CN108728874A - Electrolytic copper foil, its manufacturing method with low bounce-back power and its application - Google Patents

Electrolytic copper foil, its manufacturing method with low bounce-back power and its application Download PDF

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Publication number
CN108728874A
CN108728874A CN201810345340.6A CN201810345340A CN108728874A CN 108728874 A CN108728874 A CN 108728874A CN 201810345340 A CN201810345340 A CN 201810345340A CN 108728874 A CN108728874 A CN 108728874A
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copper foil
millimeters
warpage
electrolytic copper
surveyed
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CN108728874B (en
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赖耀生
郑桂森
黄建铭
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Chang Chun Petrochemical Co Ltd
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Chang Chun Petrochemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0438—Processes of manufacture in general by electrochemical processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0438—Processes of manufacture in general by electrochemical processing
    • H01M4/045—Electrochemical coating; Electrochemical impregnation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0438—Processes of manufacture in general by electrochemical processing
    • H01M4/0469—Electroforming a self-supporting electrode; Electroforming of powdered electrode material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)

Abstract

This disclosure relates to the method for showing the copper foil of surprising low bounce-back force characteristic and manufacturing this copper foil.Typically, there is copper foil (a) to be counted on the basis of L*a*b color systems, and the lightness L* values without roughening treatment side are 75 to 90, and (b) 40kgf/mm2To 55kgf/mm2Tensile strength.The disclosure is further to the flexible printed wiring board and electronic device for using above-mentioned copper foil to form conducting wire wherein.

Description

Electrolytic copper foil, its manufacturing method with low bounce-back power and its application
Technical field
This disclosure relates to show the improvement copper foil of low bounce-back power property；Method for manufacturing the copper foil；And soft The copper foil and the electronic device using the flexible printed wiring board are used in printed circuit board.
Background technology
In general, rolled copper foil is widely used in flexible printed wiring board (FPC) industry.Grain structure and light Sliding surface is very suitable for the circuit application of dynamic, flexibility.However, rolled copper foil generally includes horizontal die structure, this Challenge may be had more to being etched into narrow conductive line segregation.In contrast, electrolytic copper foil (electrodeposited Copper foil) there is vertical grain structure, the conductor lines for being etched into narrow circuit spacing He the division is clearly demarcated can be conducive to Road.General electrolytic copper foil usually has the surface more more coarse than rolled copper foil, can be beneficial to increase the combination of copper foil and substrate Intensity.
Exemplary device for manufacturing electrolytic copper foil includes metallic cathode roller and insoluble petal anode, the metallic cathode Roller is rotatable and with the surface of mirror finish.Insoluble petal anode is disposed substantially at the lower half of metallic cathode roller Part, and surround metallic cathode roller.Being produced by for copper foil makes copper electrolyte continue between cathode roller and anode It flows and applies direct current between them, so that copper is deposited on cathode roller, and when reaching predetermined thickness, by cathode copper Foil is detached from cathode roller.
The copper foil manufactured in this way be typically used as include the printed wiring board of flexible printed wiring board (FPC) conduction Material.Flexible printed wiring board refers to the printing electricity that the electronic building brick wherein for FPC is mounted or formed on flexible substrate Road plate.Therefore, FPC can be adapted for required specific shape, or be bent in use.For example, FPC has been typically used as rolling over The first-class moveable part of the flexed portion of stacked (clam shell) mobile phone, digital camera, printer and with such as hard drive The moveable part of device (HDD), multifunction digital CD (DVD) and CD (CD) etc..
Therefore, from the point of view of reliability and manufacture viewpoint, at least it is being related at FPC, the pliability of copper foil is important.If copper The pliability of foil is not high enough, then the copper foil for bending or deforming will apply restoring force as spring to bendable FPC substrates, This is referred to as the bounce of copper foil.If bounce is too high, during making or using, copper foil may be from flexible substrate Stripping.Furthermore when FPC is connected to another device, the high bounce on flexible substrate is applied to by copper foil and may interfere with The normal engagement of FPC and another component.What is worse, FPC may be detached from other assemblies.Therefore, copper foil industry is solved The manufacturing issue of middle FPC, and the reliability of product is improved, the pliability of copper foil will be especially important.
Invention content
This disclosure relates to show the improvement copper foil of low bounce-back power property.As above-mentioned, in flexible printed wiring board as have compared with The copper foil of high bounce may cause process problems.Present disclosure is the improvement copper foil of relatively low bounce, improves these systems It makes and the problem of reliability.
More specifically, the copper foil for showing following property has lower bounce：(a) on the basis of L*a*b color systems Meter, the lightness L* values that not roughened (nodule) handles side are 75 to 90；(b)40kgf/mm2To 55kgf/mm2Tensile strength. These copper foils can also have measures low angle grain boundary (LAGB) less than 7.0%, crystalline substance via electronics backscattering diffraction (EBSD) Particle size is 4.5 μm to 7.5 μm and/or is less than 3mm to be laminated the warpage degree that warpage test measures.
These copper foils can be used for flexible printed wiring board, the electronic building brick etc. using these flexible printed wiring boards.
Description of the drawings
Fig. 1 and 2 is the diagram for illustrating L*a*b* color systems.
Fig. 3 shows the exemplary device for manufacturing electrolytic copper foil.
Fig. 4 A and 4B show the program on the surface for handling naked copper foil.
Fig. 5 is the method for measuring crystallite dimension.
The method that Fig. 6 A, 6B, 6C and 6D illustrate the bounce for measuring copper foil.
Fig. 7 illustrates the method for measuring warpage degree.
Fig. 8 is a variety of tables tested and measured.
Fig. 9 is with a series of cross section images of the copper foil manufactured by different chlorine ion concentrations.
Symbol description
300 device, 302 metallic cathode roller
The 306 naked copper foil of anode of 304 dimensional stabilitys
306A rollers side 306B deposits side
400 electro-deposition rear surfaces handle processing procedure 401a containers
401b solution 401c electrodes
402 pickling of 401d rollers/cleaning procedure
404 roughening 406 coating plating process of program
408 alloying program, 410 antirust program
412 silane treatments 414 are annealed
501 transmitter, 502 detector
503 electron beam, 504 sample
601 copper foil, 602 polyimides
603 stacking material, 603 ' stacking material
604 sample, 605 scale
606 lid of 605a plates
703 cross slit, 705 corner cut
707 rulers 416,758 copper foils.
Specific implementation mode
The present invention is described with reference to schema, wherein indicating similar using identical schema component symbol in entire schema Or equal element.What schema was not drawn to scale, and they are merely provided to illustrate the present invention.Referring to for explaination Illustrative application come describe the present invention several embodiments.It should be understood that numerous specific details are set forth, relationship and method, To provide complete understanding of the present invention.However, field that the present invention belongs to technical staff will be easily understand that the present invention can not have There are one or multiple details or got off implementation using the case where other methods.In other cases, it does not display the details of Well-known structure or operation are to avoid the fuzzy present invention.The present invention is not limited by the behavior or event sequence illustrated, Because some behaviors may occur and/or occur simultaneously with other behaviors or event in a different order.In addition, and not all explaining The behavior or event released are required for implementing according to the method for the present invention.
The copper foil of present disclosure usually has：
(a) it is counted on the basis of L*a*b color systems, the lightness L* values without roughening treatment side are 75 to 90；And
(b)40kgf/mm2To 55kgf/mm2Tensile strength.
In some cases, it carries out electronics backscattering diffraction (EBSD) after copper foil carries out cycle of annealing to measure, the copper There is low angle grain boundary (LAGB) to be less than 7%, be 3.5% to 7% foil, for example, by 3.5,4.0,4.5,5.0,5.5,6.0 or Any range combined by 6.5% and 7%；Or it is 3.5% to 4.0%.
Copper foil as described above has specific color.The color of object is usually related with three factors：(color is deep for lightness Either shallow), form and aspect (chromaticness) and chroma (vividness).In order to accurately measure and express these factors, color system is used Such factor is objectively indicated with numerical value.The L*a*b* color systems are illustrated in Fig. 1 and Fig. 2.The L*a*b* color systems It is the color system described in JISZ 8729, and points out each color in the position of ball-type color space as illustrated in fig. 1. In these color spaces, which indicates that the form and aspect are with the position on circumferencial direction with the position on ordinate (z-axis) direction It indicates and the chroma at a distance from central shaft to indicate.
Lightness is specified by L* shown in position on ordinate (z-axis), and the variation of the L* values is from 0 corresponding to black to right It should be in the 100 of white.The sectional view of face L*=50 as shown in Fig. 2, spherical color space is made even in the horizontal direction, the pros of x-axis Correspond to yellow direction to the positive direction corresponding to red direction, y-axis, the negative direction of x-axis corresponds to green direction, and y-axis is born Direction corresponds to the direction of blue and the position in x-axis is specified by a*, and wherein the numerical value change is from -60 to+60 and y-axis Position specified by b*, the wherein numerical value change is from -60 to+60.The form and aspect and chroma are indicated respectively by a* values and b* values.
The usual L* values of copper foil of present disclosure are 75 to 90.L* values are measured using unannealed copper foil, however in certain feelings Under condition, copper foil have lightness L* values 75 to 80, such as by numerical value 75.0,75.5,76.0,76.5,77.0,77.5,78.0, 78.5, any range combined by 79.0,79.5,80；Or be 80 to 85, such as by numerical value 80.0,80.5,81.0,81.5, 82.0, any range combined by 82.5,83.0,83.5,84.0,84.5,85；Or be range 85 to 90, such as about by numerical value 85.0, any range combined by 85.5,86.0,86.5,87.0,87.5,88.0,88.5,89.0,89.5,90.
The usual tensile strength of copper foil of present disclosure is 40kgf/mm2To 55kgf/mm2Between.As used herein, anti-tensile Intensity refers to the tensile strength as measured copper foil before following cycle of annealings.However, in some cases, copper foil Tensile strength can be about 40,41,42,43,44,45,46,47 or 47.5kgf/mm2To about 48,49,50,51,52,53,54 Or 55kgf/mm2。
Tensile strength is that material is stretched to the maximum stress that can be born before failure or fracture.Tensile strength and resistance to compression Intensity is different, and its numerical value is significantly different.Elongation, tensile strength and roughness are measured by IPC-TM-650.
The unique of the copper foil of present disclosure is in it warpage, the warpage about copper foil unlike traditional copper foil Property, warpage degree can be less than 3 millimeters.
Warpage degree can be 2mm either smaller 1.5mm either smaller or 1mm as measured by lamination warpage test Or smaller.For example, in some cases, warpage degree can be about 2.5mm to 3.0mm, about 1.5mm to 2.5mm or about 0.5mm to 1.5mm.It is presented below to test more explained in details about lamination warpage.
Measured by pressing bounce test, in the copper foil of the rear generation pressed with polyimides and heat treatment With about 12 to 14 grams of bounce, for example, about 12.0,12.1,12.2,12.3,12.4,12.5,12.6,12.7,12.8 and 12.9 grams to about 13.0,13.1,13.2,13.3,13.4,13.5,13.6,13.7,13.8,13.9 and 14.0 grams, wherein this is anti- Elastic force is measured as described below.Other than above-mentioned characteristic, after carrying out cycle of annealing (being heated 1 hour at 200 DEG C), copper foil can With with 20kgf/mm2To 36kgf/mm2Tensile strength, such as 21,22,23,24,25,26,27 or 28kgf/mm2To about 29,30,31,32,33,34,35 or 36kgf/mm2.200 DEG C of heating 1 hour are the temperature and times of simulation pressing program.
In addition, after carrying out cycle of annealing (being heated 1 hour at 200 DEG C), copper foil has 4.5 to 7.5 microns of crystal grain ruler Very little, for example, about 4.5,4.6,4.7,4.8,4.9,5.0,5.1,5.2,5.3,5.4,5.5,5.6,5.7,5.8 and 5.9 microns to about 6.0,6.1,6.2,6.3,6.4,6.5,6.6,6.7,6.8,6.9,7.0,7.1,7.2,7.3,7.4 and 7.5 microns.
In addition, after heating annealing in 1 hour at 200 DEG C, copper foil can have the tensile strength for reducing about 35% to 50%, all Such as 34%, 35%, 36%, 37%, 38%, 39%, 40%, 41% to about 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49% and 50%.
The disclosure further relates to the processing procedure for manufacturing electrolytic copper foil.Processing procedure for manufacturing electrolytic copper foil can refer to Fig. 3.
Copper wire is dissolved in the aqueous sulfuric acid of 50 weight % by the processing procedure contains 320 to prepare
G/l cupric sulfate pentahydrate solution (CuSO4·5H2) and the electrolyte of 100g/l sulfuric acid O.For every liter of copper sulfate bath Chlorion is added so that chlorine ion concentration ranging from 10ppm to 20ppm in liquid, such as 10ppm, 15ppm or 20ppm.Chlorion Applying can illustrate such as by hydrochloric acid or water-soluble chlorine-containing compound, the water solubility chlorine-containing compound is added：Sodium chloride, chlorination Potassium, ammonium chloride etc..Then in 45 DEG C of liquid temperature and current density 60A/dm2The electrolytic copper foil that thickness is 12 microns is prepared under environment.
In general conventional process, the coating solution for generating naked copper foil product can contain some additives, including add Fast agent, inhibitor and leveling agent.Accelerator (or referred to as brightening agent) is the additive for increasing plating rate.Accelerator is given Apply and adsorbed on the metal surface under voltage, and increases local current densities.Accelerator may contain side chain sulfur atom, these sulphur Atom is understood to participate in bivalent cupric ion reduction ionic reaction, therefore the strong nucleation for influencing metal film and surface growth.Add Fast agent is typically the derivative of thiohydracrylic acid (MPS), dimercaptopropane sulphonate (DPS) or two (3- sulfopropyls) disulphide (SPS) Object, but other compounds can also be used.Inhibitor (or referred to as carrying agent) is to be inclined to be adsorbed onto on metal surface at them Inhibit the polymer of electric current afterwards.Inhibitor can come from animal gelatin, hydroxyethyl cellulose (HEC), polyethylene glycol (PEG), gather Propylene glycol (PPG), polyethylene oxide or derivatives thereof or copolymer.Leveling agent is typically cationic surfactant and in its matter Measure the dyestuff that the most fast position of delivery rate inhibits electric current.
Organic additive is considered to have the effect for inhibiting grain growth, therefore is incorporated into meaningful in crystal grain. In this case, the amount for being incorporated to the organic additive of crystal grain is bigger, and crystallite dimension is smaller.In order to avoid the interference of additive, Other than chlorion, organic or metallic compound will not be deliberately added in copper sulfate electrolyte.
Fig. 3 is the device 300 described for manufacturing electrolytic copper foil, and device 300 includes that metallic cathode roller 302 and size are steady Qualitative anode (DSA) 304.Metallic cathode roller 302 is rotatable and has high polishing surface.As shown in figure 3, dimensionally stable Property anode (DSA) 304 relative to metallic cathode roller 302 dispose, with the lower half generally about metallic cathode roller 302 Point.By making cupric electrolysis solution be flowed between metallic cathode roller 302 and the anode (DSA) 304 of dimensional stability, and at this Apply electric current between two components, to utilize 300 continuous manufacturing copper foil of device, this allows the copper ion from cupric electrolysis solution It is electrodeposited on metallic cathode roller 302.When obtaining scheduled thickness, naked copper foil (initial electrolysis copper foil) 306 is then from gold Belong to cathode roller 302 to detach.
Naked copper foil 306 has roller side 306A (copper foil surface formed on metallic cathode roller 302) and in copper foil surface It is upper contacted with cupric electrolysis solution deposition side 306B (metallic cathode roller 302 and the anode (DSA) 304 of dimensional stability it Between).
After generating naked copper foil, electro-deposition rear surface processing routine can be carried out to naked copper foil, hereafter surface treatment can be with Use a series of process containers (belt electrode and without electrode) and/or oven.It is heavy that illustrative electricity is described below with reference to Fig. 4 A and 4B Product rear surface handles processing procedure 400, wherein Fig. 4 A describe the composition of each processing unit in electro-deposition rear surface processing processing procedure, with acid Wash/cleaning procedure 402 for, which includes container 401a, the solution 401b that is filled in container 401a, be set to should Electrode 401c in the container 401a and plural roller 401d for conveying the naked copper foil 306.
When electro-deposition rear surface processing processing procedure 400 starts, the naked copper foil 306 can be set via a series of rollers (guide wheel) Enter in pickling/cleaning procedure 402.In etching procedures, the inside of pickling container can fill copper electrolyte, such as 130g/L The sulfuric acid of copper sulphate and 50g/L, and the temperature of electrolyte is maintained at 27 DEG C.Naked copper foil 306 is immersed in 30 in cupric electrolysis solution Second, the oil on surface, fat is anti-and oxide to remove, and then naked copper foil 306 is washed with water.
Then naked copper foil can be made by roughening program 404 to form copper roughening particle layer.The copper roughening particle layer can To be imported in electroplating bath by by naked copper foil, and additional copper is electroplated onto on the roller side of naked copper foil or the surface of deposition side To be formed.As for the form of copper roughening particle layer, copper sulphate and sulfuric acid solution can be used to be electroplated.Illustrative match at one In setting, the concentration of copper sulphate and sulfuric acid is respectively 70g/L and 100g/L in solution, and solution temperature is maintained at 25 DEG C.As for electricity Deposition itself, in 10A/dm2Current density carry out electrolysis 10 seconds.
In the roughened, coating plating process 406 can be carried out to prevent copper roughening particle layer from removing.Coating plating Processing procedure may involve the use of copper sulphate and sulfuric acid solution is electroplated.In an exemplary arrangement, the concentration of copper sulphate and sulfuric acid Respectively 320g/L and 100g/L, and the temperature of electrolyte is maintained at 40 DEG C, and with 15A/dm2Current density is electroplated.
Then alloying program 408 can be carried out after coating plating processing procedure, to be formed for being roughened the blunt of copper foil Change layer.Passivation layer formation is in the both sides of roughening copper foil.In an exemplary arrangement, zinc can be used to be used as passivation element, And alloy plating can be used in the both sides of roughening copper foil simultaneously.Addition zinc can use solution of zinc sulfate as electrolysis Liquid.This solution of zinc sulfate can be 100g/L and pH value is 3.4, and solution temperature may be set in 50 DEG C.Then 4A/ can be used dm2Current density carry out Alloying Treatment.Then cleaning procedure (not showing in figure 4b) can be carried out with water.
After alloying process, antirust program 410 can be executed to provide antirust.Under the passivation based on zinc, then Carry out chromating.Chromate coating is formed that is, can be electrolysed on zinc passivation layer.In an exemplary arrangement, This can be carried out using a concentration of 5g/L, pH for the chromic acid solution of 11.5 and 35 DEG C of temperature.Then 10A/dm is used2's Current density is electrolysed.Such as zinc passivation, electrolytic chromate is passivated the both sides for being equally applicable to copper foil.
Although chromium has antirust effect, organic solution to be also applied for antirust.Organic rust preventing layer can include it is at least one with On organize groups of member selected from triazole, thiazole and imidazoles or derivatives thereof, such member is because of its ability being bonded with copper Selection.Triazolyl includes adjacent triazole (1,2,3- triazoles) and its isomers or derivatives thereof.Adjacent triazole derivative includes benzo three Azoles, tolyl-triazole, carboxyl benzotriazole, benzotriazole, amido triazole and its isomers or derivative such as alkali through chlorine substitution Metal salt or amine salt etc..As for the isomers of amido triazole, 3- amidos -1,2,4- triazoles, 2- amidos -1,3,4- tri- can be used Azoles, 4- amido -1,2,4- triazoles and 1- amido -1,3,4- triazoles.The example of amido triazole derivative includes sodium salt or amine salt, It includes such as monoethanolamine salt, cyclohexylamine salt, diisopropyl amine salt, alkylbenzyldimethylasaltsum saltsum.
After completing antirust treatment, (can not in figure 4b it not shown) after the copper foil of passivation is just washed with water, you can with In the case of the copper foil surface of not dry passivation, silane treatment 412 is provided.Particularly, the copper foil of passivation is through being treated so that It is carried out on the Zn/Cr passivation layers of copper roughening particle layer of the absorption of silane coupling agent only in silane coupling agent process container.? In one exemplary arrangement, using the solution of a concentration of 0.25% 3- aminocarbonyl propyl triethoxysilanes, and by spray solution Silane treatment is carried out on the copper roughening particle side of copper foil surface.
In addition, silane coupling agent layer can use such as epoxy silane, amino containing silane, methacryloxypropyl silane, ethylene Base silane, sulfydryl type silane silane coupling agent formed.It should be noted that such silane coupling agent can also be used as two The mixture of person or more person uses.Wherein, it is preferable to use aminosilane coupling agent or epoxy type silane coupling agent.
Aminosilane coupling agent as described herein includes selected from the group being made of the following：N- (2- amidos ethyl)- 3- aminocarbonyl propyl trimethoxy silanes, 3- (N- styrylmethyl -2- amido ethyls amido) propyl trimethoxy silicane, 3- amine Base propyl-triethoxysilicane, bis- (2- ethoxys) -3- aminocarbonyl propyl triethoxysilanes, aminocarbonyl propyl trimethoxy silane, N- methyl-aminocarbonyl propyl trimethoxy silane, N- phenyl-aminocarbonyl propyl trimethoxy silane, N- (3- acryloxy -2- hydroxyls Base propyl) -3- aminocarbonyl propyl triethoxysilanes, 4- amido butyl triethoxysilane, (amido ethyl aminomethyl) benzene second Base trimethoxy silane, N- (2- amido ethyl -3- aminocarbonyl propyls) trimethoxy silane, N- (2- amido ethyl -3- amidos third Base) three (2- ethyl hexyl oxies) silane, 6- (aminohexyl aminocarbonyl propyl) trimethoxy silane, aminocarbonyl phenyl trimethoxy silicon Alkane, 3- (1- amidos propoxyl group) -3,3- dimethyl -1- acrylic trimethoxy silanes, (the methoxyl group ethoxy of 3- aminocarbonyl propyls three Base) silane, 3- aminocarbonyl propyl triethoxysilanes, 3- aminocarbonyl propyl trimethoxy silanes, ω-amido-undecyl trimethoxy Base silane, 3- (2-N- Benzyl bases-amido ethyl aminocarbonyl propyl) trimethoxy silane, bis- (2- hydroxyethyls) -3- aminocarbonyl propyls three Ethoxysilane, (N, N- diethyl -3- aminocarbonyl propyls) trimethoxy silane, (N, N- dimethyl -3- aminocarbonyl propyls) trimethoxy Base silane, N- methyl-aminocarbonyl propyl trimethoxy silane, N- phenyl-aminocarbonyl propyl trimethoxy silane, 3- (N- styryls Methyl -2- amido ethyls amido) propyl trimethoxy silicane.
Finally, copper foil can be dried, and it is optionally annealed to 414 in an oven.Then, according to packaging and fortune Surface treated copper foil 416 can be cut and be wound to defeated demand.
It should be noted that present disclosure consider the program stated clearly above and condition be intended merely to facilitate explaination and Explanation.In addition, any of the above described value is all approximation.That is, present disclosure is considered to indicate that any value can be with above-mentioned Change from state value.For example, particular value can differ ± 5%, ± 10%, ± 15% or even ± 20% with described value.
Embodiment
Embodiments shown herein is not only restricted in various concrete examples.Their purpose is only used for illustrating in the disclosure Hold.
As described in table one, embodiment 1 to 9 be the invention discloses copper foil, comparative example 1 to 6 is traditional copper foil processing procedure Copper foil.For traditional copper foil processing procedure, the coating solution and 70A/dm that chlorine ion concentration is 0ppm to 5ppm are used2Electric current it is close Degree uses the coating solution and 85A/dm that chlorine ion concentration is 0ppm to 20ppm2Current density carry out initial plating copper wiring. Using the coating solution that chlorine ion concentration is 10ppm, 15ppm or 20ppm and it is 60A/dm for the copper foil according to the disclosure2、 70A/dm2Or 80A/dm2Current density carry out initial plating copper wiring.
Table 1：Copper plating process conditions
Sample Chlorion Current density
ppm A/dm2
Embodiment 1 10 60
Embodiment 2 10 70
Embodiment 3 10 80
Embodiment 4 15 60
Embodiment 5 15 70
Embodiment 6 15 80
Embodiment 7 20 60
Embodiment 8 20 70
Embodiment 9 20 80
Comparative example 1 0 70
Comparative example 2 5 70
Comparative example 3 10 85
Comparative example 4 20 85
Comparative example 5 0 85
Comparative example 6 5 85
Then following measure is carried out to manufactured each copper foil.
Tensile strength：Tensile strength is measured by IPC-TM-650, cutting surfaces processing it is rear (but without any Annealing or calendering) copper foil and 100 millimeters × 12.7 millimeters of copper foil sample.Sample uses Shimadzu limited liability company The testing machine of (Shimadzu Corporation) model AG-I, with 50 millimeters of upper and lower collet distance and 50 mm/mins Tensile speed measures under about 25 degree of room temperature.
Annealed tensile strength：The copper foil of (but without any annealing or calendering) is to obtain after cutting surfaces processing The test sample of 100 millimeters × 12.7 millimeters (long × wide) sizes.Then test sample is put into baking oven, without cleaning. Annealing conditions are set in 200 DEG C, 1 hour.After annealing, test sample is tested under room temperature (about 25 DEG C), in 50 millimeters of collet It is measured using AG-I testing machines under conditions of the tensile speed of distance and 50 mm/mins.In addition, also calculating the front and back anti-tensile of annealing The reduction degree of intensity.
Crystallite dimension after annealing：Use the electronics backscattering diffraction (EBSD) with transmitter 501 and detector 502 Method measures the crystallite dimension of the annealing specimen 504 of copper foil (annealing 1 hour in 200 DEG C).Specifically, it is moved back using EBSD analyses The cross section of fiery copper foil sample 504, to obtain the surface area of crystal grain in copper foil sample 504, i.e. crystal boundary.Hereafter, this can be used Message calculates the largest grain size value of copper foil sample 504.Use Oxford Instruments (OxfordInstruments) NordlyNano scanning electron microscopes carry out EBSD, which depicts crystalline substance to operate the ejecting gun of voltage 15kV Grain boundary and crystallite dimension.EBSD samples 504 are (flat relative to incidence relative to about 70 ° of the vertical incidence overturning angle of electron beam 503 Face tilts 70 °).The configuration is schematically shown in Figure 5.
Low angle grain boundary (LAGB)：EBSD data are also used for determining the LAGB values of copper foil annealing sample.EBSD data are at 2 degree It is low angle grain boundary to 15 degree.Hereafter, the LAGB values obtained indicate the low angle grain boundary percentage in annealing specimen.
Lightness L*：The color L*a*b* measurements of the unannealed sample of copper foil be based on JIS Z8722 (2000) method simultaneously It is carried out using spectrophotometer (Konica Minolta, CM2500c boards are in relation to " color measurement method-reflection and transmission object ") It measures.Color measuring, because there are many roughening particles in roughening treatment side, may be influenced anti-based on without roughening treatment side It penetrates.
Bounce：The measurement of bounce measures bounce according to the test of lamination bounce.As used herein term " test of lamination bounce " refers to the program of preparation laminate samples as described below and follow-up measurement.
The first and second parts that laminate samples are related to unannealed copper foil 601 are prepared, are respectively all more than 10 millimeters through measuring The thickness of × 70 millimeters (such as 20 centimetres of 20 cm x) and polyimides 602 (KANEKA FRS-142#SW) is about 25 micro- Rice, also needs to meet the area more than 10 millimeters × 70 millimeters.The part of copper foil 601 is substantially thickness having the same, i.e., small In 10% thickness difference.The thickness of foil section can be about 9 microns to 30 microns, for example, about 12 microns to 25 microns, or about 12 microns to 18 microns.Then the placement of these parts is shaped as 601/ polyimides of copper foil, 602/ copper foil as shown in Figure 6A 601 stacking material 603.Then the stacking material 603 is pressed.Pressure programming is to subject the material to the pressure of 600psi, while with 3 DEG C/rate of min will adjust temperature to 330 DEG C from 150 DEG C.It should be noted that influence of the pressure programming to copper foil is basic Upper and other annealing processes measured have the effect of substantially the same.
Hereafter, as shown in Figure 6B, using containing FeCl3The copper foil 601 of wherein side is lost completely with the aqueous solution of HCl It carves, to only be left the stacking material 603 ' of one layer of copper foil 601 and polyimides 602.Etching solution is 1 by weight ratio：1：1 FeCl3：HCl：H2O is formed.For etch process itself, the side 4 minutes of spray solution to stacking material 603 ' simultaneously will Temperature is maintained at 25 DEG C.Obtained material stacking material 603 ' is cut into 10 millimeters × 70 millimeters later.Sample is ready at this time It measures well.
As shown in Figure 6 C, process of measurement first circularizes the placement of sample 604 or round, and two edges are by double faced adhesive tape Band bonding.Then ring is placed on the plate 605a of balance or scale 605, and weight is zeroed.Then lid 606 is placed on scale To 604 applied force of loop sample, directly to shift lid 606 onto bottom downwards on 605.At this point, as shown in Figure 6 D, 606 top of lid The distance between tops plate 605a are 10 millimeters.For the purpose of measurement, scale 605 and lid 606 should be configured to lid 606 Bottom be located at the region other than measurement plate 605a.By this mode, the weight of lid 606 does not include in the measurements.By scale 605 or the value that shows of balance therefore only include the bounce confirmed by the ring pushed away.Later, the value that record scale 605 is reported, And it is used as rebound force value.
Warpage degree：The degree of determining warpage is measured according to the test of lamination warpage.As used herein, term " stick up by lamination Song test " refers to preparing laminate samples preparation procedure described below and subsequent measurement.
Laminate samples preparation for being laminated warpage test, which is related to measuring substantially the same mode with bounce, prepares sample Product.Lamination warpage test is to cut into the part of copper foil and polyimides more than 100 millimeters × 100 millimeters before pressing, After pressing, obtained stacking material is cut into 100 millimeters × 100 millimeters and carries out etch copper foil.Then, by the copper of stacking material Foil upward and is placed on plastic plate.The scraps of paper for drawing the cross mark of 10 centimetres of 10 cm x, are placed on the upper of copper foil Face.Then using blade the stacking of the scraps of paper and lower layer is cut along the cross mark scraps of paper of 10 centimetres of 10 cm x of drafting Object.It assists to stablize knife using ruler in cutting process, and ensures that tangent line is straight.Then by the paper from stacking material shifting, Corner cut of the copper foil obtained by the tangent line free warpage upwards.The maximum height of warpage is measured with ruler.Then with four warpages Height in measurement as sample warpage degree of maximum value or peak.
The cross slit 703 that Fig. 7 display rulers 707 are positioned over copper foil 758 is formed by opening, and ruler 707 is used for surveying Measure the maximum height in 705 warpage of corner cut.If warp value is less than 3 millimeters, then it is assumed that copper foil is notable resistance warpage, this representative Low bounce-back power.If warp value is at 3 millimeters or more, then it is assumed that copper foil is easy warpage, is high bounce.
The table 2 provided in Fig. 8 gives the result of various measurements and test.Data in table 2 are shown, according in the disclosure Hold the copper foil of manufacture compared with conventionally manufactured copper foil, shows unexpected low bounce-back power.
About crystallite dimension, the data of Tables 1 and 2 are also shown, with the increase of chlorine ion concentration, tensile strength after annealing It reduces and crystallite dimension increases.Also the trend of the crystallite dimension after annealing is illustrated in Fig. 9.Fig. 9 is shown at above-mentioned 200 DEG C and 1 After the cycle of annealing of hour, a series of copper foils of chlorine ion concentration 0ppm, 2ppm, 5ppm, 10ppm, 15ppm and 25ppm Cross sectional Scanning Electron microscope (SEM) image of sample.From Fig. 9 it is observed that with chlorine ion concentration increase, annealing When crystallite dimension also increase.Therefore, the increase of crystallite dimension also implies that lower bounce.For example, in 0ppm, copper is found Foil sample has about 18 grams of bounce.However, in 20ppm, bounce is reduced to about 12 grams.
According to Tables 1 and 2, increasing current density leads to higher LAGB and higher L*.If current density is too high, instead Elastic force may be too big, therefore can induce high warpage degree.
In addition, the copper foil of constructed according to the present disclosure usually will display：
(a) L*a*b color systems are based on, are 75 to 90 without roughening treatment side lightness L* values；
(b)40kgf/mm2To 55kgf/mm2Tensile strength in range.
(c) low angle grain boundary (LAGB) percentage measured via electronics backscattering diffraction (EBSD) is less than 7.0%.
(d) crystallite dimension is 4.5 μm to 7.5 μm of range；
(e) warpage degree is less than 3mm.
Although the various concrete examples of the present invention are described above, but it is to be understood that they are only with the side of embodiment Formula is presented, rather than qualifications.It, can be according in disclosure herein in the case where without departing from the spirit or model is raised Hold and various changes are carried out to disclosed concrete example.Therefore, range of the invention and scope should not be by any of above concrete example institutes Limitation.On the contrary, scope of the invention should be limited according to claims and its equivalent.
Although illustrate and describing the present invention with one or more embodiments, in technical field that the present invention belongs to Technical staff reading and understanding this specification and diagram when, it will expect equal change and modification.Although in addition, this hair Bright special characteristic may be disclosed only with one of several embodiments, this feature can with one of other embodiment or Other multiple features merge, because being desired or advantageous for any given or specific application.
Terms used herein are only used for the purpose of description specific embodiments, and are not intended to limit the present invention.Such as this paper institutes It uses, unless the context clearly indicates otherwise, otherwise singulative " one (a) ", " one (an) " and "the" are also intended to including multiple Number form formula.In addition, the term "comprising" used in embodiment and/or claim is just described in detail, " includes (includes) ", " with (having) ", for " with (has) ", " with (with) " or its variant, such term purport By with similar to " including (comprising) " in a manner of equally have inclusiveness.
Unless otherwise defined, otherwise all terms (including technical and scientific term) used herein have with belonging to invention Has the normally understood identical meaning of usually intellectual in field.It should will be further understood that, unless explicitly define in this article, Otherwise term should be construed to have with it in the contexts of the association area those of defined in the common dictionary of such as they The consistent meaning of meaning, and will not be understood to idealization or excessively formal meaning.

Claims (23)

1. a kind of electrolytic copper foil, including:
(a) it is counted on the basis of L*a*b color systems, the lightness L* values without roughening treatment side are 75 to 90；And
(b)40kgf/mm2To 55kgf/mm2Tensile strength.
2. electrolytic copper foil as described in claim 1 further includes being less than via what electronics backscattering diffraction (EBSD) measured 7.0% low angle grain boundary (LAGB) percentage.
3. electrolytic copper foil as described in claim 1 further includes 4.5 microns to 7.5 microns of crystallite dimension.
4. electrolytic copper foil as described in claim 1, also have that lamination warpage surveyed at 0.45 millimeter to 1.5 millimeters Warpage degree.
5. electrolytic copper foil as described in claim 1, also have that lamination warpage surveyed at 1.5 millimeters to 2.5 millimeters Warpage degree.
6. electrolytic copper foil as described in claim 1, also have that lamination warpage surveyed at 2.5 millimeters to 3.0 millimeters Warpage degree.
7. electrolytic copper foil as described in claim 1, also with 7.0 microns to 7.5 microns of crystallite dimension value, and by being laminated It is 0.45 millimeter to 1.5 millimeters that warpage, which tests surveyed warpage degree,.
8. electrolytic copper foil as described in claim 1, also with 5.0 microns to 5.5 microns of crystallite dimension value, and by being laminated It is 1.5 millimeters to 2.5 millimeters that warpage, which tests surveyed warpage degree,.
9. electrolytic copper foil as described in claim 1, also with 4.5 microns to 5.0 microns of crystallite dimension value, and by being laminated It is 2.5 millimeters to 3.0 millimeters that warpage, which tests surveyed warpage degree,.
10. electrolytic copper foil as described in claim 1 further includes antirust coat, which, which contains, is selected from by chromate, is substituted Triazole or combinations thereof organize in groups in one kind.
It is relative to this without roughening treatment side 11. electrolytic copper foil as described in claim 1 further includes roughened processing side.
12. electrolytic copper foil as claimed in claim 11, also multiple includes being formed in without roughening treatment side and the roughened processing Passivation layer on side.
13. electrolytic copper foil as described in claim 1 further includes bounce, which measures via pressing bounce It is about 12 to 14 grams.
14. a kind of method for manufacturing electrolytic copper foil, including：
(a) it is 20ppm or lower copper sulfate electrolytes that preparing, which has chlorine ion concentration,；
(b) about 80A/dm is used2Or lower current density is electrochemically reacted on the copper sulfate electrolyte, it is naked to generate Copper foil；And
(c) the naked copper foil is processed to generate the electrolytic copper foil, causes the electrolytic copper foil that can have：
(i) it is counted on the basis of L*a*b color systems, the lightness L* values without roughening treatment side are 75 to 90；And
(j)40kgf/mm2To 55kgf/mm2Tensile strength,
And the processing includes surface treatment program.
15. method as claimed in claim 14, which is characterized in that the chlorine ion concentration is about 20ppm, which is 40kgf/mm2To 45kgf/mm2, and it is 0.45 millimeter to 1.5 millimeters to test surveyed warpage degree by lamination warpage.
16. method as claimed in claim 14, which is characterized in that the chlorine ion concentration is about 15ppm, which is 45kgf/mm2To 50kgf/mm2, and it is 1.5 millimeters to 2.5 millimeters to test surveyed warpage degree by lamination warpage.
17. method as claimed in claim 14, which is characterized in that the chlorine ion concentration is about 10ppm, which is 50kgf/mm2To 55kgf/mm2, and it is 2.5 millimeters to 3.0 millimeters to test surveyed warpage degree by lamination warpage.
18. method as claimed in claim 14, which is characterized in that the current density is about 60A/dm2, in the LAGB values surveyed It is 3.5% to 3.8%, and it is 75 to 80 to be somebody's turn to do the lightness L* values without roughening treatment side.
19. method as claimed in claim 14, which is characterized in that the current density is about 70A/dm2, the LAGB values surveyed are 5.8% to 6.0%, and it is 83 to 87 to be somebody's turn to do the lightness L* values without roughening treatment side.
20. method as claimed in claim 14, which is characterized in that the current density is about 80A/dm2, wherein the LAGB surveyed Value is 6.4% to 7.0%, and it is 87 to 90 to be somebody's turn to do the lightness L* values without roughening treatment side.
21. a kind of flexible printed wiring board, including electrolytic copper foil as described in claim 1.
22. a kind of electronic building brick, including flexible printed wiring board as claimed in claim 21.
23. a kind of electronic device includes the electronic building brick such as claim 22.
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US11283080B2 (en) 2019-02-01 2022-03-22 Chang Chun Petrochemical Co., Ltd. Electrodeposited copper foil, current collector, electrode, and lithium ion secondary battery comprising the same
US11362337B2 (en) 2019-02-01 2022-06-14 Chang Chun Petrochemical Co., Ltd. Electrodeposited copper foil and electrode, and lithium-ion secondary battery comprising the same
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JP2018178261A (en) 2018-11-15
US10081875B1 (en) 2018-09-25
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US10190225B2 (en) 2019-01-29
JP6554203B2 (en) 2019-07-31
KR20180117064A (en) 2018-10-26

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