component 7；Semiconductor cooling component includes thermally conductive sheet 71, cool guide sheet 72, partly leads
The hot junction of body cooling piece 73, semiconductor chilling plate connects thermally conductive sheet, and the cold end of semiconductor chilling plate connects cool guide sheet, and cool guide sheet connects
Waffle slab is connect, thermally conductive sheet connects one end of circulation pipe 8, and the other end of circulation pipe and the bottom of soldering room are connected, circulation pipe
It is interior to be equipped with heat storage 20；Vacuum chamber 9 is equipped with above furnace body；Vacuum generator 10, vacuum gauge 11, vacuum hair are equipped in vacuum chamber
Raw device connects vacuum gauge, and the end of vacuum gauge is located in cooling cycle room；Filter 12 is equipped in vacuum gauge.
In the present embodiment, vacuum chamber side is equipped with sensing chamber 13, and detection is indoor to be equipped with vacuum degree display 14, vacuum degree
Display connects vacuum level detector 16 by vacuum degree measurement pipeline 15, and vacuum level detector is located in cooling cycle room.
In the present embodiment, soldering is indoor is equipped with thermal insulation layer 17, and thermal insulation layer is arranged in the top of soldering platform.
In the present embodiment, semiconductor chilling plate includes alumina ceramic plate, P-type semiconductor, N-type semiconductor, the oxygen
The one side for changing aluminium potsherd connects P-type semiconductor, and another side connects N-type semiconductor.
In the present embodiment, semiconductor cooling component includes 4 groups.
In the present embodiment, furnace body is equipped with observation window 18.Observation window facilitates observation soldering situation, and it is indoor to observe soldering
The case where.
In the present embodiment, the end of vacuum gauge is equipped with cone-shaped hood 19.Cone-shaped hood can accelerate the speed vacuumized.
The operation principle of the present invention：It puts the workpiece on soldering platform, the indoor vacuum generator of vacuum takes out soldering room
Vacuum, while indoor heater heating is heated, heat is provided, realizes that the soldering in the indoor realization workpiece of soldering, soldering are completed
Afterwards, using the indoor semiconductor cooling component of cooling cycle to being brazed indoor heat recovery and utilization, while it is indoor to reduce soldering
Stabilization, realize being quickly cooled down for workpiece；Then the heat of recycling when being brazed next time, is heated to be brazed indoor use.
The technical means disclosed in the embodiments of the present invention is not limited only to the technological means disclosed in the above embodiment, further includes
By the above technical characteristic arbitrarily the formed technical solution of combination.It should be pointed out that for those skilled in the art
For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (7)
1. a kind of vacuum high-temperature soldering oven being quickly cooled down, it is characterised in that：Including furnace body, the furnace body side is equipped with sealing
Door, the hermatic door hinge connection furnace body；Soldering room, heating room, cooling cycle room are equipped in the furnace body, the soldering is indoor
Equipped with soldering platform, brazing member is placed on the soldering platform, the heating room of upper end opening, the heating are equipped with below the soldering platform
Interior is equipped with heater, and the top of the soldering platform is equipped with cooling cycle room, is equipped between the soldering room and cooling cycle room
Waffle slab；2 groups and 2 groups or more of semiconductor cooling component is equipped in the cooling cycle room；The semiconductor cooling component packet
Thermally conductive sheet, cool guide sheet, semiconductor chilling plate are included, the hot junction of the semiconductor chilling plate connects thermally conductive sheet, the semiconductor refrigerating
The cold end of piece connects cool guide sheet, and the cool guide sheet connects waffle slab, one end of the thermally conductive sheet connection circulation pipe, the circulation pipe
The other end and be brazed the bottom of room and be connected, heat storage is equipped in the circulation pipe；It is equipped with above the furnace body true
Empty room；Vacuum generator, vacuum gauge are equipped in the vacuum chamber, the vacuum generator connects vacuum gauge, the vacuum
The end regulated is located in cooling cycle room；Filter is equipped in the vacuum gauge.
2. a kind of vacuum high-temperature soldering oven being quickly cooled down as described in claim 1, it is characterised in that：The vacuum chamber side
Equipped with sensing chamber, the detection is indoor to be equipped with vacuum degree display, and the vacuum degree display is connected by vacuum degree measurement pipeline
Vacuum level detector is connect, the vacuum level detector is located in cooling cycle room.
3. a kind of vacuum high-temperature soldering oven being quickly cooled down as claimed in claim 1 or 2, it is characterised in that：The soldering room
Interior to be equipped with thermal insulation layer, the thermal insulation layer is arranged in the top of soldering platform.
4. a kind of vacuum high-temperature soldering oven being quickly cooled down as claimed in claim 3, it is characterised in that：The semiconductor refrigerating
Piece includes alumina ceramic plate, P-type semiconductor, N-type semiconductor, and the one side of the alumina ceramic plate connects P-type semiconductor, separately
N-type semiconductor is connected on one side.
5. a kind of vacuum high-temperature soldering oven being quickly cooled down as claimed in claim 4, it is characterised in that：The semiconductor cooling
Component includes 4 groups.
6. a kind of vacuum high-temperature soldering oven being quickly cooled down as described in claim 1, it is characterised in that：The furnace body is equipped with
Observation window.
7. a kind of vacuum high-temperature soldering oven being quickly cooled down as described in claim 1, it is characterised in that：The vacuum gauge
End is equipped with cone-shaped hood.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810495146.6A CN108788360A (en) | 2018-05-22 | 2018-05-22 | A kind of vacuum high-temperature soldering oven being quickly cooled down |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810495146.6A CN108788360A (en) | 2018-05-22 | 2018-05-22 | A kind of vacuum high-temperature soldering oven being quickly cooled down |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108788360A true CN108788360A (en) | 2018-11-13 |
Family
ID=64091303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810495146.6A Pending CN108788360A (en) | 2018-05-22 | 2018-05-22 | A kind of vacuum high-temperature soldering oven being quickly cooled down |
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| CN (1) | CN108788360A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110744166A (en) * | 2019-11-29 | 2020-02-04 | 昆山市嘉源昊泽光电科技有限公司 | Vacuum welding furnace |
Citations (9)
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|---|---|---|---|---|
| JPH06124955A (en) * | 1991-02-16 | 1994-05-06 | Sukegawa Electric Co Ltd | High-temperature vacuum heating furnace and its cooling method |
| US20020139794A1 (en) * | 2001-03-30 | 2002-10-03 | Budinger David Edwin | Apparatus and method for protective atmosphere induction brazing of complex geometries |
| CN102029707A (en) * | 2010-11-04 | 2011-04-27 | 霍兆添 | Heat setting device of pillow core |
| CN103394783A (en) * | 2013-07-30 | 2013-11-20 | 哈尔滨工业大学（威海） | Ultrasonic-assisted vacuum brazing equipment |
| CN203478683U (en) * | 2013-07-05 | 2014-03-12 | 赖耀华 | Semiconductor cooler |
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2018
- 2018-05-22 CN CN201810495146.6A patent/CN108788360A/en active Pending
Patent Citations (9)
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|---|---|---|---|---|
| JPH06124955A (en) * | 1991-02-16 | 1994-05-06 | Sukegawa Electric Co Ltd | High-temperature vacuum heating furnace and its cooling method |
| US20020139794A1 (en) * | 2001-03-30 | 2002-10-03 | Budinger David Edwin | Apparatus and method for protective atmosphere induction brazing of complex geometries |
| CN102029707A (en) * | 2010-11-04 | 2011-04-27 | 霍兆添 | Heat setting device of pillow core |
| CN203478683U (en) * | 2013-07-05 | 2014-03-12 | 赖耀华 | Semiconductor cooler |
| CN103394783A (en) * | 2013-07-30 | 2013-11-20 | 哈尔滨工业大学（威海） | Ultrasonic-assisted vacuum brazing equipment |
| CN103769712A (en) * | 2013-12-31 | 2014-05-07 | 吴江亿泰真空设备科技有限公司 | Vacuum brazing furnace |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110744166A (en) * | 2019-11-29 | 2020-02-04 | 昆山市嘉源昊泽光电科技有限公司 | Vacuum welding furnace |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181113 |