CN108730778A - 实用超大功率led照明系统专用导热装置 - Google Patents

实用超大功率led照明系统专用导热装置 Download PDF

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Publication number
CN108730778A
CN108730778A CN201710268968.6A CN201710268968A CN108730778A CN 108730778 A CN108730778 A CN 108730778A CN 201710268968 A CN201710268968 A CN 201710268968A CN 108730778 A CN108730778 A CN 108730778A
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heat
transfer device
main body
pcb board
device main
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CN201710268968.6A
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郑华耀
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

本发明公开了一种实用超大功率LED照明系统专用导热装置，包括灯体、导热装置主体和、PCB板，本发明 PCB板所产生的热量不仅通过导热装置主体进行散热，而且还能通过导热装置主体迅速传导给灯体进行散热，从而大大增加了LED灯散热面积，可以很好解决目前存在的LED灯大功率小体积的难题。

Description

实用超大功率LED照明系统专用导热装置
技术领域
本发明涉及LED照明电器领域，尤其属于一种实用超大功率LED照明系统专用导热装置。
背景技术
LED灯广泛应用于建筑照明和市政工程。目前，大多数LED灯的散热要求较高，由于受到LED灯体积的限制，即使设计有专门的导热装置也很难满足大功率小体积场合，且目前的LED灯导热装置结构复杂散热效果差。
发明内容
本发明的目的是，为了克服现有技术的缺陷与不足，提供一种结构简单、适用范围广、安装方便且体积小散热效果好的LED导热装置。
本发明的目的可以通过采取以下技术方案达到：
一种实用超大功率LED照明系统专用导热装置，包括灯体、导热装置主体和集成有LED灯泡的PCB板，所述的PCB板紧贴在所述导热装置主体一个平面上，所述的导热装置主体与PCB板紧贴的平面具有突出的散热筋，导热装置主体与灯体连接是面接触，以确保所述的集成有LED灯泡的PCB板所产生的热量迅速传导给灯体。
作为本发明专利优选实施例，所述的PCB板通过硅脂层紧贴在所述导热装置主体一个平面上，所述的导热装置主体与灯体连接是通过导热硅胶层实现面接触的。
作为本发明专利另一优选实施例，所述导热装置主体与PCB板接触的面通过竖向加强筋条同导热装置主体与外壳连接的面连接，所述的竖向加强筋条与导热装置主体是一体成形或焊接的，导热装置主体与PCB板紧贴平面的散热筋与导热装置主体是一体成形或焊接的。
与现有技术相比较，本发明具有以下优点：
本发明所述的导热装置主体与PCB板紧贴的平面具有突出的散热筋，同时导热装置主体还具有竖向加强筋条，这样大大增加了导热装置主体本身散热的功能，而且导热装置主体形状与外壳的配合设计使得集成有LED灯泡的PCB板产生的热量很快通过导热装置本身传递到LED灯的外壳进行散热，这样大大增加了LED灯整体的散热面积，从而可以很好解决目前存在的LED灯大功率小体积的难题。
附图说明
图1是本发明的LED灯剖视示意图。
具体实施方式
以下结合附图对本发明的具体实施方式作详细描述。
如图1所示，一种实用超大功率LED照明系统专用导热装置，包括灯体1、导热装置主体2和集成有LED灯泡的PCB板3，所述的PCB板3通过硅脂层4紧贴在所述导热装置主体2一个平面2-1上，所述的导热装置主体2与PCB板3紧贴的平面2-1具有突出的散热筋2-1-1，散热筋2-1-1与导热装置主体2是一体成形或焊接的，散热筋2-1-1大大增加了导热装置主体2的散热面积，导热装置主体2与灯体通过导热硅胶层5实现面接触，以确保所述的集成有LED灯泡的PCB板3所产生的热量迅速传导给灯体1，导热装置主体2与集成有LED灯泡的PCB板3接触的面2-2通过竖向加强筋条2-3同导热装置主体2与外壳连接的面连接，竖向加强筋条2-3与导热装置主体2是一体成形的或焊接到，导热装置主体2具有竖向加强筋条2-3一方面增加了导热装置主体2的散热面积，另一方面也加强了导热装置主体2的强度，同时也使得导热装置主体2内部是空心的，有利于灯体内部的空气对流，从而增加散热效果。
以上所揭露的仅为本发明的较佳实施例而已,当然不能以此来限定本发明之权利范围,因此，依本发明申请专利范围所作的等同变化,仍属本发明所涵盖的范围。

Claims (4)

1.一种实用超大功率LED照明系统专用导热装置，其特征在于：包括灯体、导热装置主体和PCB板，所述的PCB板通过导热硅脂层紧贴在所述导热装置主体一个平面上，所述的导热装置主体与PCB板紧贴的平面具有突出的散热筋，导热装置主体与灯体连接是通过导热硅胶层实现面接触的，以确保所述的集成有LED灯泡的PCB板所产生的热量迅速传导给灯体。
2.如权利要求1所述的实用超大功率LED照明系统专用导热装置，其特征在于：所述导热装置主体与PCB板接触的面通过竖向加强筋条同导热装置主体与外壳连接的面连接。
3.如权利要求3所述的实用超大功率LED照明系统专用导热装置，其特征在于：所述的竖向加强筋条与导热装置主体是一体成形或焊接的。
4.如权利要求1所述的实用超大功率LED照明系统专用导热装置，其特征在于：导热装置主体与PCB板紧贴平面的散热筋与导热装置主体是一体成形或焊接的。
CN201710268968.6A 2017-04-24 2017-04-24 实用超大功率led照明系统专用导热装置 Pending CN108730778A (zh)

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