CN108718487B - 一种电路板加工用载具工装 - Google Patents
一种电路板加工用载具工装 Download PDFInfo
- Publication number
- CN108718487B CN108718487B CN201810777093.7A CN201810777093A CN108718487B CN 108718487 B CN108718487 B CN 108718487B CN 201810777093 A CN201810777093 A CN 201810777093A CN 108718487 B CN108718487 B CN 108718487B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- frame
- movable rod
- rotating shaft
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 19
- 235000013162 Cocos nucifera Nutrition 0.000 claims description 3
- 244000060011 Cocos nucifera Species 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000003610 charcoal Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 9
- 230000006378 damage Effects 0.000 description 4
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003546 flue gas Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 210000000056 organ Anatomy 0.000 description 2
- 230000000241 respiratory effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Treating Waste Gases (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810777093.7A CN108718487B (zh) | 2018-07-16 | 2018-07-16 | 一种电路板加工用载具工装 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810777093.7A CN108718487B (zh) | 2018-07-16 | 2018-07-16 | 一种电路板加工用载具工装 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108718487A CN108718487A (zh) | 2018-10-30 |
CN108718487B true CN108718487B (zh) | 2020-11-06 |
Family
ID=63913498
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810777093.7A Active CN108718487B (zh) | 2018-07-16 | 2018-07-16 | 一种电路板加工用载具工装 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108718487B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113696352B (zh) * | 2021-10-27 | 2021-12-28 | 南通金诺精细陶瓷有限公司 | 一种氧化铝陶瓷电路板表面加工装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11104820A (ja) * | 1997-09-30 | 1999-04-20 | Pentel Kk | 半田付け用位置決め治具 |
CN105101666A (zh) * | 2015-08-21 | 2015-11-25 | 苏州斯卡柏通讯技术有限公司 | 一种贴片机夹紧装置 |
CN107081445A (zh) * | 2017-06-29 | 2017-08-22 | 祝秀英 | 一种夹紧效果好的轴承钻孔装置 |
CN108012452A (zh) * | 2017-12-04 | 2018-05-08 | 毛燕婷 | 一种电路板加工装置 |
CN207604103U (zh) * | 2017-12-21 | 2018-07-10 | 杭州迈传科技有限公司 | 一种便于安装的电路板 |
-
2018
- 2018-07-16 CN CN201810777093.7A patent/CN108718487B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11104820A (ja) * | 1997-09-30 | 1999-04-20 | Pentel Kk | 半田付け用位置決め治具 |
CN105101666A (zh) * | 2015-08-21 | 2015-11-25 | 苏州斯卡柏通讯技术有限公司 | 一种贴片机夹紧装置 |
CN107081445A (zh) * | 2017-06-29 | 2017-08-22 | 祝秀英 | 一种夹紧效果好的轴承钻孔装置 |
CN108012452A (zh) * | 2017-12-04 | 2018-05-08 | 毛燕婷 | 一种电路板加工装置 |
CN207604103U (zh) * | 2017-12-21 | 2018-07-10 | 杭州迈传科技有限公司 | 一种便于安装的电路板 |
Also Published As
Publication number | Publication date |
---|---|
CN108718487A (zh) | 2018-10-30 |
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TA01 | Transfer of patent application right |
Effective date of registration: 20201015 Address after: Room 223, 2 / F, building g, Wenzhou enlightenment future industrial park, 77 Jinyang Road, nanbaixiang street, Ouhai District, Wenzhou City, Zhejiang Province Applicant after: Wenzhou Lianrui industrial product design Co.,Ltd. Address before: Room 201, G2 building, Wanchun Xinyuan blue collar apartment, Wuhu Economic and Technological Development Zone, Anhui Province Applicant before: WUHU HUILIN AOYUAN AUTOMATION TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20210415 Address after: 529051 201, 2nd floor, building 5, No.3 Jinyi Road, Pengjiang district, Jiangmen City, Guangdong Province Patentee after: JIANGMEN WEISHI SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Address before: 325006 room 223, 2 / F, building g, Wenzhou enlightenment future industrial park, 77 Jinyang Road, nanbaixiang street, Ouhai District, Wenzhou City, Zhejiang Province Patentee before: Wenzhou Lianrui industrial product design Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211101 Address after: 529100 Room 101, daze Park office building, Xinhui equipment Industrial Park, Xinhui District, Jiangmen City, Guangdong Province Patentee after: Guangdong Weishi wafer Technology Co.,Ltd. Address before: 529051 201, 2nd floor, building 5, No.3 Jinyi Road, Pengjiang district, Jiangmen City, Guangdong Province Patentee before: JIANGMEN WEISHI SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A kind of carrier tooling for circuit board processing Effective date of registration: 20221209 Granted publication date: 20201106 Pledgee: Guangfa Bank Co.,Ltd. Xinhui Sub branch Pledgor: Guangdong Weishi wafer Technology Co.,Ltd. Registration number: Y2022980025958 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20201106 Pledgee: Guangfa Bank Co.,Ltd. Xinhui Sub branch Pledgor: Guangdong Weishi wafer Technology Co.,Ltd. Registration number: Y2022980025958 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |