CN108717251A - Cleaning device and method, toning system and method - Google Patents
Cleaning device and method, toning system and method Download PDFInfo
- Publication number
- CN108717251A CN108717251A CN201810352958.5A CN201810352958A CN108717251A CN 108717251 A CN108717251 A CN 108717251A CN 201810352958 A CN201810352958 A CN 201810352958A CN 108717251 A CN108717251 A CN 108717251A
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- Prior art keywords
- nozzle
- groove body
- cleaning
- cleaning device
- nozzle assembly
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
- G03F7/3057—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the processing units other than the developing unit, e.g. washing units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Technical solution of the present invention discloses a kind of cleaning device and method, toning system and method.The cleaning device includes：Groove body, the nozzle assembly for accommodating developing apparatus, the nozzle assembly include developer solution supply and temperature control cavity and the nozzle for investing the cavity bottom, have cavity placement region and nozzle cleaning region inside the groove body；Lid is set at the top of the groove body；Sensor is opened or closed for incuding the nozzle with controlling the lid；Wind drenches end, is set to the cavity placement region；Liquid feed end and liquid discharge end are respectively arranged on the position that the groove body side wall corresponds to the nozzle cleaning region；And outlet and outlet side, it is set to the groove body bottom.Technical solution of the present invention reduces the developing defect generated in follow-up developing process, improves product yield.
Description
Technical field
The invention belongs to developing technique fields, and in particular to a kind of cleaning device, using the cleaning side of the cleaning device
The developing method of the toning system and the application toning system of method including the cleaning device.
Background technology
Development is the important step in integrated circuit fabrication process, and in the photoetching process of semiconductor, photoresist is by applying
Cloth, baking, exposure, development and etc. after, formed photoengraving pattern.Wherein developing procedure is using developer solution spray infiltration wafer
(Wafer), the technical process for removing the photoresist exposed on wafer is the reuse process for controlling photoengraving pattern forming.
However, the developing apparatus of existing proximity developing nozzle has very although the consumption of developer solution can be reduced
Good critical dimension uniformity (CD uniformity) and other effects, but developing defect (Defect) and process effects are easily generated,
Even if regularly carrying out maintenance washes to developing apparatus, this developing defect can not be eliminated well, thereby results in semiconductor
The yield of product reduces.
Invention content
Technical solution of the present invention technical problems to be solved are that the developing apparatus of existing proximity developing nozzle easily produces
Raw developing defect.
In order to solve the above technical problems, technical solution of the present invention provides a kind of cleaning device, including：Groove body, for accommodating
The nozzle assembly of developing apparatus, the nozzle assembly include developer solution supply and temperature control cavity and the spray for investing the cavity bottom
Mouth, the groove body inside have cavity placement region and nozzle cleaning region；Lid is set at the top of the groove body；Sensor is used
It is opened or closed in incuding the nozzle with controlling the lid；Wind drenches end, is set to the cavity placement region；Liquid feed end
With liquid discharge end, it is respectively arranged on the position that the groove body side wall corresponds to the nozzle cleaning region；And outlet and discharge
End is set to the groove body bottom.
Optionally, the sensor is set to lid or is set to the groove body top edge.
Optionally, the groove body inner wall is equipped with the salient point with the nozzle assembly point contact.
Optionally, including at least two wind drench end, and the position at least two wind leaching end has difference in height.
Optionally, wind leaching end is long vertical bar type, has the spout of long straight shape and/or poroid spout.
Optionally, the groove body inner wall corresponds to the position of the cavity placement region equipped with buckle.
In order to solve the above technical problems, technical solution of the present invention also provides a kind of toning system, including developing apparatus, it is described
Developing apparatus includes developing trough and nozzle assembly；Further include：Above-mentioned cleaning device, the groove body of the cleaning device invest described
The side wall of the side wall of developing trough or the close developing trough.
In order to solve the above technical problems, technical solution of the present invention also provides a kind of cleaning side using above-mentioned cleaning device
Method, including：The nozzle assembly is moved into the cleaning device；The sensor sensing to the nozzle close to when, open institute
Lid and wind leaching end are stated, wind drenches gas so that the groove body internal and external environment is isolated in the groove body；In the nozzle assembly
After being put into the groove body, the lid and wind leaching end are closed；It is passed through cleaning solution from the liquid feed end, using ultrasound
Cleaning way cleans the nozzle；After the completion of cleaning, the lid and wind leaching end are opened, by the nozzle assembly from described
It is removed in groove body, during removal, wind leaching end dries up the nozzle；After the nozzle assembly moves to outside the groove body,
Close the wind leaching end and the lid.
Optionally, the number for cleaning the nozzle is at least twice.
Optionally, the time cleaned every time is within 5s, and the time interval cleaned twice is 0.5s~1.5s.
Optionally, cleaning is front and back from the nozzle ejection portion developer solution every time.
Optionally, the cleaning solution is developer solution or ultra-pure water.
Optionally, the gas is nitrogen.
In order to solve the above technical problems, technical solution of the present invention also provides a kind of development side using above-mentioned toning system
Method, including：The nozzle assembly sprays developer solution to the wafer placed in the developing trough, develops；After development, in use
The cleaning method stated cleans the nozzle；The nozzle assembly is moved to above the developing trough, continue to lower wafer into
Row development.
Compared with prior art, technical solution of the present invention has the advantages that：
After the completion of each development, the nozzle of developing apparatus is cleaned using cleaning device, is reduced and is even avoided due to aobvious
Residue that shadow liquid generates after being reacted with photoresist pollution nozzle and cause developing defect, improve photoengraving pattern uniformity and
Stability.
Cleaning device is set by the developing trough of developing apparatus, first washer jet is shown next time again after development every time
Shadow, reduces the transmission of particle residue object in this way, and then reduces the generation of development graphic defects, good to improve product
Rate.
Cleaning device includes groove body and lid, and using built-in gas wind leaching isolation internal and external environment, using this closed
Structure design, the inner loop of liquid splash and contaminated system board (especially developing apparatus) is generated when can be to avoid cleaning
Border.Also, gas wind leaching drying built in cleaning device, also prevent the nozzle after cleaning has liquid drippage dirty in moving process
Dye system board.
Cleaning device washer jet by the way of being cleaned by ultrasonic can clean more rapid and thoroughly clean.Also,
It is rapid due to cleaning, the time interval washer jet between two wafer development operations can be utilized, therefore do not interfere with entire
The progress of technological process.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of developing apparatus；
Fig. 2 is the structural schematic diagram of the cleaning device of the embodiment of the present invention；
Fig. 3 to Fig. 5 is that the wind of the cavity placement region of the cleaning device of the embodiment of the present invention drenches the example schematic at end；
Fig. 6 is the flow diagram of the cleaning method of the embodiment of the present invention；
Fig. 7 is the flow diagram of the developing method of the embodiment of the present invention.
Specific implementation mode
In the prior art, in the developing apparatus of proximity nozzle, in order to reduce the consumption of developer solution, it is uniform to improve CD
Property effect, using the nozzle (nozzle) for the long spray orifice for being more nearly the surface wafer (Wafer), however in developing process, such as
Shown in Fig. 1, since spray orifice 22 is more nearly 4 surface of wafer, surface tension, developer solution and photoetching are easy tod produce when spraying developer solution
The tiny particle residue object 8 (particle) generated after glue reaction is sailed against the current by surface tension to be attached on nozzle 2, is made
It being polluted at nozzle 2, contaminated nozzle 2 will bring wafer when spraying developer solution to subsequent wafer particle residue object,
So that wafer is contaminated and leads to the graphic defects of development, the development effect of subsequent wafer is influenced, product is greatly reduced
Yield., can not be clean by nozzle cleaning even if regularly doing prevention maintenance using non-dust cloth cleaning way, it eliminates development and lacks
It falls into.
In view of the above-mentioned problems, technical scheme of the present invention provides a kind of cleaning device, development is cleaned after each development
The nozzle of device ensures that the development effect of postorder wafer is unaffected.
Technical solution of the present invention is described in detail with reference to the accompanying drawings and examples.
The toning system of the embodiment of the present invention includes developing apparatus and cleaning device, and the developing apparatus includes at least development
Slot and nozzle assembly, the cleaning device include at least groove body, and the groove body of the cleaning device invests the side wall of the developing trough
Or the side wall close to the developing trough.
Referring to FIG. 1, the developing apparatus of the present embodiment includes：Developing trough 1 and nozzle assembly, the nozzle assembly include aobvious
The supply of shadow liquid and temperature control cavity 20 (hereinafter referred to as cavity) and the nozzle 2 for investing 20 bottom of the cavity.
Nozzle 2 is attached to 20 bottom of cavity, and 20 top of cavity is connected to bubble delivery pipe 201 and developer solution feed end 202,203,
Developer solution is injected by developer solution feed end 202,203 in cavity 20, and the bubble that developer solution generates when injecting is arranged by bubble
The exclusion of pipe 201 is put, the cooling water (not shown) of cycle is also connected with to control the developer temperatur in cavity 20 inside cavity 20.It is aobvious
Shadow liquid 7 equably sprays the wafer 4 placed in developing trough 1 by multiple spray orifices 22 inside nozzle 2, removes and has been exposed on wafer 4
The photoresist of light, is consequently formed photoengraving pattern.
Referring to FIG. 2, the cleaning device of the present embodiment includes：Groove body 30, lid 31, sensor 32, wind leaching end 331,
332, liquid feed end 341, liquid discharge end 342, outlet 351 and outlet side 352.It should be noted that the line in diagram
Item is mainly used for illustrating the position of each section and each region, the thickness of lines and real empty difference primarily to clearly distinguishing each
Part and each region.
Specifically, groove body 30 is used to accommodate the nozzle assembly of developing apparatus, and 30 inside of the groove body has cavity rest area
Domain 301 and nozzle cleaning region 302.Cavity placement region 301 is used to place the developer solution confession of developing apparatus combined with Figure 1 and Figure 2,
It answers and temperature control cavity 20, the nozzle 2 for being attached to 20 bottom of cavity is cleaned in nozzle cleaning region 302.301 He of cavity placement region
The structure size in nozzle cleaning region 302 is designed according to the structure of nozzle assembly, is generally omited than the overall structure of nozzle assembly
It is big.
30 top of groove body is equipped with lid 31, and lid 31 is equipped with sensor 32, for incuding the nozzle 2 with described in control
Lid 31 opens or closes.Sensor 32 can also be set to 30 top edge of groove body or other suitable positions, as long as can incude
To nozzle assembly close to groove body 30.
Cavity placement region 301 in groove body 30 is equipped at least two wind and drenches end 331,332, and wind drenches outside end 331,332
It connects gas and is passed through interface.Wind leaching end effect be make in such a way that gas wind drenches when being put into nozzle assembly slot internal and external environment every
Absolutely, the nozzle after cleaning is dried up in such a way that gas wind drenches when taking out nozzle assembly.Wind drenches the protective gas that end is passed through
It is not susceptible to chemical reaction and nontoxic gas, generally use nitrogen (N2) it is used as protective gas.
In the present embodiment, wind leaching end includes two, is separately positioned on the opposite sides of cavity placement region 301.Into
The position of one step, two wind leaching ends 331,332 has difference in height, as shown in Figure 1, end 332 is drenched in the position at wind leaching end 331 higher than wind
Position, the purpose one being arranged in this way is to be provided with two layers of inside and outside protection completely cut off, second is that after capable of more completely drying up cleaning
Nozzle.
It please refers to Fig.3 to Fig. 5, in the present embodiment, it is long vertical bar type that wind, which drenches end, can have the spout of long straight shape, also may be used
With with poroid spout, when wind drenches, shown in the flow direction arrow as shown of gas.For example, as shown in figure 3, wind drenches end
331,332 spout (narrow long direct-injection mouth) with long straight shape.As shown in figure 4, wind leaching end 331,332 be distributed with respectively it is multiple
Poroid spout (hole), the nozzle exit area of both sides are opposite.As shown in figure 5, wind leaching end 331,332,333,334 is distributed with respectively
Multiple poroid spouts, and the nozzle exit area at opposite wind leaching end interlocks.The shape of spout and distribution are not limited to above-mentioned row
It lifts, for example, it is also possible to which being a wind leaching end has long direct-injection mouth, another wind, which drenches end, had had hole or a wind leaching end both
Be distributed long direct-injection mouth, be divided into cloth hole etc., as long as can realize that the inside and outside protection completely cut off of setting at wind leaching end and drying are clear
The effect of nozzle after washing.
Referring still to Fig. 2, it is clear to be respectively arranged on 30 side wall corresponding nozzle of groove body for liquid feed end 341 and liquid discharge end 342
Wash the position in region 302.In conjunction with Fig. 1, when cavity 20 is put in cavity placement region 301,2, the nozzle of 20 bottom of cavity is invested
In nozzle cleaning region 302, washer jet 2 by the way of ultrasonic cleaning, in cleaning process, cleaning solution is from liquid feed end
341 enter, and are discharged from liquid discharge end 342, outlet 351, to realize the liquid being ceaselessly cyclically updated in rinse bath.Ultrasound
Cleaning has the characteristics that rapid and strong cleaning force.Cleaning solution can use developer solution, the use of developer solution cleaning be in order to avoid spray
Mouth is polluted by other liquid, influences development effect.In addition to developer solution, cleaning solution can also use ultra-pure water (DI water)
Deng.
30 bottom of groove body is additionally provided with multiple outlets 351 (being illustrated as 3) and an outlet side 352, is set to the groove body
Bottom.Gas or liquid, which are first shunted from outlet 351, to be discharged, and then can be kept away in this way outside the unified discharge slot of outlet side 352 again
Exempt from gas air blowing time slot body internal environment to be affected.
Further, in the present embodiment, 30 inner wall of groove body is additionally provided at least one salient point with the nozzle assembly point contact
36, when nozzle assembly is put into groove body 30, by the point contact at nozzle assembly edge and salient point 36, it can preferably position nozzle
Component, alignment cavity 20 make nozzle 2 be located at the suitable position of cleaning area 302 in the position of placement region 301.
In addition, the position of 30 inner wall respective chamber placement region 301 of groove body is also provided at least one buckle 37, spraying
Nozzle assembly is put into groove body 30 and with after 36 point contact of salient point, buckle 37 clasps and fixed cavity 20 so that nozzle 2 is in cleaning
It is more difficult to be influenced by ultrasonic vibration.
Using above-mentioned cleaning device, the cleaning method of the embodiment of the present invention is as shown in fig. 6, include：Step S21, by institute
It states nozzle assembly and moves to the cleaning device；Step S22, the sensor sensing to the nozzle close to when, open the lid
Body and the wind drench end, and wind drenches gas so that the groove body internal and external environment is isolated in the groove body；Step S23, in the nozzle
After component is put into the groove body, the lid and wind leaching end are closed；Step S24 is passed through clearly from the liquid feed end
Washing lotion cleans the nozzle using ultrasonic cleaning mode；Step S25 after the completion of cleaning, opens the lid and wind leaching
End, the nozzle assembly is removed out of described groove body, and during removal, wind leaching end dries up the nozzle；Step S26,
After the nozzle assembly moves to outside the groove body, the wind leaching end and the lid are closed.
Wherein, the cleaning solution can be developer solution or ultra-pure water.The gas can be nitrogen.
Further, in step s 24, the number of the nozzle is cleaned as that at least twice, generally can be twice or thrice.
The time cleaned every time is within 5s, such as 0.5s, 1s, 1.5s, 2s, 2.5s, 3s, 3.5s, 4s, 4.5s, 5s；Clean twice when
Between between be divided into 0.5s~1.5s, such as 0.5s, 1s, 1.5s.In addition, can develop every time from the nozzle ejection portion before and after cleaning
Liquid sprays (pump) some developer solutions with after cleaning from the nozzle before cleaning, can be to avoid cleaning solution pair in cleaning process
Developer solution in nozzle has an impact, and then influences subsequent development effect.
For example, used nozzle assembly can be moved to cleaning using mechanical arm after the completion of development every time
The lid automatic sensing of device, cleaning device is opened, at this time N2Wind leaching makes internal and external environment be isolated, and mechanical arm places the nozzle into again
In groove body, wind leaching is closed.After nozzle assembly is put into groove body, it is cleaned by ultrasonic to nozzle pitch cleaning twice, each 0.5s, interval
1s or so, and clean front and back nozzle and all spray some developer solutions.After the completion of cleaning, mechanical arm takes out nozzle assembly, takes out
During N2Wind leaching, which automatically opens, dries up nozzle.After mechanical arm removes nozzle assembly, then N2Wind leaching is automatically closed, and covers
Body is closed.
Using above-mentioned toning system, the developing method of the embodiment of the present invention as shown in fig. 7, comprises：Step S20, it is described
Nozzle assembly sprays developer solution to the wafer placed in the developing trough, develops；After development, step S21 is executed；Step
The nozzle assembly is moved to the cleaning device by S21；Step S22, the sensor sensing to the nozzle close to when, beat
The lid and wind leaching end are opened, wind drenches gas so that the groove body internal and external environment is isolated in the groove body；Step S23,
After the nozzle assembly is put into the groove body, the lid and wind leaching end are closed；Step S24 is supplied from the liquid
End is passed through cleaning solution, and the nozzle is cleaned using ultrasonic cleaning mode；Step S25 after the completion of cleaning, opens the lid and institute
Wind leaching end is stated, the nozzle assembly is removed out of described groove body, during removal, wind leaching end dries up the nozzle；Step
Rapid S26 closes the wind leaching end and the lid after the nozzle assembly moves to outside the groove body；Step S27, will be described
Nozzle assembly moves to above the developing trough, continues to develop to lower wafer.
Since the particle residue object on nozzle has utilized cleaning device cleaning removal, it will not bring and subsequently be shown
The wafer of shadow thus ensures that product is good to make wafer graphic defects that are contaminated and leading to development in development
Rate.
Although the present invention discloses as above in a preferred embodiment thereof, it is not for limiting the present invention, any ability
Field technique personnel without departing from the spirit and scope of the present invention, may be by the methods and technical content of the disclosure above to this
Inventive technique scheme makes possible variation and modification, therefore, every content without departing from technical solution of the present invention, according to this hair
Bright technical spirit belongs to the technology of the present invention to any simple modifications, equivalents, and modifications made by embodiment of above
The protection domain of scheme.
Claims (14)
1. a kind of cleaning device, which is characterized in that including：
Groove body, the nozzle assembly for accommodating developing apparatus, the nozzle assembly include developer solution supply and temperature control cavity and attached
There is cavity placement region and nozzle cleaning region inside the nozzle of the cavity bottom, the groove body；
Lid is set at the top of the groove body；
Sensor is opened or closed for incuding the nozzle with controlling the lid；
Wind drenches end, is set to the cavity placement region；
Liquid feed end and liquid discharge end are respectively arranged on the position that the groove body side wall corresponds to the nozzle cleaning region；With
And
Outlet and outlet side are set to the groove body bottom.
2. cleaning device as described in claim 1, which is characterized in that the sensor is set to lid or is set to the groove body top
Portion edge.
3. cleaning device as described in claim 1, which is characterized in that the groove body inner wall is equipped with and is connect with the nozzle assembly point
Tactile salient point.
4. cleaning device as described in claim 1, which is characterized in that drench end, at least two wind including at least two wind
The position for drenching end has difference in height.
5. cleaning device as described in claim 1 or 4, which is characterized in that wind leaching end is long vertical bar type, has long straight shape
Spout and/or poroid spout.
6. cleaning device as described in claim 1, which is characterized in that the groove body inner wall corresponds to the cavity placement region
Position is equipped with buckle.
7. a kind of toning system, including developing apparatus, the developing apparatus includes developing trough and nozzle assembly, which is characterized in that
Further include：Claim 1 to 6 any one of them cleaning device, the groove body of the cleaning device invest the side of the developing trough
The side wall of wall or the close developing trough.
8. a kind of cleaning method using claim 1 to 6 any one of them cleaning device, which is characterized in that including：
The nozzle assembly is moved into the cleaning device；
The sensor sensing to the nozzle close to when, open the lid and the wind leaching end, in the groove body wind drench
Gas is to be isolated the groove body internal and external environment；
After the nozzle assembly is put into the groove body, the lid and wind leaching end are closed；
It is passed through cleaning solution from the liquid feed end, the nozzle is cleaned using ultrasonic cleaning mode；
After the completion of cleaning, the lid and wind leaching end are opened, the nozzle assembly is removed out of described groove body, was removed
Cheng Zhong, wind leaching end dry up the nozzle；
After the nozzle assembly moves to outside the groove body, the wind leaching end and the lid are closed.
9. cleaning method as claimed in claim 8, which is characterized in that the number for cleaning the nozzle is at least twice.
10. cleaning method as claimed in claim 9, which is characterized in that the time cleaned every time is to be cleaned twice within 5s
Time interval is 0.5s~1.5s.
11. cleaning method as claimed in claim 8 or 9, which is characterized in that cleaning is front and back from the nozzle ejection portion every time
Developer solution.
12. cleaning method as claimed in claim 8, which is characterized in that the cleaning solution is developer solution or ultra-pure water.
13. cleaning method as claimed in claim 8, which is characterized in that the gas is nitrogen.
14. a kind of developing method using the toning system described in claim 7, which is characterized in that including：
The nozzle assembly sprays developer solution to the wafer placed in the developing trough, develops；
After development, the nozzle is cleaned using claim 8 to 13 any one of them cleaning method；
The nozzle assembly is moved to above the developing trough, continues to develop to lower wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810352958.5A CN108717251A (en) | 2018-04-19 | 2018-04-19 | Cleaning device and method, toning system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810352958.5A CN108717251A (en) | 2018-04-19 | 2018-04-19 | Cleaning device and method, toning system and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108717251A true CN108717251A (en) | 2018-10-30 |
Family
ID=63899248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810352958.5A Pending CN108717251A (en) | 2018-04-19 | 2018-04-19 | Cleaning device and method, toning system and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108717251A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110153097A (en) * | 2019-05-17 | 2019-08-23 | 深圳市华星光电技术有限公司 | Apparatus cleaning method, device and developing apparatus |
| US11919054B2 (en) | 2022-01-17 | 2024-03-05 | Changxin Memory Technologies, Inc. | Cleaning device and method of cleaning nozzle |
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| JPH07232143A (en) * | 1994-02-22 | 1995-09-05 | Toshiba Corp | Ultrasonic washing nozzle |
| JP2000061377A (en) * | 1998-08-24 | 2000-02-29 | Dainippon Screen Mfg Co Ltd | Method and apparatus for treating substrate |
| US6210481B1 (en) * | 1998-05-19 | 2001-04-03 | Tokyo Electron Limited | Apparatus and method of cleaning nozzle and apparatus of processing substrate |
| JP2008186983A (en) * | 2007-01-30 | 2008-08-14 | Shinka Jitsugyo Kk | Developing apparatus, and cleaning method of developing nozzle |
| CN101377626A (en) * | 2007-08-31 | 2009-03-04 | 细美事有限公司 | Method of developing a substrate and apparatus for performing the same |
| US20130315627A1 (en) * | 2012-05-22 | 2013-11-28 | Minoru Sugiyama | Development processing device |
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2018
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07232143A (en) * | 1994-02-22 | 1995-09-05 | Toshiba Corp | Ultrasonic washing nozzle |
| US6210481B1 (en) * | 1998-05-19 | 2001-04-03 | Tokyo Electron Limited | Apparatus and method of cleaning nozzle and apparatus of processing substrate |
| JP2000061377A (en) * | 1998-08-24 | 2000-02-29 | Dainippon Screen Mfg Co Ltd | Method and apparatus for treating substrate |
| JP2008186983A (en) * | 2007-01-30 | 2008-08-14 | Shinka Jitsugyo Kk | Developing apparatus, and cleaning method of developing nozzle |
| CN101377626A (en) * | 2007-08-31 | 2009-03-04 | 细美事有限公司 | Method of developing a substrate and apparatus for performing the same |
| US20130315627A1 (en) * | 2012-05-22 | 2013-11-28 | Minoru Sugiyama | Development processing device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110153097A (en) * | 2019-05-17 | 2019-08-23 | 深圳市华星光电技术有限公司 | Apparatus cleaning method, device and developing apparatus |
| US11919054B2 (en) | 2022-01-17 | 2024-03-05 | Changxin Memory Technologies, Inc. | Cleaning device and method of cleaning nozzle |
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Application publication date: 20181030 |