CN108672922A - A kind of laser carving device and method - Google Patents

A kind of laser carving device and method Download PDF

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Publication number
CN108672922A
CN108672922A CN201810410207.4A CN201810410207A CN108672922A CN 108672922 A CN108672922 A CN 108672922A CN 201810410207 A CN201810410207 A CN 201810410207A CN 108672922 A CN108672922 A CN 108672922A
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CN
China
Prior art keywords
laser
laser beam
microscope group
group
power regulator
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Application number
CN201810410207.4A
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Chinese (zh)
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CN108672922B (en
Inventor
赵盛宇
彭信翰
周宇超
林国栋
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Shenzhen Sea Star Laser Intelligent Equipment Ltd By Share Ltd
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Shenzhen Sea Star Laser Intelligent Equipment Ltd By Share Ltd
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Priority to CN201810410207.4A priority Critical patent/CN108672922B/en
Publication of CN108672922A publication Critical patent/CN108672922A/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material

Abstract

The present invention relates to a kind of laser carving device and methods, including laser, expands microscope group and focus microscope group, the laser beam that the laser is sent out is by expanding microscope group ingoing power adjuster, the power regulator other end, which is equipped with, focuses microscope group, and detection device and regulating device are also equipped in the focusing microscope group.Methods and apparatus of the present invention, laser output are stablized, and the engraving size on material is small, can be applied to the laser engraving on transparent material.

Description

A kind of laser carving device and method
Technical field
The present invention relates to laser technology field more particularly to a kind of laser carving device and methods.
Background technology
Laser engraving is to be radiated at material surface using the laser beam of high-energy, and the laser reflection of sub-fraction is most of Light by material surface, thermal energy is converted into material, to material heat, due to the fuel factor of material, material is sufficient The laser beam irradiation of power density, reaches the temperature of material surface fusing and vaporization, and material is made to vaporize or melt, and carves out required Figure and word, as permanent marks.
With the rapid development of electronic product, the visible area of electronic curtain becomes larger, can the space of hidden wiring or label get over Next smaller, the label size that existing laser engraving technique can be accomplished is larger, and naked eyes can still be realized, can not be used as on transparent material The label of visible area uses.
Invention content
The technical problems to be solved by the invention are to provide a kind of laser carving device and method, the label of engraving Size is smaller, stability is high, can be applied to the label creating of transparent material visible area.
Technical solution is used by the present invention solves above-mentioned technical problem:
A kind of laser carving device, including,
Laser and expand microscope group, the angle of divergence for expanding microscope group and changing the laser beam that the laser is sent out;
Power regulator, the power regulator receive by it is described expand microscope group after laser beam, adjust laser light The power of beam simultaneously feeds back to and expands microscope group, the angle of divergence for expanding microscope group and readjusting laser beam according to feedback data;
Microscope group is focused, the microscope group that focuses receives the laser beam by the power regulator and carried out to laser beam It focuses.
Detection device, the detection device detect the distance between the focusing microscope group and workpiece to be added;
The position for focusing microscope group is adjusted in regulating device, the regulating device;
The laser expands microscope group, power regulator and is arranged in order and connect with microscope group is focused.
In a preferred embodiment, galvanometer group is equipped between the power regulator and focusing microscope group, it is described to shake Microscope group receives the laser beam by the power regulator and changes the direction of laser beam, and the focusing microscope group, which receives, passes through The position of the focusing microscope group and/or galvanometer group is adjusted in laser beam after galvanometer group, the regulating device.
In a preferred embodiment, what the laser beam that the laser is sent out was sent out with the power regulator Laser beam is oriented parallel to X-axis, the laser beam that the laser beam that the galvanometer group is sent out is sent out with the focusing microscope group Be oriented parallel to Z axis and vertical with the finished surface of workpiece to be added.
In a preferred embodiment, by it is described expand microscope group after laser beam dispersion angle not less than not Into the dispersion angle of the laser beam for expanding microscope group, by it is described expand microscope group after the diameter of laser beam be not more than The diameter of the laser beam for expanding microscope group is not entered.
In a preferred embodiment, the diameter of the laser beam after the focusing microscope group, which is not more than, does not enter The diameter of the laser beam for focusing microscope group.
In a preferred embodiment, detection device detection focus between microscope group and the workpiece to be added away from From and feed back to the regulating device, the regulating device drives the galvanometer group and focuses the shifting that microscope group carries out X, Y or Z-direction It is dynamic.
In a preferred embodiment, the workpiece to be added is located at the laser beam after focusing microscope group At non-focus.
The present invention also provides a kind of laser carving methods, include the following steps,
S1:Adjust the spot diameter and dispersion angle of laser;
S2:Laser power is set, and filters extra laser energy;
S3:Laser beam is focused;
S4:Adjust the distance between laser and work piece;
S5:Laser engraving is carried out in the designated position of work piece.
In a preferred embodiment, between the step S2 and S3 further include the steps that deflection laser direction.
In a preferred embodiment, before executing step S4, the direction of the laser beam and workpiece to be added Finished surface it is vertical.
The beneficial effects of the invention are as follows:Present invention employs a kind of laser carving device and method, laser output is stablized, Engraving size on material is small, can be applied to the laser engraving on transparent material.
Description of the drawings
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is the laser carving device composed structure schematic diagram of one embodiment of the invention.
Specific implementation mode
The technique effect of the design of the present invention, concrete structure and generation is carried out below with reference to embodiment and attached drawing clear Chu is fully described by, to be completely understood by the purpose of the present invention, feature and effect.Obviously, described embodiment is this hair Bright a part of the embodiment, rather than whole embodiments, based on the embodiment of the present invention, those skilled in the art are not being paid The other embodiment obtained under the premise of creative work, belongs to the scope of protection of the invention.In addition, being arrived involved in patent All connection/connection relations, not singly refer to component and directly connect, and refer to can according to specific implementation situation, by addition or Couple auxiliary is reduced, to form more preferably coupling structure.Each technical characteristic in the present invention, before not conflicting conflict Putting can be with combination of interactions.
Fig. 1 is a kind of structure composition schematic diagram of laser carving device one embodiment of the present invention, referring to Fig.1, laser carving Engraving device includes laser 1, and for emitting the laser beam carved to machined part, what laser 1 was sent out swashs laser 1 For light light beam by expanding microscope group 2, it includes one or more beam expanding lens to expand microscope group 2, expands microscope group 2 and is expanded by one or more Being applied in combination for mirror can change laser beam divergent angle, and the focal length of laser beam is made to shorten, and spot diameter reduces, Spot diameter is reduced, to control the range that laser beam acts on material.Because of the diverging of the laser beam of laser output It is approximately definite value that angle is seized the opportunity with spot diameter, therefore the dispersion angle of laser beam and spot diameter are in inverse ratio, if the angle of divergence Original x times is expanded as, then spot diameter is the 1/x of original spot diameter, therefore in the expansion by beam expanding lens to laser beam The angle of divergence of Shu Hou, laser beam become larger, and spot diameter becomes smaller, and are focused to be more advantageous to.
Preferably, it expands and is additionally provided with optical coating (not shown) in microscope group 2, be applied to by the optical coating of customization After expanding microscope group 2, extra laser beam energy can be filtered, and the diameter of focal beam spot can be adjusted.
Then laser beam passes through galvanometer group 3, and laser beam can be directed to assigned direction by galvanometer group 3, in galvanometer group 3 Laser beam direction may be implemented by the way that speculum to be arranged to different angles including several speculum (not shown)s Deflection can adjust galvanometer group 3 according to the relative position of machined material and laser 1 in actual conditions with connection relation, will Laser beam is directed to assigned direction and position.The laser beam that laser 1 in the present embodiment is sent out is oriented parallel to X-axis, Laser beam after galvanometer group 3 is oriented parallel to Z axis and perpendicular to workpiece 5 to be added.Increase the angle of divergence by expanding microscope group 2 Laser beam using the direction of the launch of 3 deflecting laser beams of galvanometer group, be more advantageous to the focusing of laser beam.
Laser beam after the deflection of direction focuses microscope group 4 by laser beam focusing, line focus microscope group 4 by focusing microscope group 4 The ability of laser beam marginal incident to detector after focusing improves, incident flux becomes larger and light beam is more uniform, simultaneously Spot diameter becomes smaller, and laser beam is carved on workpiece 5 to be added later.
Preferably, detection device 9 and regulating device 10 are also equipped in galvanometer group 3, detection device 9 can measure focus lamp Group the distance between 4 and workpiece 5 to be added, and institute's measured data is fed back into regulating device 10, regulating device 10 is according to detection device 9 Institute's measured data is adjusted the position of both galvanometer group 3, focusing microscope group 4 or galvanometer group 3 and focusing microscope group 4 so as to be added The laser beam that workpiece 5 is carved meets production requirement, because of energy value highest of the laser beam at its focal position, therefore It is to be added to avoid laser beam when to machined part 5 are carved because the excessively high material to machined part of energy damages The position of workpiece 5 is preferably provided at the non-focus of the laser beam after over-focusing.
In addition, in the present invention expand microscope group 2 after be additionally provided with power regulator 7, power regulator 7 can control laser light The output energy and power of beam, and the energy of laser beam and power is made to keep stablizing, power regulator 7 is received from expanding microscope group 2 laser beams sent out, the laser beam energy during laser beam energy and actual process are required are compared, and by result Feed back to and expand microscope group 2, microscope group 2 is expanded according to feedback result adjusting, i.e., to the spot diameter of laser beam and dispersion angle into Row is adjusted, and the laser beam after overregulating is again introduced into power regulator 7, until meeting in actual process to laser beam energy The requirement of amount.It can ensure the constant output of laser beam energy by the laser beam of power regulator 7, therefore work as laser light When beam acts on workpiece 5 to be added, the working height and sphere of action of workpiece 5 to be added are stablized, and the matter of laser engraving has been effectively ensured Amount.
If not meeting process requirements still by focusing the laser beam spot diameter that microscope group 4 is sent out, may be repeated to expanding The adjustment of beam microscope group 2 and power regulator 7 resets laser power, is then adjusted in conjunction with detection device 9 and regulating device 10 It saves galvanometer group 3 and focuses microscope group 4, until laser beam meets actual process demand.
It is additionally provided with automatic focusing mechanism (not shown) in the present invention, can automatically confirm that engraving height, it is ensured that laser Light beam to machined part 5 engraving stability, it is preferred that may be selected to be precision be less than 1um high-precision laser auto-focusing system System.
The minimum dimension that existing laser engraving technique can be accomplished is 0.4mm ◇ 0.4mm, but the label size still can It is enough visually to be found, therefore can not be applied on transparent material, visible area is marked.The laser carving device of the present invention, Combination by that will expand microscope group 2, power regulator 7, galvanometer group 3, focusing microscope group 4 and detection device 9, regulating device 10 makes With the label size for making to act on work piece 5 is not more than 100um ◇ 100um, in the range not visible in naked eyes, therefore Solve size after existing laser acts on material cause greatly very much naked eyes it is visible and can not asking in smaller area engraved markings Topic.
The invention also discloses a kind of laser carving methods, and this approach includes the following steps,
S1:Adjust the spot diameter and dispersion angle of outgoing laser beams;
The spot diameter and dispersion angle of laser beam can be adjusted according to optical design in this step, reduces hot spot Diameter, to control sphere of action of the laser beam on workpiece to be added.
S2:Laser power is set, and filters extra laser energy, makes laser energy constant output;
This step for detecting in S1, after the adjustment after laser beam whether meet the laser power requirement of setting, and it is right The energy of laser beam is adjusted.
S3:Laser beam is focused;
Laser beam after line focus is more uniform, while spot diameter becomes smaller, and is conducive to laser carving to machined part It carves.
S4:Adjust the distance between laser and work piece;
The distance between laser beam and work piece need to be in a zone of reasonableness, if distance is too short, work piece is excited The influence of light light beam generates reaction force, influences to disperse energy to splatter cleaved products particle, if apart from too long, can make At unnecessary energy loss, therefore, the distance between laser beam and work piece should meet actual process requirement, and laser Light beam is in the energy highest of its focal point, and to avoid laser beam, material damages to machined part, can be by workpiece position to be added It installs at the non-focus of laser beam.
S5:Laser engraving is carried out in the designated position of work piece.
Preferably, it is additionally provided with deflection laser direction between step S2 and S3, the surface of laser beam and work piece is made to hang down Straight step the energy highest of laser beam and acts on work piece when laser beam is vertical with the surface of work piece The spot diameter on surface is minimum.When laser beam and surface to be machined out of plumb, deflecting operation need to be carried out to laser beam.
Step S1 and S2 cycles carry out, and step S3-S5 is carried out after reaching setting laser power requirement, are carrying out S5 steps Later, it if the spot diameter of laser beam is not up to technological requirement, needs to re-start step S1-S5, until meeting laser carving It carves and requires then to carry out step S6, and then complete laser engraving.
It is to be illustrated to presently preferred embodiments of the present invention, but the present invention is not limited to the embodiment above, Those skilled in the art can also make various equivalent variations or replacement under the premise of without prejudice to spirit of that invention, this Equivalent deformation or replacement are all contained in the application claim limited range a bit.

Claims (10)

1. a kind of laser carving device, which is characterized in that including,
Laser and expand microscope group, the angle of divergence for expanding microscope group and changing the laser beam that the laser is sent out;
Power regulator, the power regulator receive by it is described expand microscope group after laser beam, adjust laser beam Power simultaneously feeds back to and expands microscope group, the angle of divergence for expanding microscope group and readjusting laser beam according to feedback data;
Microscope group is focused, the microscope group that focuses receives the laser beam by the power regulator and gathers to laser beam It is burnt.
Detection device, the detection device detect the distance between the focusing microscope group and workpiece to be added;
The position for focusing microscope group is adjusted in regulating device, the regulating device;
The laser expands microscope group, power regulator and is arranged in order and connect with microscope group is focused.
2. laser carving device as described in claim 1, which is characterized in that set between the power regulator and focusing microscope group There is galvanometer group, the galvanometer group receives the laser beam by the power regulator and changes the direction of laser beam, described It focuses microscope group and receives the laser beam after galvanometer group, position of the regulating device to the focusing microscope group and/or galvanometer group It sets and is adjusted.
3. laser carving device as claimed in claim 2, which is characterized in that the laser beam that the laser is sent out with it is described The laser beam that power regulator is sent out is oriented parallel to X-axis, the laser beam that the galvanometer group is sent out and the focus lamp The laser beam that group is sent out is oriented parallel to Z axis and vertical with the finished surface of workpiece to be added.
4. laser carving device as described in claim 1, which is characterized in that by it is described expand microscope group after laser beam Dispersion angle is not less than the dispersion angle for not entering the laser beam for expanding microscope group, by it is described expand microscope group after laser The diameter of light beam is not more than the diameter for not entering the laser beam for expanding microscope group.
5. laser carving device as described in claim 1, which is characterized in that the laser beam after the focusing microscope group Diameter is not more than the diameter for not entering the laser beam for focusing microscope group.
6. laser carving device as claimed in claim 2, which is characterized in that detection device detection focus microscope group with it is described The distance between workpiece to be added simultaneously feeds back to the regulating device, the regulating device drive the galvanometer group and focus microscope group into The movement of row X, Y or Z-direction.
7. laser carving device as described in claim 1, which is characterized in that the workpiece to be added is located at described by focus lamp At the non-focus of laser beam after group.
8. a kind of laser carving method, which is characterized in that include the following steps,
S1:Adjust the spot diameter and dispersion angle of laser;
S2:Laser power is set, and filters extra laser energy;
S3:Laser beam is focused;
S4:Adjust the distance between laser and work piece;
S5:Laser engraving is carried out in the designated position of work piece.
9. laser carving method as claimed in claim 8, which is characterized in that further include that deflection swashs between the step S2 and S3 The step of light direction.
10. laser carving method as claimed in claim 8 or 9, which is characterized in that before executing step S4, the laser The direction of light beam is vertical with the finished surface of workpiece to be added.
CN201810410207.4A 2018-05-02 2018-05-02 Laser engraving device and method Active CN108672922B (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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CN108672922B CN108672922B (en) 2024-03-19

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114054972A (en) * 2020-12-17 2022-02-18 帝尔激光科技(无锡)有限公司 Dynamic focusing laser cutting method and device

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5748222A (en) * 1992-06-11 1998-05-05 Zed Instruments Ltd. Laser angroxing head employing acousto-optic modulator
US20030221570A1 (en) * 2002-05-31 2003-12-04 Campbell Jeffrey G. System and method for direct laser engraving of images onto a printing substrate
CN1593943A (en) * 2004-07-04 2005-03-16 华中科技大学 Laser internal engraving apparatus for transparent material
CN2734397Y (en) * 2004-11-02 2005-10-19 武汉众泰数码光电设备有限公司 Laser dual purpose machine for carving and cutting
CN104191089A (en) * 2014-09-11 2014-12-10 苏州菲镭泰克激光技术有限公司 Three-dimensional dynamic focusing marking system and method based on light beam output by laser device
CN106903438A (en) * 2015-12-22 2017-06-30 武汉奇致激光技术股份有限公司 The light path design control system and control method of laser etching machine
CN107695529A (en) * 2017-09-26 2018-02-16 大族激光科技产业集团股份有限公司 A kind of method and apparatus for making deep trouth on aluminium alloy using laser
CN107745589A (en) * 2017-09-28 2018-03-02 大族激光科技产业集团股份有限公司 A kind of laser marking machine and its marking method
CN208304138U (en) * 2018-05-02 2019-01-01 深圳市海目星激光智能装备股份有限公司 A kind of laser carving device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5748222A (en) * 1992-06-11 1998-05-05 Zed Instruments Ltd. Laser angroxing head employing acousto-optic modulator
US20030221570A1 (en) * 2002-05-31 2003-12-04 Campbell Jeffrey G. System and method for direct laser engraving of images onto a printing substrate
CN1593943A (en) * 2004-07-04 2005-03-16 华中科技大学 Laser internal engraving apparatus for transparent material
CN2734397Y (en) * 2004-11-02 2005-10-19 武汉众泰数码光电设备有限公司 Laser dual purpose machine for carving and cutting
CN104191089A (en) * 2014-09-11 2014-12-10 苏州菲镭泰克激光技术有限公司 Three-dimensional dynamic focusing marking system and method based on light beam output by laser device
CN106903438A (en) * 2015-12-22 2017-06-30 武汉奇致激光技术股份有限公司 The light path design control system and control method of laser etching machine
CN107695529A (en) * 2017-09-26 2018-02-16 大族激光科技产业集团股份有限公司 A kind of method and apparatus for making deep trouth on aluminium alloy using laser
CN107745589A (en) * 2017-09-28 2018-03-02 大族激光科技产业集团股份有限公司 A kind of laser marking machine and its marking method
CN208304138U (en) * 2018-05-02 2019-01-01 深圳市海目星激光智能装备股份有限公司 A kind of laser carving device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114054972A (en) * 2020-12-17 2022-02-18 帝尔激光科技(无锡)有限公司 Dynamic focusing laser cutting method and device

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Address after: 518110 301, Building B, Comlong Science Park, Guansheng 5th Road, Luhu Community, Guanhu Street, Longhua District, Shenzhen City, Guangdong Province (one photo multiple site enterprise)

Applicant after: Haimuxing Laser Technology Group Co.,Ltd.

Address before: 518000 Longhua New District, Shenzhen, Guangdong, 26 guanhuan Road, Guanlong street, Jun long community.

Applicant before: SHENZHEN HYMSON LASER INTELLIGENT EQUIPMENTS Co.,Ltd.

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