CN108696984B - Substrate comprising a first metal layer region having a corner - Google Patents
Substrate comprising a first metal layer region having a corner Download PDFInfo
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- CN108696984B CN108696984B CN201810282616.0A CN201810282616A CN108696984B CN 108696984 B CN108696984 B CN 108696984B CN 201810282616 A CN201810282616 A CN 201810282616A CN 108696984 B CN108696984 B CN 108696984B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
Abstract
The invention relates to a substrate comprising a first metal layer area having a corner, said substrate comprising a ceramic plate (2), the substrate comprising a first metal layer area (5), which first metal layer area (5) has corner portions (6), which first metal layer area is arranged on a first main surface (2a) of the ceramic plate (2), wherein the first metal-layer region (5) has a first corner (6), which first corner (6) connects a straight first-layer-region edge portion (5a) of the first metal-layer region (5) to a straight second-layer-region edge portion (5b) of the first metal-layer region (5), which second-layer-region edge portion extends perpendicularly to the first-layer-region edge portion (5a) of the first metal-layer region (5), wherein the first corner (6) of the first metal layer region (5) has a corner radius (R) of 50 μm to 180 μm. The present invention provides a reliable substrate that is resistant to temperature changes.
Description
Technical Field
The invention relates to a substrate comprising a ceramic plate and comprising a first metal layer area having corners, the first metal layer area being arranged on a first main surface of the ceramic plate.
Background
In the case of power semiconductor modules known from the prior art, power semiconductor components, such as power semiconductor switches and diodes, are usually arranged on a substrate and are connected to one another in an electrically conductive manner by means of conductor layers, bonding wires and/or film compounds of the substrate. In this case, the power semiconductor switches are usually present in the form of transistors, such as, for example, IGBTs (insulated gate bipolar transistors) or MOSFETs (metal oxide semiconductor field effect transistors), or in the form of thyristors.
The substrate usually has a structured, electrically conductive metal layer which is arranged on the first main surface of the ceramic plate, said metal layer forming metal layer areas which, due to their structure, are arranged at a distance from one another. To manufacture the substrate, a metal sheet of uniform thickness is usually attached to the ceramic body, and then the metal layer regions are formed from the metal sheet. In this case, the metal sheet may comprise a plurality of different metal layers and/or be provided with at least one additional metal coating after being connected to the ceramic body. Such substrates are also conventionally referred to in the art as DCB (direct copper bonding) substrates or AMB (active metal brazing) substrates. In the simplest case, it is also possible that only a single area of the metal layer is to be arranged on the first main surface of the ceramic plate.
In the case of such ceramic plate-based substrates, the following problems arise: due to the different thermal expansion coefficients of the ceramic plate and the corresponding metal layer regions, mechanical stresses occur in the event of temperature changes, which can lead to stress cracks in the ceramic plate. In particular, the regions of the ceramic plate which are arranged in the immediate vicinity of the corners of the respective metal layer region are critical for such stress cracks.
In order to reduce mechanical stresses caused by temperature changes and to avoid stress cracks in the ceramic, it is known from JP2015225948A to arrange holes in the edge region of the respective metal layer region around the entire edge of the respective metal layer region. The corners of the respective metal layer regions have corner radii.
EP 1061783B 1 discloses providing an edge region of a metal layer region disposed on a multi-ply substrate (multi substrate) with an edge weakening for the purpose of avoiding undesired flaking that may occur during directional interruptions of the multi-ply substrate for the purpose of producing multiple substrates from the multi-ply substrate.
Disclosure of Invention
It is an object of the present invention to provide a reliable substrate that is resistant to temperature variations.
This object is achieved by means of a substrate comprising a ceramic plate, which substrate comprises a first metal layer area having a corner, which first metal layer area is arranged on a first main surface of the ceramic plate, wherein the first metal layer area has a first corner, which connects a straight first metal layer area edge portion of the first metal layer area to a straight second metal layer area edge portion of the first metal layer area, which second metal layer area edge portion extends perpendicularly to the first metal layer area edge portion of the first metal layer area, wherein the first corner of the first metal layer area has a corner radius of 50 μm to 180 μm.
Advantageous embodiments of the invention will be apparent from the following.
It has proven to be advantageous if all corners of the first metal layer region have a corner radius of 50 μm to 180 μm, since the substrate is thus particularly resistant to temperature changes.
Furthermore, if the first edge region of the first metal layer region has a first edge weakening, which extends around a first corner of the first metal layer region, wherein the first edge region of the first metal layer region proceeds from an edge of the first metal layer region, the first edge region of the first metal layer region having a width corresponding to 4 times the thickness of the first metal layer region, wherein the first edge weakening has a first length, which is 1 to 27 times the thickness of the first metal layer region, which extends along a first metal layer edge portion of the first metal layer region, and a second length, which is 1 to 27 times the thickness of the first metal layer region, which extends along a second metal layer edge portion, wherein the first edge region of the first metal layer region has a width corresponding to the first edge weakening, along the first metal layer edge portion and the second metal layer edge portion The same respective length of the portions, wherein the first edge weakening is designed such that the first edge weakening in the first edge region of the first metal layer region reduces the volume of the material of the first edge region of the first metal layer region by 10% to 90%, proves advantageous. As a result, the mechanical stresses, which are subject to temperature changes, which may lead to stress cracks in the ceramic plate, may be further reduced.
Furthermore, it has proven to be advantageous if the substrate has a second metal layer area which has a corner and which is arranged on the first main surface of the ceramic plate and at a distance from the first metal layer area, wherein the second metal layer area has a first corner which connects a straight first metal layer area edge portion of the second metal layer area to a straight second metal layer area edge portion of the second metal layer area which extends perpendicularly to the first metal layer area edge portion, wherein the first corner of the second metal layer area has a corner radius of 50 μm to 180 μm. As a result, the mechanical stress that is subjected to temperature changes can be further reduced.
It has furthermore proved advantageous if all corners of the second metal layer region have a corner radius of 50 μm to 180 μm, since the substrate is thus particularly resistant to temperature changes.
Furthermore, if a first edge region of the second metal layer region has a second edge weakening, which first edge region extends around a first corner of the second metal layer region, wherein the first edge region of the second metal layer region proceeds from an edge of the second metal layer region, the first edge region of the second metal layer region having a width corresponding to 4 times the thickness of the second metal layer region, wherein the second edge weakening has a third length which is 1 to 27 times the thickness of the second metal layer region, which third length extends along the first metal layer region edge portion of the second metal layer region, and a fourth length which is 1 to 27 times the thickness of the second metal layer region, which fourth length extends along the second metal layer region edge portion of the second metal layer region, wherein the first edge region of the second metal layer region extends along the first metal layer region edge portion of the second metal layer region and the second metal layer region edge portion of the second metal layer region It has proven to be advantageous if the layer-region edge section has the same respective length as the second edge weakening, wherein the second edge weakening is designed such that the second edge weakening in the first edge region of the second metal layer region reduces the volume of the material of the first edge region of the second metal layer region by 10% to 90%. As a result, the mechanical stress that is subjected to temperature changes can be further reduced.
It has furthermore proved advantageous if an edge portion of the second metal-layer region of the first metal-layer region and an edge portion of the second metal-layer region extend parallel to one another and the edge portion of the first metal-layer region and the edge portion of the first metal-layer region of the second metal-layer region extend on a common first line.
Furthermore, if the substrate has a third metal layer area having a corner, which third metal layer area is arranged on the first main surface of the ceramic plate and at a distance from the first metal layer area and the second metal layer area, wherein the third metal layer area has a straight first metal layer area edge portion which extends parallel to the first metal layer area edge portion of the first metal layer area and parallel to the first metal layer area edge portion of the second metal layer area, wherein there is the same first distance between the second metal layer area edge portion of the second metal layer area and the second metal layer area edge portion of the first metal layer area and between the first metal layer area edge portion of the second metal layer area and the first metal layer area edge portion of the third metal layer area, wherein a second line having a common point with an edge portion of the second metal layer region of the first metal layer region intersects the edge portion of the first metal layer region of the third metal layer region at a first intersection point, wherein a third line having a common point with an edge portion of the second metal layer region intersects the edge portion of the first metal layer region of the third metal layer region at a second intersection point, wherein the first edge region of the third metal layer region has a third edge weakening which extends along the first metal layer edge portion of the third metal layer region, wherein the first edge region of the third metal layer region proceeds from the edge of the third metal layer region, the first edge region of the third metal layer region has a width corresponding to 4 times the thickness of the third metal layer region, wherein the third edge weakening has a fifth length, a fifth length which is 2 to 15 times the first distance and which extends along the first metal-layer-region edge portion of the third metal-layer region, wherein the first intersection point and the second intersection point are arranged in the first edge region of the third metal-layer region, wherein the first edge region of the third metal-layer region has the same length as the third edge weakening along the first metal-layer-region edge portion of the third metal-layer region, wherein the third edge weakening is designed such that the third edge weakening in the first edge region of the third metal-layer region reduces the volume of the material of the first edge region of the third metal-layer region by 10 to 90%. As a result, the mechanical stress that is subjected to temperature changes can be further reduced.
In this context, it has proved advantageous if a fourth line extends parallel to the second metal-layer area edge portion of the first metal-layer area, said fourth line being situated at half the first distance from the second metal-layer area edge portion of the first metal-layer area, said fourth line intersecting the first metal-layer area edge portion of the third metal-layer area at a third intersection point, wherein the third edge weakening is arranged such that two portions of the third edge weakening which are arranged on both sides of the third intersection point and which extend along the first metal-layer area edge portion of the third metal-layer area have the same length. As a result, mechanical stresses which are subject to temperature changes can be reduced particularly well.
Furthermore, it has proven to be advantageous if the respective edge weakening is designed in the form of at least one hole which is arranged in the first edge region of the respective metal layer region, since the hole can be introduced into the respective metal layer region in a simple manner.
In this context, it has proven to be advantageous if the at least one bore has a circular cross section, since bores having a circular cross section can be produced particularly simply.
Furthermore, it has proven to be advantageous if the center point of the hole is arranged at least approximately on a fifth line which is at an angle of 45 ° with respect to the first metal-layer-region edge portion and the second metal-layer-region edge portion of the first metal-layer region and which extends through the corner-radius starting point of the corner radius of the first corner of the first metal-layer region, since this enables particularly good reduction of mechanical stresses which are subject to temperature changes.
Furthermore, if the respective edge weakening is designed such that the respective edge region has the area: this region has an inclined or stepped course proceeding from the edge of the respective metal layer region, which proves to be advantageous since mechanical stresses which are subject to temperature changes can be reduced particularly well.
Furthermore, if the substrate has a further metal layer area having corners, the further metal layer area being arranged on a second main surface of the ceramic plate, wherein the second main surface of the ceramic plate is arranged opposite to the first main surface of the ceramic plate; wherein the further metal layer region has a first corner which connects a straight first metal layer region edge portion of the further metal layer region to a straight second metal layer region edge portion of the further metal layer region, which extends perpendicularly to the further metal layer region edge portion, wherein the first corner of the further metal layer region has a corner radius of 50 μm to 180 μm, then this proves advantageous. As a result, the mechanical stress that is subjected to temperature changes can be further reduced.
Furthermore, it has proven to be advantageous if all corners of the further metal layer region have a corner radius of 50 μm to 180 μm, since the substrate is thus particularly resistant to temperature changes.
It has furthermore proved advantageous if the further metal layer region has a further edge weakening. As a result, the mechanical stress that is subjected to temperature changes can be further reduced.
Drawings
Exemplary embodiments of the invention are described below with reference to the following drawings, in which:
fig. 1 shows a plan view of a first main side of a substrate according to the invention;
FIG. 2 shows a detailed view of the area of FIG. 1;
FIG. 3 shows a cross-sectional view of the area shown in FIG. 2;
fig. 4 shows a plan view of a second main side of the substrate according to the invention, said second main side being arranged opposite to the first main side of the substrate according to the invention;
FIG. 5 illustrates a cross-sectional view of an alternative embodiment of the area shown in FIG. 2; and is
Fig. 6 shows a cross-sectional view of a further alternative embodiment of the region shown in fig. 2.
Detailed Description
Fig. 1 shows a plan view of a first main side of a substrate 1 according to the invention, fig. 2 shows a detailed view of the region F of fig. 1, and fig. 3 shows a sectional view through a section G of the region F shown in fig. 2. Fig. 4 shows a plan view of a second main side of the substrate 1 according to the invention, which is arranged opposite to the first main side of the substrate 1 according to the invention. In the drawings, like elements are provided with like reference numerals. Furthermore, it should be noted that in fig. 1, 2 and 4, the corners of the metal layer regions 5, 9, 10 and 18 are shown with corner radii R that are greatly enlarged in relation to the size of the rest of the shown element in order to better visualize the rounding strokes of the corners of the metal layer regions 5, 9, 10 and 18. Furthermore, in particular in fig. 3, 5 and 6, the thicknesses of metal layer region 5, metal layer region 9, metal layer region 10 and metal layer region 18 are shown in a manner not true to scale.
The substrate 1 according to the invention is typically embodied as a DCB (direct copper bonding) substrate or as an AMB (active metal brazing) substrate.
The substrate 1 according to the invention comprises a ceramic plate 2 and a first metal layer area 5, the first metal layer area 5 having a corner 6, the first metal layer area being arranged on a first main surface 2a of the ceramic plate 2. The first metal layer area 5 is materially bonded to the first main surface 2a of the ceramic plate 2. In this case, the first metal-layer region 5 has a first corner 6, the first corner 6 connecting a straight first-layer-region edge portion 5a of the first metal-layer region 5 to a straight second-layer-region edge portion 5b of the first metal-layer region 5, which extends perpendicularly to the first-layer-region edge portion 5a of the first metal-layer region 5, wherein the first corner 6 of the first metal-layer region 5 has a corner radius R of 50 μm to 180 μm, in particular a corner radius R of 100 μm to 160 μm, in particular a corner radius R of 150 μm. The first corner 6 extends with a corner radius R around a corner radius starting point M over an angle of 90 °.
In the case of the present invention, the first corner 6 of the first metal-layer region 5 therefore has a very small corner radius R, in colloquially speaking, so that the first corner 6 of the first metal-layer region 5 is embodied very sharply. Thus, in the case of the present invention, the rounding of the first corner 6 is deliberately made small. Contrary to the frequently common view in the usual technique that sharp corners on objects lead to high mechanical stress loads and should therefore be avoided as much as possible in embodiments of the object, the present invention is based on the surprising insight gained by the inventors that in the case of a substrate, the mechanical stresses occurring in the direct vicinity of the corners of the respective metal layer areas are significantly lower in the case of corners having a very small corner radius compared to the conventional embodiments of the technique having corners with a relatively large corner radius, due to the different coefficients of thermal expansion of the ceramic plate and the respective metal layer area, if the temperature changes.
Preferably, all corners 6 of the first metal layer region 5 have a corner radius R of 50 μm to 180 μm, in particular a corner radius R of 100 μm to 160 μm, in particular a corner radius R of 150 μm. The respective corner 6 of the first metal layer region 5 extends with a corner radius R around the respective corner radius starting point M over an angle of 90 deg..
Preferably, the first edge region 11 of the first metal-layer region 5 has a first edge weakening 13 which extends around the first corner 6 of the first metal-layer region 5. The first edge region 11 of the first metal-layer region 5 proceeds from the edge 5' of the first metal-layer region 5, the first edge region 11 of the first metal-layer region 5 having a width ba corresponding to 4 times the thickness da of the first metal-layer region 5. The thickness da of the first metal layer region 5 is preferably 100 μm to 800 μm, in particular 200 μm to 400 μm, in particular 300 μm. The first edge weakening 13 has a first length la which extends along the first metal layer area edge portion 5a of the first metal layer area 5 and a second length 1b which extends along the second metal layer area edge portion 5b, the first length la being 1 to 27 times, in particular 1 to 10 times, the thickness da of the first metal layer area 5, and the second length 1b being 1 to 27 times, in particular 1 to 10 times, the thickness da of the first metal layer area 5. The first edge region 11 of the first metal-layer region 5 has the same length as the first edge weakening 13 along the first metal-layer region edge portion 5a of the first metal-layer region 5. The first edge region 11 of the first metal-layer region 5 has the same length as the first edge weakening 13 along the second metal-layer region edge portion 5b of the first metal-layer region 5. Thus, the first edge zone 11 ends at both ends E of the first edge weakening 13. It should be noted here that the first metal-layer region 5 is free of edge weakenings after the respective end E of the first edge weakening 13 of the first metal-layer region 5 along the edge 5' of the first metal-layer region 5, preferably over a respective length lg of at least 7 times the thickness da of the first metal-layer region 5. Thus, the entire edge 5' of the first metal layer region 5 has no edge weakening. The first edge weakening 13 is designed such that the first edge weakening 13 in the first edge region 11 of the first metal layer region 5 reduces the volume of the material of the first edge region 11 of the first metal layer region 5 by 10% to 90%, in particular by 20% to 80%. Thus, the first edge region 11 of the first metal layer region 5 has 10% to 90%, in particular 20% to 80%, less material of the first metal layer region 5 than an inner region 11 'of the first metal layer region, which is not arranged at the edge 5' of the first metal layer region, has no material weakening and has the same volume as the first edge region 11.
The remaining part of the edge region of the first metal-layer region 5, which extends around the respective corner 6 of the first metal-layer region 5, preferably has a respective edge weakening designed in a similar manner to the first edge weakening 13.
Furthermore, the substrate 1 may comprise a second metal layer area 9, the second metal layer area 9 having a corner 7, the second metal layer area being arranged on the first main surface 2a of the ceramic plate 2 and at a distance from the first metal layer area 5. The second metal layer area 9 is materially bonded to the first main surface 2a of the ceramic plate 2. In this case, the second metal-layer region 9 has a first corner 7, the first corner 7 connecting a straight first-layer-region edge portion 9a of the second metal-layer region 9 to a straight second-layer-region edge portion 9b of the second metal-layer region 9. Which extends perpendicularly to the first metal-layer-region edge portion 9a of the second metal-layer region 9, wherein the first corner 7 of the second metal-layer region 9 has a corner radius R of 50 μm to 180 μm, in particular 100 μm to 160 μm, in particular 150 μm. The first corner 7 of the second metal layer region 9 extends with a corner radius R around the corner radius starting point M over an angle of 90 °.
Preferably, all corners 7 of the second metal layer region 9 have a corner radius R of 50 μm to 180 μm, in particular a corner radius R of 100 μm to 160 μm, in particular a corner radius R of 150 μm. The respective corner 7 of the second metal layer region 9 extends with a corner radius R around the respective corner radius starting point M over an angle of 90 deg..
Preferably, the first edge region 12 of the second metal layer region 9 has a second edge weakening 14, which extends around the first corner 7 of the second metal layer region 9. The first edge region 12 of the second metal layer region 9 proceeds from the edge 9' of the second metal layer region 9, the first edge region 12 of the second metal layer region 9 having a width bb corresponding to 4 times the thickness db of the second metal layer region 9. The thickness db of the second metal layer region 9 is preferably 100 μm to 800 μm, in particular 200 μm to 400 μm, in particular 300 μm. The second edge weakening 14 has a third length lc which is 1 to 27 times, in particular 1 to 10 times, the thickness db of the second metal layer region 9, and a fourth length ld which extends along the second metal layer region edge portion 9b, the third length lc being 1 to 27 times, in particular 1 to 10 times, the thickness db of the second metal layer region 9. The first edge region 12 of the second metal-layer region 9 has the same length as the second edge weakening 14 along the first metal-layer region edge portion 9a of the second metal-layer region 9. The first edge region 12 of the second metal-layer region 9 has the same length as the second edge weakening 14 along the second metal-layer region edge portion 9b of the second metal-layer region 9. Thus, the first edge region 12 terminates at both ends E of the second edge weakening 14. It should be noted here that after the respective end E of the second edge weakening 14 of the second metal layer region 9 along the edge 9' of the second metal layer region 9, the second metal layer region 9 is free of edge weakening, preferably over a respective length lg of at least 7 times the thickness db of the second metal layer region 9. Thus, the entire edge 9' of the second metal layer region 9 has no edge weakening. The second edge weakening 14 is designed such that the second edge weakening 14 in the first edge region 12 of the second metal layer region 9 reduces the volume of the material of the first edge region 12 of the second metal layer region 9 by 10% to 90%, in particular by 20% to 80%. Thus, the first edge region 12 of the second metal layer region 9 has 10% to 90%, in particular 20% to 80%, less material of the second metal layer region 9 than an inner region 12 'of the second metal layer region, which is not arranged at the edge 9' of the second metal layer region 9, has no material weakening and has the same volume as the first edge region 12.
The remaining part of the edge region of the second metal layer region 9, which extends around the respective corner 7 of the second metal layer region 9, preferably has a respective edge weakening designed in a similar manner to the second edge weakening 14.
The second-layer-region edge portion 5b of the first metal-layer region 5 and the second-layer-region edge portion 9b of the second metal-layer region 9 extend parallel to one another, wherein the first-layer-region edge portion 5a of the first metal-layer region 5 and the first-layer-region edge portion 9a of the second metal-layer region 9 extend on a common first line L1. The second metal-layer-region edge portion 9b of the second metal-layer region 9 is at a first distance g from the second metal-layer-region edge portion 5b of the first metal-layer region 5, which is preferably 500 μm to 1100 μm, in particular 700 μm to 900 μm, and in particular 800 μm. The first corner 6 of the first metal layer region 5 and the first corner 7 of the second metal layer region 9 extend in mirror-inverted fashion with respect to one another.
The ceramic plate 2 may comprise a third metal layer area 10, the third metal layer area 10 having a corner 8, the third metal layer area being arranged on the first main surface 2a of the ceramic plate 2 and at a distance from the first metal layer area 5 and the second metal layer area 9. The third metal layer area 10 is materially bonded to the first main surface 2a of the ceramic plate 2. The third metal-layer region 10 comprises a straight first metal-layer region edge portion 10a, which straight first metal-layer region edge portion 10a extends parallel to the first metal-layer region edge portion 5a of the first metal-layer region 5 and parallel to the first metal-layer region edge portion 9a of the second metal-layer region 9. The distances between the second-metal-layer-region edge portion 9b of the second metal-layer region 9 and the second-metal-layer-region edge portion 5b of the first metal-layer region 5 and between the first-metal-layer-region edge portion 9a of the second metal-layer region 9 and the first-metal-layer-region edge portion 10a of the third metal-layer region 10 are the same first distance g. A second line L2 having a common point with the second-layer-area edge portion 5a of the first metal-layer area 5 intersects the first-layer-area edge portion 10a of the third metal-layer area 10 at a first intersection point S1. A third line L3 having a common point with the second-layer-region edge portion 9b of the second metal-layer region 9 intersects the first-layer-region edge portion 10a of the third metal-layer region 10 at a second intersection point S2. The first edge region 16 of the third metal-layer region 10, which extends along the first metal-layer region edge portion 10a of the third metal-layer region 10, has a third edge weakening 17. The first edge region 16 of the third metal-layer region 10 proceeds from the edge 10' of the third metal-layer region 10, the first edge region 16 of the third metal-layer region 10 having a width bc corresponding to 4 times the thickness of the third metal-layer region 10; wherein the third edge weakening 17 has a fifth length le which is 2 to 15 times, in particular 2 to 17 times, the first distance g, said fifth length le extending along the first metal layer area edge portion 10a of the third metal layer area 10. The first intersection point S1 and the second intersection point S2 are arranged in the first edge region 16 of the third metal layer region 10. The first edge region 16 of the third metal-layer region 10 has the same length as the third edge weakening 17 along the first metal-layer region edge portion 10a of the third metal-layer region 10, i.e. the first edge region 16 of the third metal-layer region 10 ends at both ends E of the third edge weakening 17. It is noted that after the respective end E of the third edge weakening 17 of the third metal layer region 10 along the edge 10' of the third metal layer region 10, the third metal layer region 10 is free of edge weakening, preferably over a respective length lg of at least 7 times the thickness of the third metal layer region 10. Thus, the entire edge 10' of the third metal layer region 10 has no edge weakening. The third edge weakening 17 is designed such that the third edge weakening 17 in the first edge region 16 of the third metal layer region 10 reduces the volume of the material of the first edge region 16 of the third metal layer region 10 by 10% to 90%, in particular by 20% to 80%. Thus, the first edge region 16 of the third metal layer region 10 has 10% to 90%, in particular 20% to 80%, less material of the third metal layer region 10 than an inner region of the third metal layer region, which is not arranged at the edge 10' of the third metal layer region 10, has no material weakening and has the same volume as the first edge region 16.
A fourth line L4 extends parallel to the second metal-layer-region edge portion 5b of the first metal-layer region 5, which fourth line is situated at half the first distance g from the second metal-layer-region edge portion 5b of the first metal-layer region 5, preferably intersects the first metal-layer-region edge portion 10a of the third metal-layer region 10 at a third intersection point S3, wherein the third edge weakening 17 is arranged such that the two portions 10 a' and 10a "of the third edge weakening 17, which are arranged on both sides of the third intersection point S3 and extend along the first metal-layer-region edge portion 10a of the third metal-layer region 10, have the same length.
As shown by way of example in fig. 1 to 3, the respective edge weakening 13, 14 and 17 can be implemented in the form of at least one aperture 13', 14' and 17' arranged in the first edge region 11, 12 and 16 of the respective metal layer region 5, 9 and 10. As regards the holes 13' and 14', as shown by way of example in fig. 3, the at least one hole 13', 14' and 17' can be implemented in the form of a through hole passing through the complete respective metal layer region 5, 9 and 10 or in the form of a blind hole (not shown) not passing through the complete respective metal layer region 5, 9 and 10. The through-holes do not extend in the ceramic plate 2.
The at least one hole 13', 14' and 17' each preferably has a circular cross section. As shown by way of example in fig. 1, the midpoint of the hole 13' is preferably arranged at least approximately on a fifth line L5, which is L5 at an angle of 45 ° with respect to the first-layer-area edge portion 5a and the second-layer-area edge portion 5b of the first metal-layer area 5 and extends through the corner-radius starting point M of the corner radius R of the first corner 6 of the first metal-layer area 5. As shown by way of example in fig. 1, the midpoint of the hole 14' is preferably arranged at least substantially on a sixth line L6, which sixth line L6 is at an angle of 45 ° with respect to the first-layer-area edge portion 9a and the second-layer-area edge portion 9b of the second layer-area 9 and extends through the corner-radius starting point M of the corner radius R of the first corner 7 of the second layer-area 9.
As regards the edge weakening 13 and the edge weakening 14, as is shown by way of example in fig. 5 and 6, the respective edge weakening 13, 14 and 17 can also be designed such that the respective edge region 11, 12 and 16 has a region with an inclined or stepped course proceeding from the edge 5', 9' and 10' of the respective metal layer region 5, 9 and 10, respectively.
As regards the edge weakening 13 and the edge weakening 14, as shown by way of example in fig. 6, independently of the specific type of their design (hole or holes, inclined progression or stepped progression), the respective edge weakening 13, edge weakening 14 and edge weakening 17 can be an integral part of a respective larger edge primary weakening 30 and 31, respectively, which larger edge primary weakening 30 and 31 extends beyond the respective edge region 11, 12 and 16 in the direction of the central region of the respective metal layer region. In this case, the first, second and third edge weakenings 13, 14, 17 end at the boundary of the respectively associated edge region 11, 12, 16, respectively.
As shown by way of example in fig. 3 to 6, the substrate 1 preferably comprises a further metal layer area 18, said further metal layer area 18 having a corner 19, said further metal layer area being arranged on the second main surface 2b of the ceramic plate 2, wherein the second main surface 2b of the ceramic plate 2 is arranged opposite the first main surface 2a of the ceramic plate 2. The further metal layer area 18 is materially bonded to the second main surface 2b of the ceramic plate 2. The further metal layer region 18 has a first corner 19, which first corner 19 connects a straight first metal layer region edge portion of the further metal layer region 18 to a straight second metal layer region edge portion of the further metal layer region 18, which second metal layer region edge portion extends perpendicularly to the first metal layer region edge portion, wherein the first corner 19 of the further metal layer region 18 has a corner radius R, which is 50 μm to 180 μm, in particular 100 μm to 160 μm, in particular 150 μm.
Preferably, all corners 19 of the further metal layer region 18 have a corner radius R, which is 50 μm to 180 μm, in particular 100 μm to 160 μm, in particular 150 μm. The respective corner 19 of the further metal layer region 18 extends with a corner radius R around the respective corner radius starting point M over an angle of 90 °. The thickness dc of the further metal layer region 18 is preferably 100 μm to 800 μm, in particular 200 μm to 400 μm, in particular 300 μm.
The further metal layer region 18 preferably has a further edge weakening 20. The further edge weakening 20 is preferably designed in a similar way as the first edge weakening 11 and the second edge weakening 12, respectively (including an advantageous embodiment). The features described above in relation to the first and second edge weakenings 11, 12 and the first and second edge regions 13, 14 respectively also apply equally to the further edge weakening 20 and the first and second edge regions, respectively, of the further metal layer region 18.
It should be noted that the thickness of the respective metal layer region 5, 9, 10 and 18 is to be understood as meaning a uniform thickness of the respective metal layer region 5, 9, 10 and 18 in the region of the respective metal layer region 5, 9, 10 and 18 without material weakening. The first metal layer area 5 and the second metal layer area 9 and, if present, the third metal layer area 10, which are arranged on the first main surface 2a of the ceramic plate 2, preferably have the same thickness.
The respective metal layer regions 5, 9, 10 and 18 may consist of a single metal layer or comprise a plurality of metal layers arranged one above the other. The respective metal layer region 5, metal layer region 9, metal layer region 10 and metal layer region 18 are preferably at least substantially composed of copper.
Furthermore, it should be noted that the corner radius R of the first corner 6 of the first metal layer region 5 is preferably the same as the corner radius R of the first corner 7 of the second metal layer region 9. Furthermore, the corner radius R of the first corner 19 of the third metal-layer region 18 is preferably the same as the corner radius R of the first corner 6 of the first metal-layer region 5 and the corner radius R of the first corner 7 of the second metal-layer region 9.
It should of course be pointed out here that the features of the different exemplary embodiments of the invention can be combined with one another in any desired manner, provided that these features are not mutually exclusive.
Claims (19)
1. A substrate comprising a first metal layer area having corners, the substrate comprising a ceramic plate (2), the first metal layer area being arranged on a first main surface (2a) of the ceramic plate (2), wherein the corner of the first metal layer region (5) has a first corner (6), the first corner (6) connects a straight first-layer-area edge portion (5a) of the first-layer-area (5) to a straight second-layer-area edge portion (5b) of the first-layer-area (5), the second metal-layer-region edge portion extending perpendicularly to the first metal-layer-region edge portion (5a) of the first metal-layer region (5), wherein the first corner (6) of the first metal layer region (5) has a corner radius (R) of 50 μm to 180 μm.
2. The substrate according to claim 1, characterized in that a first edge region (11) of the first metal layer region (5) has a first edge weakening (13) which extends around the first corner (6) of the first metal layer region (5), wherein the first edge region (11) of the first metal layer region (5) proceeds from an edge (5') of the first metal layer region (5), the first edge region (11) of the first metal layer region (5) having a width (ba) which corresponds to 4 times a thickness (da) of the first metal layer region (5), wherein the first edge weakening (13) has a first length (la) and a second length (1b), the first length (la) being 1 to 27 times the thickness (da) of the first metal layer region (5), the first length extends along the first metal layer area edge portion (5a) of the first metal layer area (5), the second length (1b) is 1 to 27 times the thickness (da) of the first metal layer area (5), the second length extends along the second metal layer area edge portion (5b), wherein the first edge region (11) of the first metal layer area (5) has the same respective length as the first edge weakening (13) along the first metal layer area edge portion (5a) and the second metal layer area edge portion (5b), wherein the first edge weakening (13) is designed such that the first edge weakening (13) in the first edge region (11) of the first metal layer area (5) reduces the volume of the material of the first edge region (11) of the first metal layer area (5) by 10 to 90% .
3. Substrate according to any one of the preceding claims, characterized in that the substrate (1) has a second metal layer area (9), which second metal layer area (9) has a corner, which second metal layer area is arranged on the first main surface (2a) of the ceramic plate (2) and at a distance from the first metal layer area (5), wherein the corner of the second metal layer area (9) has a first corner (7), which first corner (7) of the second metal layer area (9) connects a straight first metal layer area edge portion (9a) of the second metal layer area (9) to a straight second metal layer area edge portion (9b) of the second metal layer area (9), which second metal layer area edge portion extends perpendicularly to the first metal layer area edge portion (9a), wherein the first corner (7) of the second metal layer region (9) has a corner radius (R) of 50 μm to 180 μm.
4. Substrate according to claim 3, characterized in that a first edge region (12) of the second metal layer region (9) has a second edge weakening (14) extending around the first corner (7) of the second metal layer region (9), wherein the first edge region (12) of the second metal layer region (9) proceeds from an edge (9') of the second metal layer region (9), the first edge region (12) of the second metal layer region (9) having a width (bb) corresponding to 4 times a thickness (db) of the second metal layer region (9), wherein the second edge weakening (14) has a third length (lc) and a fourth length (1d), the third length (lc) being 1 to 27 times the thickness (db) of the second metal layer region (9), the third length extends along the first metal layer area edge portion (9a) of the second metal layer area (9), the fourth length (1d) is 1 to 27 times the thickness (db) of the second metal layer area (9), the fourth length extends along the second metal layer area edge portion (9b) of the second metal layer area (9), wherein the first edge region (12) of the second metal layer area (9) has the same respective length as the second edge weakening (14) along the first metal layer area edge portion (9a) and the second metal layer area edge portion (9b) of the second metal layer area (9), wherein the second edge weakening (14) is designed such that the second edge weakening (14) in the first edge region (12) of the second metal layer area (9) will connect the second metal layer area (9) to the second metal layer area (9) The volume of the material of the first edge region (12) is reduced by 10% to 90%.
5. Substrate according to claim 3, characterized in that the second metal-layer-area edge portion (5b) of the first metal-layer area (5) and the second metal-layer-area edge portion (9b) of the second metal-layer area (9) extend parallel to each other, and wherein the first metal-layer-area edge portion (5a) of the first metal-layer area (5) and the first metal-layer-area edge portion (9a) of the second metal-layer area (9) extend on a common first line (L1).
6. Substrate according to claim 5, characterized in that the substrate (1) has a third metal layer area (10), which third metal layer area (10) has a corner (8), which third metal layer area (10) is arranged on the first main surface (2a) of the ceramic plate (2) and at a distance from the first metal layer area (5) and the second metal layer area (9), wherein the third metal layer area (10) has a straight first metal layer area edge portion (10a), which straight first metal layer area edge portion (10a) extends parallel to the first metal layer area edge portion (5a) of the first metal layer area (5) and parallel to the first metal layer area edge portion (9a) of the second metal layer area (9), wherein there is a same first distance (g) between the second metal-layer-region edge portion (9b) of the second metal-layer region (9) and the second metal-layer-region edge portion (5b) of the first metal-layer region (5) and between the first metal-layer-region edge portion (9a) of the second metal-layer region (9) and the first metal-layer-region edge portion (10a) of the third metal-layer region (10), wherein a second line (L2) having a common point with the second metal-layer-region edge portion (5a) of the first metal-layer region (5) intersects the first metal-layer-region edge portion (10a) of the third metal-layer region (10) at a first intersection point (S1), wherein a third line (L3) having a common point with the second metal-layer-region edge portion (9b) of the second metal-layer region (9) is at a second intersection point (S2) Intersecting the first metal layer area edge portion (10a) of the third metal layer area (10), wherein a first edge region (16) of the third metal layer area (10) has a third edge weakening (17) extending along the first metal layer area edge portion (10a) of the third metal layer area (10), wherein the first edge region (16) of the third metal layer area (10) proceeds from an edge (10') of the third metal layer area (10), the first edge region (16) of the third metal layer area (10) has a width (bc) corresponding to 4 times the thickness of the third metal layer area (10), wherein the third edge weakening (17) has a fifth length (le) which is 2 to 15 times the first distance (g), said fifth length extending along said first metal layer area edge portion (10a) of said third metal layer area (10), wherein the first intersection point (S1) and the second intersection point (S2) are arranged in the first edge region (16) of the third metal layer region (10), wherein the first edge region (16) of the third metal layer region (10) has the same length as the third edge weakening (17) along the first metal layer region edge portion (10a) of the third metal layer region (10), wherein the third edge weakening (17) is designed such that the third edge weakening (17) in the first edge region (16) of the third metal layer region (10) reduces the volume of the material of the first edge region (16) of the third metal layer region (10) by 10% to 90%.
7. Substrate according to claim 6, characterized in that a fourth line (L4) extends parallel to the second metal layer area edge portion (5b) of the first metal layer area (5), which fourth line is at half the first distance (g) from the second metal layer area edge portion (5b) of the first metal layer area (5), which fourth line intersects the first metal layer area edge portion (10a) of the third metal layer area (10) at a third intersection point (S3), wherein the third edge weakening (17) is arranged such that two portions (10 a'; of the third edge weakening (17) arranged on both sides of the third intersection point (S3) and extending along the first metal layer area edge portion (10a) of the third metal layer area (10), 10a ") have the same length.
8. The substrate according to claim 2, characterized in that the first edge weakening (13) is designed in the form of at least one hole (13', 14', 17') arranged in the first edge region (11) of the first metal layer region (5).
9. The substrate according to claim 4, characterized in that the second edge weakening (14) is designed in the form of at least one hole (13', 14', 17') arranged in the first edge region (12) of the second metal layer region (9).
10. The substrate according to claim 6, characterized in that the third edge weakening (17) is designed in the form of at least one hole (13', 14', 17') arranged in the first edge region (16) of the third metal layer region (10).
11. The substrate according to any of claims 8 to 10, characterized in that said at least one hole (13', 14', 17') has a circular cross section.
12. The substrate according to claim 11, characterized in that the midpoint of the hole is arranged at least substantially on a fifth line (L5), which fifth line (L5) is at an angle of 45 ° with respect to the first-layer-area edge portion (5a) and the second-layer-area edge portion (5b) of the first-layer-area (5) and extends through the corner-radius starting point (M) of the corner radius (R) of the first corner (6) of the first-layer-area (5).
13. The substrate according to claim 11, characterized in that the midpoint of the hole is arranged at least substantially on a sixth line (L6), which sixth line (L6) is at an angle of 45 ° with respect to the first-layer-area edge portion (9a) and the second-layer-area edge portion (9b) of the second-layer-area (9), and extends through the corner-radius starting point (M) of the corner radius (R) of the first corner (7) of the second-layer-area (9).
14. The substrate according to claim 2, characterized in that the first edge weakening (13) is designed such that the first edge region (11) of the first metal layer region (5) has the area: this region has an inclined or stepped course proceeding from the edge (5') of the first metal layer region (5).
15. The substrate according to claim 4, characterized in that the second edge weakening (14) is designed such that the first edge region (12) of the second metal layer region (9) has the area: this region has an inclined or stepped course proceeding from the edge (9') of the second metal layer region (9).
16. The substrate according to claim 6, characterized in that the third edge weakening (17) is designed such that the first edge region (16) of the third metal layer region (10) has the area: this region has an inclined or stepped course proceeding from the edge (10') of the third metal layer region (10).
17. Substrate according to any one of claims 1-2, characterized in that the substrate (1) has a further metal layer area (18), which further metal layer area (18) has a corner, which further metal layer area is arranged on a second main surface (2b) of the ceramic plate (2), wherein the second main surface (2b) of the ceramic plate (2) is arranged opposite to the first main surface (2a) of the ceramic plate (2), wherein the corner of the further metal layer area (18) has a first corner (19), which first corner (19) of the further metal layer area (18) connects a straight first metal layer area edge portion of the further metal layer area (18) to a straight second metal layer area edge portion of the further metal layer area (18), the second metal layer region edge portion extends perpendicularly to the first metal layer region edge portion, wherein the first corner (19) of the further metal layer region (18) has a corner radius (R) of 50 μm to 180 μm.
18. Substrate according to claim 17, characterized in that all the corner portions of the further metal layer region (18) have a corner radius (R) of 50 μ ι η to 180 μ ι η.
19. Substrate according to claim 17, characterized in that the further metal layer region (18) has a further edge weakening (20).
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| DE102017107116.4A DE102017107116A1 (en) | 2017-04-03 | 2017-04-03 | Substrate having a cornered first metal layer region |
| DE102017107116.4 | 2017-04-03 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4004844C1 (en) * | 1990-02-16 | 1991-01-03 | Abb Ixys Semiconductor Gmbh | Copper metallisation on ceramic substrate - obtd. by bonding copper foil directly to whole surface of substrate, then masking and etching |
| US6638592B1 (en) * | 1999-06-14 | 2003-10-28 | Jurgen Schulz-Harder | Ceramic/metal substrate, especially composite substrate |
| CN104011852A (en) * | 2011-12-20 | 2014-08-27 | 株式会社东芝 | Ceramic Copper Circuit Board And Semiconductor Device Employing Same |
| JP2015225948A (en) * | 2014-05-28 | 2015-12-14 | Ｎｇｋエレクトロデバイス株式会社 | Power module substrate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014220650A1 (en) * | 2014-10-13 | 2016-04-14 | Heraeus Deutschland GmbH & Co. KG | Optimized trace design of metallic materials on ceramic substances |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4004844C1 (en) * | 1990-02-16 | 1991-01-03 | Abb Ixys Semiconductor Gmbh | Copper metallisation on ceramic substrate - obtd. by bonding copper foil directly to whole surface of substrate, then masking and etching |
| US6638592B1 (en) * | 1999-06-14 | 2003-10-28 | Jurgen Schulz-Harder | Ceramic/metal substrate, especially composite substrate |
| CN104011852A (en) * | 2011-12-20 | 2014-08-27 | 株式会社东芝 | Ceramic Copper Circuit Board And Semiconductor Device Employing Same |
| JP2015225948A (en) * | 2014-05-28 | 2015-12-14 | Ｎｇｋエレクトロデバイス株式会社 | Power module substrate |
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