CN108705168B - Power amplifier tube protection structure for preventing flange plate from being deformed during installation and forming method thereof - Google Patents
Power amplifier tube protection structure for preventing flange plate from being deformed during installation and forming method thereof Download PDFInfo
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- CN108705168B CN108705168B CN201810627810.8A CN201810627810A CN108705168B CN 108705168 B CN108705168 B CN 108705168B CN 201810627810 A CN201810627810 A CN 201810627810A CN 108705168 B CN108705168 B CN 108705168B
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- flange
- power amplifier
- plate
- amplifier tube
- carrier plate
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- 238000009434 installation Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000010949 copper Substances 0.000 claims abstract description 20
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 14
- 229910000679 solder Inorganic materials 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 11
- 230000001680 brushing effect Effects 0.000 claims abstract description 5
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims abstract description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 238000005336 cracking Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 238000000465 moulding Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000003321 amplification Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910020658 PbSn Inorganic materials 0.000 description 1
- 101150071746 Pbsn gene Proteins 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Amplifiers (AREA)
- Microwave Amplifiers (AREA)
Abstract
The invention discloses a power amplifier tube protection structure for preventing flange plate mounting deformation and a forming method thereof, wherein the power amplifier tube protection structure comprises a flange support plate (1) and a power amplifier tube with a flange plate (2), and the lower surface of the flange plate (2) is fixedly welded with the upper surface of the flange support plate (1); the molding method comprises the following steps: processing a copper carrier plate with the thickness of 4 mm; plating a nickel-gold Cu/Ep.Ni5Au0.5 on the copper carrier plate to form a flange carrier plate (1); brushing a layer of low-temperature solder paste with the thickness of 0.12-0.15 mm on the upper surface of the flange carrier plate (1); placing a flange plate (2) of the power amplifier tube on the upper surface of a flange carrier plate (1) and aligning the flange plate with the flange plate up and down; placing a flange support plate (1) on a heating table; s6, controlling the temperature of the heating table to be 170 ℃, and heating and welding the flange plate (2) and the flange carrier plate (1); the invention can effectively prevent the flange plate of the power amplifier tube from being installed and deformed, thereby effectively avoiding the power amplifier tube from being damaged and bringing great convenience to the installation and use of the power amplifier tube.
Description
Technical Field
The invention relates to a power amplifier tube, in particular to a power amplifier tube protection structure for preventing flange plate from being deformed during installation and a forming method thereof.
Background
At present, various power amplifier tubes are used on power amplifier products, and the power amplifier tubes are mainly installed by screws and welded by soldering tin in an installation mode; the specific installation mode of selecting is mainly decided according to factors such as the characteristic or the structure implementation mode of a product, if the screw installation mode is adopted, the flange plate is likely to deform under the influence of environmental factors such as vibration, high and low temperature and the like after the power amplifier tube is installed, so that the power amplifier tube is damaged, and a great deal of inconvenience is brought to the installation and the use of the power amplifier tube.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a power amplifier tube protection structure for preventing flange plate installation deformation and a forming method thereof, which can effectively prevent the flange plate of the power amplifier tube from being installed and deformed, further effectively avoid the damage of the power amplifier tube and bring great convenience to the installation and use of the power amplifier tube.
The purpose of the invention is realized by the following technical scheme: the utility model provides a prevent power amplifier tube protection architecture of ring flange installation deformation, includes flange support plate and the power amplifier tube that has the ring flange, the lower surface of ring flange and the upper surface welded fastening of flange support plate form the power amplifier tube of flanged support plate.
Preferably, the thickness of the flange carrier plate is 4mm, and the length and width dimensions of the flange carrier plate and the flange plate are the same; the flange support plate is a copper support plate with the upper surface provided with nickel-plated Au Cu/Ep.Ni5Au0.5.
Preferably, the power amplifier tube is an EGNC210MK power amplifier tube.
The forming method of the power amplifier tube protection structure for preventing the flange plate from being deformed during installation comprises the following steps:
s1, processing a copper carrier plate with the thickness of 4mm and the length and width equal to those of the flange plate by using a copper plate;
s2, plating a nickel-gold Cu/Ep.Ni5Au0.5 on the copper carrier plate to form a flange carrier plate;
s3, brushing a layer of low-temperature solder paste with the thickness of 0.12-0.15 mm on the upper surface of the flange carrier plate;
s4, placing a flange plate of the power amplifier tube on the upper surface of the flange carrier plate;
s5, after the flange plate and the flange support plate are vertically aligned, placing the flange support plate on a heating table;
s6, controlling the temperature of the heating table to be 170 ℃, and heating and welding the flange plate and the flange support plate to form a power amplifier tube with the flange support plate;
and S7, after the heating welding is finished, taking out the power amplifier tube with the flange carrier plate, naturally cooling, and finishing the processing and forming.
Preferably, the low-temperature solder paste is SnBiAg low-temperature solder paste.
The invention has the beneficial effects that: can effectively prevent that the ring flange installation of power amplifier tube from warping, and then effectively avoid the power amplifier tube to damage, bring very big facility for the installation of power amplifier tube is used.
Drawings
FIG. 1 is a schematic diagram of the structure of an EGNC210MK power amplifier tube;
FIG. 2 is a schematic diagram of the protection structure of the power amplifier tube according to the present invention;
FIG. 3 is a flow chart of a method of the present invention;
in the figure, 1-flange carrier plate, 2-flange plate, 3-tube core base, 4-tube shell and 5-groove.
Detailed Description
The technical solutions of the present invention are further described in detail below with reference to the accompanying drawings, but the scope of the present invention is not limited to the following.
Taking the EGNC210MK power amplifier tube as an example, the reason that the flange plate deforms and damages the power amplifier tube when the power amplifier tube is fixed by a screw is specifically described, and the specific principle that the flange plate is prevented from deforming after the structure and the method of the application are adopted;
as shown in fig. 1, which is a schematic structural diagram of an EGNC210MK power amplifier tube, the power amplifier tube includes a die base 3, a case 4 and a flange 2, the bottom of the die base 3 is fixed on the upper surface of the flange 2, a groove 5 with an upward opening is provided in the die base 3, the groove 5 is used for mounting a power amplifier chip, the case 4 is bonded on the top of the die base 3 by resin, and the groove 5 is sealed, and the flange 2 is provided with a threaded hole (matched with a M2.5 × 6 screw); the upper surface of the flange plate 2 is also provided with a boss, the lower surface of the tube core base 3 is provided with a pit, the flange plate 2 and the tube core base 3 are fixed together in a welding or resin bonding mode after the flange plate 2 and the tube core base 3 are assembled by matching the boss with the pit;
in the process of installing the power amplifier tube, an M2.5 multiplied by 6 stainless steel screw is adopted to install the power amplifier tube in the aluminum cavity; however, after subsequent high and low temperature tests, a plurality of power amplification tube failures are found, and when the failures are taken down and analyzed, cracks appear on all the power amplification tube shells 4 of the failures, and the flange 2 of the power amplification tube is bent;
further analysis shows that the flange 2 of the EGNC210MK power amplifier tube is made of Kovar metal materials in three layers in an overlapping mode, and the total thickness is only 1.78 mm; the power amplifier tube is subjected to the action of temperature stress at high and low temperatures, and because the thermal expansion coefficients of the Kovar metal material flange 2 and the aluminum cavity which are superposed at three layers are different, the flange is very thin and only has 1.78mm, the flange can deform and release stress when the flange can not bear the stress, and the flange 2 is firmly fixed on the aluminum cavity by screws, so that the power amplifier tube shell 4 is cracked after the power amplifier tube flange is completely arranged, and the power amplifier tube is damaged.
In view of the above situation, the present invention provides a power amplifier tube protection structure for preventing flange plate mounting deformation, as shown in fig. 2, the structure includes a flange carrier plate 1 and a power amplifier tube with a flange plate 2, and a lower surface of the flange plate 2 is welded and fixed to an upper surface of the flange carrier plate 1 to form the power amplifier tube with the flange carrier plate 1.
In the embodiment of the present application, the thickness of the flange carrier plate 1 is 4 mm; the length and width dimensions of the flange carrier plate 1 and the flange plate 2 are the same; the flange carrier plate 1 is a copper carrier plate with the upper surface provided with nickel-plated gold Cu/Ep.Ni5Au0.5.
As shown in fig. 3, the method for forming a power amplifier tube protection structure for preventing flange mounting deformation includes the following steps:
s1, processing a copper carrier plate with the thickness of 4mm and the length and width equal to those of the flange plate 2 by using a copper plate;
s2, plating a nickel-gold Cu/Ep.Ni5Au0.5 on the copper carrier plate to form a flange carrier plate 1;
s3, brushing a layer of low-temperature solder paste (SnBiAg low-temperature solder paste) with the thickness of 0.12-0.15 mm on the upper surface of the flange carrier plate 1;
s4, placing a flange plate 2 of the power amplifier tube on the upper surface of a flange carrier plate 1;
s5, after the flange plate 2 and the flange support plate 1 are vertically aligned, placing the flange support plate 1 on a heating table;
s6, controlling the temperature of the heating table to be 170 ℃, and heating and welding the flange plate 2 and the flange support plate 1 to form a power amplifier tube with the flange support plate 1;
and S7, after the heating welding is finished, taking out the power amplifier tube of the carrier plate 1 with the flange, naturally cooling, and finishing the processing and forming.
In the embodiment of the present application, since the package 4 and the die pad 3 of the power amplifier tube are generally bonded together by using resin (e.g., EGNC210MK power amplifier tube), the resin may soften after the temperature exceeds 200 ℃, and the package 4 may be displaced and affect the sealing performance between the package 4 and the pad 3. Therefore, when the flange plate and the flange carrier plate of the power amplifier tube are sintered, the temperature cannot exceed 200 ℃. Therefore, the traditional PbSn soldering paste (the melting point is 183 ℃, and good welding spots can be formed only when the general temperature reaches 220 ℃ during welding) cannot be selected during sintering, and the SnBiAg alloy low-temperature soldering paste is selected, and the melting point of the alloy low-temperature soldering paste is 143 ℃. Brushing a layer of low-temperature solder paste with the thickness of 0.12-0.15 mm on a flange support plate during sintering, placing a power amplifier tube on the flange support plate 4, aligning, and then placing on a heating table with the temperature set to 170 ℃ for heating and sintering; in the embodiment, since the power amplifier tube of the carrier plate 1 with the flange is required to be installed on the product cavity, a plurality of threaded holes are required to be formed in the carrier plate 1 with the flange, which facilitates the assembly between the power amplifier tube of the carrier plate 1 with the flange and the product cavity. The flange plate 1 with the thickness of 4mm is arranged below the flange plate 2, so that the stress under high and low temperatures can be completely resisted, the cracking of the shell of the power amplifier tube and the damage to the power amplifier tube caused by the deformation of the flange can be effectively avoided, and in conclusion, the flange plate of the power amplifier tube can be effectively prevented from being installed and deformed, so that the damage to the power amplifier tube is effectively avoided, and great convenience is brought to the installation and use of the power amplifier tube.
Finally, it is to be understood that the foregoing is only a preferred embodiment of the invention and that the invention is not to be limited to the specific forms disclosed herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (5)
1. The utility model provides a prevent power amplifier tube protection architecture of ring flange installation deformation which characterized in that: the power amplifier comprises a flange carrier plate (1) and a power amplifier tube with a flange plate (2), wherein the lower surface of the flange plate (2) is fixedly welded with the upper surface of the flange carrier plate (1) to form the power amplifier tube with the flange carrier plate (1); the lower surface of the flange plate (2) and the upper surface of the flange carrier plate (1) are heated through low-temperature solder paste to realize welding fixation, and the heating temperature is 170 ℃;
the flange support plate (1) resists stress at high and low temperatures, and the flange plate (2) is prevented from deforming to cause cracking of the power amplifier tube shell;
the thickness of the flange carrier plate (1) is 4 mm; the flange carrier plate (1) is a copper carrier plate with the upper surface provided with a nickel-plated gold Cu/Ep.Ni5Au0.5.
2. The structure of claim 1, wherein the power amplifier tube is configured to prevent deformation of the flange when mounted, and further comprises: the length and width sizes of the flange carrier plate (1) and the flange plate (2) are the same.
3. The structure of claim 1, wherein the power amplifier tube is configured to prevent deformation of the flange when mounted, and further comprises: the power amplifier tube is an EGNC210MK power amplifier tube.
4. The method for forming a power amplifier tube protection structure for preventing flange mounting deformation as claimed in any one of claims 1 to 3, wherein: the method comprises the following steps:
s1, processing a copper carrier plate with the thickness of 4mm and the length and width equal to those of the flange plate (2) by using a copper plate;
s2, plating a nickel-gold Cu/Ep.Ni5Au0.5 on the copper carrier plate to form a flange carrier plate (1);
s3, brushing a layer of low-temperature solder paste with the thickness of 0.12-0.15 mm on the upper surface of the flange carrier plate (1);
s4, placing a flange plate (2) of the power amplifier tube on the upper surface of the flange carrier plate (1);
s5, after the flange plate (2) and the flange carrier plate (1) are vertically aligned, placing the flange carrier plate (1) on a heating table;
s6, controlling the temperature of the heating table to be 170 ℃, and heating and welding the flange plate (2) and the flange support plate (1) to form a power amplifier tube with the flange support plate (1);
and S7, after the heating welding is finished, taking out the power amplifier tube with the flange carrier plate (1), naturally cooling, and finishing the processing and forming.
5. The method for forming a power amplifier tube protection structure for preventing flange mounting deformation as claimed in claim 4, wherein: the low-temperature solder paste is SnBiAg low-temperature solder paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810627810.8A CN108705168B (en) | 2018-06-19 | 2018-06-19 | Power amplifier tube protection structure for preventing flange plate from being deformed during installation and forming method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810627810.8A CN108705168B (en) | 2018-06-19 | 2018-06-19 | Power amplifier tube protection structure for preventing flange plate from being deformed during installation and forming method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108705168A CN108705168A (en) | 2018-10-26 |
| CN108705168B true CN108705168B (en) | 2021-11-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810627810.8A Active CN108705168B (en) | 2018-06-19 | 2018-06-19 | Power amplifier tube protection structure for preventing flange plate from being deformed during installation and forming method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4355159B2 (en) * | 2002-04-16 | 2009-10-28 | キヤノンアネルバ株式会社 | Electrostatic chuck holder and substrate processing apparatus |
| CN201114015Y (en) * | 2007-08-14 | 2008-09-10 | 中兴通讯股份有限公司 | Power amplifier tube installation apparatus and its mounting system |
| CN100483763C (en) * | 2007-11-02 | 2009-04-29 | 长春市北方电子有限责任公司 | Method for preparing copper film thicken copper-coating ceramic substrate |
| US8472193B2 (en) * | 2008-07-04 | 2013-06-25 | Kabushiki Kaisha Toyota Jidoshokki | Semiconductor device |
| CN202455656U (en) * | 2011-12-13 | 2012-09-26 | 京信通信系统（中国）有限公司 | Metal baseplate assembled with PCB and PCB component |
| CN205406512U (en) * | 2016-03-04 | 2016-07-27 | 滕雳 | A integrated circuit board that is used for direct subsides to adorn high -power chip |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A power amplifier tube protection structure and its forming method for preventing flange plate from being installed and deformed Effective date of registration: 20220808 Granted publication date: 20211123 Pledgee: Chengdu Rural Commercial Bank Co.,Ltd. high tech sub branch Pledgor: CHENGDU DFINE TECHNOLOGY Co.,Ltd. Registration number: Y2022510000231 |
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Date of cancellation: 20230830 Granted publication date: 20211123 Pledgee: Chengdu Rural Commercial Bank Co.,Ltd. high tech sub branch Pledgor: CHENGDU DFINE TECHNOLOGY Co.,Ltd. Registration number: Y2022510000231 |
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Denomination of invention: A protective structure and forming method for power amplifier tubes to prevent flange plate installation deformation Effective date of registration: 20231027 Granted publication date: 20211123 Pledgee: Chengdu Rural Commercial Bank Co.,Ltd. high tech sub branch Pledgor: CHENGDU DFINE TECHNOLOGY Co.,Ltd. Registration number: Y2023510000237 |
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