CN108650807A - A kind of socket can be used for Reflow Soldering - Google Patents
A kind of socket can be used for Reflow Soldering Download PDFInfo
- Publication number
- CN108650807A CN108650807A CN201810629019.0A CN201810629019A CN108650807A CN 108650807 A CN108650807 A CN 108650807A CN 201810629019 A CN201810629019 A CN 201810629019A CN 108650807 A CN108650807 A CN 108650807A
- Authority
- CN
- China
- Prior art keywords
- socket
- reflow soldering
- pin
- pcb board
- fixinig plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention discloses a kind of sockets can be used for Reflow Soldering, the socket includes contact pin, pin and insulation shell, the bottom of the insulation shell is equipped with positioning column and fixinig plate, and pcb board is equipped with pin pad hole and the location hole being adapted to the positioning column, the fixinig plate slot being adapted to the fixinig plate.Using the technical solution simple production process, production efficiency are improved.
Description
Technical field
The present invention relates to the fields PCB, more particularly to a kind of socket can be used for Reflow Soldering.
Background technology
The effect of PCB is support and interlinking electronic component, the pcb board after assembling passes through electronic component
In the attachment to pcb board of the SMT techniques such as Reflow Soldering, wave-soldering, to realize design function.
The attachment process of electronic component mainly has surface mount device (such as patch electronics, stamp-mounting-paper diode, patch three-level
Pipe, socket etc.), plug-in unit device (socket, capacitance, inductance), crimping device.Meet surface-pasted electronic component generally to pass through
Reflow soldering process is welded；And plug-in unit class component then need either manually or automatically plug-in component equipment be placed to corresponding position,
Then it is welded again by wave-soldering.As it can be seen that solder wave process process is more, comparatively laborious, inefficiency.
Socket is the important component of pcb board, it is connected to internal component, again can be with itself parts by harness
Other pcb boards be attached, additionally provide external interface and be attached with other parts, transmit power supply and signal message,
It is the bridge transmitted with inside and outside boundary's information.The socket bigger to certain volumes, traditional design scheme be socket is made it is slotting
Part encapsulates, as shown in Figure 1, socket is made of contact pin and glue shell, it is solid for socket weld that pad hole is designed on pcb board
It is fixed, in order to ensure that contact pin and pcb board welding are reliable by external impacts, vibration, need to design spiral shell on pcb board
Wire hole is tightly lockked glue shell with pcb board using screw, and such external force would not directly act in socket and pad hole.It is right
In the socket of plug-in unit encapsulation, its technological process is：1) socket is positioned on pcb board first with human hand or equipment, due to not having
In addition Design Orientation hole, so socket is to realize to align by contact pin and pad hole with pcb board, precision is poor, has larger
Deviation.2) it after socket is placed into pcb board, then is put on frock clamp, frock clamp is as transmission track is in wave-soldering stove
It is inside welded, just realizes being fixedly connected for socket and pcb board in this way.It 3) will be on screw locking to socket using screw electric screwdriver
Glue shell on.As it can be seen that the socket of plug-in unit encapsulation, production technology is complicated, and number of parts is more, and process portion relies on manual operations,
The degree of automation is not high, low production efficiency.Hardware Engineer is such as selected when exploitation design circuit board realizes specific function
Electronic component can carry out Reflow Soldering, single side or two-sided full surface mount be realized, then the production technology of pcb board will
Become simple, the degree of automation higher, production efficiency greatly promotes, and the circuit board stability for developing design is more preferable.
Invention content
The embodiment of the present invention is designed to provide a kind of socket can be used for Reflow Soldering so that simple production process, it is raw
Efficiency is produced to improve.
A kind of socket can be used for Reflow Soldering provided in an embodiment of the present invention, socket include contact pin, pin and insulation shell,
The bottom of the insulation shell is equipped with positioning column and fixinig plate, and pcb board is equipped with pin pad hole and is fitted with the positioning column
The location hole matched, the fixinig plate slot being adapted to the fixinig plate.
Optionally, the pin of the socket is equipped with insulating rear plug, is used to support, fixes and protects the pin.
Optionally, the top design of the pin is guide bevel structure, convenient for being inserted into the pcb board when reflow soldering
Pad hole.
Optionally, the shape of the pin is round, rectangle or square.
Optionally, the height that the pin stretches out the pcb board is 0.5mm~1.2mm.
Optionally, the pin bearing height >=0.3mm.
Optionally, the supplied materials mode of the socket is package or disk dress.
Optionally, the socket top surface is the surface for Reflow Soldering suction.
Optionally, the socket is equipped with absorption cap or suction sheet for Reflow Soldering suction.
Therefore using the present embodiment technical solution, since Reflow Soldering may be used in the socket so that production technology
Simply, production efficiency improves.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without having to pay creative labor, may be used also for those of ordinary skill in the art
With obtain other attached drawings according to these attached drawings.
Fig. 1 is socket structure schematic diagram in the prior art；
Fig. 2 is a kind of socket fractionation structural representation can be used for Reflow Soldering provided by the invention；
Fig. 3 is the socket overall structure side view that can be used for Reflow Soldering in Fig. 2；
Fig. 4 is a kind of pin configuration schematic diagram provided by the invention；
Fig. 5 is the socket overall structure vertical view that can be used for Reflow Soldering in Fig. 2.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without creative efforts
Embodiment shall fall within the protection scope of the present invention.
Embodiment：
The present embodiment provides a kind of sockets can be used for Reflow Soldering, as shown in Fig. 2, the socket 10 includes contact pin 11, draws
The bottom of foot 12 and insulation shell 13, the insulation shell 13 is equipped with positioning column 14 and fixinig plate 15, the pin of the socket 10
12 are equipped with insulating rear plug 16, are used to support, fix and protect the pin 12, as shown in figure 3, the support of the pin 12 is high
H >=0.3mm is spent, the height H that the pin 12 stretches out the pcb board is 0.5mm~1.2mm.The pcb board 20 is equipped with pin
Pad hole 21 and the location hole 22 being adapted to the positioning column 14, the fixinig plate slot 23 being adapted to the fixinig plate.Such as figure
Shown in 4, the top design of the pin 12 is guide bevel structure, convenient for being inserted into the pad of the pcb board 20 when reflow soldering
Hole 21.The shape of the pin is round, rectangle or square etc..It can be, but not limited to, 10 top surface 17 of the socket is to use
In the surface of Reflow Soldering suction, alternatively, can also be on the socket 10 additional increased one inhaled for Reflow Soldering
The absorption cap or suction sheet of mouth absorption.The supplied materials mode of the socket 10 is package or disk dress.The insulation shell 13 with absolutely
Edge rear plug 16 is all made of plastic cement material.The reflow soldering process of the socket 10 realizes that process includes paste solder printing, component mounter, returns
Fluid welding connects.
As it can be seen that as shown in figure 5, the socket 10 provides the positioning column 14 that can be used for positioning, in this way the socket 10 with
The pcb board 20 just can be positioned accurately, and the socket of traditional solder wave process, due to no positioning, socket often will appear
Deviation, production status are extremely unstable；There is fixinig plate 15 on the socket 10, the outer masterpiece that harness plug generates can be resisted after welding
With, be equivalent to lock screw fix；Insulating rear plug 16 1 on the socket 10 can support the pin 12 to make its bottom not
It can be in direct contact with the pcb board 20, ensure that the component body of the socket 10 will not push down tin cream and generate tin sweat(ing), recommend to draw
Foot bearing height >=0.3mm；Two, since 12 intensity of the pin is weaker, deformation to be easy tod produce in packaging and transportational process,
Cause the pin 12 that can not be directed at the pad hole 21 of the pcb board 20, can not weld, and can after increasing the insulating rear plug 16
To ensure the spacing of the pin 12 well, while the pin 12 also being protected to be unlikely to deform.The pin 12 stretches out described
The height of pcb board 20 wants small relative to the socket of wave soldering processes, and the pin 12 is recommended to stretch out the height of the pcb board 20
For 0.5mm~1.2mm.
To sum up, the socket simple production process of Reflow Soldering is can be used in the application, production efficiency improves, the degree of automation
Height is suitable for the socket of different pin numbers, is applicable not only to horizontal (180 °) socket, can equally be well applied to vertical (90 °)
Socket.In number of parts, the scheme compared to more traditional solder wave process has lacked screw；In production technology due to being and other electricity
Subcomponent carries out reflow soldering together, therefore simplifies production process, while decreasing and artificial placing socket and screw
Process reduces production cost.
Embodiments described above does not constitute the restriction to the technical solution protection domain.It is any in above-mentioned implementation
Modifications, equivalent substitutions and improvements etc., should be included in the protection model of the technical solution made by within the spirit and principle of mode
Within enclosing.
Claims (9)
1. a kind of socket can be used for Reflow Soldering, which is characterized in that socket includes contact pin, pin and insulation shell, the insulation
The bottom of shell is equipped with positioning column and fixinig plate, the positioning that pcb board is equipped with pin pad hole and is adapted to the positioning column
Hole, the fixinig plate slot being adapted to the fixinig plate.
2. a kind of socket can be used for Reflow Soldering as described in claim 1, which is characterized in that the pin of the socket is equipped with
Insulating rear plug is used to support, fixes and protects the pin.
3. a kind of socket can be used for Reflow Soldering as claimed in claim 2, which is characterized in that the top design of the pin is
Guide bevel structure, convenient for being inserted into the pad hole of the pcb board when reflow soldering.
4. a kind of socket can be used for Reflow Soldering as claimed in claim 3, which is characterized in that the shape of the pin is circle
Shape, rectangle or square.
5. a kind of socket can be used for Reflow Soldering as claimed in claim 4, which is characterized in that the pin stretches out the PCB
The height of plate is 0.5mm~1.2mm.
6. a kind of socket can be used for Reflow Soldering as claimed in claim 5, which is characterized in that the pin bearing height >=
0.3mm。
7. a kind of socket can be used for Reflow Soldering as claimed in claim 6, which is characterized in that the supplied materials mode of the socket is
Package or disk dress.
8. a kind of socket can be used for Reflow Soldering as described in any in claim 1-7, which is characterized in that the socket top surface
For the surface for Reflow Soldering suction.
9. a kind of socket can be used for Reflow Soldering as described in any in claim 1-7, which is characterized in that set on the socket
It is useful for the absorption cap or suction sheet of Reflow Soldering suction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810629019.0A CN108650807A (en) | 2018-06-19 | 2018-06-19 | A kind of socket can be used for Reflow Soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810629019.0A CN108650807A (en) | 2018-06-19 | 2018-06-19 | A kind of socket can be used for Reflow Soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108650807A true CN108650807A (en) | 2018-10-12 |
Family
ID=63752725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810629019.0A Pending CN108650807A (en) | 2018-06-19 | 2018-06-19 | A kind of socket can be used for Reflow Soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108650807A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465183A (en) * | 2020-03-30 | 2020-07-28 | 宁波市富来电子科技有限公司 | PCB with flat welding spots and welding method |
| CN114985886A (en) * | 2021-12-20 | 2022-09-02 | 上海一航凯迈光机电设备有限公司 | Automatic welding system of radar power module |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2819536Y (en) * | 2005-07-29 | 2006-09-20 | 番禺得意精密电子工业有限公司 | Socket connector |
| CN200962473Y (en) * | 2006-10-17 | 2007-10-17 | 莫列斯公司 | Overlapping jack electrical connector |
| CN201134545Y (en) * | 2007-12-29 | 2008-10-15 | 蔡添庆 | E-SATA electric connector |
| CN201285823Y (en) * | 2008-08-27 | 2009-08-05 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN202004176U (en) * | 2010-12-20 | 2011-10-05 | 环达电脑(上海)有限公司 | RJ45 socket |
| CN204966894U (en) * | 2015-09-06 | 2016-01-13 | 深圳华星通达科技有限公司 | On -vehicle plate connector |
-
2018
- 2018-06-19 CN CN201810629019.0A patent/CN108650807A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2819536Y (en) * | 2005-07-29 | 2006-09-20 | 番禺得意精密电子工业有限公司 | Socket connector |
| CN200962473Y (en) * | 2006-10-17 | 2007-10-17 | 莫列斯公司 | Overlapping jack electrical connector |
| CN201134545Y (en) * | 2007-12-29 | 2008-10-15 | 蔡添庆 | E-SATA electric connector |
| CN201285823Y (en) * | 2008-08-27 | 2009-08-05 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN202004176U (en) * | 2010-12-20 | 2011-10-05 | 环达电脑(上海)有限公司 | RJ45 socket |
| CN204966894U (en) * | 2015-09-06 | 2016-01-13 | 深圳华星通达科技有限公司 | On -vehicle plate connector |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465183A (en) * | 2020-03-30 | 2020-07-28 | 宁波市富来电子科技有限公司 | PCB with flat welding spots and welding method |
| CN111465183B (en) * | 2020-03-30 | 2023-03-17 | 宁波市富来电子科技有限公司 | PCB with flat welding spots and welding method |
| CN114985886A (en) * | 2021-12-20 | 2022-09-02 | 上海一航凯迈光机电设备有限公司 | Automatic welding system of radar power module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181012 |