CN108705168A - A kind of power amplifier protection of pipe structure and its forming method preventing ring flange installation deformation - Google Patents
A kind of power amplifier protection of pipe structure and its forming method preventing ring flange installation deformation Download PDFInfo
- Publication number
- CN108705168A CN108705168A CN201810627810.8A CN201810627810A CN108705168A CN 108705168 A CN108705168 A CN 108705168A CN 201810627810 A CN201810627810 A CN 201810627810A CN 108705168 A CN108705168 A CN 108705168A
- Authority
- CN
- China
- Prior art keywords
- support plate
- flange
- ring flange
- power tube
- power amplifier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000009434 installation Methods 0.000 title claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 14
- 238000003466 welding Methods 0.000 claims abstract description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000006071 cream Substances 0.000 claims abstract description 7
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 238000007747 plating Methods 0.000 claims abstract description 7
- 238000005476 soldering Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 8
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910020658 PbSn Inorganic materials 0.000 description 1
- 101150071746 Pbsn gene Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810627810.8A CN108705168B (en) | 2018-06-19 | 2018-06-19 | Power amplifier tube protection structure for preventing flange plate from being deformed during installation and forming method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810627810.8A CN108705168B (en) | 2018-06-19 | 2018-06-19 | Power amplifier tube protection structure for preventing flange plate from being deformed during installation and forming method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108705168A true CN108705168A (en) | 2018-10-26 |
CN108705168B CN108705168B (en) | 2021-11-23 |
Family
ID=63872855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810627810.8A Active CN108705168B (en) | 2018-06-19 | 2018-06-19 | Power amplifier tube protection structure for preventing flange plate from being deformed during installation and forming method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108705168B (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004006813A (en) * | 2002-04-16 | 2004-01-08 | Anelva Corp | Electrostatic chuck susceptor and substrate processor |
CN101147994A (en) * | 2007-11-02 | 2008-03-26 | 长春市北方电子有限责任公司 | Method for preparing copper film thicken copper-coating ceramic substrate |
CN201114015Y (en) * | 2007-08-14 | 2008-09-10 | 中兴通讯股份有限公司 | Power amplifier tube installation apparatus and its mounting system |
EP2141740A2 (en) * | 2008-07-04 | 2010-01-06 | Kabushiki Kaisha Toyoda Jidoshokki | Semiconductor device |
CN202455656U (en) * | 2011-12-13 | 2012-09-26 | 京信通信系统(中国)有限公司 | Metal baseplate assembled with PCB and PCB component |
CN205406512U (en) * | 2016-03-04 | 2016-07-27 | 滕雳 | A integrated circuit board that is used for direct subsides to adorn high -power chip |
-
2018
- 2018-06-19 CN CN201810627810.8A patent/CN108705168B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004006813A (en) * | 2002-04-16 | 2004-01-08 | Anelva Corp | Electrostatic chuck susceptor and substrate processor |
CN201114015Y (en) * | 2007-08-14 | 2008-09-10 | 中兴通讯股份有限公司 | Power amplifier tube installation apparatus and its mounting system |
CN101147994A (en) * | 2007-11-02 | 2008-03-26 | 长春市北方电子有限责任公司 | Method for preparing copper film thicken copper-coating ceramic substrate |
EP2141740A2 (en) * | 2008-07-04 | 2010-01-06 | Kabushiki Kaisha Toyoda Jidoshokki | Semiconductor device |
CN202455656U (en) * | 2011-12-13 | 2012-09-26 | 京信通信系统(中国)有限公司 | Metal baseplate assembled with PCB and PCB component |
CN205406512U (en) * | 2016-03-04 | 2016-07-27 | 滕雳 | A integrated circuit board that is used for direct subsides to adorn high -power chip |
Non-Patent Citations (2)
Title |
---|
牛文生: "《机载计算机技术》", 31 January 2013 * |
许安等: "《工程机械维修》", 31 August 2004 * |
Also Published As
Publication number | Publication date |
---|---|
CN108705168B (en) | 2021-11-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A power amplifier tube protection structure and its forming method for preventing flange plate from being installed and deformed Effective date of registration: 20220808 Granted publication date: 20211123 Pledgee: Chengdu Rural Commercial Bank Co.,Ltd. high tech sub branch Pledgor: CHENGDU DFINE TECHNOLOGY Co.,Ltd. Registration number: Y2022510000231 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230830 Granted publication date: 20211123 Pledgee: Chengdu Rural Commercial Bank Co.,Ltd. high tech sub branch Pledgor: CHENGDU DFINE TECHNOLOGY Co.,Ltd. Registration number: Y2022510000231 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A protective structure and forming method for power amplifier tubes to prevent flange plate installation deformation Effective date of registration: 20231027 Granted publication date: 20211123 Pledgee: Chengdu Rural Commercial Bank Co.,Ltd. high tech sub branch Pledgor: CHENGDU DFINE TECHNOLOGY Co.,Ltd. Registration number: Y2023510000237 |