CN108692204A - Fluorescent light source device - Google Patents
Fluorescent light source device Download PDFInfo
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- CN108692204A CN108692204A CN201710665181.3A CN201710665181A CN108692204A CN 108692204 A CN108692204 A CN 108692204A CN 201710665181 A CN201710665181 A CN 201710665181A CN 108692204 A CN108692204 A CN 108692204A
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- Prior art keywords
- coating
- layer
- oxide
- reflecting layer
- light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
- F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/416—Reflective
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/422—Luminescent, fluorescent, phosphorescent
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B2207/00—Coding scheme for general features or characteristics of optical elements and systems of subclass G02B, but not including elements and systems which would be classified in G02B6/00 and subgroups
- G02B2207/113—Fluorescence
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Elements Other Than Lenses (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Laminated Bodies (AREA)
- Luminescent Compositions (AREA)
Abstract
The present invention provides reflecting layer can obtain the fluorescent light source device that the stripping in high reflectivity and the reflecting layer is inhibited for a long time.The fluorescent light source device of the present invention; it is characterized in that; it is fluorescent light source device made of having the fluorescent plate that excitation light incident surface and fluorescence outgoing plane are made of the same face; wherein; above-mentioned fluorescent plate is sequentially laminated with fluorescence coating, the first oxide skin(coating) and the reflecting layer formed by silver; the first protective layer is provided between above-mentioned first oxide skin(coating) and above-mentioned reflecting layer, above-mentioned first protective layer is made of translucent material, and above-mentioned translucent material is formed by nitride or fluoride.
Description
Technical field
The present invention relates to a kind of fluorescent light source devices.For in more detail, it is related to having excitation light incident surface and fluorescence is penetrated
The fluorescent light source device for reflection-type made of the fluorescent plate being made of the same face of appearing.
Background technology
In the past, as certain type of fluorescent light source device, it is known to the device of the reflection-type constituted as follows:Laser is made
It is irradiated to the one side of fluorescent plate for exciting light, thus will constitute the phosphor excitation of the fluorescence coating of the fluorescent plate, is projected from the face
Fluorescence.
In the fluorescent light source device of such reflection-type, as fluorescent plate, enter with exciting light using in fluorescence coating
The opposite side for penetrating side is provided with the plate (referring for example to patent document 1) in the reflecting layer formed by metals such as aluminium, silver and gold.
Moreover, in order to realize high brightness, in the fluorescent light source device of patent document 1, fluorescence coating and reflecting layer it
Between, by the refringence of constituent material small by the refractive index than the constituent material of the fluorescence coating and with the fluorescence coating be 0.2 with
On the total reflection film that is formed of material be arranged with the state that is in direct contact with fluorescence coating.Total reflection film is made into for example by magnesium fluoride
(MgF2) formed film.In addition, being laminated between fluorescence coating and reflecting layer, specifically between total reflection film and reflecting layer
The increasing reflecting layer formed by optical multilayer and the protective film formed as needed by metal oxide.
On the other hand, in the speculum used in the optics system such as flat-panel monitor or projecting apparatus, it is also known that have and setting
Component made of the reflecting layer formed by metal is formed on the substrate of fat, which is to be formed by silver with high reflectivity
Layer (referring for example to patent document 2).
Existing technical literature
Patent document
Patent document 1:Japanese Unexamined Patent Publication 2015-50124 bulletins
Patent document 2:Japanese Unexamined Patent Publication 2008-260978 bulletins
Invention content
The technical problems to be solved by the invention
However, in the fluorescent light source device that fluorescent plate is provided with reflecting layer, when reflecting layer is to be formed by silver, it is known that meeting
Generate various unfavorable conditions.
It specifically illustrates, there are following problems:Oxidative degradation occurs for reflecting layer, and the reflectivity in the reflecting layer reduces.It is logical
The further investigation for crossing the present inventor is found:This problem has the feelings for the composition layer being formed of oxide in fluorescent plate
Under condition, especially become apparent in the state that the composition layer being formed of oxide is in direct contact with reflecting layer.In addition, there is also
Following problems:It cannot get sufficient adaptation between fluorescence coating, thus generate the stripping in reflecting layer.
The present invention is made based on situation as above, its purpose is to provide reflecting layer can obtain for a long time it is high
The fluorescent light source device that the stripping in reflectivity and the reflecting layer is inhibited.
Means for solving technical problem
The fluorescent light source device of the present invention is characterized in that, is to have excitation light incident surface and fluorescence outgoing plane by same
Fluorescent light source device made of the fluorescent plate that face is constituted, wherein
Above-mentioned fluorescent plate is sequentially laminated with fluorescence coating, the first oxide skin(coating) and the reflecting layer formed by silver,
It is provided with the first protective layer between above-mentioned first oxide skin(coating) and above-mentioned reflecting layer,
Above-mentioned first protective layer is made of translucent material, and above-mentioned translucent material is formed by nitride or fluoride.
In the fluorescent light source device of the present invention preferably:Above-mentioned first oxide skin(coating) is by oxide mono film and oxide
At least one of multilayer film is constituted, and above-mentioned oxide mono film is formed by aluminium oxide, and above-mentioned oxide multilayered film is by the first structure
Stratification and the second composition layer are formed, and above-mentioned first composition layer is formed by silica, and above-mentioned second composition layer is formed by titanium oxide.
In the fluorescent light source device of the present invention preferably:In above-mentioned reflecting layer be laminated with above-mentioned fluorescence coating, above-mentioned
It is laminated with the second oxide skin(coating) on the side in the face of the face opposite side of the first oxide skin(coating) and above-mentioned first protective layer,
It is provided with the second protective layer between above-mentioned second oxide skin(coating) and above-mentioned reflecting layer,
Above-mentioned second protective layer is constituted by oxygen atom is non-containing material, above-mentioned oxygen atom it is non-containing material by molecular structure
In formed without containing the compound of oxygen atom.
In the fluorescent light source device of the present invention preferably:Constitute above-mentioned second protective layer oxygen atom it is non-containing material by fluorine
Change magnesium;Silicon nitride;Aluminium nitride;Any metal in aluminium, chromium and nickel;Or at least one of alloy of aluminium, chromium and nickel formation.
The effect of invention
In the fluorescent light source device of the present invention, due to the fluorescence coating in fluorescent plate and it is provided with first between reflecting layer
Oxide skin(coating) and the first protective layer, so even if reflecting layer can be obtained if formation between fluorescence coating and reflecting layer by silver
To high adaptation.In addition, since the first protective layer is disposed between the first oxide skin(coating) and reflecting layer, first protective layer by
Translucent material is constituted, and above-mentioned translucent material is formed by nitride or fluoride, so even if fluorescent plate has the first oxidation
Nitride layer can also prevent the oxidative degradation in the reflecting layer caused by being provided with first oxide skin(coating).
Therefore, fluorescent light source device according to the present invention, reflecting layer can obtain high reflectivity for a long time, and should
The stripping in reflecting layer is inhibited.
In the fluorescent light source device of the present invention, by by least one in oxide mono film and oxide multilayered film
Person constitutes the first oxide skin(coating), and above-mentioned oxide mono film is formed by aluminium oxide, and above-mentioned oxide multilayered film constitutes layer by first
It being formed with the second composition layer, above-mentioned first composition layer is formed by silica, and above-mentioned second composition layer is formed by titanium oxide, to
Fluorescent plate has superior characteristic.
In the fluorescent light source device of the present invention, in reflecting layer be laminated with fluorescence coating, the first oxide skin(coating) and the
The second oxide skin(coating) is set gradually on the side in the face of the face opposite side of one protective layer and is constituted containing material by oxygen atom is non-
Second protective layer, even if to be prevented if fluorescent plate has the second oxide skin(coating) because being provided with the second oxide skin(coating) institute
The oxidative degradation in caused reflecting layer.
Description of the drawings
Fig. 1 is the definition graph of the outline of an example of the composition for indicating the fluorescent light source device of the present invention.
Fig. 2 is the explanation exploded view of the specific composition of the fluorescence radiation component in the fluorescent light source device for indicate Fig. 1.
Fig. 3 is the chart for the result that the line reflection rate for indicating to obtain in experimental example 1 measures.
Symbol description
10 fluorescent light source devices
11 excitation light sources
20 fluorescence radiation components
21 fluorescent plates
22 fluorescence coatings
24 heat-radiating substrates
25 protection film layers
26 soft solders soak film layer
28 joint part layers
31 reflecting layer
The first protective layers of 32A
The second protective layers of 32B
33 first oxide skin(coating)s
34 oxide mono films (specific monofilm)
35 oxide multilayered films (specific multilayer film)
35A first constitutes layer
35B second constitutes layer
37 second oxide skin(coating)s
41 sealants
42 adhesive linkages
43 stress relaxation layers
43A titanium layers
43B platinum layers
45 layer gold
46 barrier layers
47 soft solders soak film layer
Specific implementation mode
Hereinafter, being illustrated to the embodiment of the fluorescent light source device of the present invention.
Fig. 1 is the definition graph of the outline of an example of the composition for indicating the fluorescent light source device of the present invention, and Fig. 2 is to indicate
The explanation exploded view of the specific composition of fluorescence radiation component in the fluorescent light source device of Fig. 1.
As shown in Figure 1, the fluorescent light source device 10 has the excitation light source 11 and fluorescence for example formed by semiconductor laser
Luminous component 20, they are arranged with leaving mutually, and above-mentioned fluorescence radiation component 20, which has, passes through the excitation from excitation light source 11
Light and the fluorescent plate 21 for projecting fluorescence.
In the example of the figure, fluorescence radiation component 20 by with excitation light source 11 it is opposite in a manner of and relative to the exciting light
The posture configuration of the inclined light shaft in source 11.
Fluorescence radiation component 20 is that flat fluorescent plate 21 is disposed in the surface of flat heat-radiating substrate 24 (in Fig. 1
Upper surface) on component, the joint part layer 28 of rectangular flat plate is formed between heat-radiating substrate 24 and fluorescent plate 21.
That is, fluorescent plate 21 is engaged with heat-radiating substrate 24 by joint part layer 28.In addition, in fluorescence radiation component 20, fluorescent plate 21
Surface (upper surface in Fig. 1) by with excitation light source 11 it is opposite in a manner of configure, the surface of the fluorescent plate 21 is by as swashing
Also by as fluorescence outgoing plane while the luminous plane of incidence.That is, in fluorescent plate 21, excite light incident surface and fluorescence outgoing plane by
The same face is constituted.
As shown in Fig. 2, fluorescent plate 21 is to be cascading to have flat fluorescence coating 22, flat first oxide
Plate made of layer 33 and the reflecting layer 31 of film-form formed by silver.In the fluorescent plate 21, by surface (Fig. 2 of fluorescence coating 22
In upper surface) constitute the surface of the fluorescent plate 21, i.e. the excitation light incident surface and fluorescence outgoing plane of fluorescent plate 21, in fluorescence coating
22 back side (lower surface in Fig. 2) side is disposed with the first oxide skin(coating) 33 and reflecting layer 31.
In the example of the figure, in fluorescent plate 21, in the back side of fluorescence coating 22, with cover the first oxide skin(coating) 33 and
The mode in reflecting layer 31 and aftermentioned first protective layer 32A, the second protective layer 32B and the second oxide skin(coating) 37, is provided with bonding
Layer 42 and sealant 41.Specifically, the back side of fluorescence coating 22 be equipped with the first oxide skin(coating) 33, the first protective layer 32A,
The laminated body that the sequence in reflecting layer 31, the second protective layer 32B and the second oxide skin(coating) 37 is laminated is (hereinafter also referred to " anti-
Penetrate laminated body "), in a manner of covering the reflection laminated body, sealant 41 with adhesive linkage 42 will reflect laminated body and fluorescence coating
The state setting of 22 bondings.That is, by fluorescence coating 22, adhesive linkage 42 and sealant 41, the sealing structure of reflection laminated body is formed.
In addition, being disposed with stress relaxation layer 43, layer gold 45, anti-at the back side (lower surface in Fig. 2) of sealant 41
Diffusion layer 46 and soft solder soak film layer 47.Stress relaxation layer 43 is formed by the multilayer film with titanium layer 43A and platinum layer 43B.
It is preferred that:Fluorescence coating 22 is formed by the polycrystal containing fluorophor, specifically, by fluorophor and aluminium oxide (Al2O3)
The mixed sintering body of equal metal oxides is formed.
It is formed by polycrystal by fluorescence coating 22, which has high thermal conductivity.
As the specific example for the polycrystal for constituting fluorescence coating 22, Al can be enumerated2O3/YAG:Ce,Al2O3/YAG:
Pr,Al2O3/YAG:Sm,Al2O3/LuAG:Ce etc..In the fluorophor of these polycrystal, rare earth element (activated material) is mixed
Miscellaneous amount is 0.5mol% or so.
In the example of the figure, fluorescence coating 22 is formed by the mixed sintering body (polycrystal) of YAG systems fluorophor and aluminium oxide.
Constituting the polycrystal of fluorescence coating 22 can for example be obtained by following methods.
First, by raw material (specifically base material, activated material, adjuvant for combustion and metal oxide (specifically example
Such as it is aluminium oxide (Al2O3)) using ball mill etc. processing is crushed, thus obtain sub-micron raw material micropowder below.So
Afterwards, using obtained raw material micropowder and organic solvent come prepare raw material micropowder it is evenly dispersed in organic solvent and
At slurry.
Then, the raw cook for making specific thickness by obtained slurry using scraper method, firing processing is carried out to the raw cook,
Thus sintered body is obtained.Later, hot isostatic pressing pressure processing is implemented to obtained sintered body, thus obtaining the porosity is
0.5% polycrystal below.
In addition, from the viewpoint of the efficiently using property of exciting light and it is rejecting, the thickness of fluorescence coating 22 is preferably 0.05
~2.0mm.
In the example of the figure, the thickness of fluorescence coating 22 is 0.10mm.
First oxide skin(coating) 33 is preferably by oxide mono film (hereinafter also referred to " specific monofilm ") 34 and oxide
Multilayer film (hereinafter also referred to " specific multilayer film ") at least one of 35 is constituted, and above-mentioned oxide mono film 34 is by aluminium oxide
(Al2O3) formed, above-mentioned oxide multilayered film 35, which by first constitutes layer 35A and second and constitutes a layer 35B, to be formed, and above-mentioned first is constituted
Layer 35A is by silica (SiO2) formed, above-mentioned second constitutes layer by titanium oxide (TiO2) formed.
By constituting the first oxide skin(coating) 33, fluorescent plate 21 by least one of specific monofilm 34 and specific multilayer film 35
With more excellent characteristic.
It specifically illustrates, by the first oxide skin(coating) 33 there is specific monofilm 34, specific monofilm 34 to have excellent
Weatherability, it is above-mentioned so can prevent or fully inhibit the surface (upper surface in Fig. 2) in reflecting layer 31 to be exposed to moisture
Moisture is the composition layer (specifically specific multilayer film 35 and fluorescence coating 22) via the surface side for being stacked in the reflecting layer 31
And invade the inside of fluorescent plate 21.
On the other hand, by the first oxide skin(coating) 33 there is specific multilayer film 35, specific multilayer film 35 to play anti-as increasing
The effect of film is penetrated, so the reflectivity (the specifically reflectivity at the back side of fluorescence coating 22) of fluorescent plate 21 can be improved, because
This fluorescent plate 21 has further excellent high reflectivity energy.
In the example of the figure, the first oxide skin(coating) 33 is made of specific monofilm 34 and specific multilayer film 35, specific list
Tunic 34 is disposed in 31 side of reflecting layer (downside in Fig. 2), and it is (upper in Fig. 2 that specific multilayer film 35 is disposed in 22 side of fluorescence coating
Side).
The thickness of first oxide skin(coating) 33 is suitably determined by the composition of first oxide skin(coating) 33.
Specifically, it for example is set as 5~15nm in the case where the first oxide skin(coating) 33 is made of specific monofilm 34,
In addition, in the case where the first oxide skin(coating) 33 is made of specific multilayer film 35, it is set as 80~100nm.In addition, in the first oxidation
In the case that nitride layer 33 is made of specific monofilm 34 and specific multilayer film 35, it is set as 85~115nm.
In the example of the figure, the thickness of the first oxide skin(coating) 33 is 85~115nm.That is, the thickness of specific monofilm 34
Thickness for 5~15nm, specific multilayer film 35 is 80~100nm.Moreover, in specific multilayer film 35, first constitutes layer 35A's
Thickness is 10nm, and the second thickness for constituting layer 35B is 40nm.
Reflecting layer 31 is formed by silver.Specifically, being formed by silver-colored reflectance coating or the silver alloy reflective based on silver.
It is formed by silver by reflecting layer 31, silver has high reflection characteristic, so 21 (specifically fluorescence coating 22 of fluorescent plate
The back side) have high reflectivity energy.
The thickness in reflecting layer 31 is, for example, 110~350nm.
In addition, from the viewpoint of the efficiently using property of exciting light and fluorescence, the area on the preferably surface in reflecting layer 31 exists
Below the area at the back side of fluorescence coating 22.
In the example of the figure, the thickness in reflecting layer 31 is 130nm.In addition, the surface in reflecting layer 31 is with slightly smaller than glimmering
The size of the back dimension of photosphere 22, entire surface and the central portion at the back side of fluorescence coating 22 are opposite.
Moreover, in fluorescent plate 21, together with fluorescence coating 22, the first oxide skin(coating) 33 and reflecting layer 31, in the first oxidation
The first protective layer 32A of film-form is provided between nitride layer 33 and reflecting layer 31.The first protective layer 32A is by translucent material structure
At above-mentioned translucent material is formed by nitride or fluoride, has translucency to exciting light and fluorescence.Moreover, the first protection
Layer 32A has the function of protecting reflecting layer 31 not oxidized.Specifically, impermeable peroxide and not releasing oxygen.
By the way that the first protective layer 32A is arranged, in the reflecting layer 31 (the specifically surface in reflecting layer 31) formed by silver
In, the generation of the compounds such as the sulfide of silver, the oxide of silver and silver hydroxide can be prevented.Thereby, it is possible to inhibit reflecting layer
The reduction of 31 reflectivity.Therefore, even if fluorescent plate 21 has oxide skin(coating) (specifically the first oxide skin(coating) 33), reflection
The surface of layer 31 will not be exposed to the oxygen released by the oxide skin(coating) and the structure via the surface side for being laminated in reflecting layer 31
Layered (specifically fluorescence coating 22 and the first oxide skin(coating) 33) and the oxygen for invading the inside of fluorescent plate 21.As a result, energy
Enough prevent the oxidative degradation in reflecting layer 31.
Here, following reasons are illustrated:It is made of translucent material the first protective layer 32A, above-mentioned translucency
Material is formed by nitride or fluoride, can prevent the sulfide of the silver in reflecting layer 31, the oxide and silver hydroxide of silver
Deng compound generation.The translucent material for constituting the first protective layer 32A is preferably the material in addition to oxide, and is not nothing
Shape (noncrystalline) but the material of crystalline.It is the material in addition to oxide by translucent material, will not be protected from first
Sheath 32A releases oxygen, and can reduce the partial pressure of oxygen in reflectance coating film forming, can prevent the oxidation in reflecting layer 31.In turn, lead to
The material that translucent material is crystalline is crossed, the first protective layer 32A is fine and close, so moisture-free in first protective layer 32A, and
And the immersion from external oxygen, sulphur, water etc. and oxygen, particularly structure from the first oxide skin(coating) 33 can be further prevented
Silica (the SiO for constituting layer 35A at first2) in diffusion of the water to reflecting layer 31.Therefore, pass through the first protective layer 32A
It being made of translucent material, above-mentioned translucent material is not oxide and is crystalline and is formed by nitride or fluoride,
Silver and oxygen, sulphur, the water etc. that can prevent composition reflecting layer 31 react.
In addition, as shown in Fig. 2, be arranged by the state that is in direct contact the first protective layer 32A with reflecting layer 31, from rear
It states experimental example will also realize that, reflecting layer 31 can obtain high reflectivity.
As the nitride as the translucent material for constituting the first protective layer 32A, aluminium nitride (AlN) etc. can be enumerated
Metal nitride and silicon nitride (Si3N4) etc..
In addition, as the fluoride as the translucent material for constituting the first protective layer 32A, magnesium fluoride can be enumerated
(MgF2) etc. metal fluorides.
Moreover, as described above, from the viewpoint of anti-block release and the immersion of anti-block, sulphur and water etc., preferred structure
Translucent material at the first protective layer 32A is magnesium fluoride (MgF2), silicon nitride (Si3N4), aluminium nitride (AlN).
In the example of the figure, the first protective layer 32A is by magnesium fluoride (MgF2) constitute.
The thickness of first protective layer 32A is preferably 1~80nm.More preferably 40~80nm.Pass through the first protective layer 32A's
Thickness is 40~80nm, can prevent silver and oxygen, sulphur, the water in composition reflecting layer 31 etc. from reacting.
In addition, from the viewpoint of protecting reflecting layer 31, the back side (lower surface in Fig. 2) of preferably the first protective layer 32A
Area and reflecting layer 31 surface area equation.
In the example of the figure, the thickness of the first protective layer 32A is 40nm.In addition, the back side of the first protective layer 32A has
With the equal sized size on the surface in reflecting layer 31, the entire surface on the surface in first protective layer 32A coverings reflecting layer 31.
In addition preferably:As shown in Fig. 2, being laminated with the first protective layer 32A, the first oxygen in reflecting layer 31 in fluorescent plate 21
Compound layer 33 and the face opposite side of fluorescence coating 22 are laminated with second in the back side (lower face side in Fig. 2) in reflecting layer 31
Oxide skin(coating) 37 is provided with the second protective layer 32B between second oxide skin(coating) 37 and reflecting layer 31.That is, in fluorescent plate 21
In, in the case where the second oxide skin(coating) 37 are arranged in the back side in reflecting layer 31, preferably in second oxide skin(coating) 37 and reflection
There are the second protective layer 32B between layer 31.The second protective layer 32B is constituted by oxygen atom is non-containing material, and above-mentioned oxygen atom is non-
It is formed by the compound for not containing oxygen atom in the molecular structure containing material, to not oxidized with protection reflecting layer 31
Function.Specifically, impermeable peroxide and not releasing oxygen.
By the way that the second protective layer 32B is arranged, even if fluorescent plate 21 has oxide skin(coating) (specifically the second oxide skin(coating)
37), the back side in reflecting layer 31 will not be exposed to the oxygen released from the oxide skin(coating).As a result, reflecting layer 31 can be prevented
Oxidative degradation.
Second protective layer 32B can have translucency to exciting light and fluorescence, can also be non-light transmittance.
Preferably comprise the second protective layer 32B oxygen atom it is non-containing material by fluoride, nitride or metal and its alloy
It is formed.
Specifically, it is preferable that oxygen atom it is non-containing material by magnesium fluoride (MgF2);Silicon nitride (Si3N4);Aluminium nitride (AlN);
At least one of aluminium (Al), chromium (Cr) and any metal in nickel (Ni) or its alloy are formed.
By oxygen atom it is non-containing material by magnesium fluoride (MgF2);Silicon nitride (Si3N4);Aluminium nitride (AlN);Aluminium (Al), chromium
(Cr) it is formed at least one of any metal in nickel (Ni) or its alloy, 31 (specifically reflecting layer 31 of reflecting layer
The back side) be not exposed to the oxygen released from oxide skin(coating) (specifically the second oxide skin(coating) 37).
In the example of the figure, the second protective layer 32B is by magnesium fluoride (MgF2) constitute.
It is preferred that the thickness of the second protective layer 32B is 1~30nm.
In addition, from the viewpoint of protecting reflecting layer 31, the surface (upper surface in Fig. 2) of preferably the second protective layer 32B
Area and reflecting layer 31 the back side area equation.
In the example of the figure, the surface of the second protective layer 32B has the equal sized ruler with the back side in reflecting layer 31
It is very little, the entire surface at the back side in second protective layer 32B coverings reflecting layer 31.
It is preferred that the second oxide skin(coating) 37 is formed by metal oxide.
Specifically, it is preferable that the second oxide skin(coating) 37 is made of metal oxide mono film (specific monofilm), above-mentioned gold
Belong to oxide mono film by aluminium oxide (Al2O3) formed.
It is made of specific monofilm the second oxide skin(coating) 37, which has excellent weatherability, so
It can prevent or the back side in reflecting layer 31 is fully inhibited to be exposed to moisture.
In the example of the figure, the second oxide skin(coating) 37 is made of metal oxide mono film, above-mentioned metal oxide list
Tunic is by aluminium oxide (Al2O3) formed.
The thickness of second oxide skin(coating) 37 is suitably determined according to the material of second oxide skin(coating) 37.Specifically, example
Such as in the case where the second oxide skin(coating) 37 is made of metal oxide mono film, i.e., the material of the second oxide skin(coating) 37 is oxidation
In the case of aluminium, it is set as 5~30nm.
In the example of the figure, the thickness of the second oxide skin(coating) 37 is 20nm.
Heat-radiating substrate 24 has the function of the hot driving that will be generated in fluorescent plate 21 (fluorescence coating 22).
It is preferred that the heat-radiating substrate 24 by with high-termal conductivity and with the (constituent material (polycrystalline of fluorescence coating 22 of fluorescent plate 21
Body)) the small material of difference of coefficient of thermal expansion formed.
As the constituent material of heat-radiating substrate 24, the metals such as copper (Cu) and the alloy (Mo-Cu) of molybdenum and copper can be used.
Wherein, the coefficient of thermal expansion of the copper used as the constituent material of heat-radiating substrate 24 is 16.5 × 10-6(1/K), molybdenum
Coefficient of thermal expansion with the alloy (content ratio of copper (Cu) is 30 mass %) of copper is 8.6 × 10-6〔1/K〕.On the other hand, make
The coefficient of thermal expansion of the YAG used for the constituent material of fluorescence coating 22 is 8.6 × 10-6〔1/K〕。
In example in figure, heat-radiating substrate 24 is formed by copper.
In heat-radiating substrate 24, consider that thickness, for example, 0.5~5.0mm is suitably determined in heat dissipation characteristics.
In addition, as depicted in figs. 1 and 2, from the viewpoints such as rejecting, the area on the preferably surface of heat-radiating substrate 24 is more than
The area at the back side of fluorescent plate 21.
In addition, heat-radiating substrate 24 can also have both gelled function.
In the example of the figure, the thickness of heat-radiating substrate 24 is 0.5~4mm.
In addition, from the viewpoint of with the zygosity of joint part layer 28, as shown in Fig. 2, it is preferred that on heat-radiating substrate 24
It is formed with and stacks gradually metal film obtained from protection film layer 25 and soft solder wetting film layer 26 on the surface of the heat-radiating substrate 24.
In the example of the figure, the entire surface (surface, the back side and all sides) of the outer surface of heat-radiating substrate 24 is by by protecting
The metal film covering that film layer 25 and soft solder wetting film layer 26 are formed.For the thickness of each layer for constituting the metal film, protect
Cuticular layer 25 is 2.5 μm, and it is 0.03 μm that soft solder, which soaks film layer 26,.
From the viewpoint of rejecting and low stress, as the joint element for constituting joint part layer 28, it is preferable to use
Soft solder containing tin.
As the specific example of the soft solder containing tin as joint element, such as gold-tin alloy can be enumerated
(content ratio of AuSn, tin (Sn) are 20 mass %, thermal conductivity 250W/mk) and tin-silver-copper alloy (Sn-3Ag-
(content ratio of silver-colored (Ag) is 3 mass % to 0.5Cu, the content ratio that the content ratio of copper (Cu) is 0.5 mass %, tin (Sn)
For 96.5 mass %), thermal conductivity 55W/mk) etc..
In addition, the thickness of joint part layer 28 is, for example, 30 μm.
It, can be with as the joint method of fluorescent plate 21 and heat-radiating substrate 24 using joint element in the example of the figure
Use following Reflow Soldering mode:Such as using reflow soldering, the soft solder piece (joint element) of flux-free is clipped in fluorescence
Between plate 21 and heat-radiating substrate 24, heated in the atmosphere of formic acid gas or hydrogen.In this way, according to formic acid or hydrogen is utilized
The surface film oxide of the soft solder piece of flux-free is removed and is carried out the joint method of Reflow Soldering by reducing power, is connect being formed by
It closes in component layer 28 and not will produce gap, good thermal conductivity can be obtained.
In the fluorescent light source device 10 constituted in this way, the exciting light projected from excitation light source 11 is irradiated to fluorescence radiation portion
The surface (excitation light incident surface) of fluorescent plate 21 in part 20, injects the fluorescent plate 21.Then, it in fluorescent plate 21, constitutes glimmering
The fluorophor of photosphere 22 is excited.As a result, from fluorophor radiofluorescence in fluorescence coating 22.The fluorescence not by fluorophor absorb and
Together in the exciting light that the back side of fluorescence coating 22 is reflected by reflecting layer 31, projected from the surface (fluorescence outgoing plane) of fluorescent plate 21
To outside, and inject to the outside of fluorescent light source device 10.
Moreover, in fluorescent light source device 10, due to being arranged between fluorescence coating 22 and reflecting layer 31 in fluorescent plate 21
There are the first oxide skin(coating) 33 and the first protective layer 32A, so even if the reflecting layer 31 is by the small silver of the adaptation to fluorescence coating 22
It is formed, high adaptation can be also obtained between fluorescence coating 22 and reflecting layer 31.In addition, the first protective layer 32A is disposed in
Between monoxide layer 33 and reflecting layer 31, first protective layer 32A is made of translucent material, and above-mentioned translucent material is by nitrogen
Compound or fluoride are formed, and impermeable peroxide and do not release oxygen, therefore even if fluorescent plate 21 can if having the first oxide skin(coating) 33
Prevent the oxidative degradation in the reflecting layer 31 caused by being provided with first oxide skin(coating) 33.
Therefore, according to fluorescent light source device 10, reflecting layer 31 can obtain high reflectivity, and the reflection for a long time
The stripping of layer 31 is inhibited.
In addition, in fluorescent light source device 10, since the first oxide skin(coating) 33 is by specific monofilm 34 and specific multilayer film
35 are constituted, so can prevent or the surface in reflecting layer 31 is fully inhibited to be exposed to moisture, and fluorescent plate 21 has more into one
Walk excellent high reflectivity energy.
In addition, in fluorescent light source device 10, due in fluorescent plate 21, together with the second oxide skin(coating) 37, this
The second protective layer 32B is provided between dioxide layer 37 and reflecting layer 31, so can prevent because being provided with second oxidation
The oxidative degradation in the reflecting layer 31 caused by nitride layer 37.
More than, the fluorescent light source device of the present invention, but the fluorescent light source device of the present invention are illustrated using specific example
It is without being limited thereto.
For example, fluorescent plate can also be formed with week made of multiple protrusions are periodically arranged on the surface of the fluorescent plate
Phase structure.Here, the periodic structure on the surface of fluorescent plate is such as general conical shape (specifically taper or pyramidal)
Structure made of protrusion is arranged with intensive state two-dimension periodic.In addition, there are the feelings of periodic structure on surface in fluorescent plate
Under condition, from the viewpoint of ease of manufacturing, preferably the fluorescent plate is laminated on the surface of fluorescence coating to exciting light and fluorescence
Periodic structure body layer with translucency.
In addition, the structure of fluorescent light source device entirety is not limited to structure shown in FIG. 1, various compositions can be used.For example,
Use the light of 1 excitation light source (such as semiconductor laser) but it is also possible to be excitation light source in the fluorescent light source device of Fig. 1
Have it is multiple, before fluorescence radiation component configure condenser, by focus irradiation in the form of fluorescence radiation component.In addition, excitation
Light is not limited to the light obtained by semiconductor laser, as long as the light of the fluorophor in fluorescent plate can be excited, then can both serve as reasons
Light made of the light that LED is obtained is assembled can also be the light obtained from the lamp for being sealed with mercury, xenon etc..In addition, using lamp or
In the case that the such radiation wavelengths of LED have the light source of width, the wavelength of exciting light is the region of main radiation wavelength.Only exist
It is not limited to this in the present invention.
Hereinafter, being illustrated to the experimental example of the present invention.
1 > of < experimental examples
Experiment is made with laminated body (hereinafter also referred to " reflection laminated body A ") is reflected, above-mentioned experiment is existed with reflection laminated body
The surface and the back side of the reflectance coating formed by silver are respectively formed with by aluminium oxide (Al2O3) formed metal oxide layer.
In addition, in reflecting laminated body A, instead of by aluminium oxide (Al2O3) formed metal oxide layer and make by being fluorinated
Magnesium (MgF2) metal fluoride layer that is formed makes the experiment reflecting layer of identical as reflection laminated body A composition in addition to this
Stack (hereinafter also referred to " reflection laminated body B ").That is, reflection laminated body B is on the surface and the back side of the reflectance coating formed by silver
It is respectively formed with magnesium fluoride (MgF2) metal fluoride layer laminated body.
Then, made reflection laminated body A and reflection laminated body the B light for being respectively 5 ° with angle of light are irradiated
Condition irradiation light carries out line reflection rate measurement, measures spectral reflectance.It the results are shown in Fig. 3.In figure 3, with dotted line table
Show the spectral reflectance of reflection laminated body A, the spectral reflectance of reflection laminated body B indicated by the solid line.
It is confirmed from the result of Fig. 3, the average value of the reflectivity for the light that the wavelength for reflecting laminated body A is 435~660nm is
96.8%, on the other hand, the average value of the reflectivity for the light that the wavelength for reflecting laminated body B is 435~660nm is 97.7%, because
The reflectivity of the luminance factor reflection laminated body A of this reflection laminated body B is about high by 1%.
From this result, impermeable peroxide is respectively set by the surface back side in the reflecting layer formed by silver and do not released
The protective layer of oxygen replaces setting oxide skin(coating), from fluorescent plate as power efficiency of fluorescence relative to exciting power ratio it is outer
Portion's quantum efficiency is 65% to 68.3%, bright 3.3%.
In addition distinguish:In the composition as the reflection laminated body B of the composition of the present invention, it will not occur to be formed by silver anti-
The stripping of layer is penetrated, high reflectivity can be maintained for a long time.
Claims (4)
1. a kind of fluorescent light source device, which is characterized in that it is that have excitation light incident surface and fluorescence outgoing plane by the same face structure
At fluorescent plate made of fluorescent light source device, wherein
The fluorescent plate is sequentially laminated with fluorescence coating, the first oxide skin(coating) and the reflecting layer formed by silver,
It is provided with the first protective layer between first oxide skin(coating) and the reflecting layer,
First protective layer is made of translucent material, and the translucent material is formed by nitride or fluoride.
2. fluorescent light source device according to claim 1, which is characterized in that
First oxide skin(coating) is made of at least one of oxide mono film and oxide multilayered film, the oxide
Monofilm is formed by aluminium oxide, and the oxide multilayered film constitutes layer and second by first and constitutes layer and formed, and described first is constituted
Layer is formed by silica, and the second composition layer is formed by titanium oxide.
3. the fluorescent light source device according to claim 1 or claim 2, which is characterized in that
In the reflecting layer with the face phase that is laminated with the fluorescence coating, first oxide skin(coating) and first protective layer
The second oxide skin(coating) is laminated on the side in the face tossed about,
It is provided with the second protective layer between second oxide skin(coating) and the reflecting layer,
Second protective layer is constituted by oxygen atom is non-containing material, the oxygen atom it is non-containing material by the molecular structure not
Compound containing oxygen atom is formed.
4. fluorescent light source device according to claim 3, which is characterized in that
Constitute second protective layer oxygen atom it is non-containing material by
Magnesium fluoride;
Silicon nitride;
Aluminium nitride;
Any metal in aluminium, chromium and nickel;
Or the alloy of aluminium, chromium and nickel
At least one of formed.
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| JP2016155523A JP6753202B2 (en) | 2016-08-08 | 2016-08-08 | Fluorescent light source device |
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| KR102249331B1 (en) | 2021-05-07 |
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