CN108728807A - The equipment of conductive composite film, ceramic coating method and its use comprising this film - Google Patents
The equipment of conductive composite film, ceramic coating method and its use comprising this film Download PDFInfo
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- CN108728807A CN108728807A CN201710270596.0A CN201710270596A CN108728807A CN 108728807 A CN108728807 A CN 108728807A CN 201710270596 A CN201710270596 A CN 201710270596A CN 108728807 A CN108728807 A CN 108728807A
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- Prior art keywords
- metal layer
- torpescence
- ceramics
- machine
- film
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
Abstract
The present invention provides a kind of conductive composite film, including the first torpescence metal layer, active metal layer and the second torpescence metal layer set gradually, intermediate frequency power supply generates argon plasma in respective target surface excitation, argon ion bombardment respective target, corresponding film layer is formed on product to be coated, structure is simplified, preparation method is simplified and good with ceramic coating performance.The present invention also provides a kind of ceramic coating methods of ceramic coating product, include that above-mentioned conductive composite film is plated on ceramics, further include clamping step, vacuum step, plasma preconditioning step and unloading clip step, the ceramic coating product that technique is simplified, technological parameter is easy to control and performance is good.The present invention also provides a kind of device for above-mentioned film plating process, each component is easy to get, and easy to operate.
Description
Technical field
The present invention relates to electronic technology fields, and in particular to a kind of conductive composite film, the ceramic coating side for including this film layer
Method and its equipment of use.
Background technology
Ceramic mobile phone and watch case belong to new industry, in order to give other parts to concede space, reduce casing internal line
Road needs to carry out PVD plated films on chassis cavity surface.
Plated film mode in traditional technology is applied on ceramics, following defect occurs：(1) film layer is too thick, takes up space big；
(2) film layer is easily separated from.
Therefore, in order to meet the market demand, exploitation is a kind of to be suitable for ceramics and film layer and pad pasting work with excellent properties
Skill is of great significance.
Invention content
The first object of the present invention is to provide that a kind of structure is simplified, preparation method is simplified and good with ceramic coating performance
Conductive composite film, specific technical solution is as follows：
A kind of conductive composite film, including set gradually the first torpescence metal layer, active metal layer and the second torpescence
The preparation method of metal layer, the first torpescence metal layer is：Intermediate frequency power supply generates argon in torpescence metallic target surface excitation
Plasma, argon ion bombardment torpescence metallic target form the first torpescence metal layer on product to be coated；
The preparation method of active metal layer is：Intermediate frequency power supply generates argon plasma in active metal target surface excitation
Body, argon ion bombardment active metal target form active metal layer in the first layers of chrome；
The preparation method of the second torpescence metal layer is：Intermediate frequency power supply generates argon in torpescence metallic target surface excitation
Plasma, argon ion bombardment torpescence metallic target form the second torpescence metal layer on the aluminium layer.
Preferred in above technical scheme, the first torpescence metal layer is the first layers of chrome, and active metal layer is aluminium layer,
Second torpescence metal layer is the second layers of chrome.
Preferred in above technical scheme, the thickness of first layers of chrome is 2-8nm, and the thickness of the aluminium layer is 3000-
The thickness of 5000nm, second layers of chrome are 30-50nm.
It applies the technical scheme of the present invention, effect is：(1) coating process step is simplified, and technological parameter is easy to control；(2)
Thicknesses of layers is controllable, meets the needs of different；The single blocked up adhesive force that can be caused between film layer of film layer weakens, and performance test can not
Pass through；For the present invention using the combination of torpescence metal layer and active metal layer, torpescence metal layer is more stable, can effectively protect
Active metal layer is protected, active metal layer is again the conductive layer to play a crucial role, and performance is good；(3) film layer is beautiful, and conductive composite film
In each layer between and cementitiousness between conductive composite film and carrier it is strong, the good product performance after plated film.
The second object of the present invention be to provide a kind of technique simplify, the ceramics that technological parameter is easy to control and performance is good
The ceramic coating method of coated product, specific technical solution are as follows：
A kind of ceramic coating method, including conductive composite film as described above is plated on ceramics.
It is preferred in above technical scheme, further include before plating the conductive composite film clamping step, vacuum step with
And plasma preconditioning step, it further includes later unloading clip step to plate the conductive composite film, specifically：
The clamping step is specifically：By ceramic clamping on fixture, it is placed in coating apparatus；
The vacuum step is specifically：The cavity that ceramics are placed in coating apparatus is vacuumized；
The plasma pre-processes：Excitation generates argon plasma in the cavity of coating apparatus after evacuation
Body handles ceramics, activates ceramic surface effect, atom film layer is allowed to be more easy to deposit.Magnetically controlled sputter method is electromagnetic wave one
Determine to activate target under frequency, allow atomic deposition in ceramic surface, it is to reduce the interference of plated film undesirable element to vacuumize.
The unloading clip step is specifically：Ceramics after plated film are subjected to sudden and violent sky, and the ceramic from fixture of film will have been plated
On remove up to ceramic product；
Plasma pretreatment and plate the speed of rotation that clamping during the conductive composite film has the fixture of ceramics
It is 1000-5000 revs/min.
It is preferred in above technical scheme, further include pre-treatment step before clamping step, the pre-treatment step includes
Blasting treatment and cleaning treatment, blasting treatment are specifically：Alumina powder is sprayed onto by ceramic surface using sand-blasting machine, in ceramic surface
The rough surface that roughness is 600-800nm is formed, wherein：The spray gun of film surface and sand-blasting machine to be plated in ceramics is at 30 ° -60 °
Angle, blast time are 40-80 seconds, pressure 40-60psi；Cleaning treatment is specifically：By the ceramics after sandblasting in cleaning machine
It is cleaned, wherein：Cleaning machine is supersonic wave cleaning machine, and cleaning temperature is room temperature, and scavenging period is 5-20 minutes.
Preferred in above technical scheme, the vacuum step is specifically：The A chambers of ceramics will be placed in coating apparatus
It is evacuated to 8.0 × 10E-3Pa in vivo；There is the fixture of ceramics to move in the B cavitys of coating apparatus clamping, continues to be evacuated to
3.0×10E-4Pa。
Preferred in above technical scheme, the plasma pretreatment is specifically：B of the RF radio-frequency power supplies in coating apparatus
Excitation generates argon plasma and carries out cleaning and activation process to film surface to be plated in ceramics in cavity, wherein：RF radio-frequency powers are
The flow of 1000-3000w, argon gas are 200-500sccm, processing time 1000-1200s.
It is preferred in above technical scheme, during plating the first torpescence metal layer：The power of intermediate frequency power supply is
The flow of 4000-8000w, argon gas are 100-120sccm；Power is stronger, the easier activation of target, and plated film time is shorter.
It needs to control the stacking speed between atom and atom, prevents gap, influence conductive effect.This power bracket is that film layer is led
The control of the best range of electric effect, argon flow amount can make the atom being activated stabilization, uniformly be plated in product subsurface.If stream
It measures too small or excessive, can lead to coating performance difference, and then influence conductive effect.
During plating active metal layer：The power of intermediate frequency power supply is 6200-6500w, argon flow amount 120-
150sccm；
During plating the second torpescence metal layer：The power of intermediate frequency power supply is 6000-6200w, and the flow of argon gas is
80-120sccm。
It applies the technical scheme of the present invention, effect is：(1) it is 600- that blasting treatment, which is used to form roughness in ceramic surface,
The rough surface of 800nm, it is therefore an objective to increase the adhesive force between the first torpescence metal layer and ceramics, it is conductive compound convenient for follow-up plating
Film；(2) cleaning treatment is conducive to follow-up plated film for removing the dirty of product to be coated film surface to be plated；(3) fixture fixation is used to wait for
Coated product is convenient for subsequent operation；(4) plasma pretreatment carries out cleaning and activation process for treating coated product, increases
The adhesive force of strong follow-up plated film film layer；(5) coating machine is used to carry out plated film under vacuum, coated product performance is good (as outside
See beautiful, thicknesses of layers is moderate, film layer bond effect is good, service life is grown etc.)；(6) magnetron sputtering coater, automatic spray are used
Sand machine and supersonic wave cleaning machine, it can be achieved that plated film automation control, plating membrane efficiency can be improved and improve coated product
Quality.
The third object of the present invention is to provide a kind of device for above-mentioned film plating process, and specific technical solution is as follows：
Coating apparatus used by a kind of ceramic coating method as described above, includes the plated film with A cavitys and B cavitys
Machine, vacuum extractor, fixture, sand-blasting machine and cleaning machine；
A cavitys and B cavitys in the coating machine are connect with the vacuum extractor, and band is equipped in the B cavitys
Move the fixed component that the fixture is rotated；
It is mutual indepedent setting or detachable connection between the coating machine, fixture, sand-blasting machine and cleaning machine.
Preferred in above technical scheme, the coating machine is magnetron sputtering coater；The sand-blasting machine is automatic sand blasting
Machine；The cleaning machine is supersonic wave cleaning machine.
Using the device of the invention, each component is easy to get, and easy to operate.
Other than objects, features and advantages described above, the present invention also has other objects, features and advantages.
Below with reference to figure, the present invention is described in further detail.
Description of the drawings
The attached drawing constituted part of this application is used to provide further understanding of the present invention, schematic reality of the invention
Example and its explanation are applied for explaining the present invention, is not constituted improper limitations of the present invention.In the accompanying drawings：
Fig. 1 is the partial structural diagram of ceramic product obtained by ceramic coating method in the preferred embodiment of the present invention 1；
Fig. 2 is the C partial schematic diagrams of Fig. 1；
Wherein, 1, ceramic product to be coated, 2, sandblasting layer, 3, conductive composite film, the 3.1, first layers of chrome, 3.2, aluminium layer,
3.3, the second layers of chrome.
Specific implementation mode
The embodiment of the present invention is described in detail below in conjunction with attached drawing, but the present invention can be limited according to claim
Fixed and covering multitude of different ways is implemented.
Embodiment 1：
A kind of ceramic coating method, Details as Follows：
Coating apparatus includes used by this film plating process：Coating machine, vacuum extractor, fixture, sand-blasting machine and cleaning
Machine is to be arranged independently of each other between coating machine, fixture, sand-blasting machine and cleaning machine, and the coating machine includes A cavitys and B
Cavity, the A cavitys and B cavitys are connect with the vacuum extractor, and are equipped in the B cavitys and the fixture is driven to carry out
The fixed component of rotation.Herein, the coating machine is magnetron sputtering coater；The sand-blasting machine is automatic sand-blasting machine；It is described clear
Washing machine is supersonic wave cleaning machine.
Above-mentioned ceramic coating method specifically includes following steps：
Pre-treatment step, specifically：Including blasting treatment and cleaning treatment, the blasting treatment is specifically：Using sandblasting
Alumina powder is sprayed onto the surface of ceramic product 1 to be coated by machine, and it is the coarse of 600-800nm to form roughness in ceramic surface
Face (i.e. sandblasting layer 2), wherein：
The spray gun of film surface and sand-blasting machine to be plated in ceramic product 1 (being herein zirconia ceramics product) to be coated at
45 ° of angle, blast time are 60 seconds, pressure 40-60psi；Cleaning treatment is specifically：By the ceramic product after sandblasting clear
It is cleaned in washing machine, wherein：Cleaning machine is supersonic wave cleaning machine, and cleaning temperature is room temperature, and scavenging period is 5-20 minutes；
The first step, clamping step, specifically：By zirconia ceramics clamping on fixture, it is placed in coating apparatus；
Second step, vacuum step, specifically：It will be placed in the cavity of zirconia ceramics product and taken out very in coating apparatus
Sky, details are：It will be evacuated to 8.0 × 10E-3Pa in the A cavitys for being placed with zirconia ceramics product in coating apparatus；It will dress
The fixture for accompanying zirconia ceramics product moves in the B cavitys of coating apparatus, continues to be evacuated to 3.0 × 10E-4Pa；
Third step, plasma pretreatment, specifically：Excitation generates argon etc. in the cavity of coating apparatus after evacuation
Gas ions handle zirconia ceramics product, and details are：RF radio-frequency power supplies excite in the B cavitys of coating apparatus generates argon
Plasma carries out cleaning and activation process to film surface to be plated in zirconia ceramics product, wherein：RF radio-frequency powers are 1000-
The flow of 3000w, argon gas are 200-500sccm, processing time 1000-1200s；
4th step, plating steps, specifically：Conductive composite film is plated using coating machine on zirconia ceramics product；
5th step, unloading clip step, specifically：Zirconia ceramics product after plated film is subjected to sudden and violent sky, and will be plated
The zirconia ceramics product of film is removed from fixture up to zirconia ceramics product, refers to Fig. 1.
It the pretreatment of above-mentioned plasma and plates clamping during the conductive composite film and has the fixture of zirconia ceramics product
The speed of rotation be 2000 revs/min.High speed rotation is kept, is more uniformly distributed conducive to plated film, further increases the quality of product.
The structure of above-mentioned conductive composite film 3 refers to Fig. 2 comprising the first layers of chrome 3.1 for setting gradually, aluminium layer 3.2 and
The thickness of two layers of chrome 3.3, first layers of chrome is 5nm, and the thickness of the aluminium layer is 5000nm, and the thickness of second layers of chrome is
50nm, wherein：
The preparation method of first layers of chrome is：Intermediate frequency power supply generates argon plasma, argon ion bombardment in chromium target surface excitation
Chromium target forms the first layers of chrome on product to be coated, and herein, the power of intermediate frequency power supply is 6500w, and the flow of argon gas is
120sccm；
The preparation method of the aluminium layer is：Intermediate frequency power supply generates argon plasma, argon ion bombardment in aluminium target surface excitation
Aluminium target forms aluminium layer in the first layers of chrome, and herein, the power of intermediate frequency power supply is 6500w, argon flow amount 150sccm；Described second
The preparation method of layers of chrome is：Intermediate frequency power supply generates argon plasma, argon ion bombardment chromium target, in the aluminium in chromium target surface excitation
The second layers of chrome is formed on layer, herein, the power of intermediate frequency power supply is 6200w, and the flow of argon gas is 120sccm.
Using the performance such as table 1 for the ceramic product that the film plating process of the present embodiment is obtained：
The performance comparison sheet of ceramic product obtained by 1 traditional technology of table and present invention gained ceramic product
It applies the technical scheme of the present invention, product cavity surface is pre-processed by plasma first, it is then sharp
With medium frequency magnetron sputtering method after chromium target and aluminium target surface formation argon plasma, argon ion bombardment target, in product cavity
Surface forms uniform, fine and close conductive film layer, has strong adhesive force, the efficient advantage of plated film；Increase sandblasting pretreatment with
And plasma pretreatment, it can achieve the effect that further enhance adhesive force；By complicated test environment, appointing can keep good
Good film adhesion and electric conductivity.
Embodiment 2：
The present embodiment difference from Example 1 is：First torpescence metal layer and the second torpescence metal layer are titanium
Layer, active metal layer use aluminium layer.The thickness of each layer and the actual process of plated film are the same as embodiment 1.
The properties of product that the present embodiment obtains are the same as embodiment 1.
In addition to this, the first torpescence metal layer and the second torpescence metal layer can also use other torpescence
Metal (copper, silver etc.), and active metal layer can also use other active metals (such as magnesium, potassium), slightly further according to actual conditions
Micro- modification filming parameter, meets the needs of different.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of conductive composite film, it is characterised in that：Including the first torpescence metal layer, the active metal layer and the set gradually
The preparation method of two torpescence metal layers, the first torpescence metal layer is：Intermediate frequency power supply swashs on torpescence metallic target surface
Hair generates argon plasma, and argon ion bombardment torpescence metallic target forms the first torpescence metal layer on product to be coated；
The preparation method of active metal layer is：Intermediate frequency power supply generates argon plasma, argon in active metal target surface excitation
Ion bombardment active metal target forms active metal layer on the first torpescence metal layer；
The preparation method of the second torpescence metal layer is：Intermediate frequency power supply torpescence metallic target surface excitation generate argon etc. from
Daughter, argon ion bombardment torpescence metallic target form the second torpescence metal layer on the layer of the active metal.
2. conductive composite film according to claim 1, it is characterised in that：The first torpescence metal layer is the first chromium
Layer, active metal layer are aluminium layer, and the second torpescence metal layer is the second layers of chrome.
3. conductive composite film according to claim 2, it is characterised in that：The thickness of first layers of chrome is 2-8nm, described
The thickness of aluminium layer is 3000-5000nm, and the thickness of second layers of chrome is 30-50nm.
4. a kind of ceramic coating method, which is characterized in that include plating the leading as described in claim 1-3 any one on ceramics
Electric composite membrane.
5. ceramic coating method according to claim 4, it is characterised in that：It further include dress before plating the conductive composite film
Step, vacuum step and plasma preconditioning step are pressed from both sides, it further includes later unloading clip step to plate the conductive composite film, tool
Body is：
The clamping step is specifically：By ceramic clamping on fixture, it is placed in coating apparatus；
The vacuum step is specifically：The cavity that ceramics are placed in coating apparatus is vacuumized；
The plasma pre-processes：Excitation generates argon plasma pair in the cavity of coating apparatus after evacuation
Ceramics are handled；
The unloading clip step is specifically：Ceramics after plated film are subjected to sudden and violent sky, and the ceramics for having plated film are torn open from fixture
Lower ceramic product to obtain the final product；
Plasma pretreatment and plating clamping during the conductive composite film has the speed of rotation of the fixture of ceramics to be
1000-5000 revs/min.
6. ceramic coating method according to claim 5, which is characterized in that further include pretreatment before the clamping step
Step, the pre-treatment step include blasting treatment and cleaning treatment, and the blasting treatment is specifically：It will be aoxidized using sand-blasting machine
Aluminium powder is sprayed onto ceramic surface, and the rough surface that roughness is 600-800nm is formed in ceramic surface, wherein：It is to be coated in ceramics
The spray gun of face and sand-blasting machine is at 30 ° -60 ° of angle, and blast time is 40-80 seconds, pressure 40-60psi；The cleaning treatment
Specifically：Ceramics after sandblasting are cleaned in cleaning machine, wherein：Cleaning machine is supersonic wave cleaning machine, and cleaning temperature is
Room temperature, scavenging period are 5-20 minutes.
7. ceramic coating method according to claim 5, which is characterized in that the vacuum step is specifically：By plated film
It is placed in device in the A cavitys of ceramics and is evacuated to 8.0 × 10E-3Pa；There is the fixture of ceramics to move to coating apparatus clamping
B cavitys in, continue to be evacuated to 3.0 × 10E-4Pa；
The plasma pre-processes：RF radio-frequency power supplies excite in the B cavitys of coating apparatus generates argon plasma
Cleaning and activation process are carried out to film surface to be plated in ceramics, wherein：RF radio-frequency powers are 1000-3000w, and the flow of argon gas is
200-500sccm, processing time 1000-1200s.
8. ceramic coating method according to claim 6, which is characterized in that plating the first torpescence metal layer process
In：The power of intermediate frequency power supply is 6000-6500w, and the flow of argon gas is 100-120sccm；
During plating active metal layer：The power of intermediate frequency power supply is 6200-6500w, argon flow amount 120-150sccm；
During plating the second torpescence metal layer：The power of intermediate frequency power supply is 6000-6200w, and the flow of argon gas is 80-
120sccm。
9. coating apparatus used by a kind of ceramic coating method as claimed in claim 5, which is characterized in that including with A
The coating machine of cavity and B cavitys, vacuum extractor, fixture, sand-blasting machine and cleaning machine；
A cavitys and B cavitys in the coating machine are connect with the vacuum extractor, and are equipped in the B cavitys and are driven institute
State the fixed component that fixture is rotated；
It is mutual indepedent setting or detachable connection between the coating machine, fixture, sand-blasting machine and cleaning machine.
10. coating apparatus according to claim 9, it is characterised in that：The coating machine is magnetron sputtering coater；It is described
Sand-blasting machine is automatic sand-blasting machine；The cleaning machine is supersonic wave cleaning machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710270596.0A CN108728807A (en) | 2017-04-24 | 2017-04-24 | The equipment of conductive composite film, ceramic coating method and its use comprising this film |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710270596.0A CN108728807A (en) | 2017-04-24 | 2017-04-24 | The equipment of conductive composite film, ceramic coating method and its use comprising this film |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5569255A (en) * | 1978-11-16 | 1980-05-24 | Fujitsu General Ltd | Forming method for alloy film chromium or titanium, and copper |
| CN1804112A (en) * | 2006-01-20 | 2006-07-19 | 浙江大学 | Electronic ceramic continuous sputtering coating equipment |
| CN101521988A (en) * | 2009-03-27 | 2009-09-02 | 浙江大学 | Preparation method of metal base copper-clad plate and copper-clad sectional material |
| CN102896832A (en) * | 2011-07-28 | 2013-01-30 | 中国科学院金属研究所 | Power module metalized ceramic substrate and metallization method thereof |
-
2017
- 2017-04-24 CN CN201710270596.0A patent/CN108728807A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5569255A (en) * | 1978-11-16 | 1980-05-24 | Fujitsu General Ltd | Forming method for alloy film chromium or titanium, and copper |
| CN1804112A (en) * | 2006-01-20 | 2006-07-19 | 浙江大学 | Electronic ceramic continuous sputtering coating equipment |
| CN101521988A (en) * | 2009-03-27 | 2009-09-02 | 浙江大学 | Preparation method of metal base copper-clad plate and copper-clad sectional material |
| CN102896832A (en) * | 2011-07-28 | 2013-01-30 | 中国科学院金属研究所 | Power module metalized ceramic substrate and metallization method thereof |
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Application publication date: 20181102 |