CN108664104B - Computer heat dissipation method and device - Google Patents
Computer heat dissipation method and device Download PDFInfo
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- CN108664104B CN108664104B CN201810470053.8A CN201810470053A CN108664104B CN 108664104 B CN108664104 B CN 108664104B CN 201810470053 A CN201810470053 A CN 201810470053A CN 108664104 B CN108664104 B CN 108664104B
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Abstract
The invention discloses a computer heat dissipation method and device, and belongs to the technical field of computers. The method is applied to a heat dissipation device, the heat dissipation device comprises a heat insulation water storage tank, a transit water tank, at least one water pump and a water bag, wherein the water bag is arranged on one side of a main board, the heat insulation water storage tank is arranged below the water bag, a water outlet at the bottom of the water bag is connected with the heat insulation water storage tank through a pipeline, and when the water temperature of the water bag is higher than a preset temperature, water in the heat insulation water storage tank is pumped into the transit water tank through the water pump; after the water in the heat-insulating water storage tank is pumped out, controlling a valve in a water outlet at the bottom of the water bag to be continuously opened for a first time; when the valve in the water outlet is continuously opened for a first time, closing the valve, and pumping water in the transit water tank into the water bag by using the water pump; the problem of utilize the work that the fan does not stop among the correlation technique to dispel the heat and produce the noise big is solved, reached the effect that reduces the noise that heat abstractor sent.
Description
Technical Field
The invention relates to the technical field of computers, in particular to a computer heat dissipation method and device.
Background
At present, computer technology is rapidly developed, and because a computer is used for a long time, the computer works for a long time, so that devices such as a case, a display, a CPU and the like of the computer are in a high-temperature state, the temperature is too high, the operation of a computer system is slow, and the normal work of a computer user is delayed. In the prior art, a fan is arranged in a case of a computer or on a display, so that the computer is cooled, but the fan works continuously, so that the vibration and noise are large in the working process, and the normal working environment of a user is influenced.
Disclosure of Invention
In order to solve the problem of loud noise caused by heat dissipation by using a fan in the prior art, the embodiment of the invention provides a computer heat dissipation method and a computer heat dissipation device. The technical scheme is as follows:
in a first aspect, a computer heat dissipation method is provided, where the method is applied to a heat dissipation device, the heat dissipation device includes a heat insulation water storage tank, a transit water tank, at least one water pump, and a water bag attached to one side of a motherboard, the heat insulation water storage tank is connected to the heat insulation water storage tank through a pipeline below the water bag and at a water outlet at the bottom of the water bag, and the method includes:
when the water temperature of the water bag is higher than the preset temperature, pumping water in the heat-insulation water storage tank into a transit water tank by using a water pump;
after the water in the heat-insulation water storage tank is pumped out, controlling a valve in the water outlet to be continuously opened for a first time;
and when the valve in the water outlet is continuously opened for a first time, closing the valve, and pumping the water in the transfer water tank into the water bag by using a water pump.
Optionally, the method further includes:
and when the valve in the water outlet is continuously opened for the first time, opening the heat dissipation port at the top of the heat insulation water storage tank, or displaying a prompt message for prompting to replace the water in the heat insulation water storage tank.
Optionally, the heat dissipation device is disposed in the chassis, a door is disposed at the bottom or below the chassis, and the door faces the heat insulation water storage tank.
Optionally, the heat dissipation device further includes a fan disposed toward the other side of the motherboard, and the method further includes:
determining a target wind speed of the fan according to the water temperature of the water bag, and controlling the fan to rotate according to the target wind speed;
and controlling the fan to rotate at a speed higher than the target wind speed in the process of pumping water in the heat-insulation water storage tank into the transfer water tank by using a water pump and in the process of continuously opening the valve in the water outlet for a first time.
Optionally, the heat dissipation device further includes a thermoelectric generation piece, an energy storage unit, and a fan, the fan is disposed toward the other side of the motherboard, a first surface of the thermoelectric generation piece contacts the water bag, a second surface of the thermoelectric generation piece contacts the motherboard, and the method further includes:
when the thermoelectric generation piece generates electricity, the electric energy generated by the thermoelectric generation piece is stored in an energy storage unit;
and when the thermoelectric generation piece stops generating power, the energy storage unit is controlled to supply power to the fan.
Optionally, the method further includes:
and when the temperature difference between the water temperature of the water bag and the water temperature of the heat-insulation water storage tank is higher than a preset temperature difference, the step of pumping the water in the heat-insulation water storage tank into the transfer water tank by using the water pump is executed.
Optionally, the method further includes:
calculating the temperature difference between the water temperature of the water bag and the water temperature of the heat insulation water storage tank;
and controlling the fan to rotate according to the target wind speed of the fan according to the temperature difference, wherein the target wind speed of the fan is in negative correlation with the temperature difference.
Optionally, a stirrer is arranged in the water bag, and after the water in the transit water tank is pumped into the water bag by using the water pump, the method further includes:
and controlling the stirrer to stir once every second time interval.
In a second aspect, a computer-readable storage medium is provided, in which one or more instructions are stored, and the one or more instructions, when executed by a processor in a computer heat dissipation device, implement the method for dissipating heat from a computer according to the first aspect and any of the embodiments of the first aspect.
In a third aspect, a computer heat sink is provided, the computer heat sink comprising:
a memory and a processor;
at least one program instruction is stored in the memory;
the processor is configured to load and execute the at least one program instruction to implement the method for dissipating heat from a computer according to the first aspect and any embodiment of the first aspect.
The technical scheme provided by the embodiment of the invention has the following beneficial effects:
the computer heat dissipation method is applied to a heat dissipation device, the heat dissipation device comprises a heat insulation water storage tank, a transit water tank, at least one water pump and a water bag attached to one side of a mainboard, the heat insulation water storage tank is arranged below the water bag, a water outlet in the bottom of the water bag is connected with the heat insulation water storage tank through a pipeline, and when the water temperature of the water bag is higher than a preset temperature, water in the heat insulation water storage tank is pumped into the transit water tank through the water pump; after the water in the heat-insulating water storage tank is pumped out, controlling a valve in a water outlet at the bottom of the water bag to be continuously opened for a first time; when the valve in the water outlet is continuously opened for a first time, closing the valve, and pumping water in the transit water tank into the water bag by using the water pump; the problem of utilize the work that the fan does not stop among the correlation technique to dispel the heat and produce the noise big is solved, reached the effect that reduces the noise that heat abstractor sent.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural view of a heat dissipation device according to an exemplary embodiment of the present invention;
fig. 2 is a flowchart of a method for dissipating heat of a computer according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a heat dissipation device according to an exemplary embodiment of the present invention, the heat dissipation device including: the heat-insulating water storage tank 10, the transit water tank 20, the at least one water pump 30 and the water bag 50 are arranged on one side of the main board 40, the heat-insulating water storage tank 10 is arranged below the water bag 50, a water outlet at the bottom of the water bag 50 is connected with the heat-insulating water storage tank 10 through a pipeline, the heat dissipation device further comprises a processor (not shown in the figure), and the heat dissipation device is arranged in the case 60. The processor is electrically connected to each of the water pump 30, the valves of the water outlet at the bottom of the water bag 50.
Optionally, the heat dissipation device further includes a fan (not shown), the fan is disposed toward the motherboard, but no water bag exists between the fan and the motherboard. For example, the fan is disposed toward the other side of the main board.
Optionally, the heat sink includes a battery for powering the electrical devices (e.g., the water pump, the processor, and the fan) in the heat sink.
Optionally, the heat dissipation device comprises a thermoelectric generation piece and an energy storage unit, wherein the first surface of the thermoelectric generation piece is in contact with the water bag, and the second surface of the thermoelectric generation piece is in contact with the main board. When the temperature difference exists between the temperature of the main board and the temperature of the water bag, the temperature difference power generation sheet generates power and stores the electric energy to the energy storage unit. Wherein the energy storage unit is used for supplying power to electric equipment (such as a water pump, a processor and a fan) in the heat dissipation device.
In one example, when the thermoelectric generation piece generates electricity, the electric energy generated by the thermoelectric generation piece is stored in the energy storage unit; and when the thermoelectric power generation piece stops generating power, the energy storage unit is controlled to supply power to the fan. The specific implementation can be as follows: an electronic switch is arranged between the energy storage unit and the fan; when the thermoelectric power generation piece generates power, the electronic switch is controlled to be opened; and when the thermoelectric generation piece stops generating electricity, the electronic switch is controlled to be closed.
Referring to fig. 2, a flowchart of a method for dissipating heat of a computer according to an embodiment of the present invention is shown, where the method is used in a processor of a heat dissipation apparatus. As shown in fig. 2, the method for dissipating heat of a computer may include:
and step 210, when the water temperature of the water bag is higher than the preset temperature, pumping the water in the heat-insulation water storage tank into a transit water tank by using a water pump.
The implementation of this step can be: a first temperature sensor is arranged in the water bag or on a preset surface of the water bag, wherein the preset surface is a surface of the water bag which is not in contact with the main board, and the first temperature sensor is used for detecting the temperature of the water bag; when the first temperature sensor detects that the water temperature of the water bag is higher than the preset temperature, the water in the heat-insulation water storage tank is pumped into the transfer water tank by the water pump.
The preset temperature can be set by a developer and can also be customized by a user, for example, a system developer can set the preset temperature to be 40 ℃.
In this embodiment, water in the water bag is used for cooling down the mainboard, and when the temperature in the water bag was higher than preset temperature, the effect of water in the water bag to the cooling of mainboard reduced, need will insulate against heat the water exchange in the water tank and the water bag this moment, utilizes the water of newly changing in the water bag to cool down the mainboard to guarantee the cooling effect, specifically realize looking into step 220 and step 230.
The first time length is set by a system developer, for example, the developer can determine the average time length required by all water in the water outlet bag to flow into the heat insulation water tank from the water outlet through a plurality of tests, and the set preset time length is greater than or equal to the average time length.
In summary, the method provided by the embodiment of the invention is applied to a heat dissipation device, the heat dissipation device comprises a heat insulation water storage tank, a transit water tank, at least one water pump, and a water bag attached to one side of a main board, the heat insulation water storage tank is arranged below the water bag, a water outlet at the bottom of the water bag is connected with the heat insulation water storage tank through a pipeline, and when the water temperature of the water bag is higher than a preset temperature, water in the heat insulation water storage tank is pumped into the transit water tank by the water pump; after the water in the heat-insulating water storage tank is pumped out, controlling a valve in a water outlet at the bottom of the water bag to be continuously opened for a first time; when the valve in the water outlet is continuously opened for a first time, closing the valve, and pumping water in the transit water tank into the water bag by using the water pump; the problem of utilize the work that the fan does not stop among the correlation technique to dispel the heat and produce the noise big is solved, reached the effect that reduces the noise that heat abstractor sent.
In one example, when the valve in the water outlet at the bottom of the water bag is continuously opened for a first time, the heat dissipation port at the top of the heat insulation water storage tank is opened to reduce the water temperature in the heat insulation water storage tank, so that the water temperature in the heat insulation water storage tank can be naturally cooled to room temperature, and when the temperature in the water bag is higher than a preset temperature later, the water in the heat insulation water storage tank and the water in the water bag are exchanged, and the mainboard is cooled by the newly exchanged water in the water bag, so that the cooling effect is ensured.
In one example, the heat dissipation device is arranged in a chassis, and a door is arranged at the bottom or below the chassis and faces the heat insulation water storage tank; in one example, when the valve in the water outlet at the bottom of the water bag is continuously opened for a first time, a prompt message for prompting to replace the water in the heat-insulation water storage tank is displayed, so that a user can open the box door to take out the heat-insulation water storage tank from the box according to the prompt message to replace the water in the heat-insulation water storage tank with the water with lower temperature.
In one example, when the water temperature of the water bag is higher than a preset temperature, a target wind speed of the fan is determined according to the water temperature of the water bag, the fan is controlled to rotate according to the target wind speed, and the target speed is positively correlated with the water temperature of the water bag so as to improve the heat dissipation speed of the mainboard; in the course of performing steps 210 to 230, the fan is controlled to rotate at a speed higher than the target wind speed. Therefore, the fan rotates only when the water bag cannot cool the mainboard, the heat of the mainboard is continuously dissipated, and the noise is limited.
In one example, a target wind speed of the fan is determined according to the water temperature of the water bag, the fan is controlled to rotate according to the target wind speed, and the target speed is positively correlated with the water temperature of the water bag so as to improve the heat dissipation speed of the mainboard; in the course of performing steps 210 to 230, the fan is controlled to rotate at a speed higher than the target wind speed. Therefore, when the water temperature of the water bag is lower than or equal to the preset temperature, the fan does not rotate to reduce noise; however, when the water temperature of the water bag is higher than the preset temperature, the water bag cannot play a role in cooling, the target wind speed of the fan is determined according to the water temperature of the water bag, the fan is controlled to rotate according to the target wind speed, and the fan is controlled to rotate in the water changing process, so that the effect of continuously radiating the mainboard is achieved, and the noise is limited.
In one example, a second temperature sensor is disposed in the heat-insulation water storage tank, and when the temperature difference between the water temperature of the water bag and the water temperature of the heat-insulation water storage tank is higher than a preset temperature difference, steps 210 to 220 are performed to cool the main board with water at a lower temperature.
In one example, the temperature difference between the water temperature of the water bag and the water temperature of the heat insulation water storage tank is calculated; and controlling the fan to rotate according to the target wind speed of the temperature difference fan, wherein the target wind speed of the fan is in negative correlation with the temperature difference. Therefore, the smaller the temperature difference between the water temperature of the water bag and the water temperature of the heat insulation water storage tank is, the higher the rotation speed of the fan is, so that the heat dissipation effect of the main board is improved; when the temperature difference between the water temperature of the water bag and the water temperature of the heat insulation water storage tank is larger, the rotating speed of the fan is smaller, and the generated noise is smaller.
In one example, a stirrer is arranged in the water bag and electrically connected with the processor, and after the water in the transit water tank is pumped into the water bag by the water pump, the stirrer is controlled to stir once every second time interval, so that the temperature of the water close to the mainboard is reduced, and the cooling effect of the water bag on the mainboard is improved. The first time period is usually set by a developer, and the second time period may be set to 5 seconds or 10 seconds, for example.
An embodiment of the present invention further provides a computer-readable storage medium, in which one or more instructions are stored, and when executed by a processor in a heat dissipation device, the one or more instructions implement the method for dissipating heat of a computer in any of the above embodiments.
An embodiment of the present invention further provides a computer heat dissipation device, including: a memory and a processor; at least one program instruction is stored in the memory; the processor is configured to load and execute the at least one program instruction to implement the computer heat dissipation method in any of the embodiments.
The terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying a number of the indicated technical features. Thus, a defined feature of "first", "second", may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
It will be understood by those skilled in the art that all or part of the steps for implementing the above embodiments may be implemented by hardware, or may be implemented by a program instructing relevant hardware, where the program may be stored in a computer-readable storage medium, and the above-mentioned storage medium may be a read-only memory, a magnetic disk or an optical disk, etc.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (9)
1. A computer heat dissipation method is characterized in that the method is applied to a heat dissipation device, the heat dissipation device comprises a heat insulation water storage tank, a transit water tank, at least one water pump, a fan and a water bag, the water bag is arranged on one side of a mainboard in an attached mode, the heat insulation water storage tank is arranged below the water bag, a water outlet in the bottom of the water bag is connected with the heat insulation water storage tank through a pipeline, the fan is arranged towards the other side of the mainboard, and the method comprises the following steps:
when the water temperature of the water bag is higher than a preset temperature, determining a target wind speed of the fan according to the water temperature of the water bag, and controlling the fan to rotate according to the target wind speed;
pumping water in the heat-insulation water storage tank into a transfer water tank by using a water pump;
after the water in the heat-insulation water storage tank is pumped out, controlling a valve in the water outlet to be continuously opened for a first time;
when the valve in the water outlet is continuously opened for a first time, closing the valve, and pumping water in the transfer water tank into the water bag by using a water pump;
and controlling the fan to rotate at a speed higher than the target wind speed in the process of pumping water in the heat-insulation water storage tank into the transfer water tank by using a water pump and in the process of continuously opening the valve in the water outlet for a first time.
2. The method of claim 1, further comprising:
and when the valve in the water outlet is continuously opened for the first time, opening the heat dissipation port at the top of the heat insulation water storage tank, or displaying a prompt message for prompting to replace the water in the heat insulation water storage tank.
3. The method of claim 1, wherein the heat sink is disposed in a cabinet, and a door is disposed at a bottom or below the cabinet, the door facing the insulated storage tank.
4. The method of claim 1, wherein the heat dissipation device further comprises a thermoelectric generation chip, an energy storage unit, and a fan, the fan being disposed toward the other side of the motherboard, a first side of the thermoelectric generation chip being in contact with the water bag, and a second side of the thermoelectric generation chip being in contact with the motherboard, the method further comprising:
when the thermoelectric generation piece generates electricity, the electric energy generated by the thermoelectric generation piece is stored in an energy storage unit;
and when the thermoelectric generation piece stops generating power, the energy storage unit is controlled to supply power to the fan.
5. The method of claim 1, further comprising:
and when the temperature difference between the water temperature of the water bag and the water temperature of the heat-insulation water storage tank is higher than a preset temperature difference, the step of pumping the water in the heat-insulation water storage tank into the transfer water tank by using the water pump is executed.
6. The method of claim 1, further comprising:
calculating the temperature difference between the water temperature of the water bag and the water temperature of the heat insulation water storage tank;
and controlling the fan to rotate according to the target wind speed of the fan according to the temperature difference, wherein the target wind speed of the fan is in negative correlation with the temperature difference.
7. The method of claim 1, wherein an agitator is provided in the water bag, and after the water in the transfer tank is pumped into the water bag by a water pump, the method further comprises:
and controlling the stirrer to stir once every second time interval.
8. A computer-readable storage medium having one or more instructions stored thereon, wherein the one or more instructions, when executed by a processor within a computer heat sink, implement the method of dissipating heat from a computer of any of claims 1 to 7.
9. A computer heat sink, comprising:
a memory and a processor;
at least one program instruction is stored in the memory;
the processor, when loaded and executing the at least one program instruction, implements the method for dissipating heat from a computer of any of claims 1 to 7.
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| CN201810470053.8A CN108664104B (en) | 2018-05-16 | 2018-05-16 | Computer heat dissipation method and device |
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| CN201810470053.8A CN108664104B (en) | 2018-05-16 | 2018-05-16 | Computer heat dissipation method and device |
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| CN206039410U (en) * | 2016-06-17 | 2017-03-22 | 内江师范学院 | Imitate water -cooled computer by force |
| CN107122030A (en) * | 2017-05-09 | 2017-09-01 | 华南理工大学 | A kind of work station thermo-electric generation heat dissipating method and its device |
| CN206773630U (en) * | 2017-05-08 | 2017-12-19 | 商丘市第一高级中学 | A kind of computer heat radiating device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20040008483A1 (en) * | 2002-07-13 | 2004-01-15 | Kioan Cheon | Water cooling type cooling system for electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3992894A (en) * | 1975-12-22 | 1976-11-23 | International Business Machines Corporation | Inter-active dual loop cooling system |
| CN204631710U (en) * | 2015-05-18 | 2015-09-09 | 宿州学院 | Water bag heat dissipation type notebook computer |
| CN205068278U (en) * | 2015-10-20 | 2016-03-02 | 承德石油高等专科学校 | Radiator system of computer |
| CN206039410U (en) * | 2016-06-17 | 2017-03-22 | 内江师范学院 | Imitate water -cooled computer by force |
| CN206773630U (en) * | 2017-05-08 | 2017-12-19 | 商丘市第一高级中学 | A kind of computer heat radiating device |
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Effective date of registration: 20230804 Address after: Building A, Building 308-1, Chuangyan Port, Changzhou Science and Education City, No. 18 Changwu Middle Road, Wujin District, Changzhou City, Jiangsu Province, 213000 Patentee after: Jiangsu Maiai Information Technology Co.,Ltd. Address before: 213164 No. 22, Ming Xin Road, Wujin District, Changzhou, Jiangsu. Patentee before: CHANGZHOU College OF INFORMATION TECHNOLOGY |