CN108752724A - A kind of PCB substrate heat conductive insulating composite membrane and preparation method thereof - Google Patents
A kind of PCB substrate heat conductive insulating composite membrane and preparation method thereof Download PDFInfo
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Abstract
The present invention provides a kind of PCB substrate heat conductive insulating composite membranes and preparation method thereof, include the following steps：（1）The preparation of modified Nano AlN/ZnO particles；（2）The preparation of modified mixing Nano filling；（3）The preparation of heat conductive insulating composite membrane.The present invention is using AlN/ZnO hybrid particles as heat-conductive insulation filling, and two kinds of filler synergistic effects improve the thermal conductivity and insulating properties of composite membrane, and a small amount of addition of carbon fiber and graphite oxide plays an important role the mechanical strength of composite membrane.Composite membrane thermal coefficient produced by the present invention reaches 5.8 W/m K, and tensile strength reaches 185 MPa, and volume resistance reaches 8.2 × 1017Ω cm, therefore composite membrane produced by the present invention has good thermal conductivity, insulating properties and higher mechanical strength, the insulating heat-conductive composite membrane for being suitable for PCB substrate carries out extensive use.
Description
Technical field
The present invention relates to a kind of heat-conducting insulated films, and in particular to a kind of PCB substrate heat conductive insulating composite membrane and its preparation
Method.
Background technology
PCB substrate is printed circuit board, and PCB substrate has had the development course of decades, is exactly using most
The various components of computer-internal and low power electronic component.With electronics and IT products high-performance, multipurpose and essence
The fast development of close miniaturization, electronic component also accordingly towards light, thin, short, miniaturization, component unit volume
Reduction causes the heat flow density of unit volume drastically to be promoted, and the heating up of device causes product reliability to be deteriorated and use
Service life reduction.Studies have shown that the 50-70% that electronic product generates heat be conducted by printed circuit board derived from, therefore, tool
There is influence of the printed circuit board of excellent heat dispersion performance to product reliability particularly significant.
The middle layer of substrate is thermally conductive insulating layer, and formula, performance and the technique of thermally conductive insulating layer are entire heat-radiating substrates
Technological core where, determine insulating properties, thermal conductivity, caking property and the physical characteristic of heat-radiating substrate（Resistance to compression, anti-breakdown potential
Pressure）.Nowadays the traditional material that the thermally conductive insulating layer of substrate uses is epoxy resin, aluminium oxide etc., the heat conductivility of these materials
Poor, heat conductivility has been unable to meet the requirement of existing product, thus develop high heat conduction, high insulation, high chemical stability are led
Heat insulator is the key that improve device performance.
Invention content
Above of the existing technology in order to solve the problems, such as, the purpose of the present invention is to provide a kind of PCB substrate heat conduction
Insulation composite membrane and preparation method thereof, using this film as the thermally conductive insulating layer of PCB substrate.
To achieve the goals above, the present invention provides following technical scheme：
A kind of PCB substrate preparation method of heat conductive insulating composite membrane, includes the following steps：
（1）The preparation of modified Nano AlN/ZnO particles
100 parts of nano-aluminum nitrides and 100 parts of ZnO particles are distributed in the Aqueous Solutions of Polyethylene Glycol that mass concentration is 10%, are then added
The surface hydrophobicity modifying agent for entering 10-20 parts adjusts pH value of solution to 7.5-8.0, and the temperature in 50-60 DEG C is stirred in a nitrogen atmosphere
It mixes and 1-3h is blended, by the way that precipitation particle is collected by centrifugation, discards supernatant, then cleaned with ethyl alcohol, be placed in 60 DEG C of baking ovens and dry,
Modified Nano AlN/ZnO particles are made；
（2）The preparation of modified mixing Nano filling
The lauryl amine mass fraction that 5 parts of carbon fibers and 8 parts of graphite oxides are added to 3-5 times of parts by weight is the DMF solution of 20wt%
In, it is stirred to react 1-2h at a temperature of 120-150 DEG C, reactant is centrifuged after being cooled to room temperature, ethyl alcohol is used in combination
Sediment is cleaned, and places it in baking oven and dries, modified carbon fiber/graphite oxide mixture is made；By step（1）
Modified Nano AlN/ZnO particles obtained are added in the organic solvent of 5-10 times of parts by weight, are placed in Ultrasound Instrument and are carried out ultrasound
Modified carbon fiber/graphite oxide mixture is added in ultrasonic procedure into system by decentralized processing 20-40min, continues ultrasound 30-
Then the dopamine of final concentration of 15-30% is added in 50min, continue ultrasound 1-2h at a temperature of 60-80 DEG C, solution is carried out
Precipitation is collected by centrifugation, and it is mixed into Nano filling with ethyl alcohol cleaning, drying to get modified；
（3）The preparation of heat conductive insulating composite membrane
20-40 parts of ethylene-vinyl acetate copolymer, 15-30 parts of perfluoroethylene-propylene, 10-20 parts of polyether-ether-ketone are added to 80
In part DMF solution, it is stirred 1-2h at a temperature of 110-150 DEG C, then cools the temperature to 70-80 DEG C, in the shape of stirring
Modified 50-80 parts of Nano filling of mixing, 5-10 parts of two tricaprylate of triethylene glycol, α-cyanoacrylate are sequentially added under state
4-8 parts, 3-6 parts of oxetanes, 4-8 parts of propylene glycol phenylate, 2-5 parts of potassium fluoroaluminate, keep this temperature the reaction was continued 2-4h, i.e.,
Obtain premixed liquid；
By premixed liquid curtain coating, spin coating or plastic film mulch on clean glass plate, glass plate is dried into 1-2h at 60 DEG C, is placed it in
Dry 3-5h at 100 DEG C, then 300 DEG C are warming up to the heating rate of 2-5 DEG C/min, then 1-2h is kept the temperature at 300 DEG C, certainly by it
It is so cooled to room temperature, last demoulding, heat conductive insulating composite membrane is made.
Preferably, it is 1 that the surface hydrophobicity modifying agent, which is mass ratio,:（2-5）Methyltrimethoxysilane and perfluor it is pungent
Base ethyl triethoxysilane.
Preferably, the step（2）The middle organic solvent used is that mass ratio is（1-3）:1 isopropanol and dioxane
Mixture.
Preferably, the step（2）The middle ultrasonic power used is 200W~500W.
Preferably, the step（3）The parts by weight of the middle each raw material for preparing heat conductive insulating composite membrane are ethene-vinyl acetate
30 parts of copolymer, 23 parts of perfluoroethylene-propylene, 15 parts of polyether-ether-ketone, modified 65 parts of Nano filling of mixing, triethylene glycol two are different pungent
7.5 parts of acid esters, 6 parts of α-cyanoacrylate, 4.5 parts of oxetanes, 6 parts of propylene glycol phenylate, 3.5 parts of potassium fluoroaluminate.
PCB substrate heat conductive insulating composite membrane made from preparation method of the present invention.
Advantageous effect：The present invention provides a kind of PCB substrate heat conductive insulating composite membranes and preparation method thereof, and the present invention adopts
Use AlN/ZnO hybrid particles as heat-conductive insulation filling, two kinds of filler synergistic effects improve thermal conductivity and the insulation of composite membrane
Property, a small amount of addition of carbon fiber and graphite oxide plays an important role the mechanical strength of composite membrane.It is produced by the present invention multiple
It closes film thermal coefficient and reaches 5.8 W/m K, tensile strength reaches 185 MPa, and volume resistance reaches 8.2 × 1017Ω cm, therefore
Composite membrane produced by the present invention has good thermal conductivity, insulating properties and higher mechanical strength, is suitable for PCB substrate
Insulating heat-conductive composite membrane carries out extensive use.
Specific implementation mode
The invention will now be further described with reference to specific embodiments, but examples are merely exemplary, not to this hair
Bright range constitutes any restrictions.It will be understood by those skilled in the art that without departing from the spirit and scope of the invention
Can the details and form of technical solution of the present invention be modified or be replaced, but these modifications and replacement each fall within the present invention's
In protection domain.
Embodiment 1
A kind of PCB substrate preparation method of heat conductive insulating composite membrane, includes the following steps：
（1）The preparation of modified Nano AlN/ZnO particles
100 parts of nano-aluminum nitrides and 100 parts of ZnO particles are distributed in the Aqueous Solutions of Polyethylene Glycol that mass concentration is 10%, are then added
The surface hydrophobicity modifying agent for entering 15 parts adjusts pH value of solution to 7.5-8.0, in a nitrogen atmosphere in 55 DEG C of temperature blended under agitation
2h discards supernatant, is then cleaned with ethyl alcohol, be placed in 60 DEG C of baking ovens and dry, be made and be modified by the way that precipitation particle is collected by centrifugation
Nano-aluminum nitride/ZnO particle；
（2）The preparation of modified mixing Nano filling
The lauryl amine mass fraction that 5 parts of carbon fibers and 8 parts of graphite oxides are added to 4 times of parts by weight is the DMF solution of 20wt%
In, it is stirred to react 1.5h at a temperature of 135 DEG C, reactant is centrifuged after being cooled to room temperature, is used in combination ethyl alcohol to heavy
Starch is cleaned, and is placed it in baking oven and dried, and modified carbon fiber/graphite oxide mixture is made；By step（1）It is made
Modified Nano AlN/ZnO particles be added in the organic solvent of 8 times of parts by weight, be placed in Ultrasound Instrument progress ultrasonic disperse processing
Modified carbon fiber/graphite oxide mixture is added in ultrasonic procedure into system by 30min, continues ultrasound 40min, is then added
Final concentration of 23% dopamine continues ultrasound 1.5h at a temperature of 70 DEG C, and precipitation be collected by centrifugation by solution, and by its
With ethyl alcohol cleaning, drying Nano filling is mixed to get modified；
（3）The preparation of heat conductive insulating composite membrane
30 parts of ethylene-vinyl acetate copolymer, 23 parts of perfluoroethylene-propylene, 15 parts of polyether-ether-ketone are added to 80 parts of DMF solutions
In, it is stirred 1.5h at a temperature of 130 DEG C, then cools the temperature to 75 DEG C, modification is sequentially added in the state of stirring
Mix 65 parts of Nano filling, 7.5 parts of two tricaprylate of triethylene glycol, 6 parts of α-cyanoacrylate, 4.5 parts of oxetanes,
6 parts of propylene glycol phenylate, 3.5 parts of potassium fluoroaluminate keep this temperature the reaction was continued 3h to get premixed liquid；
By premixed liquid curtain coating, spin coating or plastic film mulch on clean glass plate, glass plate is dried into 1.5h at 60 DEG C, is placed it in
Dry 4h at 100 DEG C, then 300 DEG C are warming up to the heating rate of 3.5 DEG C/min, then 1.5h is kept the temperature at 300 DEG C, by its nature
It is cooled to room temperature, last demoulding, heat conductive insulating composite membrane is made.
It is 1 that the surface hydrophobicity modifying agent, which is mass ratio,:3.5 three second of methyltrimethoxysilane and perfluorooctylethyl group
Oxysilane.
The step（2）It is 2 that the middle organic solvent used, which is mass ratio,:1 isopropanol and the mixture of dioxane.
The step（2）The middle ultrasonic power used is 350W.
Embodiment 2
A kind of PCB substrate preparation method of heat conductive insulating composite membrane, includes the following steps：
（1）The preparation of modified Nano AlN/ZnO particles
100 parts of nano-aluminum nitrides and 100 parts of ZnO particles are distributed in the Aqueous Solutions of Polyethylene Glycol that mass concentration is 10%, are then added
The surface hydrophobicity modifying agent for entering 10 parts adjusts pH value of solution to 7.5-8.0, in a nitrogen atmosphere in 50 DEG C of temperature blended under agitation
1h discards supernatant, is then cleaned with ethyl alcohol, be placed in 60 DEG C of baking ovens and dry, be made and be modified by the way that precipitation particle is collected by centrifugation
Nano-aluminum nitride/ZnO particle；
（2）The preparation of modified mixing Nano filling
The lauryl amine mass fraction that 5 parts of carbon fibers and 8 parts of graphite oxides are added to 3 times of parts by weight is the DMF solution of 20wt%
In, it is stirred to react 1h at a temperature of 120 DEG C, reactant is centrifuged after being cooled to room temperature, is used in combination ethyl alcohol to precipitation
Object is cleaned, and is placed it in baking oven and dried, and modified carbon fiber/graphite oxide mixture is made；By step（1）It is obtained
Modified Nano AlN/ZnO particles are added in the organic solvent of 5 times of parts by weight, are placed in progress ultrasonic disperse processing in Ultrasound Instrument
Modified carbon fiber/graphite oxide mixture is added in ultrasonic procedure into system by 20min, continues ultrasound 30min, is then added
Final concentration of 15% dopamine continues ultrasound 1h at a temperature of 60 DEG C, solution is carried out precipitation is collected by centrifugation, be used in combination
Ethyl alcohol cleaning, drying mixes Nano filling to get modified；
（3）The preparation of heat conductive insulating composite membrane
20 parts of ethylene-vinyl acetate copolymer, 15 parts of perfluoroethylene-propylene, 10 parts of polyether-ether-ketone are added to 80 parts of DMF solutions
In, it is stirred 1h at a temperature of 110 DEG C, then cools the temperature to 70 DEG C, is sequentially added in the state of stirring modified mixed
Close 50 parts of Nano filling, 5 parts of two tricaprylate of triethylene glycol, 4 parts of α-cyanoacrylate, 3 parts of oxetanes, propylene glycol
4 parts of phenylate, 2 parts of potassium fluoroaluminate keep this temperature the reaction was continued 2h to get premixed liquid；
By premixed liquid curtain coating, spin coating or plastic film mulch on clean glass plate, glass plate is dried into 1h at 60 DEG C, is placed it in
Dry 3h at 100 DEG C, then 300 DEG C are warming up to the heating rate of 2 DEG C/min, then 1h is kept the temperature at 300 DEG C, by its natural cooling
To room temperature, heat conductive insulating composite membrane is made in last demoulding.
Preferably, it is 1 that the surface hydrophobicity modifying agent, which is mass ratio,:2 methyltrimethoxysilane and perfluoro capryl second
Ethyl triethoxy silicane alkane.
The step（2）It is 1 that the middle organic solvent used, which is mass ratio,:1 isopropanol and the mixture of dioxane.
The step（2）The middle ultrasonic power used is 200W.
Embodiment 3
A kind of PCB substrate preparation method of heat conductive insulating composite membrane, includes the following steps：
（1）The preparation of modified Nano AlN/ZnO particles
100 parts of nano-aluminum nitrides and 100 parts of ZnO particles are distributed in the Aqueous Solutions of Polyethylene Glycol that mass concentration is 10%, are then added
The surface hydrophobicity modifying agent for entering 12 parts adjusts pH value of solution to 7.5-8.0, in a nitrogen atmosphere in 53 DEG C of temperature blended under agitation
1.5h discards supernatant, is then cleaned with ethyl alcohol, be placed in 60 DEG C of baking ovens and dry, be made and change by the way that precipitation particle is collected by centrifugation
Property nano-aluminum nitride/ZnO particle；
（2）The preparation of modified mixing Nano filling
The lauryl amine mass fraction that 5 parts of carbon fibers and 8 parts of graphite oxides are added to 3.5 times of parts by weight is the DMF solution of 20wt%
In, it is stirred to react 1.2h at a temperature of 130 DEG C, reactant is centrifuged after being cooled to room temperature, is used in combination ethyl alcohol to heavy
Starch is cleaned, and is placed it in baking oven and dried, and modified carbon fiber/graphite oxide mixture is made；By step（1）It is made
Modified Nano AlN/ZnO particles be added in the organic solvent of 6 times of parts by weight, be placed in Ultrasound Instrument progress ultrasonic disperse processing
Modified carbon fiber/graphite oxide mixture is added in ultrasonic procedure into system by 25min, continues ultrasound 35min, is then added
Final concentration of 20% dopamine continues ultrasound 1.2h at a temperature of 65 DEG C, and precipitation be collected by centrifugation by solution, and by its
With ethyl alcohol cleaning, drying Nano filling is mixed to get modified；
（3）The preparation of heat conductive insulating composite membrane
25 parts of ethylene-vinyl acetate copolymer, 20 parts of perfluoroethylene-propylene, 12 parts of polyether-ether-ketone are added to 80 parts of DMF solutions
In, it is stirred 1.2h at a temperature of 120 DEG C, then cools the temperature to 72 DEG C, modification is sequentially added in the state of stirring
Mix 60 parts of Nano filling, 6 parts of two tricaprylate of triethylene glycol, 5 parts of α-cyanoacrylate, 4 parts of oxetanes, the third two
5 parts of alcohol phenylate, 3 parts of potassium fluoroaluminate keep this temperature the reaction was continued 2.5h to get premixed liquid；
By premixed liquid curtain coating, spin coating or plastic film mulch on clean glass plate, glass plate is dried into 1.2h at 60 DEG C, is placed it in
Dry 3.5h at 100 DEG C, then 300 DEG C are warming up to the heating rate of 3 DEG C/min, then 1.4h is kept the temperature at 300 DEG C, by its nature
It is cooled to room temperature, last demoulding, heat conductive insulating composite membrane is made.
Preferably, it is 1 that the surface hydrophobicity modifying agent, which is mass ratio,:3 methyltrimethoxysilane and perfluoro capryl second
Ethyl triethoxy silicane alkane.
The step（2）It is 1.5 that the middle organic solvent used, which is mass ratio,:1 isopropanol and the mixture of dioxane.
The step（2）The middle ultrasonic power used is 300W.
Embodiment 4
A kind of PCB substrate preparation method of heat conductive insulating composite membrane, includes the following steps：
（1）The preparation of modified Nano AlN/ZnO particles
100 parts of nano-aluminum nitrides and 100 parts of ZnO particles are distributed in the Aqueous Solutions of Polyethylene Glycol that mass concentration is 10%, are then added
The surface hydrophobicity modifying agent for entering 20 parts adjusts pH value of solution to 7.5-8.0, in a nitrogen atmosphere in 60 DEG C of temperature blended under agitation
3h discards supernatant, is then cleaned with ethyl alcohol, be placed in 60 DEG C of baking ovens and dry, be made and be modified by the way that precipitation particle is collected by centrifugation
Nano-aluminum nitride/ZnO particle；
（2）The preparation of modified mixing Nano filling
The lauryl amine mass fraction that 5 parts of carbon fibers and 8 parts of graphite oxides are added to 5 times of parts by weight is the DMF solution of 20wt%
In, it is stirred to react 2h at a temperature of 150 DEG C, reactant is centrifuged after being cooled to room temperature, is used in combination ethyl alcohol to precipitation
Object is cleaned, and is placed it in baking oven and dried, and modified carbon fiber/graphite oxide mixture is made；By step（1）It is obtained
Modified Nano AlN/ZnO particles are added in the organic solvent of 10 times of parts by weight, are placed in progress ultrasonic disperse processing in Ultrasound Instrument
Modified carbon fiber/graphite oxide mixture is added in ultrasonic procedure into system by 40min, continues ultrasound 50min, is then added
Final concentration of 30% dopamine continues ultrasound 2h at a temperature of 80 DEG C, solution is carried out precipitation is collected by centrifugation, be used in combination
Ethyl alcohol cleaning, drying mixes Nano filling to get modified；
（3）The preparation of heat conductive insulating composite membrane
40 parts of ethylene-vinyl acetate copolymer, 30 parts of perfluoroethylene-propylene, 20 parts of polyether-ether-ketone are added to 80 parts of DMF solutions
In, it is stirred 2h at a temperature of 150 DEG C, then cools the temperature to 80 DEG C, is sequentially added in the state of stirring modified mixed
Close 80 parts of Nano filling, 10 parts of two tricaprylate of triethylene glycol, 8 parts of α-cyanoacrylate, 6 parts of oxetanes, the third two
8 parts of alcohol phenylate, 5 parts of potassium fluoroaluminate keep this temperature the reaction was continued 4h to get premixed liquid；
By premixed liquid curtain coating, spin coating or plastic film mulch on clean glass plate, glass plate is dried into 2h at 60 DEG C, is placed it in
Dry 5h at 100 DEG C, then 300 DEG C are warming up to the heating rate of 5 DEG C/min, then 2h is kept the temperature at 300 DEG C, by its natural cooling
To room temperature, heat conductive insulating composite membrane is made in last demoulding.
Preferably, it is 1 that the surface hydrophobicity modifying agent, which is mass ratio,:5 methyltrimethoxysilane and perfluoro capryl second
Ethyl triethoxy silicane alkane.
The step（2）It is 3 that the middle organic solvent used, which is mass ratio,:1 isopropanol and the mixture of dioxane.
The step（2）The middle ultrasonic power used is 500W.
Comparative example 1
Difference lies in nano-aluminum nitride/ZnO particle does not carry out step to comparative example 1 in comparative example 1 with embodiment 1（2）It is modified at
Reason.
Comparative example 2
Difference lies in be not added with ZnO to comparative example 2 in comparative example 2 with embodiment 1.
The technical solution of embodiment 1-4 and comparative example 1-2 is subjected to following performance test, test result is as shown in table 1：
By test result as it can be seen that composite membrane thermal coefficient produced by the present invention reaches 5.8 W/m K, tensile strength reaches 185
MPa, volume resistance reach 8.2 × 1017Ω cm, thus composite membrane produced by the present invention have good thermal conductivity, insulating properties with
And higher mechanical strength, the insulating heat-conductive composite membrane for being suitable for PCB substrate carry out extensive use.
Table 1
Claims (6)
1. a kind of PCB substrate preparation method of heat conductive insulating composite membrane, which is characterized in that include the following steps：
（1）The preparation of modified Nano AlN/ZnO particles
100 parts of nano-aluminum nitrides and 100 parts of ZnO particles are distributed in the Aqueous Solutions of Polyethylene Glycol that mass concentration is 10%, are then added
The surface hydrophobicity modifying agent for entering 10-20 parts adjusts pH value of solution to 7.5-8.0, and the temperature in 50-60 DEG C is stirred in a nitrogen atmosphere
It mixes and 1-3h is blended, by the way that precipitation particle is collected by centrifugation, discards supernatant, then cleaned with ethyl alcohol, be placed in 60 DEG C of baking ovens and dry,
Modified Nano AlN/ZnO particles are made；
（2）The preparation of modified mixing Nano filling
The lauryl amine mass fraction that 5 parts of carbon fibers and 8 parts of graphite oxides are added to 3-5 times of parts by weight is the DMF solution of 20wt%
In, it is stirred to react 1-2h at a temperature of 120-150 DEG C, reactant is centrifuged after being cooled to room temperature, ethyl alcohol is used in combination
Sediment is cleaned, and places it in baking oven and dries, modified carbon fiber/graphite oxide mixture is made；By step（1）
Modified Nano AlN/ZnO particles obtained are added in the organic solvent of 5-10 times of parts by weight, are placed in Ultrasound Instrument and are carried out ultrasound
Modified carbon fiber/graphite oxide mixture is added in ultrasonic procedure into system by decentralized processing 20-40min, continues ultrasound 30-
Then the dopamine of final concentration of 15-30% is added in 50min, continue ultrasound 1-2h at a temperature of 60-80 DEG C, solution is carried out
Precipitation is collected by centrifugation, and it is mixed into Nano filling with ethyl alcohol cleaning, drying to get modified；
（3）The preparation of heat conductive insulating composite membrane
20-40 parts of ethylene-vinyl acetate copolymer, 15-30 parts of perfluoroethylene-propylene, 10-20 parts of polyether-ether-ketone are added to 80
In part DMF solution, it is stirred 1-2h at a temperature of 110-150 DEG C, then cools the temperature to 70-80 DEG C, in the shape of stirring
Modified 50-80 parts of Nano filling of mixing, 5-10 parts of two tricaprylate of triethylene glycol, α-cyanoacrylate are sequentially added under state
4-8 parts, 3-6 parts of oxetanes, 4-8 parts of propylene glycol phenylate, 2-5 parts of potassium fluoroaluminate, keep this temperature the reaction was continued 2-4h, i.e.,
Obtain premixed liquid；
By premixed liquid curtain coating, spin coating or plastic film mulch on clean glass plate, glass plate is dried into 1-2h at 60 DEG C, is placed it in
Dry 3-5h at 100 DEG C, then 300 DEG C are warming up to the heating rate of 2-5 DEG C/min, then 1-2h is kept the temperature at 300 DEG C, certainly by it
It is so cooled to room temperature, last demoulding, heat conductive insulating composite membrane is made.
2. a kind of preparation method of PCB substrate heat conductive insulating composite membrane according to claim 1, which is characterized in that institute
It is 1 that state surface hydrophobicity modifying agent, which be mass ratio,:（2-5）Methyltrimethoxysilane and perfluorooctylethyl group triethoxysilicane
Alkane.
3. a kind of preparation method of PCB substrate heat conductive insulating composite membrane according to claim 1, which is characterized in that institute
State step（2）The middle organic solvent used is that mass ratio is（1-3）:1 isopropanol and the mixture of dioxane.
4. a kind of preparation method of PCB substrate heat conductive insulating composite membrane according to claim 1, which is characterized in that institute
State step（2）The middle ultrasonic power used is 200W~500W.
5. a kind of preparation method of PCB substrate heat conductive insulating composite membrane according to claim 1, which is characterized in that institute
State step（3）The parts by weight of the middle each raw material for preparing heat conductive insulating composite membrane are 30 parts of ethylene-vinyl acetate copolymer, poly- perfluor
23 parts of second propylene, 15 parts of polyether-ether-ketone, modified 65 parts of Nano filling of mixing, 7.5 parts of two tricaprylate of triethylene glycol, alpha-cyano third
6 parts of olefin(e) acid ethyl ester, 4.5 parts of oxetanes, 6 parts of propylene glycol phenylate, 3.5 parts of potassium fluoroaluminate.
6. PCB substrate heat conductive insulating composite membrane made from the preparation method described in claim 1-5 any one.
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