CN108770199B - Composite circuit board - Google Patents

Composite circuit board Download PDF

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Publication number
CN108770199B
CN108770199B CN201810542765.6A CN201810542765A CN108770199B CN 108770199 B CN108770199 B CN 108770199B CN 201810542765 A CN201810542765 A CN 201810542765A CN 108770199 B CN108770199 B CN 108770199B
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CN
China
Prior art keywords
connecting piece
wiring board
main board
mainboard
pin
Prior art date
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Application number
CN201810542765.6A
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Chinese (zh)
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CN108770199A (en
Inventor
金庆波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGSU HEHONG ELECTRONIC Co.,Ltd.
Original Assignee
Jiangsu Hehong Electronic Co ltd
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Publication date
Application filed by Jiangsu Hehong Electronic Co ltd filed Critical Jiangsu Hehong Electronic Co ltd
Priority to CN201810542765.6A priority Critical patent/CN108770199B/en
Publication of CN108770199A publication Critical patent/CN108770199A/en
Application granted granted Critical
Publication of CN108770199B publication Critical patent/CN108770199B/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/142Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0209External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention discloses a composite circuit board which comprises a middle main board and side boards arranged on two sides of the main board, wherein one side of the main board opposite to the side boards is provided with a slot, the inner wall of one side of the slot is provided with a first metal conducting strip, the side boards right opposite to the slot are respectively provided with a metal conducting insert in a protruding mode, the metal conducting inserts are respectively provided with a corresponding second metal conducting strip right opposite to each first metal conducting strip, the main board and the side boards are connected and conducted through the metal conducting inserts, a protection cavity is arranged in the middle of a connecting piece, and the upper end face of the protection cavity is opened. The invention has simple structure, can protect each electronic element, has good heat radiation performance, greatly increases the heat radiation performance of the circuit board, has extremely thin mainboard part, and is particularly suitable for thin product equipment.

Description

Composite circuit board
Technical Field
The invention relates to the field of circuit boards, in particular to a composite circuit board.
Background
The PCB is the most core electronic device of each electronic device, but the conventional PCB generally includes a main board and electronic components soldered on the main board, and since the electronic components are only provided with pins to be fixed on the PCB, the overall thickness of the protruding electronic components is increased, and for today's thin products, the PCB is difficult to meet the installation requirements. In addition, the protruding electronic components are damaged by impact, and when the PCB is impacted, the electronic components are subjected to the impact force, so that the PCB is easily damaged. Furthermore, the electronic components generate a large amount of heat when the circuit board is used, the heat is gathered together, and the heat is difficult to dissipate, and particularly, the heat is concentrated on the electronic components at the middle most part.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a composite circuit board, which can effectively solve various defects in the prior art, can realize better safety and heat dissipation performance, and is particularly suitable for thin products.
The invention is realized by the following technical scheme: the utility model provides a composite circuit board, includes middle mainboard and sets up the curb plate in the mainboard both sides, a slot is all seted up to the relative curb plate one side of mainboard, and slot one side inner wall is provided with first metal conducting strip, just all the protrusion sets up a metal conductive insert on the curb plate to the slot, just all is provided with corresponding second metal conducting strip to every first metal conducting strip on the metal conductive insert, is connected through metal conductive insert between mainboard and the curb plate and switches on, equal connecting piece of cartridge between curb plate and the mainboard, the centre of connecting piece is provided with a protection chamber, and the up end opening in protection chamber, the crooked its pin of electronic component and bend to buckle in the protection intracavity, the pin with mainboard and the pad welded fastening on the curb plate.
According to a preferable technical scheme, two sides of the connecting piece are opposite to the main board and the side boards respectively provided with a clamping groove, and the side boards and the main board are inserted into the clamping grooves and fixed.
According to the preferable technical scheme, a layer of insulating heat-conducting film is adhered to the upper end and the lower end of the inner wall of the clamping groove, and the insulating heat-conducting film is in contact compression with the main board and the side boards.
As a preferred technical scheme, two sides of the upper end surface of the connecting piece are respectively provided with more than one pin clamping groove, and the bent pin part is buckled into the pin clamping grooves at the upper end of the connecting piece.
According to the preferable technical scheme, the bottom surface and the side wall of the pin clamping groove are adhered with a layer of adhesive layer, and the bottom of the buckled pin is fixedly adhered with the adhesive layer.
As a preferable technical scheme, the connecting piece is integrally made of a metal material.
As a preferred technical scheme, the connecting piece is made of copper.
As a preferred technical scheme, a screw is locked into the slot at two sides of the main board, and the screw is locked with the inserted metal conductive insertion sheet.
The invention has the beneficial effects that: the invention has simple structure, can protect each electronic element, has good heat radiation performance, greatly increases the heat radiation performance of the circuit board, has extremely thin mainboard part, and is particularly suitable for thin product equipment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic structural view of the connector of the present invention.
The codes in the figure are respectively: the structure comprises a socket 1, a first metal conducting strip 2, a metal conducting insert 3, a pin socket 4, a side plate 5, pins 6, a bonding pad 7, a connecting piece 8, a protection cavity 9, a main board 11, an electronic element 12, a clamping groove 13 and a screw 14.
Detailed Description
As shown in fig. 1, the composite circuit board includes a middle main board 11 and side boards 5 disposed at two sides of the main board 11, one side of the main board 11 opposite to the side boards is provided with a slot 1, the inner wall of one side of the slot 1 is provided with a first metal conductive sheet 2, the side boards 5 facing the slot 1 are respectively provided with a metal conductive insert 3 in a protruding manner, the metal conductive inserts 3 are provided with corresponding second metal conductive sheets (not shown) facing each first metal conductive sheet 2, and the main board 11 and the side boards 5 are connected and conducted through the metal conductive inserts 3;
a connecting piece 8 is inserted between the side plate 5 and the main plate 11, a protection cavity 9 is arranged in the middle of the connecting piece 8, the upper end face of the protection cavity 9 is open, the electronic element 12 bends the pins 6 and bends and buckles the pins in the protection cavity 9, and the pins 6 are welded and fixed with the main plate 11 and the welding disc 7 on the side plate 5.
As shown in fig. 2, two sides of the connecting member 8 are opposite to the main plate 11 and the side plate 5, and the side plate 5 and the main plate 11 are inserted into the clamping grooves 13 and fixed. The upper and lower ends of the inner wall of the clamping groove 13 are adhered with a layer of insulating heat-conducting film (not shown), and the insulating heat-conducting film (not shown) is in contact with and pressed against the main board 11 and the side board 5. Realize the insulation between connecting piece and mainboard and the curb plate through insulating heat conduction membrane to can effectively absorb heat, dispel the heat through the connecting piece.
More than one pin clamping groove 4 is formed in each of two sides of the upper end face of the connecting piece 8, the bent pin is buckled into the pin clamping groove 4 in the upper end of the connecting piece, an adhesive layer (not shown) is adhered to the bottom face and the side wall of each pin clamping groove 4, and the bottoms of the buckled pins 6 are adhered and fixed with the adhesive layer. The pins are fixed through the adhesive layer, and conductive contact can be prevented.
In this embodiment, the connecting member 8 is integrally made of a metal material, and specifically, the connecting member 8 is made of a copper material. The electronic component has good heat dissipation performance, and after the electronic component is buckled in the middle protection cavity, heat can be quickly transferred to the connecting piece for heat dissipation, so that the electronic component has good heat dissipation performance. And because each electronic element is buckled in the protection cavity, each electronic element can be effectively protected, and therefore, each electronic element cannot be damaged if the electronic element is directly impacted.
Wherein, a screw 14 is locked into the two sides of the main board 11 opposite to the slot, and the screw 14 is locked with the inserted metal conductive insert 3. The conductive connection of the main board and the side board is realized through the metal conductive insertion sheet 3, so that the main board becomes a complete circuit main board.
Because each electronic element is buckled in the protection cavity, the thickness of the whole circuit board is the thickness of the main board and the side boards, so that the whole thickness can be greatly reduced, and the circuit board is particularly suitable for thin products and is very light.
The invention has the beneficial effects that: the invention has simple structure, can protect each electronic element, has good heat radiation performance, greatly increases the heat radiation performance of the circuit board, has extremely thin mainboard part, and is particularly suitable for thin product equipment.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.

Claims (8)

1. A composite wiring board characterized by: including middle mainboard and the curb plate of setting in the mainboard both sides, a slot is all seted up to relative curb plate one side of mainboard, and slot one side inner wall is provided with first metal conducting strip, just sets up a metal conductive insert piece to all the protrusion on the curb plate of slot, just all is provided with corresponding second metal conducting strip to every first metal conducting strip on the metal conductive insert piece, is connected through metal conductive insert piece between mainboard and the curb plate and switches on, connecting piece of equal cartridge between curb plate and the mainboard, the centre of connecting piece is provided with a protection chamber, the up end opening in protection chamber, and its pin of electronic component bending is buckled in the protection intracavity, and the pad welded fastening on pin and mainboard and the curb plate.
2. The composite wiring board of claim 1, wherein: the two sides of the connecting piece are opposite to the main board and the side boards, and the side boards and the main board are inserted into the clamping grooves and fixed.
3. The composite wiring board of claim 2, wherein: the upper end and the lower end of the inner wall of the clamping groove are respectively adhered with a layer of insulating heat-conducting film, and the insulating heat-conducting film is tightly contacted with the main board and the side board.
4. The composite wiring board of claim 1, wherein: more than one pin clamping groove is formed in each of two sides of the upper end face of the connecting piece, and the bent pin part is buckled into the pin clamping groove in the upper end of the connecting piece.
5. The composite wiring board of claim 4, wherein: and the bottom surface and the side wall of the pin clamping groove are adhered with a layer of adhesive layer, and the bottom of the buckled pin is adhered and fixed with the adhesive layer.
6. The composite wiring board of claim 1, wherein: the connecting piece is integrally made of metal materials.
7. The composite wiring board of claim 6, wherein: the connecting piece adopts the copper product.
8. The composite wiring board of claim 1, wherein: and screws are locked into the slots at two sides of the main board, and the screws are locked with the inserted metal conductive insertion pieces.
CN201810542765.6A 2018-05-30 2018-05-30 Composite circuit board Active CN108770199B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810542765.6A CN108770199B (en) 2018-05-30 2018-05-30 Composite circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810542765.6A CN108770199B (en) 2018-05-30 2018-05-30 Composite circuit board

Publications (2)

Publication Number Publication Date
CN108770199A CN108770199A (en) 2018-11-06
CN108770199B true CN108770199B (en) 2020-10-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810542765.6A Active CN108770199B (en) 2018-05-30 2018-05-30 Composite circuit board

Country Status (1)

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CN (1) CN108770199B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1491074A (en) * 2002-10-15 2004-04-21 ���ǵ�����ʽ���� Printing circuit board and device
CN201976357U (en) * 2008-09-05 2011-09-14 苹果公司 Handheld electronic equipment

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6543129B2 (en) * 1995-11-03 2003-04-08 Teka Interconnections Systems, Inc. Solder-bearing contacts and method of manufacture thereof and use in a solder ball grid array connector
US6483041B1 (en) * 1999-11-12 2002-11-19 Emc Corporation Micro soldered connection
CN202335063U (en) * 2011-09-30 2012-07-11 瀚斯宝丽显示科技(南京)有限公司 Structure for pasting insulation sheet on electric connector of printed circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1491074A (en) * 2002-10-15 2004-04-21 ���ǵ�����ʽ���� Printing circuit board and device
CN201976357U (en) * 2008-09-05 2011-09-14 苹果公司 Handheld electronic equipment

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Effective date of registration: 20200827

Address after: 224200 Yancheng City Dongtai city of Jiangsu Province East New District Hongda Road No. 8

Applicant after: JIANGSU HEHONG ELECTRONIC Co.,Ltd.

Address before: 322112 No. 68, long Dai village, Zuo Cun town, Dongyang City, Jinhua, Zhejiang

Applicant before: Jin Qingbo

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