CN109705284A - A kind of polyphenyl ether resin composition of low-k and its prepreg of production - Google Patents
A kind of polyphenyl ether resin composition of low-k and its prepreg of production Download PDFInfo
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- CN109705284A CN109705284A CN201910032575.4A CN201910032575A CN109705284A CN 109705284 A CN109705284 A CN 109705284A CN 201910032575 A CN201910032575 A CN 201910032575A CN 109705284 A CN109705284 A CN 109705284A
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Abstract
The present invention relates to a kind of polyphenyl ether resin composition of low-k and its prepregs of production.The polyphenyl ether resin composition component of the low-k includes: functionalized polyphenylene ether resins, styrene monomer, crosslinking and curing agent, initiator, polymerization inhibitor, inorganic filler, silane coupling agent and fire retardant etc..Polyphenyl ether resin composition of the invention, it is scattered in styrene monomer using functionalized polyphenylene ether resins as dispersed phase, styrene is present in system as solvent and modifying agent, and prepreg is prepared by drying, it is with good technique processability, and the excellent dielectric property of polyphenylene oxide is maintained, it is suitable for the fields such as high-frequency high-speed printed wiring board.
Description
Technical field
The invention belongs to technical field of polymer materials, combine more particularly, to a kind of polyphenylene oxide resin of low-k
Object and its prepreg of production.
Background technique
Printed circuit board (PCB) is the basis of electronic equipment, and electronic signal passes through the electric current transmission in PCB circuit.Tradition
Requirement on electric performance necessary to high-frequency communication is generally extremely difficult to applied to the material in LF communication circuit.In order to adapt to high frequency
With the needs of high speed data transfer, other than the requirement in circuit design and PCB manufacture view, high performance circuit substrate to pass
It is important.Printed circuit board (PCB) mostly uses glass fabric of epoxy resin material (FR-4) at present, dielectric constant usually 4.6 with
On, dielectric loss is generally 0.01 or more.However new communication apparatus required the dielectric constant of circuit board reach 4.0 with
Under, dielectric loss is reduced to 0.003 or less.
Polyphenylene oxide has good dielectric properties, heat resistance, and dielectric constant and dielectric loss are in engineering plastics
A kind of the smallest material, is hardly influenced by frequency, temperature, humidity, by vast scientific research technical staff as high-frequency high-speed
Material has carried out a large amount of research.
Chinese patent CN102807658B is dissolved in organic solvent toluene using functionalized polyphenylene ether resins, then plus
Enter crosslinking agent, fire retardant and other auxiliary agents configuration glue, last dry out solvent and prepares prepreg.But prepared semi-solid preparation
Piece can not remove clean solvent completely, lead to the residual of small molecule compound, will generate during hot-forming small
Air blister defect greatly reduces the dielectric properties and processing performance of polyphenylene oxide high frequency substrate.
Summary of the invention
It is an object of the present invention to overcome the above-mentioned drawbacks of the prior art and provide a kind of low-ks
Polyphenyl ether resin composition and its prepreg of production.
The polyphenyl ether resin composition of low-k of the present invention has good processing characteristics, while dielectric properties and Jie
Electrical loss rate has obtained a degree of raising.
The technology of the present invention feature is that styrene is added in polyphenylene ether composition, can be very good to adjust as solvent
Composition colloid viscosity facilitates processing, on the one hand, after styrene removes, remaining styrene is present in poly- as modifying agent
In phenylate composition, crosslinked solidification remains the excellent dielectric properties of polystyrene, while reducing the volatilization of small molecule solvent heat
The gas hole defect of formation.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of polyphenyl ether resin composition of low-k, is prepared by the raw material of following components and mass fraction:
Preferably, the polyphenyl ether resin composition of low-k is prepared by the raw material of following components and mass fraction
It arrives:
It is further preferred that the polyphenyl ether resin composition of low-k, by following components and the original of parts by weight content
Material is prepared:
Functionalized polyphenylene ether resins are scattered in styrene, by the way that crosslinking and curing agent, initiator, polymerization inhibitor, inorganic is added
Filler, silane coupling agent and fire retardant etc. form polyphenylene oxide and styrene copolymerized cross-linking system.
The functionalized polyphenylene ether resins are that the molecular end that relative molecular mass is 600~4000 has unsaturated double-bond
Polyphenylene oxide resin.
The styrene is styrene monomer, is not only used as admixture solvent, but also as polyphenylene oxide resin modifying agent.It is described
Styrene monomer is small molecule compound, has preferable dissolubility with functionalized polyphenylene ether resins, by by functionalized polyphenylene ether
Resin is dissolved in styrene monomer, and by a large amount of styrene monomer of vacuum removal after mixing, control styrene is being combined
Deal in object, joint polyphenylene oxide carry out crosslinking curing together, enhance the curing activity of polyphenylene oxide in the curing process.
The crosslinking and curing agent is multifunctional allyl compound, and the multifunctional allyl compound is preferably 3-5 official
It can allyl compound.The multifunctional allyl compound includes Triallyl isocyanurate, three acrylic acid of pentaerythrite
Ester, trimethylolpropane trimethacrylate, trimethacrylate acid Glycerin ester.
The initiator is radical initiator, and the 1h half life temperature of the initiator is described to draw more than or equal to 90 DEG C
It sends out agent and is selected from one or more of following substance: dibenzoyl peroxide, peroxidized t-butyl perbenzoate, peroxidating azelaic acid
Di tert butyl carbonate, 1,1- di-tert-butyl peroxide -3,3,5- trimethyl-cyclohexane, 1,1- cyclohexane di-tert-butyl peroxide, peroxide
Change acetic acid spy pentyl ester, cumyl peroxide, cumyl t-butyl peroxide, di-tert-butyl peroxide, p-menthane hydroperoxide,
The hydrogen peroxide tert-butyl alcohol, diisopropylbenzene hydroperoxide, methyl ethyl ketone peroxide, diacetone peroxide, peroxidating 2- ethyl acid
Tert-pentyl ester, 1,1,3,3- tetramethyl butyl hydroperoxide, tertiary amyl hydrogen peroxide etc..
During preparing the pre-reaction of prepreg, styrene is easy to happen auto polymerization reaction, for the ease of polyphenylene oxide
The long-term storage and use of colloid, need to be added polymerization inhibitor in the composition, and the polymerization inhibitor is selected from one of following substance
It is or several: diethyl hydroxylamine, nitrobenzene, nitrogen oxide etc..
The inorganic filler is selected from one or more of following substance: silica, glass powder, boron nitride, aluminium nitride,
Silicon carbide, aluminium hydroxide, titanium dioxide etc., the inorganic filler are hollow sphere or entity.
The inorganic filler is chemically treated using silane coupling agent, and silane coupling agent used is vinyl silanes coupling
One of agent, acrylic silane coupling agent, amino silicane coupling agent and epoxy silane coupling or a variety of mixtures.
The fire retardant includes phosphonium flame retardant or brominated flame-retardant, the phosphonium flame retardant in following substance one
Kind is several: alkyl aryl phosphate ester, alkylaryl phosphatase, alkyl phosphine oxide, triphenyl phosphate etc.；The brominated flame-retardant
Selected from one or more of following substance: deca-BDE, decabromodiphenylethane, tetrabromobisphenol A, hexabromocyclododecane etc..
The prepreg for the polyphenyl ether resin composition production based on the low-k that the invention further relates to a kind of, leads to
The polyphenyl ether resin composition that the substrate is immersed to the low-k is crossed, and carries out being dried to obtain prepreg；
The substrate is the fabric or adhesive-bonded fabric of glass fibre, carbon fiber or organic fiber.
Compared with prior art, polyphenyl ether resin composition of the invention, using functionalized polyphenylene ether resins as dispersed phase
It is scattered in styrene monomer, styrene is present in system as solvent and modifying agent, and prepares semi-solid preparation by drying
Piece with good technique processability, and maintains the excellent dielectric property of polyphenylene oxide, is suitable for high-frequency high-speed printed wiring
The fields such as plate.
Specific embodiment
The present invention is described in detail combined with specific embodiments below.
Embodiment 1
The polyphenylene oxide resin of the metering system acid blocked of 60 mass parts and the styrene monomer of 70 mass parts are mixed, dissolution
Styrene polyphenylene oxide mixed liquor is obtained completely, and the Triallyl isocyanurate of 25 mass parts is then added as crosslinking curing
The dibenzoyl peroxide of 2 mass parts is added as initiator in agent, and 6 parts of deca-BDEs are as fire retardant, 5 mass parts nitros
For benzene as polymerization inhibitor, the coupling of 4 mass parts vinyltrimethoxysilanes is added as filler in 20 mass parts silicon dioxide powders
Agent, stirring 20min obtain resin combination, while opening cooling water circulation.
Then resin combination composition glue liquid is infiltrated into E- glass-fiber-fabric, in 90 DEG C of desolventizings and pre-reaction 5min, obtains half
Cured sheets.
Embodiment 2
The polyphenylene oxide resin of the metering system acid blocked of 60 mass parts and the styrene monomer of 60 mass parts are mixed, dissolution
Styrene polyphenylene oxide mixed liquor is obtained completely, and the Triallyl isocyanurate of 30 mass parts is then added as crosslinking curing
The dibenzoyl peroxide of 2 mass parts is added as initiator in agent, and 6 parts of decabromodiphenylethane are as fire retardant, 5 mass parts nitre
For base benzene as polymerization inhibitor, the coupling of 5 mass parts vinyltrimethoxysilanes is added as filler in 20 mass parts silicon dioxide powders
Said mixture mixing 20min is obtained resin combination, while opening cooling water circulation by agent.
Then resin combination composition glue liquid is infiltrated into E- glass-fiber-fabric, in 90 DEG C of desolventizings and pre-reaction 5min, obtains half
Cured sheets.
Embodiment 3
The polyphenylene oxide resin of the metering system acid blocked of 60 mass parts and the styrene monomer of 50 mass parts are mixed, dissolution
Styrene polyphenylene oxide mixed liquor is obtained completely, and the Triallyl isocyanurate of 30 mass parts is then added as crosslinking curing
The dibenzoyl peroxide of 2 mass parts is added as initiator in agent, and 6 parts of deca-BDEs are as fire retardant, 5 mass parts nitros
For benzene as polymerization inhibitor, the coupling of 6 mass parts vinyltrimethoxysilanes is added as filler in 20 mass parts silicon dioxide powders
Said mixture mixing 20min is obtained resin combination, while opening cooling water circulation by agent.
Then resin combination composition glue liquid is infiltrated into E- glass-fiber-fabric, in 90 DEG C of desolventizings and pre-reaction 15min, obtains half
Cured sheets.
Comparative example 1
The polyphenylene oxide resin of the metering system acid blocked of 60 mass parts and the toluene of 60 mass parts are mixed, dissolution obtains completely
To polyphenyl ethereal solution, the Triallyl isocyanurate of 30 mass parts is then added as crosslinking and curing agent, 2 mass parts are added
Dibenzoyl peroxide is as initiator, and 6 parts of deca-BDEs are as fire retardant, and 5 mass parts nitrobenzenes are as polymerization inhibitor, 20 matter
Part silicon dioxide powder is measured as filler, and 4 mass parts vinyltrimethoxysilane coupling agents are added, said mixture is mixed
Stirring 20min obtains resin combination, while opening cooling water circulation.
Then resin combination composition glue liquid is infiltrated into E- glass-fiber-fabric, in 90 DEG C of desolventizings and pre-reaction 15min, obtains half
Cured sheets.
Performance test
Above-described embodiment 1~3 and 1 prepreg of comparative example are subjected to traditional performance test analysis, Examples 1 to 3 is compared
Product dielectric constant, dielectric loss, solvent resistance, rigidity and the apparent mass of comparative example 1 have a degree of improvement.It is related
Results of property see Table 1 for details
The above description of the embodiments is intended to facilitate ordinary skill in the art to understand and use the invention.
Person skilled in the art obviously easily can make various modifications to these embodiments, and described herein general
Principle is applied in other embodiments without having to go through creative labor.Therefore, the present invention is not limited to the above embodiments, ability
Field technique personnel announcement according to the present invention, improvement and modification made without departing from the scope of the present invention all should be of the invention
Within protection scope.
Claims (10)
1. a kind of polyphenyl ether resin composition of low-k, which is characterized in that by following components and the raw material of mass fraction
It is prepared:
2. a kind of polyphenyl ether resin composition of low-k according to claim 1, which is characterized in that the function
Changing polyphenylene oxide resin is the polyphenylene oxide resin that the molecular end that molecular weight is 600~4000 has unsaturated double-bond.
3. a kind of polyphenyl ether resin composition of low-k according to claim 1, which is characterized in that the benzene second
Alkene is styrene monomer, is not only used as admixture solvent, but also as polyphenylene oxide resin modifying agent.
4. a kind of polyphenyl ether resin composition of low-k according to claim 1, which is characterized in that the crosslinking
Curing agent is multifunctional allyl compound,
The multifunctional allyl compound includes Triallyl isocyanurate, pentaerythritol triacrylate, trihydroxy methyl
Propane triacrylate, trimethacrylate acid Glycerin ester.
5. a kind of polyphenyl ether resin composition of low-k according to claim 1, which is characterized in that the initiation
Agent is radical initiator, and the 1h half life temperature of the initiator is not less than 90 DEG C,
The initiator is selected from one or more of following substance: dibenzoyl peroxide, peroxidized t-butyl perbenzoate, mistake
Aoxidize azelaic acid di tert butyl carbonate, 1,1- di-tert-butyl peroxide -3,3,5- trimethyl-cyclohexane, 1,1- di-tert-butyl peroxide ring
Hexane, peracetic acid spy pentyl ester, cumyl peroxide, cumyl t-butyl peroxide, di-tert-butyl peroxide, terpane
Hydrogen peroxide, the hydrogen peroxide tert-butyl alcohol, diisopropylbenzene hydroperoxide, methyl ethyl ketone peroxide, diacetone peroxide, peroxidating 2-
Ethyl acid tert-pentyl ester, 1,1,3,3- tetramethyl butyl hydroperoxide, tertiary amyl hydrogen peroxide.
6. a kind of polyphenyl ether resin composition of low-k according to claim 1, which is characterized in that the polymerization inhibitor
Agent is selected from one or more of following substance: diethyl hydroxylamine, nitrobenzene, nitrogen oxide.
7. a kind of polyphenyl ether resin composition of low-k according to claim 1, which is characterized in that described inorganic
Filler is selected from one or more of following substance: silica, glass powder, boron nitride, aluminium nitride, silicon carbide, aluminium hydroxide,
Titanium dioxide, the inorganic filler are hollow sphere or entity.
8. a kind of polyphenyl ether resin composition of low-k according to claim 1, which is characterized in that the silane
Coupling agent is in vinyl silicane coupling agent, acrylic silane coupling agent, amino silicane coupling agent and epoxy silane coupling
One or more mixtures.
9. a kind of polyphenyl ether resin composition of low-k according to claim 1, which is characterized in that described fire-retardant
Agent includes phosphonium flame retardant or brominated flame-retardant,
The phosphonium flame retardant is selected from one or more of following substance: alkyl aryl phosphate ester, alkylaryl phosphatase, alkane
Base phosphine oxide, triphenyl phosphate；
The brominated flame-retardant is selected from one or more of following substance: deca-BDE, decabromodiphenylethane, tetrabromobisphenol
A, hexabromocyclododecane.
10. the half of a kind of polyphenyl ether resin composition production based on low-k described in any one of claim 1~9 is solid
Change piece, which is characterized in that by the polyphenylene oxide that the substrate is immersed to the low-k as described in any one of claim 1~8
Resin combination, and carry out being dried to obtain prepreg；
The substrate is the fabric or adhesive-bonded fabric of glass fibre, carbon fiber or organic fiber.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910032575.4A CN109705284B (en) | 2019-01-14 | 2019-01-14 | Low-dielectric-constant polyphenyl ether resin composition and prepreg prepared from same |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910032575.4A CN109705284B (en) | 2019-01-14 | 2019-01-14 | Low-dielectric-constant polyphenyl ether resin composition and prepreg prepared from same |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111471144A (en) * | 2020-03-27 | 2020-07-31 | 顺德职业技术学院 | Acrylic acid modified low-dielectric fluorine-containing polyphenyl ether mixed glue and 5G copper-clad plate prepared from same |
| CN112430293A (en) * | 2020-11-23 | 2021-03-02 | 江苏诺德新材料股份有限公司 | Low-dielectric-constant organic fiber material and high-frequency copper-clad plate manufactured from same |
| CN113831720A (en) * | 2021-10-29 | 2021-12-24 | 无锡宏仁电子材料科技有限公司 | Trithiocyanuric acid or derivative composition or product thereof |
| CN114716604A (en) * | 2022-03-03 | 2022-07-08 | 重庆市化工研究院有限公司 | Production process of electronic resin material |
| CN116041869A (en) * | 2022-12-21 | 2023-05-02 | 大连理工大学 | Low-dielectric polyphenyl ether modified polystyrene material and preparation method thereof |
| CN116080211A (en) * | 2022-10-14 | 2023-05-09 | 江苏耀鸿电子有限公司 | Low-dielectric-loss PPO resin-based copper-clad plate and preparation method thereof |
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| CN106084654A (en) * | 2016-06-13 | 2016-11-09 | 电子科技大学中山学院 | Copper-clad plate resin glue solution and method for preparing copper-clad plate by applying resin glue solution |
| CN106398173A (en) * | 2015-07-30 | 2017-02-15 | 松下知识产权经营株式会社 | Thermosetting resin composition, and resin varnish, metal foil with resin, resin film, metal-clad laminate, and printed wiring board using the same |
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| JPH08231848A (en) * | 1995-02-27 | 1996-09-10 | Matsushita Electric Works Ltd | Production of prepreg |
| CN103467967A (en) * | 2013-09-16 | 2013-12-25 | 广东生益科技股份有限公司 | Thermosetting resin composition and use thereof |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111471144A (en) * | 2020-03-27 | 2020-07-31 | 顺德职业技术学院 | Acrylic acid modified low-dielectric fluorine-containing polyphenyl ether mixed glue and 5G copper-clad plate prepared from same |
| CN112430293A (en) * | 2020-11-23 | 2021-03-02 | 江苏诺德新材料股份有限公司 | Low-dielectric-constant organic fiber material and high-frequency copper-clad plate manufactured from same |
| CN113831720A (en) * | 2021-10-29 | 2021-12-24 | 无锡宏仁电子材料科技有限公司 | Trithiocyanuric acid or derivative composition or product thereof |
| CN114716604A (en) * | 2022-03-03 | 2022-07-08 | 重庆市化工研究院有限公司 | Production process of electronic resin material |
| CN114716604B (en) * | 2022-03-03 | 2023-03-21 | 重庆市化工研究院有限公司 | Production process of electronic resin material |
| CN116080211A (en) * | 2022-10-14 | 2023-05-09 | 江苏耀鸿电子有限公司 | Low-dielectric-loss PPO resin-based copper-clad plate and preparation method thereof |
| CN116080211B (en) * | 2022-10-14 | 2023-12-29 | 江苏耀鸿电子有限公司 | Low-dielectric-loss PPO resin-based copper-clad plate and preparation method thereof |
| CN116041869A (en) * | 2022-12-21 | 2023-05-02 | 大连理工大学 | Low-dielectric polyphenyl ether modified polystyrene material and preparation method thereof |
| CN116041869B (en) * | 2022-12-21 | 2024-05-17 | 大连理工大学 | Low-dielectric polyphenyl ether modified polystyrene material and preparation method thereof |
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| CN109705284B (en) | 2021-07-30 |
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Address after: 200437 No. 99, Handan Road, Shanghai, Hongkou District Patentee after: Shanghai Material Research Institute Co.,Ltd. Patentee after: SHANGHAI ADEL TECHNOLOGY CO.,LTD. Address before: 200437 No. 99, Handan Road, Shanghai, Hongkou District Patentee before: SHANGHAI Research Institute OF MATERIALS Patentee before: SHANGHAI ADEL TECHNOLOGY CO.,LTD. |