CN108728800A - For the Multifunctional treatment device in vacuum environment - Google Patents
For the Multifunctional treatment device in vacuum environment Download PDFInfo
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- CN108728800A CN108728800A CN201710269763.XA CN201710269763A CN108728800A CN 108728800 A CN108728800 A CN 108728800A CN 201710269763 A CN201710269763 A CN 201710269763A CN 108728800 A CN108728800 A CN 108728800A
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- China
- Prior art keywords
- metal platform
- treatment device
- multifunctional treatment
- specimen holder
- opening
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/34—Methods of heating
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/74—Methods of treatment in inert gas, controlled atmosphere, vacuum or pulverulent material
- C21D1/773—Methods of treatment in inert gas, controlled atmosphere, vacuum or pulverulent material under reduced pressure or vacuum
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
- C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
Abstract
The present invention relates to for the Multifunctional treatment device in vacuum environment.According to an embodiment, a kind of Multifunctional treatment device may include：Metal platform includes the podium level of one end of cylindrical lateral wall and capping cylindrical lateral wall, has opening at the center portion of the podium level for accommodating specimen holder, has first electrode on the metal platform for applying voltage to the metal platform；Insulating cylinder is arranged on the downside of the metal platform；Water-cooled cylinder, be arranged on the downside of the insulating cylinder, the insulating cylinder by the metal platform and the water-cooled cylinder it is insulated from each other be physically joined together；And filament, it is arranged in the cylindrical space that the metal platform, the insulating cylinder and the water-cooled cylinder define and faces the opening, the both ends of the filament are connected respectively to two threaded rod electrodes, two threaded rod electrodes are installed on insulation board, and the insulation board is fixed to the downside of the water-cooled cylinder.
Description
Technical field
Present invention relates in general to sample treatment fields, more specifically it relates to a kind of for multi-functional in vacuum environment
Processing unit can be used for executing various types of heat treatment to a variety of different samples, or even can be also used for sinking
The material of the low evaporating temperature of product.The present invention Multifunctional treatment device have many advantages, such as it is easy to operate, be easily changed.
Background technology
Under vacuum conditions, in order to realize the heat treatment to sample, target and other vacuum components, hot spoke is mainly used
Heating, beam bombardment heating and electric current is penetrated the methods of to directly heat.The mode that heat radiation type heating relies primarily on radiation will be hot
Amount passes to the component for needing to heat.For example, tungsten filament electric current by when generate a large amount of heat, side of these heats to radiate
Formula is transmitted on low-temperature components, realizes the heat treatment to the component.And beam bombardment formula is heated, component to be heated
It needs to add positive high voltage, while being passed through electric current appropriate in tungsten filament, in this way due to the outside radiation electric beamlet of tungsten filament fever, and these
Electron beam can bombard the component with positive high voltage under electric field action, and transfer energy to them, to realize that electron beam bangs
Hit the function of heating.For the direct-fired mode of electric current, make electric current directly through semiconductor samples, due to semiconductor samples electricity
Hinder it is relatively large, electric current by when can generate a large amount of heat, the raising of semiconductor samples own temperature is realized, to reach electricity
Stream directly heats the purpose of semi-conducting material.
There is important role to the heat treatment of sample, target and corresponding vacuum component under vacuum conditions.It is right first
The substrate of Material growth is heat-treated, and can not only remove the impurity on surface in this way, obtains clean substrate surface, additionally it is possible to
So that the atom on surface obtains enough kinetic energy, reconstruct occurs to form new surface texture.Secondly, in material deposition process
In, target is usually heated into corresponding temperature using resistance-type evaporation source or beam bombardment formula evaporation source so that it
Can deposit in corresponding substrate.Simultaneously in material deposition process or after the completion, substrate is heat-treated, it can
So that the sample of substrate surface obtains enough kinetic energy, stablize so that they can rely on the interaction of itself to be formed
Structure.In addition, in vacuum system, it is also possible to which there is the components that other need to heat.Such as it is swept in ultrahigh vacuum
The needle point in tunnel microscope system is retouched, is heated before use so that needle point can be excellent with stablizing
State obtains clear reliable data.
However, still can realize above-mentioned a variety of processing modes without a kind of processing unit at present.In addition, when in vacuum environment
When a variety of processing of middle realization, the needs for meeting various functions are not only needed, it is also necessary to consider many other problems, such as structure is tight
It gathers, the transmission of cooling water circulation, current lead-through, high-voltage safety, avoid short circuit and temperature monitoring etc..These problems are for true
The design and realization of the Multifunctional treatment device of Altitude bring difficulty.
Invention content
For the demand, the present invention provides the multi-functional processing unit under a kind of vacuum environment.It has it is simple in structure,
Multiple functional, small advantage.The processing unit can be compatible with the general plate specimen holder in laboratory first, can be fine
Ground adapts to the demand in laboratory.Secondly as the simple structure and compact design of the processing unit are easily installed in narrow sky
In, save a large amount of space for system.
According to an exemplary embodiment, a kind of Multifunctional treatment device may include：Metal platform, including cylindrical lateral wall and
The podium level of one end of cylindrical lateral wall is covered, has opening for accommodating specimen holder at the center portion of the podium level,
There is first electrode for applying voltage to the metal platform on the metal platform；Insulating cylinder is arranged in the metal
Platform underside；Water-cooled cylinder is arranged on the downside of the insulating cylinder, the insulating cylinder by the metal platform and the water-cooled cylinder each other
It is insulated to be physically joined together；And filament, it is arranged and defines in the metal platform, the insulating cylinder and the water-cooled cylinder
In cylindrical space and the opening is faced, the both ends of the filament are connected respectively to two threaded rod electrodes, two spiral shells
Bar electrode is installed on insulation board, and the insulation board is fixed to the downside of the water-cooled cylinder.
In some instances, the podium level has recess for accepting specimen holder in the surrounding of the opening.
In some instances, a part for the podium level and cylindrical lateral wall adjacent thereto are removed to expose
The side of opening is stated, the podium level is formed with slot (18) in the part of the edge of the opening, to specimen holder energy
It is inserted into the slot in the opening.
In some instances, the metal platform further includes：Metal clips, be mounted on the metal platform on and with institute
State metal platform electrical isolation；And second electrode, it is arranged on the metal clips, so as to pass through the first electrode and institute
It states second electrode and Direct Current heating is carried out to sample.
In some instances, the filament is used to carry out heat radiation heating to sample.The first electrode is used for described
Metal platform applies predetermined positive voltage so that the electronics of the filament transmitting is accelerated towards the metal platform, to realize
Beam bombardment heats.
In some instances, the Multifunctional treatment device further includes：Specimen holder has tabular body part, is used for
It is installed in the opening of the metal platform.
In some instances, the specimen holder is semiconductor samples frame, includes for supporting one end of semiconductor samples
The first support section on the body part and for the other end of semiconductor samples to be supported on the body part
The second support section, one end of the semiconductor samples is also electrically connected to the body part by first support section,
Second support section is physically contacted with the body part but is electrically insulated, and second support section is partly led described
The other end of body sample is electrically connected to the metal clips.
In some instances, the specimen holder is used as the crucible specimen holder of evaporation source, including with the body part one
Cylindric crucible body that is that body is formed or being installed on the body part and the crucible cover for covering the crucible body, institute
Stating has through-hole on crucible cover.
In some instances, the crucible cover has cylindrical shape, and the inner wall of the crucible cover and the crucible body
Outer wall on be formed with the screw thread of pairing for the crucible cover to be fastened in the crucible body.
In some instances, the Multifunctional treatment device further includes：Third electrode, be arranged on the metal platform with
For executing temperature monitoring by thermocouple.
Using the Multifunctional treatment device of the present invention, hot spoke can be carried out to common sample (metal, semiconductor, insulator)
Formula and the heating of beam bombardment formula are penetrated, can electric current additionally be carried out to semiconductor samples and directly heated, it can also be to vacuum environment
In particular component be heat-treated, such as the needle point in system of Scanning Tunneling Microscope, or even can be also used for depositing low steaming
Send out the material of temperature, including solid-state materials such as organic molecule and low-temperature metal, semiconductor, have it is easy to operate, be easily changed
Advantage.
Description of the drawings
Fig. 1 is the structural representation according to an embodiment of the invention that can be used for the Multifunctional treatment device in vacuum environment
Figure；
Fig. 2 is the phantom of the Multifunctional treatment device of Fig. 1；
Fig. 3 A are to carry out heat radiation type heating to common sample with the Multifunctional treatment device of Fig. 1 and beam bombardment formula adds
The schematic diagram of heat；
Fig. 3 B are the schematic diagrames of common sample frame；
Fig. 4 A are to carry out the direct-fired schematic diagram of electric current to semiconductor samples with the Multifunctional treatment device of Fig. 1；
Fig. 4 B are the schematic diagrames of semiconductor samples frame；
Fig. 5 A are the schematic diagrames heated to needle point with the Multifunctional treatment device of Fig. 1；
Fig. 5 B are the schematic diagrames of needle point specimen holder；
Fig. 6 A are the schematic diagrames when Multifunctional treatment device of Fig. 1 to be used as to evaporation source；
Fig. 6 B are the structural schematic diagrams of tripod；
Fig. 6 C are the phantoms of tripod；
Fig. 7 is to carry out material deposition with the Multifunctional treatment device of Fig. 1 cooperation evaporation source and heat the signal of sample simultaneously
Figure.
Specific implementation mode
Exemplary embodiment of the present invention described with reference to the accompanying drawings.
Fig. 1 shows the structure of the Multifunctional treatment device 100 according to an embodiment of the invention that can be used in vacuum environment
Schematic diagram, Fig. 2 shows the phantoms of the Multifunctional treatment device 100 of Fig. 1.As illustrated in fig. 1 and 2, Multifunctional treatment device
100 may include metal platform 10, insulating cylinder 30 and water-cooled cylinder 50.
Metal platform 10 may include cylindrical lateral wall 12 and cover the podium level 14 of one end of cylindrical lateral wall 12, and the two can
With with integral structure, or can be assembled by individual element.The center portion of podium level 14 can have an opening
16, such as rectangular or square opening, to expose the inside of cylinder 12.A part for podium level 14 and cylinder adjacent thereto
Shape side wall 12 is removed, and notch is connected to opening 16, so that the side of opening 16 is exposed.In other words, opening 16 is open
, rather than closed opening.It is open in the podium level 14 of 16 edges and could be formed with slot 18, (later to specimen holder
Detailed description) it can be inserted into opening 16 from the open sides of opening 16.The notch can also be conducive to extract the gas in cylinder
Body, therefore be used in vacuum environment convenient for device 100.
It should be understood that specimen holder can also be otherwise placed on podium level 14.For example, the podium level of 16 surroundings of opening
14 there is recess, specimen holder can be placed in the recess.In this embodiment, opening 16 can be closed, without by cutting
It cuts to expose the side of opening 16.
Metal platform 10 can be formed by high temperature resistant and with the material of good electric conductivity, such as molybdenum, tungsten etc..Below with molybdenum
For describe, however, it is understood that the component here depicted as molybdenum by other high temperature resistants and can also have good electric conductivity
Material replacement such as tungsten.
With continued reference to Fig. 1, one or more electrodes, such as high-voltage electricity can be provided on the podium level 14 of metal platform 10
Pole 20, thermometric electrode 22 etc..High-field electrode 20 can be used for applying high voltage to metal platform 10, will be further detailed below
Description.Thermometric electrode 22 can be used for realizing that thermo-couple temperature measures.14 top of podium level is also provided with metal clips 24,
It can be used for being electrically connected to the sample on specimen holder.Metal clips 24 is installed to by ceramics pipe outer 26 on podium level 14, and
Realization is electrically insulated with podium level 14.Electrode 28 is heated to be arranged on metal clips 24.
The setting of insulating cylinder 30 is connected to water-cooled cylinder 50 in 10 downside of metal platform, and by the insulation of metal platform 10.Such as Fig. 2
Sectional view shown in, a part for the side wall 12 of metal platform 10 may extend into the inside of insulating cylinder 30, to both can be tight
Contiguity is combined together.Similarly, a part for the inner wall of water-cooled cylinder 50 may extend into the inside of insulating cylinder 30, to both can be with
It is tightly engaged into together.Metal platform 10, insulating cylinder 30 and the lateral wall of water-cooled cylinder 50 can be concordant, beautiful, compact to realize
Structure.
Water-cooled cylinder 50 can be by the formation such as stainless steel of the metal material with thermal conductive resin comprising cricoid water follows
Ring channel 52, water circulation channel 52 are connected to water inlet pipe 54 and outlet pipe 56, to realize that water recycles.Recirculated water can be to processing
Device 100 is cooled down, and the temperature of sample is controlled to coordinate heating element.
As shown in Fig. 2, processing unit 100 further includes being arranged in 50 shape of the metal platform 10, insulating cylinder 30 and water-cooled cylinder
At cylindrical space in filament 60, can be such as helical tungsten filamen.Filament 60 can substantially face opening 16, and
And it is connected to threaded rod electrode 62 and 64, so as to be powered up to filament 60.Threaded rod electrode 62 and 64 can be fixed on insulation board 66.
Insulation board such as ceramic wafer 66 can be fixed to the downside of water-cooled cylinder 50.
Described above is the example arrangement of Multifunctional treatment device 100, described pair below in conjunction with various specimen holders
The use of processing unit 100.
Fig. 3 A are to carry out heat radiation type heating and beam bombardment to common sample with the Multifunctional treatment device 100 of Fig. 1
The schematic diagram of formula heating, Fig. 3 B are the schematic diagrames of common sample frame 110.
As shown in figs.3 a and 3b, specimen holder 110 can be plugged into the opening 16 of Multifunctional treatment device 100.In Fig. 3 B institutes
In the example shown, common sample frame 110 includes for fixing the molybdenum sheet a of sample, sample b and specimen holder ontology c.Specimen holder
Ontology c can also be formed by molybdenum, generally in tabular, and in order to be inserted into the slot 18 of metal platform 10, molybdenum specimen holder c's
The widest part is less than the width of slot 18, but is greater than the width of opening 16.Preferably, for the ease of being inserted and removed from molybdenum specimen holder
A, one end that molybdenum specimen holder a does not enter slot 18 are also provided with handle outstanding；Certainly, in order to simple, handle can also be saved
Slightly.Middle part in the plane of specimen holder ontology c can be equipped with one group of molybdenum sheet a, this group of molybdenum sheet a at intervals and respectively
From card slot is symmetrically equipped with for fixing sample b.
As shown in Figure 3A, will common sample frame 110 be inserted into metal platform 10 slot 18 in, wherein molybdenum specimen holder c with insert
Slot 18 contacts, and sample b is in the top of filament 60 under the support of molybdenum specimen holder c.In processing procedure, to 62 He of threaded rod electrode
64 galvanizations make filament 60 generate heat, and heat radiation heating is executed so as to heap sample b.Further, it is also possible to be applied to high-field electrode 20
Add positive high voltage appropriate so that the electronics that filament 60 emits accelerates under electric field action towards metal platform 10, and then bombards sample
Product b, to execute the heating of beam bombardment formula.In heating process, temperature monitoring can also be realized using thermometric electrode 22.When
So, temperature monitoring can also be realized using the infrared facility being arranged outside device.
Fig. 4 A are to carry out the direct-fired schematic diagram of electric current to semiconductor samples with the Multifunctional treatment device 100 of Fig. 1, figure
4B is the schematic diagram of semiconductor samples frame 120.The part similar with the specimen holder described before will be omitted, and be not repeated to retouch
It states.
As shown in Figure 4 B, semiconductor samples frame 120 includes the first molybdenum sheet a, the second molybdenum sheet c, insulating trip f, molybdenum specimen holder sheet
Body e, molybdenum screw rod b, insulation tube g and semiconductor samples d, wherein molybdenum specimen holder ontology e is in the flat of similar Fig. 3 B, herein not
It repeats, in addition, being additionally provided with multiple through-holes on molybdenum specimen holder ontology e, for passing through for molybdenum screw rod b, in the present embodiment, is equipped with again
Four through-holes that may make up four vertex of a quadrangle, for penetrating for four molybdenum screw rod b1-b4, it will be appreciated that, lead to
The number in hole is not limited to 4, can be set as the number less than or greater than 4 as needed.Molybdenum screw rod b1 and b2 is by being located at molybdenum sample
The molybdenum nut of the flat part of frame ontology e just tossed about is fixed, and molybdenum screw rod b3 and b4 is again by being located at the flat of molybdenum specimen holder ontology e
The molybdenum nut of plate portion just tossed about is fixed, but insulation tube g is equipped between molybdenum nut and molybdenum specimen holder ontology e.In this way, molybdenum screw rod
B1 and b2 is electrically connected to molybdenum ontology e, but molybdenum screw rod b3 and b4 can be electrically insulated with molybdenum ontology e.Insulating trip f1 passes through molybdenum screw rod
B1 and b2 rides on molybdenum nut, and insulating trip f2 rides over across molybdenum screw rod b3 and b4 on molybdenum nut, and insulating trip f1 and f2 are in same
Highly, the adjusting of the height can be realized by increasing or decreasing molybdenum nut quantity.Semiconductor can be placed on insulating trip f1 and f2
Sample d, and the upper surface of semiconductor samples d is fixed on molybdenum nut on insulating trip f by molybdenum sheet a and c.Specifically, the first molybdenum sheet a
It is pressed in the sides semiconductor samples d across molybdenum screw rod b1 and b2 and by being located at molybdenum nut fastening thereon, the second molybdenum sheet c passes through molybdenum
Screw rod b3 and b4 are pressed in the other sides semiconductor samples d and by being located at molybdenum nut fastening thereon, wherein the cross of the second molybdenum sheet c
Section can be L-shaped, and when semiconductor samples frame 120 is placed in slot 18, the second molybdenum sheet c can be overlapped on one with metal clips 24
It rises, is used for the conduction of electric current.
As shown in Figure 4 A, semiconductor samples frame 120 is inserted into the slot 18 of metal platform 10, wherein the just positions sample d
In the top of filament 60.Heat radiation when being heat-treated in addition to the beam bombardment and substrate that can implement deposition process, the present embodiment
Electric current can also be implemented to directly heat.Specifically, when semiconductor samples frame 120 is inserted into slot 18, the second molybdenum sheet c and metal clips
24 are in close contact, at this point, from heating electrode 28 through shrapnel 24, the second molybdenum sheet c, semiconductor samples d, the first molybdenum sheet a, molybdenum screw rod b1
Conductive path is formed with b2, molybdenum specimen holder ontology e, metal platform 10, high-field electrode 20.Note that molybdenum screw rod b3 and b4 and sample
It is electrical isolation between frame ontology e.By applying appropriate voltage to high-field electrode 20 and heating electrode 28, electric current flows through semiconductor
Sample d can generate a large amount of heat since semiconductor resistor is relatively large so that and semiconductor samples d own temperatures increase, from
And realize the purpose that electric current directly heats semi-conducting material.Although also in circuit, it is electric for a part for specimen holder 120
Resistance is much smaller than semi-conducting material, therefore calorific value very little, to which the efficiency of heating surface to semi-conducting material is high.
Fig. 5 A are the schematic diagrames heated to needle point with the Multifunctional treatment device 100 of Fig. 1, and Fig. 5 B are needle point samples
The schematic diagram of product frame 130.
As shown in Figure 5 B, needle point specimen holder 130 includes needle point sample a, molybdenum needle point frame b and needle point seat c, and molybdenum needle point frame b is in
Similar Fig. 3 B's is flat, and details are not described herein again, in addition, needle point seat c is located at the centers molybdenum needle point frame b, needle point seat is in axis
It is equipped with groove, for placing needle point sample a.
As shown in Figure 5A, needle point specimen holder 130 is inserted into the slot 18 of metal platform 10, wherein needle point a is towards filament
60 sides.Similar Fig. 3 A can complete the heat treatment to needle point by heat radiation and beam bombardment, remove the miscellaneous of needle surface
Matter, to obtain clearly image using the needle point.
Fig. 6 A are the schematic diagrames when Multifunctional treatment device 100 of Fig. 1 to be used as to evaporation source, and Fig. 6 B are tripods 140
Structural schematic diagram, Fig. 6 C are the phantoms of tripod 140.
As shown in Figure 6B, tripod 140 includes the body part a similar with the specimen holder of front, and is located at body part
Divide the crucible in the middle part of a.With reference to Fig. 6 C, crucible includes the lower part d and cover b of cylindrical shape.It lower part can be with body part a one
It is formed, or can be located in the opening in the centers body part a.Cover b can also be cylindrical shape, but its internal diameter is slightly larger
In the outer diameter of cylindric lower part d, to which cover b can be tipped upside down on the cylinder d of lower part.It in some embodiments, can also be
The screw thread of pairing is formed on the inner wall of cover b and the outer wall of lower part cylinder d, to realize close connection between the two.Under
Material to be evaporated can be accommodated in portion cylinder d, through-hole c is could be formed in cover b, convenient for material to be evaporated by heating
Evaporation afterwards is subsequently used for material deposition.For the material of relatively low evaporating temperature, the molybdenum spiral shell of electric current through the processing unit can be made
Bar electrode 62,64 is generated heat using tungsten filament 60 and realizes heat radiation heating deposition.And for the material of higher evaporating temperature, need pair
Stream is separately energized in the molybdenum threaded rod electrode 62,64 and high-field electrode 20 of processing unit, high pressure carries out beam bombardment heating.Thermometric electricity
Pole 22 can realize the monitoring to material evaporating temperature.
Fig. 7 is to carry out material deposition with the Multifunctional treatment device of Fig. 1 cooperation evaporation source and heat the signal of sample simultaneously
Figure can use common sample frame 110 shown in Fig. 3 B.As shown in fig. 7, the substrate of sample to be deposited passes through specimen holder 110
It is positioned in the opening 16 of processing unit, while substrate is heated using processing unit, mode of heating may be used aforementioned
Any one in mode.Evaporation source 150 can be the evaporation source of commercial version, can also use evaporation source dress shown in Fig. 6 A
It sets.In material deposition process, substrate is heated, enables to the atom for being deposited on surface or molecule to obtain enough
Energy, stable structure is formed by the support of mutual intermolecular forces.And the difference of underlayer temperature is regulated and controled, it is possible to meeting
Form different structures.The detection of temperature has infrared measurement of temperature and thermocouple thermometric two ways.Wherein thermocouple thermometric is by thermometric electricity
It realizes pole 22.
Although described above is the example of some specimen holders, however, it is understood that the Multifunctional treatment device of the present invention may be used also
With the specimen holder suitable for various other designs, to meet various needs.
The processing unit of the present invention is small, is easy to adjust, and powerful, disclosure satisfy that the more of different samples and component
The needs that kind mode heats, additionally it is possible to be deposited applied to material as evaporation source.Since the processing unit also has recirculated water cooling
But function can realize fast cooling and the accurate temperature control to sample, target and heating device.The processing unit energy
The general plate specimen holder in enough compatible laboratory, can be well adapted for the demand in laboratory.Secondly as the processing unit
Simple structure and compact design be easily installed in narrow space, save a large amount of space for system.
In order to which purpose of illustration and description has been presented for above description.In addition, this description is not intended to the reality of the application
It applies example and is restricted to form disclosed herein.Although already discussed above multiple exemplary aspects and embodiment, this field skill
Art personnel will be recognized that its certain modifications, modification, change, addition and sub-portfolio.The scope of the present invention by appended claims and
Its equivalent limits.
Claims (10)
1. a kind of Multifunctional treatment device, including：
Metal platform (10) includes the podium level (14) of one end of cylindrical lateral wall (12) and capping cylindrical lateral wall, described flat
Have opening (16) for accommodating specimen holder at the center portion of platform layer, have on the metal platform first electrode (20) with
For applying voltage to the metal platform；
Insulating cylinder (30) is arranged on the downside of the metal platform；
Water-cooled cylinder (50) is arranged on the downside of the insulating cylinder, the insulating cylinder by the metal platform and the water-cooled cylinder each other
It is insulated to be physically joined together；And
Filament (60), is arranged in the cylindrical space that the metal platform, the insulating cylinder and the water-cooled cylinder define and just
Against the opening, the both ends of the filament are connected respectively to two threaded rod electrodes (62,64), two threaded rod electrodes installation
Onto insulation board, the insulation board is fixed to the downside of the water-cooled cylinder.
2. Multifunctional treatment device as described in claim 1, wherein the podium level has recess in the surrounding of the opening
For accepting specimen holder.
3. Multifunctional treatment device as described in claim 1, wherein a part for the podium level and circle adjacent thereto
Cylindrical sidewall is removed the side with the exposure opening, and the podium level is formed in the part of the edge of the opening
Slot (18), to which specimen holder can be inserted into the opening in the slot.
4. Multifunctional treatment device as described in claim 1, wherein the metal platform further includes：
Metal clips (24) is mounted on the metal platform (10) and is electrically insulated with the metal platform；And
Second electrode (28) is arranged on the metal clips, so as to pass through the first electrode and the second electrode pair
Sample carries out Direct Current heating.
5. Multifunctional treatment device as described in claim 1, wherein the filament is used to carry out heat radiation heating to sample,
And
The first electrode is used to apply predetermined positive voltage to the metal platform so that the electronics of the filament transmitting is by direction
The metal platform accelerates, to realize that beam bombardment heats.
6. Multifunctional treatment device as claimed in claim 4, further includes：
Specimen holder has tabular body part, for installation into the opening of the metal platform.
7. Multifunctional treatment device as claimed in claim 6, wherein the specimen holder is semiconductor samples frame, including is used for
One end of semiconductor samples is supported on the first support section on the body part and for by the another of semiconductor samples
End is supported on the second support section on the body part, and first support section is also by one end of the semiconductor samples
It is electrically connected to the body part, second support section is physically contacted with the body part but is electrically insulated, and described
The other end of the semiconductor samples is electrically connected to the metal clips by the second support section.
8. Multifunctional treatment device as claimed in claim 6, wherein the specimen holder is used as the crucible sample of evaporation source
Frame includes cylindric crucible body and covering being integrally formed with the body part or being installed on the body part
The crucible cover of the crucible body has through-hole on the crucible cover.
9. Multifunctional treatment device as claimed in claim 6, wherein the crucible cover has cylindrical shape, and the crucible
The screw thread of pairing is formed on the inner wall of lid and the outer wall of the crucible body for the crucible cover is fastened to the earthenware
On crucible ontology.
10. Multifunctional treatment device as described in claim 1, further includes：
Third electrode (22) is arranged on the metal platform for executing temperature monitoring by thermocouple.
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| CN108728800B CN108728800B (en) | 2019-12-24 |
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| CN109490580A (en) * | 2018-11-09 | 2019-03-19 | 昆明理工大学 | A kind of annealing device of needle tip of scanning tunnel microscope |
| CN113884706A (en) * | 2020-07-02 | 2022-01-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | Vacuum interconnection system and transfer vacuum sample support |
| CN113884707A (en) * | 2020-07-02 | 2022-01-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | Heating frame interconnection assembly and transfer vacuum sample holder |
| US11971216B1 (en) | 2021-12-23 | 2024-04-30 | Rolls-Royce High Temperature Composites, Inc. | Retort with loading window |
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| JP2009105431A (en) * | 1998-01-29 | 2009-05-14 | Canon Anelva Corp | Plasma processing apparatus |
| CN103208440A (en) * | 2012-01-17 | 2013-07-17 | 中国科学院微电子研究所 | Cavity heating device |
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| JP2009105431A (en) * | 1998-01-29 | 2009-05-14 | Canon Anelva Corp | Plasma processing apparatus |
| CN103208440A (en) * | 2012-01-17 | 2013-07-17 | 中国科学院微电子研究所 | Cavity heating device |
| CN105568225A (en) * | 2014-10-13 | 2016-05-11 | 中国科学院物理研究所 | Resistance heating apparatus and resistance heating type evaporation source |
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| CN109490580A (en) * | 2018-11-09 | 2019-03-19 | 昆明理工大学 | A kind of annealing device of needle tip of scanning tunnel microscope |
| CN113884706A (en) * | 2020-07-02 | 2022-01-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | Vacuum interconnection system and transfer vacuum sample support |
| CN113884707A (en) * | 2020-07-02 | 2022-01-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | Heating frame interconnection assembly and transfer vacuum sample holder |
| US11971216B1 (en) | 2021-12-23 | 2024-04-30 | Rolls-Royce High Temperature Composites, Inc. | Retort with loading window |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108728800B (en) | 2019-12-24 |
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