CN108649003B - Wafer manufacturing device of solar cell - Google Patents
Wafer manufacturing device of solar cell Download PDFInfo
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- CN108649003B CN108649003B CN201810490229.6A CN201810490229A CN108649003B CN 108649003 B CN108649003 B CN 108649003B CN 201810490229 A CN201810490229 A CN 201810490229A CN 108649003 B CN108649003 B CN 108649003B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000003825 pressing Methods 0.000 claims abstract description 24
- 238000007906 compression Methods 0.000 claims description 26
- 230000006835 compression Effects 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 abstract description 27
- 239000000463 material Substances 0.000 abstract description 14
- 238000003754 machining Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 113
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention belongs to the technical field of solar cell manufacturing, in particular to a wafer manufacturing device of a solar cell, which comprises an upper mounting plate, an electric cylinder, a first motor, a pressurizing device, a die frame, a lifting component, a driver and a heater, wherein the end of a cylinder rod of the electric cylinder is fixedly connected with the non-output end of the first motor; the end of the rotating shaft of the first motor is fixedly connected with a pressurizing device; the end of the rotating shaft of the first motor is fixedly connected to the upper part of the middle part of the first bracket; a pressing roller is rotatably arranged below the first bracket; the electric cylinder drives the pressing roller driven by the motor, so that the situation that materials are accumulated in the wafer rolling process is avoided, and the uniform density of the rolled wafer is ensured; through set up the expansion plate in mould cavity lateral wall periphery, realized that the fused wafer is once only promoted the back by the lift part, sustainable constantly rolled, has improved the machining efficiency of wafer.
Description
Technical Field
The invention belongs to the technical field of solar cell manufacturing, and particularly relates to a wafer manufacturing device of a solar cell.
Background
The wafer refers to a silicon chip used for manufacturing a silicon semiconductor integrated circuit, the wafer is a carrier used for producing the integrated circuit, and the wafer generally refers to a monocrystalline silicon wafer. Wafers are the most commonly used semiconductor materials, and are classified into 4-inch, 5-inch, 6-inch, 8-inch, and so on, according to their diameters, and recently 12-inch and even larger sizes are developed. The larger the wafer is, the more ICs can be produced on the same wafer, so that the cost can be reduced; but the requirements on material technology and production technology are higher, such as problems of uniformity and the like. Generally, the larger the diameter of the silicon wafer is, the better the technology is in the wafer factory, and the yield is an important condition in the process of producing the wafer; firstly, a monocrystalline silicon blank is sliced and processed into a wafer with the thickness of about 300 mu m, and the surface of the wafer is corroded by liquid medicine to remove processing deformation on the surface, so that the wafer serving as a solar cell can be obtained; the wafer is subjected to impurity diffusion treatment to form a pn junction on one side of the wafer, then electrodes are mounted on both sides, and finally an antireflection film for reducing light energy loss due to reflection of light is adhered to the incident side surface of sunlight, thereby completing a solar cell. The power generation efficiency of a solar cell is influenced by the density and purity of silicon, but in the conventional method, there is a limit to increase in the wafer density, and thus there is a problem that it is difficult to increase the solar power generation efficiency.
Some technical solutions for manufacturing wafers of solar cells have been proposed in the prior art, and for example, a chinese patent with application number 200980126879.1 discloses a wafer manufacturing apparatus of solar cell units and a wafer manufacturing method using the same, including: a mold in which a mold corresponding to the shape of a wafer for manufacturing a solar cell is formed; a lifting member which is provided to the mold so as to be capable of being lifted up and down, and which lifts up the wafer material when the mold is filled with the molten wafer material; a driver for lifting or lowering the lifting member; and a pressurizing device for pressurizing the wafer raw material filled in the casting mold, so that the melted wafer raw material is extruded in the process of solidification, and the density is increased. According to the technical scheme, the wafer is extruded and molded, the density of the wafer is improved, but the technical scheme can roll the material on the upper surface of the wafer to one side, so that the density of the processed wafer is not uniform, and the quality of the wafer is directly reduced; the edge of the die cavity of the die has the residues scattered by the wafer, so that the processing materials are wasted; the intermittent rolling of the wafer has low rolling efficiency.
Disclosure of Invention
In order to make up the defects of the prior art, the wafer manufacturing device for the solar cell provided by the invention has the advantages that the electric cylinder drives the pressing roller driven by the motor, so that the situation that materials are accumulated in the wafer rolling process is avoided, and the uniform density of the rolled wafer is ensured; meanwhile, the pressing roller is driven by the electric cylinder to continuously move downwards, and then the wafer is continuously rolled.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention relates to a wafer manufacturing device of a solar cell, which comprises an upper mounting plate, an electric cylinder, a first motor, a pressurizing device, a die frame, a lifting component, a driver and a heater, wherein the lower surface of the upper mounting plate is fixedly connected with an electric cylinder base; the end of the cylinder rod of the electric cylinder is fixedly connected with the non-output end of the first motor; the end of the rotating shaft of the first motor is fixedly connected with a pressurizing device; the pressing device comprises a pressing roller and a first bracket; the end of the rotating shaft of the first motor is fixedly connected to the upper part of the middle part of the first bracket; a pressing roller is rotatably arranged below the first bracket; a die is arranged below the pressure roller; the lower part of the mould is fixedly connected with the upper end of the mould erecting plate; the lower end of the vertical plate of the die frame is fixedly connected with the upper surface of the bottom plate of the die frame; the upper part of the middle part of the die frame is fixedly connected with the lower end of the driver; a lifting component is arranged above the driver, and the driver controls the lifting component to move up and down; the lifting part slides in the die cavity; a heater is arranged in the die; the heater is used for heating the wafer in the cavity; when the melted wafer is filled in the die cavity, the driver controls the lifting part to lift the wafer, and the heater heats the wafer; the first motor rotates to drive the pressurizing device to rotate, the electric cylinder drives the first motor and the pressurizing device to move downwards, when a pressurizing roller on the pressurizing device contacts the upper surface of the wafer, the wafer is rotationally rolled by the pressurizing roller, the wafer is not subjected to material accumulation in the rolling process due to the rotational rolling, and the uniform density of the rolled wafer is ensured; the pressure roll also moves downwards continuously under the drive of the electric cylinder when rolling, and continuous rolling of the wafer is realized.
Preferably, a rectangular groove is formed in the periphery of the side wall of the mold cavity; a telescopic plate is arranged in the rectangular groove in a sliding manner; the side walls of the telescopic plates are combined into the side wall of the mold cavity, and the telescopic plates can be stretched up and down; the lifting part slides in a cavity formed by the side walls of the telescopic plates; after the melted wafer is lifted by the lifting part at one time, the periphery of the wafer is surrounded by the expansion plates so as not to overflow the die cavity; the wafer is rolled to continuous downwardly rotating behind the impression roller contact wafer upper surface, and the wafer is continuous by the compression, and the height of wafer constantly reduces, and when the impression roller pressed on the expansion plate, the expansion plate moved down, and after the impression roller moved away, the expansion plate upwards moved again, continued to surround the wafer, guaranteed that the wafer is once only promoted the back, sustainable constantly rolled, has improved the machining efficiency of wafer.
Preferably, one end of the expansion plate is arranged to be a ball head; a cylindrical blind hole is formed in the inner part of the head end of the telescopic plate, a closing-in is arranged above the cylindrical blind hole, a through hole is formed below the bottom of the blind hole, and compressed gas is introduced into the through hole; hollow balls are arranged in the cylindrical blind holes; a spring is arranged below the hollow ball; the hollow ball can slide in the cylindrical blind hole, but the hollow ball is closed and blocked in the cylindrical blind hole; an arc-shaped elastic sheet is arranged on one side above the hollow ball; the arc-shaped elastic sheet is fixedly connected to the end head of the expansion plate; when the pressing roller contacts the upper surface of the wafer, the pressing roller presses the arc-shaped elastic sheet, the arc-shaped elastic sheet presses the hollow ball after being deformed, the hollow ball moves downwards, compressed gas in the telescopic plate flows out from a gap between the hollow ball and the closed opening, and the telescopic plate moves downwards; after the pressing roller is moved away, the hollow ball is blocked and closed up under the action of the spring force, and the compressed air pushes the expansion plate to move upwards.
Preferably, the surface of the lifting component close to one side of the telescopic plate is provided with a first sliding groove and a second sliding groove; the first sliding groove is arranged above the second sliding groove, and a sponge block is arranged in the first sliding groove; one end of the sponge block is in contact with the side wall of the telescopic plate, and the other end of the sponge block is provided with a spring; a brush plate is arranged in the second sliding groove; the brush surface of the brush plate is contacted with the telescopic plate, and the non-brush surface of the brush plate is provided with a spring; when the telescopic plate moves up and down, the side wall of the telescopic plate close to one side of the mold cavity is cleaned by the brush plate and the sponge; the sponge block and the spring on one side of the brush plate enable the sponge and the brush to be in close contact with the side wall of the telescopic plate, and effective cleaning is guaranteed; the expansion plate moves upwards, and the sponge in the first sliding groove cleans the expansion plate side wall brushed by the brush again, so that the cleanness of the expansion plate side wall is further ensured.
Preferably, the two end faces of the first bracket are fixedly connected with the inner side wall of the auxiliary roller bracket; the auxiliary roller support is annular, and two auxiliary compression rollers are rotatably arranged on the inner side wall of the auxiliary roller support; the cylindrical surface of the auxiliary compression roller is provided with a tooth-shaped groove, and the rolling plane of the auxiliary compression roller is higher than that of the compression roller, so that the compression roller can be leveled after being rolled by the auxiliary compression roller; the auxiliary compression roller is driven by a motor to rotate; when the secondary compression roller rolls the upper surface of the wafer, the motor drives the secondary compression roller to rotate, and the tooth profile on the cylindrical surface of the secondary compression roller can push the contacted wafer backwards, so that the situation that the material of the wafer is pushed in the rolling direction in the rolling process is avoided, and the density of the rolled wafer is further uniform.
The invention has the following beneficial effects:
1. according to the invention, the electric cylinder drives the pressing roller driven by the motor, so that the situation that materials are accumulated in the wafer rolling process is avoided, and the uniform density of the rolled wafer is ensured; meanwhile, the pressing roller is driven by the electric cylinder to continuously move downwards, and then the wafer is continuously rolled.
2. According to the invention, the telescopic plates are arranged on the periphery of the side wall of the die cavity, so that the melted wafer can be continuously rolled after being lifted by the lifting part at one time, and the processing efficiency of the wafer is improved.
3. According to the invention, the sponge and the hairbrush are arranged on the surface of the lifting part close to one side of the telescopic plate, so that the side wall of the telescopic plate close to one side of the mold cavity is cleaned by the hairbrush plate and the sponge when the telescopic plate moves up and down.
4. By arranging the two secondary compression rollers, the invention realizes that the situation that the material of the wafer is pushed and ground in the grinding direction can not occur in the grinding process, and further ensures that the density of the wafer after grinding is uniform.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a front view of the present invention;
FIG. 2 is a cross-sectional view taken at A-A of FIG. 1;
FIG. 3 is an enlarged view at B of FIG. 1;
FIG. 4 is a schematic view of the construction of the pressurizing means in the present invention;
in the figure: the device comprises an upper mounting plate 1, an electric cylinder 2, a first motor 3, a pressurizing device 4, a pressurizing roller 41, a first support 42, an auxiliary roller support 43, an auxiliary pressurizing roller 44, a mold 5, a telescopic plate 51, hollow balls 511, arc-shaped elastic sheets 512, a mold frame 6, a lifting component 7, a sponge block 71, a brush plate 72, a driver 8 and a heater 9.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1 to 4, the apparatus for manufacturing a solar cell wafer according to the present invention includes an upper mounting plate 1, an electric cylinder 2, a first motor 3, a pressurizing device 4, a mold 5, a mold frame 6, a lifting member 7, a driver 8, and a heater 9, wherein a base of the electric cylinder 2 is fixedly connected to a lower surface of the upper mounting plate 1; the end of the cylinder rod of the electric cylinder 2 is fixedly connected with the non-output end of the first motor 3; the end of the rotating shaft of the first motor 3 is fixedly connected with a pressurizing device 4; the pressing device 4 comprises a pressing roller 41 and a first bracket 42; the end of the rotating shaft of the first motor 3 is fixedly connected to the upper part of the middle part of the first bracket 42; a pressing roller 41 is rotatably arranged below the first bracket 42; a die 5 is arranged below the pressure roller 41; the lower part of the die 5 is fixedly connected with the upper end of a vertical plate of a die frame 6; the lower end of the vertical plate of the die frame 6 is fixedly connected with the upper surface of the bottom plate of the die frame 6; the upper part of the middle part of the die frame 6 is fixedly connected with the lower end of the driver 8; a lifting component 7 is arranged above the driver 8, and the driver 8 controls the lifting component 7 to move up and down; the lifting part 7 slides in the cavity of the mould 5; a heater 9 is arranged in the die 5; the heater 9 is used for heating the wafer in the cavity; when the melted wafer is filled in the cavity of the mold 5, the driver 8 controls the lifting part 7 to lift the wafer, and the heater 9 heats the wafer; the first motor 3 rotates to drive the pressurizing device 4 to rotate, the electric cylinder 2 drives the first motor 3 and the pressurizing device 4 to move downwards, when the pressurizing roller 41 on the pressurizing device 4 contacts the upper surface of the wafer, the pressurizing roller 41 performs rotary rolling on the wafer, the wafer is prevented from being stacked in the rolling process due to the rotary rolling, and the uniform density of the rolled wafer is ensured; and the pressing roller 41 is driven by the electric cylinder 2 to continuously move downwards during rolling, so that the continuous rolling of the wafer is realized.
As an embodiment of the invention, the periphery of the side wall of the cavity of the die 5 is provided with a rectangular groove; the telescopic plate 51 is arranged in the rectangular groove in a sliding manner; the side walls of the telescopic plates 51 are combined into the side wall of the cavity of the mold 5, and the telescopic plates 51 can be stretched up and down; the lifting part 7 slides in a cavity formed by the side walls of the telescopic plate 51; after the melted wafer is lifted by the lifting part 7 at one time, the periphery of the wafer is surrounded by the expansion plates 51 so as not to overflow the cavity of the die 5; the wafer is rolled to continuous downwardly rotating behind the impression roller 41 contact wafer upper surface, and the wafer is continuous by the compression, and the height of wafer constantly reduces, and when impression roller 41 pressed on expansion plate 51, expansion plate 51 moves down, and impression roller 41 moves away the back, and expansion plate 51 upwards moves again, continues to surround the wafer, has guaranteed that the wafer is by once only promoting the back, and sustainable constantly rolled, has improved the machining efficiency of wafer.
As an embodiment of the present invention, one end of the expansion plate 51 is configured as a ball head; a cylindrical blind hole is formed in the ball head end of the expansion plate 51, a closing-in is formed above the cylindrical blind hole, a through hole is formed below the bottom of the blind hole, and compressed gas is introduced into the through hole; a hollow ball 511 is arranged in the cylindrical blind hole; a spring is arranged below the hollow ball 511; the hollow ball 511 can slide in the cylindrical blind hole, but the hollow ball 511 is closed and blocked in the cylindrical blind hole; an arc-shaped elastic sheet 512 is arranged on one side above the hollow ball 511; the arc-shaped elastic sheet 512 is fixedly connected to the end head of the expansion plate 51; when the pressure roller 41 contacts the upper surface of the wafer, the pressure roller 41 presses the arc-shaped elastic sheet 512, the hollow sphere 511 is pressed after the arc-shaped elastic sheet 512 deforms, the hollow sphere 511 moves downwards, compressed gas in the telescopic plate 51 flows out from a gap between the hollow sphere 511 and the closed end, and the telescopic plate 51 moves downwards; after the pressing roller 41 is removed, the hollow ball 511 is blocked by the spring force, and the compressed air pushes the expansion plate 51 to move upwards.
As an embodiment of the present invention, a first sliding groove and a second sliding groove are arranged on the surface of the lifting component 7 on the side close to the expansion plate 51; the first sliding groove is arranged above the second sliding groove, and a sponge block 71 is arranged in the first sliding groove; one end of the sponge block 71 is in contact with the side wall of the telescopic plate 51, and the other end of the sponge block 71 is provided with a spring; a brush plate 72 is arranged in the second sliding groove; the brush surface of the brush plate 72 is contacted with the telescopic plate 51, and the non-brush surface of the brush plate 72 is provided with a spring; when the telescopic plate 51 moves up and down, the side wall of the telescopic plate 51 close to one side of the cavity of the mold 5 is cleaned by the brush plate 72 and the sponge; the springs on one sides of the sponge block 71 and the brush plate 72 enable the sponge and the brush to be in close contact with the side wall of the telescopic plate 51, and effective cleaning is guaranteed; the expansion plate 51 moves upwards, and the sponge in the first sliding groove cleans the side wall of the expansion plate 51 brushed by the brush again, so that the side wall of the expansion plate 51 is further ensured to be clean.
As an embodiment of the invention, two end faces of the first bracket 42 are fixedly connected with the inner side wall of the secondary roller bracket 43; the auxiliary roller bracket 43 is annular, and two auxiliary pressing rollers 44 are rotatably arranged on the inner side wall of the auxiliary roller bracket 43; a tooth-shaped groove is formed in the cylindrical surface of the auxiliary compression roller 44, and the rolling plane of the auxiliary compression roller 44 is higher than that of the compression roller 41, so that the compression roller 41 can be leveled after the auxiliary compression roller 44 rolls; the sub-compression roller 44 is driven by a motor to rotate; when the secondary compression roller 44 rolls the upper surface of the wafer, the motor drives the secondary compression roller 44 to rotate, and the tooth profile on the cylindrical surface of the secondary compression roller 44 pushes the contacted wafer backwards, so that the situation that the material of the wafer is pushed in the rolling direction in the rolling process is avoided, and the density of the rolled wafer is further uniform.
During work, when a molten wafer is filled in the cavity of the mold 5, the driver 8 controls the lifting part 7 to lift the wafer, and the heater 9 heats the wafer; after the melted wafer is lifted by the lifting part 7 at one time, the periphery of the wafer is surrounded by the expansion plates 51 so as not to overflow the cavity of the die 5; the first motor 3 rotates to drive the pressurizing device 4 to rotate, the electric cylinder 2 drives the first motor 3 and the pressurizing device 4 to move downwards, when the pressurizing roller 41 on the pressurizing device 4 contacts the upper surface of the wafer, the pressurizing roller 41 performs rotary rolling on the wafer, the wafer is prevented from being stacked in the rolling process due to the rotary rolling, and the uniform density of the rolled wafer is ensured; the pressing roller 41 is driven by the electric cylinder 2 to continuously move downwards during rolling, so that continuous rolling of the wafer is realized; when the secondary compression roller 44 rolls the upper surface of the wafer, the motor drives the secondary compression roller 44 to rotate, and the tooth profile on the cylindrical surface of the secondary compression roller 44 pushes the contacted wafer backwards, so that the situation that the material of the wafer is pushed in the rolling direction in the rolling process is avoided, and the density of the rolled wafer is further uniform; the pressure roller 41 continuously rotates downwards to roll the wafer after contacting the upper surface of the wafer, the wafer is continuously compressed, the height of the wafer is continuously reduced, the pressure roller 41 presses the arc-shaped elastic sheet 512, the arc-shaped elastic sheet 512 deforms to press the hollow ball 511, the hollow ball 511 moves downwards, compressed gas in the telescopic plate 51 flows out from a gap between the hollow ball 511 and the closed opening, and the telescopic plate 51 moves downwards; after the pressing roller 41 is removed, the hollow ball 511 is blocked and closed under the action of the spring force, the compressed air pushes the expansion plate 51 to move upwards to continuously surround the wafer, the wafer is guaranteed to be continuously rolled after being lifted once, and the processing efficiency of the wafer is improved; when the telescopic plate 51 moves up and down, the side wall of the telescopic plate 51 close to one side of the cavity of the mold 5 is cleaned by the brush plate 72 and the sponge; the springs on one sides of the sponge block 71 and the brush plate 72 enable the sponge and the brush to be in close contact with the side wall of the telescopic plate 51, and effective cleaning is guaranteed; the expansion plate 51 moves upwards, and the sponge in the first sliding groove cleans the side wall of the expansion plate 51 brushed by the brush again, so that the side wall of the expansion plate 51 is further ensured to be clean.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (4)
1. An apparatus for manufacturing a wafer of a solar cell, comprising: the device comprises an upper mounting plate (1), an electric cylinder (2), a first motor (3), a pressurizing device (4), a mold (5), a mold frame (6), a lifting component (7), a driver (8) and a heater (9), wherein the lower surface of the upper mounting plate (1) is fixedly connected with a base of the electric cylinder (2); the end of the cylinder rod of the electric cylinder (2) is fixedly connected with the non-output end of the first motor (3); the end of the rotating shaft of the first motor (3) is fixedly connected with a pressurizing device (4); the pressing device (4) comprises a pressing roller (41) and a first bracket (42); the end of the rotating shaft of the first motor (3) is fixedly connected to the upper part of the middle part of the first bracket (42); a pressing roller (41) is rotatably arranged below the first bracket (42); a die (5) is arranged below the pressure roller (41); the lower part of the die (5) is fixedly connected with the upper end of a vertical plate of the die frame (6); the lower end of the vertical plate of the die frame (6) is fixedly connected with the upper surface of the bottom plate of the die frame (6); the upper part of the middle part of the die frame (6) is fixedly connected with the lower end of the driver (8); a lifting part (7) is arranged above the driver (8), and the driver (8) controls the lifting part (7) to move up and down; the lifting part (7) slides in a cavity of the mold (5); a heater (9) is arranged in the die (5); the heater (9) is used for heating the wafer in the cavity;
two end faces of the first bracket (42) are fixedly connected with the inner side wall of the auxiliary roller bracket (43); the auxiliary roller support (43) is annular, and two auxiliary pressing rollers (44) are rotatably arranged on the inner side wall of the auxiliary roller support (43); a toothed groove is formed in the cylindrical surface of the secondary compression roller (44); the sub-pressure roller (44) is rotated by a motor.
2. The apparatus of claim 1, wherein: a rectangular groove is formed in the periphery of the side wall of the cavity of the die (5); a telescopic plate (51) is arranged in the rectangular groove in a sliding manner; the side walls of the telescopic plates (51) are combined into the side wall of the cavity of the mold (5), and the telescopic plates (51) can be vertically telescopic; the lifting component (7) slides in a cavity formed by the side walls of the telescopic plate (51).
3. The apparatus of claim 2, wherein: one end of the expansion plate (51) is arranged to be a ball head; a cylindrical blind hole is formed in the ball head end of the expansion plate (51), a closing-in is arranged above the cylindrical blind hole, and a through hole is formed below the bottom of the blind hole; a hollow ball (511) is arranged in the cylindrical blind hole; a spring is arranged below the hollow ball (511); an arc-shaped elastic sheet (512) is arranged on one side above the hollow ball (511); the arc-shaped elastic sheet (512) is fixedly connected to the end head of the expansion plate (51).
4. The apparatus of claim 2, wherein: the surface of one side, close to the telescopic plate (51), of the lifting component (7) is provided with a first sliding groove and a second sliding groove; the first sliding groove is arranged above the second sliding groove, and a sponge block (71) is arranged in the first sliding groove; one end of the sponge block (71) is in contact with the side wall of the telescopic plate (51), and the other end of the sponge block (71) is provided with a spring; a brush plate (72) is arranged in the second sliding groove; the brush surface of the brush plate (72) is in contact with the telescopic plate (51), and the non-brush surface of the brush plate (72) is provided with a spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810490229.6A CN108649003B (en) | 2018-05-21 | 2018-05-21 | Wafer manufacturing device of solar cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810490229.6A CN108649003B (en) | 2018-05-21 | 2018-05-21 | Wafer manufacturing device of solar cell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108649003A CN108649003A (en) | 2018-10-12 |
| CN108649003B true CN108649003B (en) | 2020-09-11 |
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ID=63757354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810490229.6A Active CN108649003B (en) | 2018-05-21 | 2018-05-21 | Wafer manufacturing device of solar cell |
Country Status (1)
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102089885A (en) * | 2008-07-10 | 2011-06-08 | 城市环境工程有限公司 | A wafer manufacturing device for a solar battery cell and a wafer manufacturing method using the same |
| CN206415468U (en) * | 2017-01-17 | 2017-08-18 | 宜兴市科兴合金材料有限公司 | A kind of calender device processed for Mo wafer |
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2018
- 2018-05-21 CN CN201810490229.6A patent/CN108649003B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102089885A (en) * | 2008-07-10 | 2011-06-08 | 城市环境工程有限公司 | A wafer manufacturing device for a solar battery cell and a wafer manufacturing method using the same |
| CN206415468U (en) * | 2017-01-17 | 2017-08-18 | 宜兴市科兴合金材料有限公司 | A kind of calender device processed for Mo wafer |
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| CN108649003A (en) | 2018-10-12 |
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