CN108630726A - Organic LED display device - Google Patents
Organic LED display device Download PDFInfo
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- CN108630726A CN108630726A CN201710168421.9A CN201710168421A CN108630726A CN 108630726 A CN108630726 A CN 108630726A CN 201710168421 A CN201710168421 A CN 201710168421A CN 108630726 A CN108630726 A CN 108630726A
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- PNHVEGMHOXTHMW-UHFFFAOYSA-N magnesium;zinc;oxygen(2-) Chemical compound [O-2].[O-2].[Mg+2].[Zn+2] PNHVEGMHOXTHMW-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
A kind of organic LED display device, including active array substrate, at least an Organic Light Emitting Diode and package board.Active array substrate includes light absorbing layer and an at least active member.Active member is located above light absorbing layer.Organic Light Emitting Diode configures above active array substrate.Organic Light Emitting Diode includes first electrode, second electrode and organic luminous layer.First electrode is configured at the side of neighbouring active member.Second electrode is oppositely arranged with first electrode, and wherein the penetrance of the wavelength of first electrode and second electrode in visible wavelength range is more than 0.6.Organic luminous layer is located between first electrode and second electrode.Package board is configured above Organic Light Emitting Diode.By using tool optics antiradar reflectivity and the material of high-penetration rate as first electrode and second electrode, and by the way that light absorbing layer is arranged come the optical reflection phenomenon for the script that reduces and prevent, to improve the bright room comparison of organic LED display device.
Description
Technical field
The invention relates to a kind of organic LED display devices.
Background technology
Organic light emitting diode display is considered as the mainstream technology of next generation.It is aobvious in traditional Organic Light Emitting Diode
Show in device, in order to improve light extraction efficiency, the driving electrodes using the material of high reflectance as Organic Light Emitting Diode so as to
The light of lower section transmitting can be reflected towards by the driving electrodes of lower section, to obtain higher light extraction efficiency.In addition, also someone
The organic light emitting diode display for proposing micro-optical resonant cavity, in such technology, in addition under Organic Light Emitting Diode
Driving electrodes must use except the material of high reflectance, and upper driving electrodes must also have certain reflectivity, this type
Display be capable of providing preferable color saturation, it is higher face angular brightness, but there are also disadvantages.Although for example,
Brightness and the color saturation of display are improved in positive apparent direction, but cause the color distortion of the image at big visual angle,
And brightness increases with visual angle and significantly declines.
In the above art, although obtaining high light extraction efficiency, some problems are also resulted in.For example, high reflectance
Electrode can reflect from extraneous incident light, therefore when user be in high brightness environment light source (for example, it is outdoor too
Sunlight), the light reflected from the external world via panel will seriously affect the display picture of script display, cause user can not
It is seen clearly that the display picture of script display.In addition, in the technology of micro-optical resonant cavity, although such technology can carry
For preferable color saturation and it is higher face angular brightness, but because the electrode of high optical reflection must be used,
Also same problem is faced.
It is in known technology, outer above the display surface of organic light emitting diode display in order to solve the problem above-mentioned
The optical film group for adding one group of antireflection, to reduce reflex of the organic LED panel to ambient.This anti-reflective
The structure for the optical film group penetrated is made of polaroid (polarizer) and 1/4 wave plate (1/4 λ wave plate).Such knot
Although the antireflective optical film group of structure solves the reflection problems of ambient light, but also results in organic light emitting diode display
Luminance loss reach 50%-60% (because of the penetrance only about 40-50% of a piece of polaroid), and cause the thickness of single unit system
And the increase of weight.Therefore, it is necessary to propose a kind of new organic LED display panel, to improve this skill existing for one
Art problem.
In addition, the luminous organic material and high activity electrode in existing organic light emitting diode display are using appearance
The material easily influenced by aqueous vapor and oxygen, therefore, existing organic light emitting diode display need strict encapsulation procedure
Extraneous aqueous vapor and oxygen is avoided to enter and reduce the service life of Organic Light Emitting Diode.Most currently used is with glass
Upper and lower base plate of the substrate as Organic Light Emitting Diode, and the penetrance of aqueous vapor and oxygen is reduced using the glass substrate, really
Protect service life and the quality of organic light-emitting diode element.However, if it is considered that whole weight, thickness, even future can
The application of formula is scratched, just inevitably needs use plastic substrate, but will be reduced using plasticity machines plate and block aqueous vapor and oxygen
The ability that gas penetrates, and then reduce service life and the quality of Organic Light Emitting Diode.
Invention content
The one or more embodiments disclosed below the present invention can solve the reflection problems of above-mentioned ambient light, and compare
In the anti-reflective film group of external hanging type, embodiments of the present invention can improve shining for organic LED display device entirety
Efficiency.In addition, the reliability of organic LED display device more can be improved, and it is particularly suited for bendable application.
It is to disclose a kind of organic LED display device according to certain embodiments of the present invention.What is disclosed herein has
Machine light emitting display device includes active array substrate, at least an Organic Light Emitting Diode and package board.Active array
Substrate includes light absorbing layer and an at least active member.Active member is located above light absorbing layer.Organic Light Emitting Diode configures
Above active array substrate.Organic Light Emitting Diode includes first electrode, second electrode and organic luminous layer.First electrode
It is configured at the side of neighbouring active member.Second electrode is oppositely arranged with first electrode, and wherein first electrode and second electrode exists
The penetrance of a wavelength in visible wavelength range is more than 0.6.Organic luminous layer be located in first electrode and second electrode it
Between.Package board is configured above Organic Light Emitting Diode.
In one embodiment, active array substrate also includes support plate, and light absorbing layer configures the first surface in support plate, and
Active member configures on light absorbing layer.
In one embodiment, active array substrate also includes support plate, and light absorbing layer configures the second surface in support plate, and
Light absorbing layer configures the opposite sides in support plate with active member.
In one embodiment, light absorbing layer constitutes the support plate of active array substrate, and active member configuration is on support plate.
In one embodiment, light absorbing layer is the organic material or inorganic structure of single layer, or is compound organic material
The multilayered structure of matter and inorganic.
In one embodiment, the reflectivity of a wavelength of the light absorbing layer in visible wavelength range is less than 0.3.
In one embodiment, the optical density (OD) of a wavelength of the light absorbing layer in visible wavelength range is more than 0.7.
In one embodiment, active array substrate also includes light shield layer, is configured above active member.
In one embodiment, light shield layer is directed at active member, and the area of light shield layer is more than the area of active member.
In one embodiment, a plain conductor of light shield layer alignment active member, and plain conductor is completely covered.
In one embodiment, organic LED display device further includes chromatic filter layer.Chromatic filter layer is arranged
Between organic luminous layer and package board.
Description of the drawings
Fig. 1-4 is painted the diagrammatic cross-section of the organic LED display device of the various embodiments of the present invention.
Specific implementation mode
In order to keep the narration of this disclosure more detailed with it is complete, below for the present invention state sample implementation with it is specific
Embodiment proposes illustrative description；But this not implements or uses the unique forms of the specific embodiment of the invention.Following institute
Each embodiment disclosed can be combined with each other or replace in the case of beneficial, can also add other implementations in one embodiment
Example, and without further record or explanation.In the following description, many specific details be will be described in detail so that reader can fill
Sub-argument solution embodiment below.However, the embodiment of the present invention can be put into practice without these specific details.In other feelings
Under condition, to simplify attached drawing, well known structure is only symbolically illustrated in figure with device.
In order to keep the narration of this disclosure more detailed with it is complete, below for the present invention state sample implementation with it is specific
Embodiment proposes illustrative description；But this not implements or uses the unique forms of the specific embodiment of the invention.Following
In description, many specific details are will be described in detail so that reader can fully understand embodiment below.However, can be without these
The embodiment of the present invention is put into practice in the case of specific detail.In other cases, to simplify attached drawing, well known structure and device are only
Schematically it is illustrated in figure.Term about " about " used herein, " about " or " substantially " is commonly index
Within the error or range of value 20 about percent, within preferably about 10, be more preferably then about 5 percent with
It is interior.Wen Zhongruo without clearly stating, mentioned by numerical value all regard as approximation, i.e., such as " about ", " about " or " substantially " institute table
The error or range shown.Herein, can be that an element is straight when an element is referred to as being "connected" or "coupled" to another element
It connects and is connected or coupled to another element；Or one between element and another element there are one or more additional elements, that is, unitary
Part is connected to another element via one or more additional elements.Opposite, when an element is referred to as " being directly connected to " or " direct
When coupling " to another element, exist therebetween without additional element.
The one or more embodiments disclosed below the present invention, can solve above-mentioned technical disadvantages.It is taken off below the present invention
One or more embodiments of dew can not only solve the reflection problems of ambient light, and Organic Light Emitting Diode will not be caused aobvious
Show that the brightness of device declines to a great extent.
In the one or more embodiments disclosed below the present invention, give up the thinking of traditional high reflection electrode, uses
The electrode of optics antiradar reflectivity and the material of high-penetration rate as Organic Light Emitting Diode, and optical absorbing layer is set.At this
In the following one or more embodiments disclosed of invention, the ambient light because caused by high reflectance driving electrodes is not only avoided
The problem of reflection, need not also use additional anti-reflective film group.To allow whole lighting efficiency to improve about 25% (compared to biography
The anti-reflective film group of system external hanging type).
Fig. 1 is painted the diagrammatic cross-section of the organic LED display device 100 of the various embodiments of the present invention.It is organic
Light emitting display device 100 includes active array substrate 110, at least one Organic Light Emitting Diode 120 and package board
140.Organic Light Emitting Diode 120 configures between active array substrate 110 and package board 140.
Active array substrate 110 includes at least an active member 112, light shield layer 114 and light absorbing layer 130.Active element
Part 112 can be configured to array format in active array substrate 110.In some embodiments, active member 112 can be such as
Polycrystalline SiTFT, amorphous silicon film transistor or metal oxide thin-film transistor.Screening will be hereinafter described in more detail
The specific implementation mode and details of photosphere 114 and light absorbing layer 130.
Organic Light Emitting Diode 120 configures above active array substrate 110, and Organic Light Emitting Diode 120 includes first
Electrode 121, second electrode 122 and organic luminous layer 124.
First electrode 121 is configured at the side of neighbouring active member 112, and second electrode 122 and 121 phase of first electrode
To setting.In some embodiments, first electrode 121 and second electrode 122 are that antiradar reflectivity, the material of high-penetration rate are made
At.The penetrance of the wherein wavelength of first electrode 121 and second electrode 122 in visible wavelength range is greater than about 0.6, example
Such as it is about 0.7,0.8,0.9,0.95 or higher；And the reflectivity of the wherein wavelength in visible wavelength range is less than about
0.3, for example, about 0.25,0.2,0.15,0.1 or smaller.The material of first electrode 121 and/or second electrode 122 is preferably adopted
Optics antiradar reflectivity and the material of high-penetration rate are had both with low activity and simultaneously, may be, for example, tin indium oxide (indium tin
Oxide, ITO), indium zinc oxide (indium zinc oxide, IZO), aluminum zinc oxide (aluminum zinc oxide, AZO),
Indium oxide zinc-tin (indium tin zinc oxide, ITZO), cadmium tin (cadmium tin oxide, CTO), tin oxide
(tin oxide), zinc oxide (zinc oxide), cadmium oxide (cadmium oxide), indium gallium zinc (indium
Gallium zinc oxide, InGaZnO), indium gallium zinc-magnesium (indium gallium zinc magnesium oxide,
InGaZnMgO), indium gallium aluminium (indium gallium aluminum oxide, InGaAlO) or indium gallium magnesium
(indium gallium magnesium oxide, InGaMgO) etc., but not limited to this.
Organic luminous layer 124 is located between first electrode 121 and second electrode 122.In some embodiments, organic
Luminescent layer 124 is multilayered structure.For example, organic luminous layer 124 may include hole injection layer (Hole Injection Layer,
HIL), hole transport layer (Hole Transport Layer, HTL), luminescent layer (Emitting Layer, EML), hole hinder
Layer (Hole Blocking Layer, HBL) and electron transfer layer (Electron Transport Layer, ETL) etc., but not
It is limited to this.
Light absorbing layer 130 configures below active member 112.Light absorbing layer 130 to absorb be incident on from environment it is organic
Light in light emitting diode indicator.As it was noted above, first and second electrode 121,122 of Organic Light Emitting Diode 120
It is made by the conductive material using high-penetration rate and antiradar reflectivity, therefore on the light direction of display surface, such high-penetration
Rate electrode provides higher penetrance, will not cover or absorb the light that Organic Light Emitting Diode 120 is sent out.Extraneous is entered
Light is penetrated, then because of antiradar reflectivity, it is possible to reduce from the reflex of the light of environment incidence.In addition, light absorbing layer 130 is arranged in master
In dynamic array substrate 110, when the light from external environment incidence passes through high-penetration rate and first and second electrode of antiradar reflectivity
121,122, and after reaching light absorbing layer 130, these incident lights can be absorbed by light absorbing layer 130.Therefore, it can reduce and disappear
The optical reflection phenomenon for removing script, to improve the bright room comparison of organic LED display device 100.
In some embodiments, active array substrate 110 also includes support plate 111, and support plate 111 has the first opposite table
Face 111a and second surface 111b.Light absorbing layer 130 configures the first surface 111a in support plate 111, and active member 112 is matched
It sets on light absorbing layer 130.In certain embodiments, a wherein wavelength of the light absorbing layer 130 in visible wavelength range
Reflectivity is less than about 0.3, for example, about 0.25,0.2,0.15,0.1 or smaller.In other embodiments, light absorbing layer 130 exists
The optical density (OD) (optical density) of a wherein wavelength for visible wavelength range is greater than about 0.7, for example, about 0.75,
0.8,0.85,0.9 or higher.In some embodiments, 130 material of light absorbing layer may include organic and/or inorganic,
Such as dyestuff (dye), pigment (pigment), graphitic carbon, titanium is black, carbon black and/or tungsten oxide caesium etc., and grain size may be, for example, about
10 nanometers to about 2 microns, but not limited to this.
Light shield layer 114 configures above active member 112, to avoid active member 112 is irradiated by light and is leaked
The phenomenon of electricity.Specifically, first and second electrode 121,122 of Organic Light Emitting Diode 120 is by high-penetration rate and low anti-
It penetrates made by the conductive material of rate, therefore active member 112 may be irradiated to from the light of environment incidence.In addition, organic hair
The light that optical diode is launched can also be irradiated to active member 112.Therefore, light shield layer is set on active member 112
114, the light launched to avoid Organic Light Emitting Diode 120 or cause active member 422 to produce from the light of environment incidence
Raw leakage current.In some embodiments, light shield layer 114 is directed at active member 112, and the area of light shield layer 114 is more than actively
The area of element 112.In some embodiments, light shield layer 114 is directed at a plain conductor (not shown) of active member 112,
And plain conductor is completely covered, is generated reflective with to avoid plain conductor by being irradiated from the light of environment incidence.Shading
Layer 114 can be only fitted in any layer of structure of 112 top of active member.
In one embodiment, active array substrate 110 also includes protective layer 160, and protective layer 160 covers active member
112, light shield layer 114 configures above protective layer 160.In another embodiment, light shield layer 114 be interposed in protective layer 160 with
Between active member 112.In certain embodiments, light shield layer 114 be insulating materials made by, and light shield layer 114 contact and
Cover active member 112.In other some embodiments, light shield layer 114 be metal material made by, and configure in protective layer
On 160.In other embodiments, optical density (OD) (optical of the light shield layer 114 in a wherein wavelength for visible wavelength range
Density it) is greater than about 0.7, for example, about 0.75,0.8,0.85,0.9 or higher.In some embodiments, active array
Substrate 110 includes also pixel defining layer 174, and pixel defining layer 174 may be, for example, made by black resin.Light shield layer 114 is located at
Between pixel defining layer 174 and active member 112.In one embodiment, the area of light shield layer 114 is more than pixel defining layer 174
Area, in other words, the area coverage of light shield layer 114 is more than the area coverage of pixel defining layer 174.
Package board 140 is configured at 122 top of second electrode, and forms an enclosure space S with active array substrate 110,
And Organic Light Emitting Diode 120 is isolated from the outside world, to avoid the deterioration in 120 performance of Organic Light Emitting Diode.It is detailed
It says, the organic luminous layer and cathode in Organic Light Emitting Diode would generally be influenced by water and/or oxygen and be deteriorated
Phenomenon.If water or Oxygen permeation enter in organic light emitting diode display, it will the serious service life for reducing display.In this reality
It applies in mode, package board 140 is with to avoid in extraneous oxygen and/or aqueous vapor and organic LED display device 100
Element contacts.For example, organic LED display device 100 can include also sealant 170, be configured at package board 140
Between active array substrate 110, and sealant 170 surrounds active member 112 and Organic Light Emitting Diode 120.Sealing
Layer 170, package board 140 and active array substrate 110 form enclosure space S, have to prevent water in environment and/or oxygen from entering
Machine light emitting diode touch device 100.
Package board 140 may include there is hard substrate, such as glass；Or comprising can flexing substrate, such as polycarbonate
(polycarbonate, PC), two fat of poly terephthalic acid second (polyethylene terephthalate, PET), poly- methyl
Methacrylate (polymethylmesacrylate, PMMA), polysulfones (Polysulfone, PES) or other cyclenes copolymers
(cyclic olefin copolymer)。
According to various embodiments of the present invention, give up the thinking using high activity electrode, it is using low activity and simultaneous simultaneously
Has the material of optics antiradar reflectivity and high-penetration rate as first electrode 121 and second electrode 122, and by the way that light absorbing layer is arranged
130 come the optical reflection phenomenon for the script that reduces and prevent, to improve the bright room pair of organic LED display device 100
Than.Therefore, additional anti-reflective film layer or module need not be arranged in the present invention as known technology, so will not allow originally organic
The luminous intensity that light emitting diode 120 is launched reduces, anti-reflective film of the whole lighting efficiency compared to conventionally employed external hanging type
The display of layer or module can improve about 25%, and the thickness and weight of whole organic LED display device 100
It will not obviously increase.In addition, optical absorbing layer 130, which can more provide, blocks the function that water oxygen penetrates, when considering light emitting diode
The whole weight of display device 100, thickness, it is even following bendable in application, optical absorbing layer 130 can make up because making
With the problem that the sealing effect caused by plastic substrate is poor, to promote the ability for blocking water oxygen and penetrating, and then luminous two are improved
The service life of pole pipe display device 100.
In other embodiments of the invention, optical absorbing layer 170 may further be single layer densification organic material or
The multilayered structure that inorganic structure or compound organic material and inorganic interlock.Specific effect can be by aqueous vapor and
Oxygen-barrier can also have both isolation and adsorb the function of water oxygen, to reach resistance simultaneously in outside, or by aqueous vapor and Oxygen Adsorption
Effect inside exhausted aqueous vapor and oxygen penetration to light emitting display device 100.
Fig. 2 is painted the diagrammatic cross-section of the organic LED display device 100a of another embodiment of the present invention.Have
The organic LED display device 100 of the embodiment of machine light emitting display device 100a and above-mentioned Fig. 1 most very much not
It is with place, light absorbing layer 130 configures the second surface 111b in support plate 111, therefore light absorbing layer 130 and active member
Opposite sides of 112 configurations in support plate 111.The other elements of organic LED display device 100a with previously for organic
It is identical described in light emitting display device 100.
Fig. 3 is painted the diagrammatic cross-section of the organic LED display device 100b of another embodiment of the present invention.Have
The organic LED display device 100 of the embodiment of machine light emitting display device 100b and above-mentioned Fig. 1 most very much not
It is with place, the support plate 111c of active array substrate 110 just has light-absorbing function.In other words, light Fig. 1 being painted
Absorbed layer 130 and the support plate 111 of active array substrate are integrated into single layer structure, and light absorbing layer 130 is active array base
The support plate 111c of plate 110, and the configuration of active member 112 is on the support plate 111c for absorbing light ability.Organic light emission two
The other elements of pole pipe display device 100b with previously for identical described in organic LED display device 100.
Fig. 4 is painted the diagrammatic cross-section of the organic LED display device 100c of another embodiment of the present invention.Have
The organic LED display device 100 of the embodiment of machine light emitting display device 100c and above-mentioned Fig. 1 most very much not
It is with place, organic LED display device 100c includes also an at least chromatic filter layer 150, is set to organic light emission
Between diode 120 and package board 140, chromatic filter layer 150 can be for example comprising red filter layer, green color filter and blue
Filter layer.In the present embodiment, organic LED display device 100c has comprising feux rouges Organic Light Emitting Diode, green light
Machine light emitting diode and blue light organic emissive diode.The organic luminous layer 124 of assorted Organic Light Emitting Diode 120 is aligned
Corresponding red filter layer, green color filter and blue color filter layer.
Chromatic filter layer 150 is a kind of optical absorbing layer in itself, such as red filter layer can allow red light to pass through, other
The light of wave band will be absorbed.Because of feux rouges Organic Light Emitting Diode, green light Organic Light Emitting Diode, blue light organic emissive diode
Be respectively aligned to red filter layer, green color filter and blue color filter layer, thus chromatic filter layer 150 hardly consume it is organic
The self-luminous of light emitting diode 120.Opposite, chromatic filter layer 150 is absorbable from extraneous incident light, and is not filtered by colour
The extraneous incident light for the part that photosphere 150 absorbs passes through second electrode 122, organic luminous layer 124 and first electrode 121 etc. each
Layer finally reaches light absorbing layer 130 and is further absorbed and blocked.Thus, can more reduce the intensity of reflection, and promoted
The bright room of display compares.
Under the framework that organic LED display device 100c has chromatic filter layer 150, in other embodiment
In, light absorbing layer 130 can be located at any position of 112 lower section of active member, such as previously for the implementation described in Fig. 2 and Fig. 3
Mode or embodiment.
Although the present invention is disclosed above with embodiment, however, it is not to limit the invention, any to be familiar with this skill
Person, without departing from the spirit and scope of the present invention, when can be used for a variety of modifications and variations, therefore protection scope of the present invention is worked as
Subject to the scope of which is defined in the appended claims.Unless otherwise defined, all vocabulary used herein (including technology
And scientific terminology) there is its common meaning, meaning is can be familiar with this field person to understand.Further, on
Definition of the vocabulary stated in universal common dictionary, should be read as field related to the present invention in the content of this specification
Consistent meaning.Unless there are especially explicitly defining, these vocabulary will not be interpreted Utopian or too formal meaning.
Claims (11)
1. a kind of organic LED display device, which is characterized in that include：
One active array substrate a, including light absorbing layer and at least an active member are located above the light absorbing layer；
An at least Organic Light Emitting Diode configures above the active array substrate, which includes：One first
Electrode is configured at the side of the neighbouring active member；One second electrode is oppositely arranged with the first electrode, wherein first electricity
The penetrance of the wavelength of pole and the second electrode in visible wavelength range is more than 0.6；And an organic luminous layer, sandwiched
Between the first electrode and the second electrode；And
One package board is configured above the Organic Light Emitting Diode.
2. organic LED display device according to claim 1, which is characterized in that the active array substrate also wraps
Containing a support plate, which configures the first surface in the support plate, and active member configuration is on the light absorbing layer.
3. organic LED display device according to claim 1, which is characterized in that the active array substrate also wraps
Containing a support plate, which configures the second surface in the support plate, and the light absorbing layer is configured with the active member at this
The opposite sides of support plate.
4. organic LED display device according to claim 1, which is characterized in that the light absorbing layer constitutes the master
One support plate of dynamic array substrate, and active member configuration is on the support plate.
5. organic LED display device according to claim 1, which is characterized in that the light absorbing layer is single layer
Organic material or inorganic structure, or be compound organic material and the multilayered structure of inorganic.
6. organic LED display device according to claim 1, which is characterized in that the light absorbing layer is in visible light
The reflectivity of a wavelength in wave-length coverage is less than 0.3.
7. organic LED display device according to claim 1, which is characterized in that the light absorbing layer is in visible light
The optical density (OD) of a wavelength in wave-length coverage is more than 0.7.
8. organic LED display device according to claim 1, which is characterized in that the active array substrate also wraps
Containing a light shield layer, configure above the active member.
9. organic LED display device according to claim 8, which is characterized in that the light shield layer is directed at the active
Element, and the area of the light shield layer is more than the area of the active member.
10. organic LED display device according to claim 8, which is characterized in that the light shield layer is directed at the master
One plain conductor of dynamic element, and the plain conductor is completely covered.
11. organic LED display device according to claim 1, which is characterized in that further include：
One chromatic filter layer is arranged between the organic luminous layer and the package board.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710168421.9A CN108630726A (en) | 2017-03-21 | 2017-03-21 | Organic LED display device |
| TW106205935U TWM545365U (en) | 2017-03-21 | 2017-04-27 | Organic light-emit diode display device |
| TW106114133A TWI642217B (en) | 2017-03-21 | 2017-04-27 | Organic light-emit diode display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710168421.9A CN108630726A (en) | 2017-03-21 | 2017-03-21 | Organic LED display device |
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| CN108630726A true CN108630726A (en) | 2018-10-09 |
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| CN201710168421.9A Pending CN108630726A (en) | 2017-03-21 | 2017-03-21 | Organic LED display device |
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| TW (2) | TWM545365U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109585518A (en) * | 2018-12-17 | 2019-04-05 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN113196496A (en) * | 2019-11-26 | 2021-07-30 | 重庆康佳光电技术研究院有限公司 | Display assembly and electronic device using same |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI686654B (en) * | 2019-02-19 | 2020-03-01 | 友達光電股份有限公司 | Manufacturing method of a display panel |
| CN111430523B (en) * | 2020-02-24 | 2021-06-01 | 錼创显示科技股份有限公司 | Micro light-emitting diode structure, manufacturing method thereof and micro light-emitting diode device |
| US11810904B2 (en) | 2020-02-24 | 2023-11-07 | PlayNitride Display Co., Ltd. | Micro light emitting diode structure and manufacturing method thereof and micro light emitting diode device |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1334483A (en) * | 2000-07-26 | 2002-02-06 | 精工爱普生株式会社 | Electrooptical device, base plate for electrooptical device and projection type display device |
| CN1917230A (en) * | 2006-09-07 | 2007-02-21 | 友达光电股份有限公司 | Display in low reflectivity built from self-luminescence elements |
| CN1921141A (en) * | 2006-09-11 | 2007-02-28 | 友达光电股份有限公司 | Pixel unit structure for autoluminescence unit display with low reflectance |
| CN101572268A (en) * | 2001-10-10 | 2009-11-04 | 乐金显示有限公司 | Organic electroluminescent device |
| CN103474450A (en) * | 2013-09-11 | 2013-12-25 | 京东方科技集团股份有限公司 | Display panel and manufacturing method thereof and display device |
| CN104241326A (en) * | 2013-06-21 | 2014-12-24 | 乐金显示有限公司 | Organic electroluminescence device and fabrication method thereof |
| US20150001486A1 (en) * | 2013-06-28 | 2015-01-01 | Lg Display Co., Ltd. | Organic light emitting diode display device and method of fabricating the same |
| CN105070741A (en) * | 2015-09-02 | 2015-11-18 | 京东方科技集团股份有限公司 | Array substrate, OLED display panel and display device |
| CN105226052A (en) * | 2014-06-23 | 2016-01-06 | 群创光电股份有限公司 | Display device |
| CN105572998A (en) * | 2016-03-04 | 2016-05-11 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method thereof and display device |
| CN206685389U (en) * | 2017-03-21 | 2017-11-28 | 宸鸿光电科技股份有限公司 | Organic LED display device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6933532B2 (en) * | 2003-03-28 | 2005-08-23 | Eastman Kodak Company | OLED display with photosensor |
| JP6035706B2 (en) * | 2010-04-09 | 2016-11-30 | 三菱化学株式会社 | Manufacturing method of composition for organic electric field element, composition for organic electric field element, manufacturing method of organic electroluminescent element, organic electroluminescent element, organic EL display device and organic EL lighting |
| TWI566395B (en) * | 2013-11-18 | 2017-01-11 | 元太科技工業股份有限公司 | Organic light-emitting diode display and method of manufacturing the same |
| CN105932038A (en) * | 2016-05-23 | 2016-09-07 | 深圳市华星光电技术有限公司 | Woled display device |
-
2017
- 2017-03-21 CN CN201710168421.9A patent/CN108630726A/en active Pending
- 2017-04-27 TW TW106205935U patent/TWM545365U/en unknown
- 2017-04-27 TW TW106114133A patent/TWI642217B/en active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1334483A (en) * | 2000-07-26 | 2002-02-06 | 精工爱普生株式会社 | Electrooptical device, base plate for electrooptical device and projection type display device |
| CN101572268A (en) * | 2001-10-10 | 2009-11-04 | 乐金显示有限公司 | Organic electroluminescent device |
| CN1917230A (en) * | 2006-09-07 | 2007-02-21 | 友达光电股份有限公司 | Display in low reflectivity built from self-luminescence elements |
| CN1921141A (en) * | 2006-09-11 | 2007-02-28 | 友达光电股份有限公司 | Pixel unit structure for autoluminescence unit display with low reflectance |
| CN104241326A (en) * | 2013-06-21 | 2014-12-24 | 乐金显示有限公司 | Organic electroluminescence device and fabrication method thereof |
| US20150001486A1 (en) * | 2013-06-28 | 2015-01-01 | Lg Display Co., Ltd. | Organic light emitting diode display device and method of fabricating the same |
| CN103474450A (en) * | 2013-09-11 | 2013-12-25 | 京东方科技集团股份有限公司 | Display panel and manufacturing method thereof and display device |
| CN105226052A (en) * | 2014-06-23 | 2016-01-06 | 群创光电股份有限公司 | Display device |
| CN105070741A (en) * | 2015-09-02 | 2015-11-18 | 京东方科技集团股份有限公司 | Array substrate, OLED display panel and display device |
| CN105572998A (en) * | 2016-03-04 | 2016-05-11 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method thereof and display device |
| CN206685389U (en) * | 2017-03-21 | 2017-11-28 | 宸鸿光电科技股份有限公司 | Organic LED display device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109585518A (en) * | 2018-12-17 | 2019-04-05 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN109585518B (en) * | 2018-12-17 | 2020-05-12 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| WO2020124859A1 (en) * | 2018-12-17 | 2020-06-25 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| US11296306B2 (en) | 2018-12-17 | 2022-04-05 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display panel and display device with shading part at side surface of pixel definition blocks |
| CN113196496A (en) * | 2019-11-26 | 2021-07-30 | 重庆康佳光电技术研究院有限公司 | Display assembly and electronic device using same |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM545365U (en) | 2017-07-11 |
| TWI642217B (en) | 2018-11-21 |
| TW201836189A (en) | 2018-10-01 |
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Application publication date: 20181009 |