CN108649409A - A kind of the substrate connection technique and substrate assembly of LED automobile headlamp - Google Patents
A kind of the substrate connection technique and substrate assembly of LED automobile headlamp Download PDFInfo
- Publication number
- CN108649409A CN108649409A CN201810398123.3A CN201810398123A CN108649409A CN 108649409 A CN108649409 A CN 108649409A CN 201810398123 A CN201810398123 A CN 201810398123A CN 108649409 A CN108649409 A CN 108649409A
- Authority
- CN
- China
- Prior art keywords
- substrate
- pad
- flexible base
- base board
- automobile headlamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
- F21W2102/10—Arrangement or contour of the emitted light
- F21W2102/13—Arrangement or contour of the emitted light for high-beam region or low-beam region
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
- F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The present invention relates to LED automobile headlamp manufacturing technology field more particularly to a kind of substrate connection techniques of LED automobile headlamp comprising following steps：A, first substrate and second substrate to be connected are set, first substrate includes the first pad, and second substrate includes the second pad；B, flexible base board is set, flexible base board includes the third pad and the 4th pad being electrically connected by means of substrate cabling；C, the first pad is made to be aligned and weld with third pad, the second pad is aligned and welds with the 4th pad.It is not high that the technique can solve the problems, such as to connect time-consuming, expense manpower, homogeneity of product between the substrate of the prior art and substrate, easy to produce.The present invention also provides a kind of substrate assemblies of LED automobile headlamp.
Description
Technical field
The present invention relates to LED automobile headlamp manufacturing technology field more particularly to a kind of substrate connection works of LED automobile headlamp
Skill and the substrate assembly for using the substrate connection technique of this kind of LED automobile headlamp to manufacture.
Background technology
Currently, well known LED automobile headlamp industry majority is using works such as copper base, aluminum substrate or PCB (printed circuit board)
Fixation for LED lamp bead and thermal conductivity medium, hereafter using substrate as general designation.LED lamp bead in LED automobile headlamp is by base
Circuit on plate is conductive, and the heat that LED lamp bead generates, which is conducted by substrate into the passage of heat of other high thermal conductivities, to be passed.But
It is that for common substrate since the characteristic of its material makes it that can not bend larger angle, the maximum angle theoretically bent is small
In 5 °, when needing to be electrically connected the substrate that two pieces of different locations are placed, current way is to need conductive substrate
On do pad, be welded on other substrates from pad extraction wire, pass through conducting wire realize electrical connection.But above-mentioned company
The method of connecing wastes time, and needs to consume more manpower, and structural stability is poor in use for conducting wire, is susceptible to circuit event
Barrier, and the consistency of product is not high, can not be produced in enormous quantities.
For this reason, it may be necessary to propose to improve for problems of the prior art.
Invention content
(1) technical problems to be solved
In order to solve the above problem of the prior art, the present invention provides a kind of substrate connection technique of LED automobile headlamp,
It is not high that it can solve the problems, such as to connect time-consuming, expense manpower, homogeneity of product between the substrate of the prior art and substrate, is convenient for
Production；The present invention also provides a kind of substrate assemblies that the substrate connection technique using this kind of LED automobile headlamp manufactures.
(2) technical solution
To achieve the above object, the main technical schemes that the present invention uses include：
The present invention provides a kind of substrate connection techniques of LED automobile headlamp comprising following steps：A, it is arranged and waits connecting
First substrate and second substrate, the first substrate include the first pad, the second substrate include the second pad；B, it is arranged
Flexible base board, the flexible base board include the third pad and the 4th pad being electrically connected by means of substrate cabling；C, make the first weldering
Disk is aligned and welds with third pad, and the second pad is aligned and welds with the 4th pad.
Further, the circuit of the flexible base board is disposed thereon surface, the electricity of the first substrate and second substrate
Road is disposed thereon surface, in step C, the upper table of the upper surface of the flexible base board and the first substrate and second substrate
Face makes the first pad be aligned with third pad relatively, the second pad is aligned with the 4th pad.
Further, in step C, make the upper surface of the flexible base board and the first substrate by means of welding fixture
It is opposite with the upper surface of second substrate, wherein the welding fixture includes bottom plate, cover board and clamp system, the first substrate
It is located in the upper surface of the bottom plate with second substrate, the flexible base board is located in the first substrate and second substrate
Top is located in the cover board top of the flexible base board, and the bottom plate and cover board are pressed from both sides by means of the clamp system
Tightly.
Further, the welding uses Reflow Soldering or wave-soldering.
Further, before step C, the brush tin cream on first pad and/or third pad, in second weldering
Brush tin cream on disk and/or the 4th pad.
The present invention also provides a kind of substrate assemblies of LED automobile headlamp comprising first substrate, second substrate and flexibility
Substrate；The first substrate include the first pad, the second substrate include the second pad, the flexible base board include by means of
The third pad and the 4th pad of substrate cabling electrical connection；First pad and third pad solder, second pad with
4th pad solder.
Further, the circuit of the flexible base board is disposed thereon surface, the electricity of the first substrate and second substrate
Road is disposed thereon surface, and the upper surface of the flexible base board is opposite with the upper surface of the first substrate and second substrate.
Further, can be in that arbitrary angle situation is arranged between the first substrate and second substrate.
(3) advantageous effect
The beneficial effects of the invention are as follows：
It is attached compared with the existing technology using two pieces of substrates of conducting wire pair, LED automobile headlamp provided by the present invention
Substrate connection technique is used as conducting medium realization being electrically connected between two pieces of substrates by introducing flexible base board, by flexible base board
It connects so that the homogeneity of product produced is high, and uniform specification, more suitable applications are in batch production.
In the preferred scheme, a kind of welding fixture is provided, it can be rapidly to first substrate, by welding fixture
Two substrates and flexible base board carry out relative positioning, also allow for the progress subsequently welded, further increase the one of the product produced
Cause property also allows for improving production efficiency.
In the preferred scheme, welding is realized using Reflow Soldering or wave-soldering, no longer needs to use people as in the prior art
Work is welded, and human cost can be reduced, and improves production efficiency.
The present invention also provides manufacture obtained substrate assembly using above-mentioned technique.In the preferred scheme, flexible base
The upper surface of plate is opposite with the upper surface of the first substrate and second substrate, external metallization structure can be effectively prevent to cause in this way
Solder joint short circuit, improves the reliability and quality of product.
Description of the drawings
Fig. 1 is the structure schematic diagram before the substrate assembly of the LED automobile headlamp of the present invention is not connected；
Fig. 2 is the structural representation when another angle is observed after the substrate assembly of the LED automobile headlamp of the present invention connects
Schematic diagram；
Fig. 3 is structure schematic diagram of the welding fixture in clamping operation.
【Reference sign】
1- first substrates, the first pads of 11-；
2- second substrates, the second pads of 21-；
3- flexible base boards, 31- thirds pad, the 4th pads of 32-；
4- scolding tin；
51- bottom plates, 52- cover boards, 53- clamp systems, 54- substrates positioning column, 55- flexible base boards positioning column, 56- cover boards are fixed
Position column.
Specific embodiment
In order to preferably explain the present invention, in order to understand, below in conjunction with the accompanying drawings, by specific embodiment, to the present invention
It is described in detail.
The present invention provides a kind of substrate connection techniques of LED automobile headlamp, as depicted in figs. 1 and 2 comprising following step
Suddenly：A, first substrate 1 to be connected and second substrate 2 be set, first substrate 1 includes the first pad 11, and second substrate 2 includes the
Two pads 21；B, flexible base board 3 is set, flexible base board 3 includes the third pad 31 and the 4th being electrically connected by means of substrate cabling
Pad 32；C, the first pad 11 is made to be aligned and weld with third pad 31, the second pad 21 is aligned and welds with the 4th pad 32.
Preferably, before step C, the brush tin cream on the first pad 11 and/or third pad 31, in the second pad 12
And/or the 4th brush tin cream on pad 32.Above brush tin cream on so-called first pad 11 and/or third pad 31, the second weldering
Brush tin cream on disk 21 and/or the 4th pad 32 refers to：Can on the first pad 11 or third pad 31 brush tin cream, Huo Zhe
Equal brush tin cream on one pad 11 and third pad 31；Can on the second pad 21 or the 4th pad 32 brush tin cream or second
Equal brush tin cream on pad 21 and the 4th pad 32.
Based on above-mentioned step, the substrate connection technique of LED automobile headlamp provided by the present invention is by introducing flexible base
Plate 3 is used as electrical connection of the conducting medium realization between two pieces of substrates so that the product produced is consistent by flexible base board 3
Property it is high, uniform specification, more suitable applications are in batch production.
Flexible base board used by herein preferably uses flexible PCB in the prior art (Flexible Printed
Circuit abbreviation FPC), it is that there is height reliability as one kind made of base material using polyimides or polyester film, it is excellent
Flexible printed circuit.Have the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good.
In the present embodiment, the circuit of flexible base board 3 is disposed thereon surface, the circuit of first substrate 1 and second substrate 2
It is disposed thereon surface, in step C, the upper surface of flexible base board 3 is opposite with the upper surface of first substrate 1 and second substrate 2.
External metallization structure can be effectively prevent to cause solder joint short-circuit in this way, improve the reliability and quality of product.
In the present embodiment, welding fixture is set, upper surface and the first substrate of flexible base board 3 are made by means of welding fixture
1 is opposite with the upper surface of second substrate 2.Wherein, as shown in figure 3, welding fixture includes bottom plate 51, cover board 52 and clamp system
53, it is preferable that bottom plate 51 is provided with substrate positioning column 54, flexible base board positioning column 55 and cover board positioning column 56.1 He of first substrate
Second substrate 2 is located in the upper surface of bottom plate 51 by substrate positioning column 54.Flexible base board 3 is fixed by flexible base board positioning column 55
Position is in the top of first substrate 1 and second substrate 2.Cover board 52 is located in the top of flexible base board 3 by cover board positioning column 56.This
Sample forms the layered relationship of bottom plate 51- first substrates 1 and second substrate 2- flexible base board 3- cover boards 52, Zhi Houzai from below to up
Bottom plate 51 and cover board 52 are clamped by clamp system 53, with realize flexible base board 3 respectively with first substrate 1 and second substrate
2 clamping.After the completion of clamping, then to flexible base board 3 and first substrate 1 carry out welding and to flexible base board 3 and second substrate 2 into
Row welding.Preferably, fastening spring can be selected in clamp system 53.
In the present embodiment, welding uses Reflow Soldering or wave-soldering.Welding is realized using Reflow Soldering or wave-soldering, is no longer needed to
As in the prior art using manually being welded, human cost can be reduced, improves production efficiency.
The present invention also provides a kind of substrate assemblies of the LED automobile headlamp based on above-mentioned technique, as shown in Figure 1, it is wrapped
Include first substrate 1, second substrate 2 and flexible base board 3；First substrate 1 includes the first pad 11, and second substrate 2 includes the second weldering
Disk 21, flexible base board 3 include the third pad 31 and the 4th pad 32 being electrically connected by means of substrate cabling；First pad 11 and
Three pads 31 weld, and the second pad 21 and the 4th pad 32 weld.Scolding tin 4 be located at the first pad 11 and third pad 31 it
Between between the second pad 21 and the 4th pad 32.
Based on above-mentioned structure, the first substrate 1 and second in the substrate assembly of LED automobile headlamp provided by the present invention
Formed angle can be 0-180 ° cavity between, first substrate 1 and second substrate 2 can be placed on different positions and phase
It is mutually different angles；Using flexible base board 3 instead of traditional conducting wire as the company between first substrate 1 and second substrate 2
Connect medium so that the homogeneity of product produced is high, uniform specification.
In the present embodiment, as shown in Fig. 2, the circuit of flexible base board 3 is disposed thereon surface, first substrate 1 and second
The circuit of substrate 2 is disposed thereon surface, the upper surface phase of the upper surface and first substrate 1 and second substrate 2 of flexible base board 3
It is right.External metallization structure can be effectively prevent to cause solder joint short-circuit in this way, improve the reliability and quality of product.
In the present embodiment, the first pad and the second pad are pad to be connected on first substrate and second substrate, this hair
It is bright that its quantity is not limited.It will be appreciated that multigroup first pad and the second pad can also be by one or more soft
Property substrate is attached.
In the absence of conflict, the feature in the above embodiments and embodiment can be combined with each other.
It is to be appreciated that describing the skill simply to illustrate that the present invention to what specific embodiments of the present invention carried out above
Art route and feature, its object is to allow those skilled in the art to can understand the content of the present invention and implement it accordingly, but
The present invention is not limited to above-mentioned specific embodiments.Every various change made within the scope of the claims is repaiied
Decorations should all be covered within the scope of the present invention.
Claims (8)
1. a kind of substrate connection technique of LED automobile headlamp, it is characterised in that include the following steps：
A, first substrate and second substrate to be connected are set, the first substrate includes the first pad, the second substrate packet
Include the second pad；
B, flexible base board is set, the flexible base board includes the third pad and the 4th pad being electrically connected by means of substrate cabling；
C, the first pad is made to be aligned and weld with third pad, the second pad is aligned and welds with the 4th pad.
2. the substrate connection technique of LED automobile headlamp according to claim 1, it is characterised in that：The flexible base board
Circuit is disposed thereon surface, and the circuit of the first substrate and second substrate is disposed thereon surface, described in step C
The upper surface of flexible base board is opposite with the upper surface of the first substrate and second substrate and makes the first pad and third pad pair
Accurate, the second pad is aligned with the 4th pad.
3. the substrate connection technique of LED automobile headlamp according to claim 2, it is characterised in that：In step C, by
Keep the upper surface of the flexible base board opposite with the upper surface of the first substrate and second substrate in welding fixture, wherein
The welding fixture includes bottom plate, cover board and clamp system,
The first substrate and second substrate are located in the upper surface of the bottom plate, the flexible base board is located in described
The top of one substrate and second substrate is located in the cover board top of the flexible base board, by means of the clamp system
The bottom plate and cover board are clamped.
4. the substrate connection technique of LED automobile headlamp according to claim 1, it is characterised in that：The welding uses back
Fluid welding or wave-soldering.
5. the substrate connection technique of LED automobile headlamp according to claim 1, it is characterised in that：Before step C,
Brush tin cream on first pad and/or third pad, the brush tin cream on second pad and/or the 4th pad.
6. a kind of substrate assembly of LED automobile headlamp, it is characterised in that：Including first substrate, second substrate and flexible base board；Institute
It includes the first pad to state first substrate, and the second substrate includes the second pad, and the flexible base board includes being walked by means of substrate
The third pad and the 4th pad of line electrical connection；First pad and third pad solder, second pad and the 4th weldering
Disk welds.
7. the substrate assembly of LED automobile headlamp according to claim 6, it is characterised in that：The circuit of the flexible base board
It is disposed thereon surface, the circuit of the first substrate and second substrate is disposed thereon surface, the upper table of the flexible base board
Face is opposite with the upper surface of the first substrate and second substrate.
8. the substrate assembly of LED automobile headlamp according to claim 6, it is characterised in that：The first substrate and second
Can be in that arbitrary angle situation is arranged between substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810398123.3A CN108649409B (en) | 2018-04-28 | 2018-04-28 | Substrate connecting process and substrate assembly of L ED automobile headlamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810398123.3A CN108649409B (en) | 2018-04-28 | 2018-04-28 | Substrate connecting process and substrate assembly of L ED automobile headlamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108649409A true CN108649409A (en) | 2018-10-12 |
| CN108649409B CN108649409B (en) | 2020-07-14 |
Family
ID=63748132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810398123.3A Active CN108649409B (en) | 2018-04-28 | 2018-04-28 | Substrate connecting process and substrate assembly of L ED automobile headlamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108649409B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114799388A (en) * | 2022-04-15 | 2022-07-29 | 深圳市子轩光电子科技有限公司 | Horizontal welding process for bridging flexible lamp strip |
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|---|---|---|---|---|
| CN101083878A (en) * | 2006-05-29 | 2007-12-05 | 深圳飞通光电子技术有限公司 | Method for welding FPC plate with PCB plate and its dedicated clamp |
| CN201243101Y (en) * | 2008-06-04 | 2009-05-20 | 天瑞电子科技发展(昆山)有限公司 | Improved connection structure of electronic product |
| CN101589319A (en) * | 2006-09-19 | 2009-11-25 | 揖斐电株式会社 | Optical interconnect device and method for manufacturing the same |
| CN105449476A (en) * | 2015-12-29 | 2016-03-30 | 广东欧珀移动通信有限公司 | Circuit board connection assembly and mobile terminal |
| CN205842455U (en) * | 2016-07-19 | 2016-12-28 | 上海小糸车灯有限公司 | A kind of OLED module connecting structure for electrical equipment for automobile lamp illumination |
-
2018
- 2018-04-28 CN CN201810398123.3A patent/CN108649409B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101083878A (en) * | 2006-05-29 | 2007-12-05 | 深圳飞通光电子技术有限公司 | Method for welding FPC plate with PCB plate and its dedicated clamp |
| CN101589319A (en) * | 2006-09-19 | 2009-11-25 | 揖斐电株式会社 | Optical interconnect device and method for manufacturing the same |
| CN201243101Y (en) * | 2008-06-04 | 2009-05-20 | 天瑞电子科技发展(昆山)有限公司 | Improved connection structure of electronic product |
| CN105449476A (en) * | 2015-12-29 | 2016-03-30 | 广东欧珀移动通信有限公司 | Circuit board connection assembly and mobile terminal |
| CN205842455U (en) * | 2016-07-19 | 2016-12-28 | 上海小糸车灯有限公司 | A kind of OLED module connecting structure for electrical equipment for automobile lamp illumination |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114799388A (en) * | 2022-04-15 | 2022-07-29 | 深圳市子轩光电子科技有限公司 | Horizontal welding process for bridging flexible lamp strip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108649409B (en) | 2020-07-14 |
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