CN216719921U

CN216719921U - Novel semiconductor cutting machine

Info

Publication number: CN216719921U
Application number: CN202220421846.2U
Authority: CN
Inventors: 刘燕玲
Original assignee: Henan Weina Semiconductor Technology Co ltd
Current assignee: Henan Weina Semiconductor Technology Co ltd
Priority date: 2022-02-25
Filing date: 2022-02-25
Publication date: 2022-06-10
Anticipated expiration: 2032-02-25

Abstract

The utility model relates to the technical field of semiconductor cutting, in particular to a novel semiconductor cutting machine which comprises a base, wherein an upper frame is arranged at the top of the base, a cutting mechanism is arranged at the bottom of the upper frame, a placing table is arranged at the top of the base, a supporting frame is arranged in the placing table, an electric push rod is arranged at the bottom of the supporting frame, a first rotating shaft is arranged at the top of the supporting frame, and a threaded sleeve is arranged in the first rotating shaft. This novel semiconductor cutting machine uses through the cooperation of threaded sleeve and screw rod for two concave type pieces can remove to placing the platform simultaneously, thereby carry on spacingly to the both sides of semiconductor disc, then through electric putter's setting, make electric putter can drive concave type piece downstream, and make the extrusion piece that sets up at concave type piece top, contact and extrude with the semiconductor disc, thereby reach and carry out the purpose of fixing to the semiconductor disc.

Description

Novel semiconductor cutting machine

Technical Field

The utility model relates to the technical field of semiconductor cutting, in particular to a novel semiconductor cutting machine.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device manufactured by adopting the semiconductor, the size of a semiconductor finished product is very small, the semiconductor finished product is generally manufactured into a disc when being processed, and the disc is divided after being processed, in the prior art, the cutting of the semiconductor needs to ensure extremely high precision and stability, so mechanical automatic cutting is generally adopted, the semiconductor disc is placed in a placing disc and is moved to a proper processing position through a mechanical arm, but the requirement on the position of mechanical cutting is high, the semiconductor disc is not effectively fixed in the placing disc, and the semiconductor disc is deviated due to the shaking generated in the moving process of the placing disc, the cutting position of the semiconductor disc is made wrong, so that a whole semiconductor disc is scrapped, and economic loss is caused, and therefore, some devices are appeared on the market to improve the problems.

The firm cutting device of centre gripping for semiconductor processing that discloses in chinese patent CN214542179U, this firm cutting device of centre gripping for semiconductor processing, setting through buffer spacer, when the fixed semiconductor disc of stripper plate, buffer spacer can keep off between the two, from avoiding the stripper plate to cause the loss to the semiconductor disc, through T type piece, do not have quick installation and maintenance through T type piece after buffer spacer appears wearing and tearing, thereby the practicality of cutting device body has been improved, however, this firm cutting device of centre gripping for semiconductor processing, when the solution problem, still have following shortcoming:

in the using process, the fixing effect on the semiconductor disc is not good enough, and the semiconductor disc is easy to displace in the cutting process, so that the working efficiency is seriously influenced, and therefore, a novel reporter cutting machine is needed to improve the problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a novel semiconductor cutting machine, which is used for solving the technical problems that the fixing effect on a semiconductor disc is not good enough and the semiconductor disc is easy to displace in the cutting process, so that the working efficiency is seriously influenced in the using process of the conventional semiconductor cutting device.

The above object of the present invention is achieved by the following technical solutions:

a novel semiconductor cutting machine comprises a base, wherein the top of the base is provided with a top frame, the bottom of the top frame is provided with a cutting mechanism, the top of the base is provided with a placing table, the inside of the placing table is provided with a supporting frame, the bottom of the supporting frame is provided with an electric push rod, the top of the supporting frame is provided with a first rotating shaft, the inside of the first rotating shaft is provided with a threaded sleeve, both ends of the threaded sleeve are in threaded connection with a screw rod, the outer surface of the threaded sleeve is provided with a driven gear, the inside of the supporting frame is provided with a motor, the output end of the motor is connected with a driving gear, one end of the screw rod, which is far away from the threaded sleeve, is provided with a concave block, one end of the screw rod, which is close to the concave block, is provided with a second rotating shaft, one end of the second rotating shaft, which is far away from the screw rod, is provided with a mounting seat, the inside of the placing table is provided with a movable groove, the top of the concave block is provided with an extrusion block, and the bottom of the extrusion block is provided with a cushion pad.

The utility model is further configured to: the threaded sleeve is rotatably connected with the support frame through a first rotating shaft.

The utility model is further configured to: the thread directions of the outer surfaces of the two screws are opposite.

Through adopting above-mentioned technical scheme for when the threaded rod rotated, two screws can be simultaneously to opposite direction displacement.

The utility model is further configured to: the driving gear is meshed with the driven gear.

Through adopting above-mentioned technical scheme for when the motor drove driving gear pivoted, the driving gear can drive driven gear and rotate, can make the screw sleeve rotate.

The utility model is further configured to: the mounting seat is fixedly connected to one side of the bottom of the concave block, and the concave block is rotatably connected with the screw rod through a second rotating shaft.

Through adopting above-mentioned technical scheme for concave type piece can not rotate along with the rotation of screw rod, and concave type piece is convenient for install and dismantle, thereby makes concave type piece be convenient for maintain and change.

The utility model is further configured to: the bottom of concave type piece is provided with the stopper, the both sides of support frame all are provided with the gag lever post, the through-hole with gag lever post looks adaptation is seted up to the inside of stopper, the gag lever post is pegged graft in the inside of stopper.

Through adopting above-mentioned technical scheme, use through the cooperation of stopper and gag lever post, played spacing effect to concave type piece to make concave type piece can not produce the upset.

In conclusion, the beneficial technical effects of the utility model are as follows:

1. according to the novel semiconductor cutting machine, the concave blocks are arranged on the two sides of the placing table and are used in cooperation with the threaded sleeve and the threaded rod, so that the two concave blocks can move towards the placing table simultaneously, the two sides of the semiconductor disc are limited, then the electric push rod can drive the concave blocks to move downwards through the arrangement of the electric push rod, the extrusion blocks arranged at the tops of the concave blocks are in contact with and extrude the semiconductor disc, the purpose of fixing the semiconductor disc is achieved, the semiconductor disc is not prone to displacement in the cutting process, and the working efficiency is effectively guaranteed;

2. this novel semiconductor cutting machine uses through the cooperation of stopper and gag lever post, has played spacing effect to concave type piece to make the phenomenon of upset can not take place for concave type piece.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the internal structure of the standing board of the present invention;

FIG. 3 is a schematic view of the female block of the present invention.

In the figure: 1. a base; 2. a top frame; 3. a cutting mechanism; 4. a placing table; 5. a support frame; 6. an electric push rod; 7. a first rotating shaft; 8. a threaded sleeve; 9. a screw; 10. a driven gear; 11. a motor; 12. a driving gear; 13. a concave block; 14. a second rotating shaft; 15. a mounting seat; 16. a movable groove; 17. extruding the block; 18. a cushion pad; 19. a limiting block; 20. a limiting rod.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

Example one

Referring to fig. 1, 2 and 3, the novel semiconductor cutting machine disclosed by the utility model comprises a base 1, a top frame 2 is arranged at the top of the base 1, a cutting mechanism 3 is arranged at the bottom of the top frame 2, a placing table 4 is arranged at the top of the base 1, a supporting frame 5 is arranged inside the placing table 4, an electric push rod 6 is arranged at the bottom of the supporting frame 5, a first rotating shaft 7 is arranged at the top of the supporting frame 5, a threaded sleeve 8 is arranged inside the first rotating shaft 7, both ends of the threaded sleeve 8 are in threaded connection with a screw 9, a driven gear 10 is arranged on the outer surface of the threaded sleeve 8, a motor 11 is arranged inside the supporting frame 5, an output end of the motor 11 is connected with a driving gear 12, a concave block 13 is arranged at one end of the screw 9 far away from the threaded sleeve 8, a second rotating shaft 14 is arranged at one end of the screw 9 close to the concave block 13, and a mounting seat 15 is arranged at one end of the second rotating shaft 14 far away from the screw 9, place the inside of platform 4 and seted up the movable groove 16, the top of concave type piece 13 is provided with extrusion piece 17, the bottom of extrusion piece 17 is provided with blotter 18, in this embodiment, set up concave type piece 13 through the both sides of placing platform 4, and use through the cooperation of threaded sleeve 8 with screw rod 9, make two concave type pieces 13 can remove to placing platform 4 simultaneously, thereby it is spacing to the both sides of semiconductor disc, then through electric putter 6's setting, make electric putter 6 can drive concave type piece 13 downstream, and will set up the extrusion piece 17 at concave type piece 13 top, contact and extrude with the semiconductor disc, thereby reach and carry out fixed purpose to the semiconductor disc, and then make the semiconductor disc be difficult for producing the displacement at the process of cutting, with effectual work efficiency that has ensured.

The threaded sleeve 8 is rotatably connected with the support frame 5 through a first rotating shaft 7.

The outer surfaces of the two screws 9 are threaded in opposite directions.

The driving gear 12 is engaged with the driven gear 10.

The mount pad 15 fixed connection is in one side of concave type piece 13 bottom, and rotates through second pivot 14 between concave type piece 13 and the screw rod 9 and be connected, in this embodiment, the arc wall with semiconductor disc looks adaptation is all seted up to two adjacent one sides of concave type piece 13 to two concave type pieces 13 carry out centre gripping and fixed to the semiconductor disc.

Example two

Referring to fig. 2 and 3, the bottom of concave type piece 13 is provided with stopper 19, and the both sides of support frame 5 all are provided with gag lever post 20, and the through-hole with gag lever post 20 looks adaptation is seted up to stopper 19's inside, and gag lever post 20 is pegged graft in stopper 19's inside, in this embodiment, uses through stopper 19 and gag lever post 20's cooperation, has played spacing effect to concave type piece 13 to make concave type piece 13 can not take place the phenomenon of upset.

The implementation principle of the embodiment is as follows: when the device is used, the motor 11 drives the driving gear 12 to rotate, the driving gear 12 drives the driven gear 10 to rotate, the threaded sleeve 8 rotates along with the threaded sleeve, the two screw rods 9 at two ends of the threaded sleeve 8 rotate and contract towards the inside of the threaded sleeve 8, the two concave blocks 13 move towards the direction of the placing table 4 at the same time until contacting with a semiconductor disc, preliminary fixing of the semiconductor disc can be achieved, then the electric push rod 6 contracts to reduce the height of the supporting frame 5, so that the height of the concave blocks 13 is reduced, until the extrusion blocks 17 at the tops of the concave blocks 13 contact with the top of the semiconductor disc, fixing of the semiconductor disc can be completed, the concave blocks 13 are arranged at two sides of the placing table 4, and the two concave blocks 13 can move towards the placing table 4 through matching use of the threaded sleeve 8 and the screw rods 9, thereby it is spacing to the both sides of semiconductor disc, then through electric putter 6's setting, make electric putter 6 can drive concave type piece 13 downstream, and will set up the extrusion piece 17 at concave type piece 13 top, contact and extrude with the semiconductor disc, thereby reach and carry out fixed purpose to the semiconductor disc, and then make the semiconductor disc be difficult for producing the displacement at the process of cutting, with effectual work efficiency that has ensured, cooperation through stopper 19 and gag lever post 20 is used, spacing effect has been played concave type piece 13, thereby make concave type piece 13 can not take place the phenomenon of upset, therefore the device has certain practicality.

The embodiments of the present invention are preferred embodiments of the present invention, and the scope of the present invention is not limited by these embodiments, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered by the protection scope of the utility model.

Claims

1. The utility model provides a novel semiconductor cutting machine, includes base (1), its characterized in that: the cutting machine is characterized in that an upper frame (2) is arranged at the top of the base (1), a cutting mechanism (3) is arranged at the bottom of the upper frame (2), a placing table (4) is arranged at the top of the base (1), a supporting frame (5) is arranged inside the placing table (4), an electric push rod (6) is arranged at the bottom of the supporting frame (5), a first rotating shaft (7) is arranged at the top of the supporting frame (5), a threaded sleeve (8) is arranged inside the first rotating shaft (7), two ends of the threaded sleeve (8) are both in threaded connection with a screw rod (9), a driven gear (10) is arranged on the outer surface of the threaded sleeve (8), a motor (11) is arranged inside the supporting frame (5), the output end of the motor (11) is connected with a driving gear (12), and a concave block (13) is arranged at one end, far away from the threaded sleeve (8), of the screw rod (9), one end of the screw rod (9) close to the concave block (13) is provided with a second rotating shaft (14), one end of the second rotating shaft (14) far away from the screw rod (9) is provided with a mounting seat (15), a movable groove (16) is formed in the placing table (4), an extrusion block (17) is arranged at the top of the concave block (13), and a cushion pad (18) is arranged at the bottom of the extrusion block (17).

2. The novel semiconductor cutting machine according to claim 1, characterized in that: the pattern sleeve (8) is rotatably connected with the support frame (5) through a first rotating shaft (7).

3. The novel semiconductor cutting machine according to claim 1, characterized in that: the thread directions of the outer surfaces of the two screw rods (9) are opposite.

4. The novel semiconductor cutting machine according to claim 1, characterized in that: the driving gear (12) is meshed with the driven gear (10).

5. The novel semiconductor cutting machine according to claim 1, characterized in that: the mounting seat (15) is fixedly connected to one side of the bottom of the concave block (13), and the concave block (13) is rotatably connected with the screw rod (9) through a second rotating shaft (14).

6. The novel semiconductor cutting machine according to claim 1, characterized in that: the bottom of concave type piece (13) is provided with stopper (19), the both sides of support frame (5) all are provided with gag lever post (20), the through-hole with gag lever post (20) looks adaptation is seted up to the inside of stopper (19), gag lever post (20) are pegged graft in the inside of stopper (19).